RM1002. N-Channel Enhancement Mode Power MOSFET. Description. General Features. Application. Marking:1002
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1 RM1002 N-Channel Enhancement Mode Power MOSFET Description The 1002 uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of applications. General Features G 10V (typ) 100V m S Schematic diagram High density cell design for ultra low Rdson Fully characterized avalanche voltage and current Excellent package for good heat dissipation Application Power switching application Hard switched and high frequency circuits Uninterruptible power supply Halogen-free P/N suffix V means AEC-Q101 qualified, e.g:rm1002v Marking: SOT-23 Absolute Maximum Ratings (T A =25 unless otherwise noted) Parameter Symbol Limit Unit Drain-Source Voltage VDS 100 V Gate-Source Voltage VGS ±20 V Drain Current-Continuous I D 2 A Drain Current-Pulsed (Note 1) I DM 5 A Maximum Power Dissipation P D 1.1 W Operating Junction and Storage Temperature Range T J,T STG -55 To 150 Thermal Characteristic Thermal Resistance,Junction-to-Ambient (Note 2) R JA 120 /W Electrical Characteristics (T A =25 unless otherwise noted) Parameter Symbol Condition Min Typ Max Unit Off Characteristics Drain-Source Breakdown Voltage BV DSS V GS=0V I D=250 A V Zero Gate Voltage Drain Current I DSS V DS=100V,V GS=0V A /59 REV:A
2 Gate-Body Leakage Current I GSS V GS=±20V,V DS=0V - - ±100 na On Characteristics (Note 3) Gate Threshold Voltage V GS(th) V DS=V GS,I D=250 A V Drain-Source On-State Resistance R DS(ON) V GS=10V, I D=1A m Forward Transconductance g FS V DS=5V,I D=1A S Dynamic Characteristics (Note4) Input Capacitance C lss PF V DS=50V,V GS=0V, Output Capacitance C oss PF F=1.0MHz Reverse Transfer Capacitance PF Switching Characteristics (Note 4) C rss Turn-on Delay Time t d(on) ns Turn-on Rise Time t r V DD=50V,I D=1.3A,R L= ns Turn-Off Delay Time t d(off) V GS=10V,R G= ns Turn-Off Fall Time t f ns Total Gate Charge Q g V DS=50V,I D=1.3A, nc Gate-Source Charge Q gs V GS=10V nc Gate-Drain Charge nc Q gd Drain-Source Diode Characteristics Diode Forward Voltage (Note 3) V SD V GS=0V,I S=1.3A V Diode Forward Current (Note 2) I S A Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on FR4 Board, t 10 sec. 3. Pulse Test: Pulse Width 300 s, Duty Cycle 2%. 4. Guaranteed by design, not subject to production
3 Test Circuit 1 E AS test circuit 2 Gate charge test circuit 3 Switch Time Test Circuit
4 RATING AND CHARACTERISTICS CURVES (RM1002) Rdson On-Resistance( ) ID- Drain Current (A) ID- Drain Current (A) Vds Drain-Source Voltage (V) Figure 1 Output Characteristics Vgs Gate-Source Voltage (V) Figure 2 Transfer Characteristics Normalized On-Resistance Vgs Gate-Source Voltage (V) Is- Reverse Drain Current (A) T J -Junction Temperature( ) Figure 4 Rdson-JunctionTemperature Qg Gate Charge (nc) Figure 5 Gate Charge I D - Drain Current (A) Figure 3 Rdson- Drain Current Vsd Source-Drain Voltage (V) Figure 6 Source- Drain Diode Forward
5 RATING AND CHARACTERISTICS CURVES (RM1002) Vds Drain-Source Voltage (V) Figure 7 Capacitance vs Vds T J -Junction Temperature( ) Figure 9 BV DSS vs Junction Temperature Power Dissipation (w) C Capacitance (nf) Vds Drain-Source Voltage (V) Figure 8 Safe Operation Area T J -Junction Temperature( ) Figure 10 Power De-rating r(t),normalized Effective Transient Thermal Impedance ID- Drain Current (A) Square Wave Pluse Duration(sec) Figure 11 Normalized Maximum Transient Thermal Impedance
6 Package Tube (pcs/tube) Tube (pcs/inner box) Tube (pcs/cartoon) Tape&Reel (pcs/reel) Tape&Reel (pcs/inner box) Tape&Reel (pcs/cartoon) DFN , ,000 2,500 5,000 40,000 SOP , ,000 4,000 4,000 20,000 TSSOP , ,000 3,000 6,000 48,000 SOT-23-3L 3,000 30, ,000 SOT-23-6L 3,000 30, ,000 SOT-23(6R) 3,000 30, ,000 SOT-363 3,000 30, ,000 SOT-523 3,000 30, ,000 S0T223 2,500 2,500 20,000 TO ,000 5,000 TO-220F 50 1,000 10,000 TO ,200 TO ,000 40,000 TO-251S(4R) 80 4,000 40,000 TO-252-2L(4R) 80 4,000 40,000 2,500 2,500 25,000 TO-263-2L 50 1,000 10, ,000 TO-3P ,000 TO-92 1,000( 袋装 ) 10, ,000
7 DISCLAIMER NOTICE Rectron Inc reserves the right to make changes without notice to any product specification herein, to make corrections, modifications, enhancements or other changes. Rectron Inc or anyone on its behalf assumes no responsibility or liability for any errors or inaccuracies. Data sheet specifications and its information contained are intended to provide a product description only. "Typical" parameters which may be included on RECTRON data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. Rectron Inc does not assume any liability arising out of the application or use of any product or circuit. Rectron products are not designed, intended or authorized for use in medical, life-saving implant or other applications intended for life-sustaining or other related applications where a failure or malfunction of component or circuitry may directly or indirectly cause injury or threaten a life without expressed written approval of Rectron Inc. Customers using or selling Rectron components for use in such applications do so at their own risk and shall agree to fully indemnify Rectron Inc and its subsidiaries harmless against all claims, damages and expenditures.
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N-Channel Enhancement Mode Power MOSFET General Description The YMP200N08 uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. This device is suitable for use
More informationDevice Marking Device Device Package Reel Size Tape width Quantity NCEP0178AK NCEP0178AK TO-252-2L Parameter Symbol Limit Unit
http://www.ncepower.com NCE N-Channel Super Trench Power MOSFET Description The uses Super Trench technology that is uniquely optimized to provide the most efficient high frequency switching performance.
More informationDevice Marking Device Device Package Reel Size Tape width Quantity NCE85H21T NCE85H21T TO Parameter Symbol Limit Unit
NCE N-Channel Enhancement Mode Power MOSFET DESCRIPTION The uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in Automotive applications and
More informationNot Recommended. TSM V N-Channel MOSFET. PRODUCT SUMMARY V DS (V) R DS(on) (mω) I D (A) Features. Block Diagram. Application
SOT-23 Pin Definition: 1. Gate 2. Source 3. Drain PRODUCT SUMMARY V DS (V) R DS(on) (mω) I D (A) 30 @ V GS = 10V 5.8 30 43 @ V GS = 4.5V 5.0 Features Advance Trench Process Technology High Density Cell
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SOP-8 Pin Definition: 1. Source 1 8. Drain 1 2. Gate 1 7. Drain 1 3. Source 2 6. Drain 2 4. Gate 2 5. Drain 2 PRODUCT SUMMARY V DS (V) R DS(on) (mω) I D (A) 36 @ V GS = 10V 5.9 30 53 @ V GS = 4.5V 4.9
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Pb Free Product http://www.ncepower.com NCE P-Channel Enhancement Mode Power MOSFET Description The uses advanced trench technology to provide excellent R DS(ON), low gate charge and operation with gate
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N-Channel Super Junction Power MOSFET Ⅲ General Description The series of devices use advanced trench gate super junction technology and design to provide excellent RDS(ON) with low gate charge. This super
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SOT-26 Pin Definition: 1. Drain 6. Drain 2. Drain 5, Drain 3. Gate 4. Source PRODUCT SUMMARY V DS (V) R DS(on) (mω) I D (A) 48 @ V GS = -10V -5.3-30 79 @ V GS = -4.5V -4.1 Features Advance Trench Process
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SOT-23 Pin Definition: 1. Gate 2. Source 3. Drain Key Parameter Performance Parameter Value Unit V DS 20 V V GS = 4.5V 33 R DS(on) (max) V GS = 2.5V 40 V GS = 1.8V 51 mω Q g 11 nc Features Advance Trench
More informationDevice Marking Device Device Package Reel Size Tape width Quantity 6003 NCE6003Y SOT-23-3L Ø180mm 8 mm 3000 units
http://www.ncepower.com NCE N-Channel Enhancement Mode Power MOSFET Description The uses advanced trench technology to provide excellent R DS(ON), low gate charge and operation with gate voltages as low
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SOT-23 Pin Definition: 1. Gate 2. Source 3. Drain Key Parameter Performance Parameter Value Unit V DS -30 V V GS = -10V 95 R DS(on) (max) mω V GS = -4.5V 140 Q g 10 nc Features Advance Trench Process Technology
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N-Channel -V (D-S) MOSFET Key Features: Low r DS(on) trench technology Low thermal impedance Fast switching speed VDS (V) PRODUCT SUMMARY r DS(on) (mω) @ V GS =.5V @ V GS =.5V ID(A) 7..5 Typical Applications:
More informationDevice Marking Device Device Package Reel Size Tape width Quantity A2SHB HM2302A SOT-23 Ø180mm 8 mm 3000 units. Parameter Symbol Limit Unit
N-Channel Enhancement Mode Power MOSFET DESCRIPTION The HM2302A uses advanced trench technology to provide excellent R DS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device
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N & P-Channel -V (D-S) MOSFET Key Features: Low r DS(on) trench technology Low thermal impedance Fast switching speed Typical Applications: LED Inverter Circuits DC/DC Conversion Circuits Motor drives
More informationNot Recommended. TSM V P-Channel MOSFET. PRODUCT SUMMARY V DS (V) R DS(on) (mω) I D (A) Features. Block Diagram. Application
SOP-8 Pin Definition: 1. Source 8. Drain 2. Source 7. Drain 3. Source 6. Drain 4. Gate 5. Drain PRODUCT SUMMARY V DS (V) R DS(on) (mω) I D (A) 14 @ V GS = -10V -11-30 20 @ V GS = -4.5V -8.5 Features Advance
More informationDevice Marking Device Device Package Reel Size Tape width Quantity NCEP4085EG NCEP4085EG DFN5X6-8L - - -
http://www.ncepower.com NCE N-Channel Super Trench Power MOSFET Description The uses Super Trench technology that is uniquely optimized to provide the most efficient high frequency switching performance.
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SOT-23 Pin Definition: 1. Gate 2. Source 3. Drain PRODUCT SUMMARY V DS (V) R DS(on) (mω) I D (A) 55 @ V GS =-4.5V -3.2-20 80 @ V GS =-2.5V -2.7 130 @ V GS =-1.8V -2.0 Features Advance Trench Process Technology
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http://www.ncepower.com 30V Half Bridge Dual N-Channel Enhancement Mode Power MOSFET Description The is designed to provide a high efficiency synchronous buck power stage with optimal layout and board
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1 3 FEATURES RDS(ON) 110mΩ@VGS=-4.5V RDS(ON) 150mΩ@VGS=-2.5V Super high density cell design for extremely low RDS(ON) APPLICATIONS Power Management in Note book Portable Equipment Battery Powered System
More informationNCE3415Y. NCE P-Channel Enhancement Mode Power MOSFET. Description. General Features. Application
http://www.ncepower.com NCE P-Channel Enhancement Mode Power MOSFET Description The uses advanced trench technology to provide excellent R DS(ON), low gate charge and operation with gate voltages as low
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