Product Summary. BV DSS typ. 84 V. R DS(ON) typ. 6.8 mω I D 60 A

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1 RM60N75LD N-Channel Enhancement Mode Power MOSFET General Description The RM60N75LD uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of applications. Product Summary BV DSS typ. 84 V R DS(ON) typ. 6.8 mω max. 8.5 mω I D 60 A Features V DS =75V I D =60A@ V GS =10V R DS(ON) V GS =10V Special process technology for high ESD capability Special designed for Convertors and power controls High density cell design for ultra low Rdson Fully characterized Avalanche voltage and current 100% UIS TESTED! Good stability and uniformity with high E AS Excellent package for good heat dissipation Application Power switching application Hard Switched and High Frequency Circuits Uninterruptible Power Supply D G S TO-252-2L top view Schematic diagram Package Marking and Ordering Information Device Marking Device Device Package Reel Size Tape width Quantity 60N75 RM60N75LD TO-252-2L Table 1. Absolute Maximum Ratings (T C =25 ) Parameter Symbol Value Unit Drain-Source Voltage (V GS =0V V DS 75 V Gate-Source Voltage (V DS =0V) V GS ±20 V Drain Current (DC) at Tc=25 I D (DC) 60 A Drain Current (DC) at Tc=100 I D (DC) 42 A Drain Current-Continuous@ Current-Pulsed (Note 1) I DM (pluse) 310 A Peak diode recovery voltage dv/dt 30 V/ns Maximum Power Dissipation(Tc=25 ) P D 140 W Derating factor 0.95 W/ Single pulse avalanche energy (Note 2) E AS 300 mj Operating Junction and Storage Temperature Range T J,T STG -55 To 175 Notes 1.Repetitive Rating: Pulse width limited by maximum junction temperature 2.EAS condition Tj=25,VDD=37.5V,VG=10V,L=0.5mH REV:O15

2 Table 2. Thermal Characteristic Parameter Symbol Value Unit Thermal Resistance Junction-to-Case Maximum R thjc 1.05 /W Thermal Resistance Junction-to-Ambient Maximum R thja 50 /W Table 3. Electrical Characteristics (T C =25 unless otherwise noted) On/off states Parameter Symbol Condition Min Typ Max Unit Drain-Source Breakdown Voltage BV DSS V GS =0V I D =250 A V Zero Gate Voltage Drain Current(Tc=25 ) I DSS V DS =75V,V GS =0V A Zero Gate Voltage Drain Current(Tc=125 ) I DSS V DS =75V,V GS =0V A Gate-Body Leakage Current I GSS V GS =±20V,V DS =0V - - ±100 na Gate Threshold Voltage V GS(th) V DS =V GS,I D =250 A V Drain-Source On-State Resistance R DS(ON) V GS =10V, I D =30A m Dynamic Characteristics Forward Transconductance g FS V DS =5V,I D =30A 66 - S Input Capacitance C lss PF V DS =25V,V GS =0V, Output Capacitance C oss PF F=1.0MHz Reverse Transfer Capacitance PF C rss Total Gate Charge Q g V DS =30V,I D =30A, nc Gate-Source Charge Q gs V GS =10V 20 - nc Gate-Drain Charge 30 - nc Switching times Q gd Turn-on Delay Time t d(on) ns Turn-on Rise Time t r V DD =30V,I D =2A,R L = ns Turn-Off Delay Time t d(off) V GS =10V,R G = ns Turn-Off Fall Time t f ns Source- Drain Diode Characteristics Source-drain current(body Diode) I SD A Pulsed Source-drain current(body Diode) I SDM A Forward on voltage (Note 1) V SD Tj=25,I SD =30A,V GS =0V V Reverse Recovery Time (Note 1) t rr Tj=25,I F =75A,di/dt=100A/ s ns (Note 1) Reverse Recovery Charge Q nc rr Forward Turn-on Time t on Intrinsic turn-on time is negligible(turn-on is dominated by L S +L D ) Notes 1.Pulse Test: Pulse Width 300 s, Duty Cycle 1.5%, R G =25, Starting Tj=25

3 Test Circuit 1) E AS test circuit 2) Gate charge test circuit 3) Switch Time Test Circuit

4 RATING AND CHARACTERISTICS CURVES (RM60N75LD) Figure1. Safe operating area Figure2. Source-Drain Diode Forward Voltage Figure3. Output characteristics Figure4. Transfer characteristics Figure5. Static drain-source on resistance Figure6. R DS(ON) vs Junction Temperature

5 RATING AND CHARACTERISTICS CURVES (RM60N75LD) Figure7. BV DSS vs Junction Temperature Figure8. V GS(th) vs Junction Temperature Figure9. Gate charge waveforms Figure10. Capacitance Figure11. Normalized Maximum Transient Thermal Impedance

6 RECTRON Marking on the body Rectron Logo Year Code (Y: ) 6 0 N X X Part No. Week code (WW:01~52)

7 TO-252 Package Information Symbol Dimensions In Millimeters Dimensions In Inches Min. Max. Min. Max. A A b c D D D TYP TYP. E e L L TYP TYP. L L TYP TYP. L h V TYP TYP.

8 DISCLAIMER NOTICE Rectron Inc reserves the right to make changes without notice to any product specification herein, to make corrections, modifications, enhancements or other changes. Rectron Inc or anyone on its behalf assumes no responsibility or liability for any errors or inaccuracies. Data sheet specifications and its information contained are intended to provide a product description only. "Typical" parameters which may be included on RECTRON data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. Rectron Inc does not assume any liability arising out of the application or use of any product or circuit. Rectron products are not designed, intended or authorized for use in medical, life-saving implant or other applications intended for life-sustaining or other related applications where a failure or malfunction of component or circuitry may directly or indirectly cause injury or threaten a life without expressed written approval of Rectron Inc. Customers using or selling Rectron components for use in such applications do so at their own risk and shall agree to fully indemnify Rectron Inc and its subsidiaries harmless against all claims, damages and expenditures.