Chapter 15 Integrated Circuits

Transcription

1 Chapter 15 Integrated Circuits SKEE1223 Digital Electronics Mun im/arif/izam FKE, Universiti Teknologi Malaysia December 8, 2015

2 Overview 1 Basic IC Characteristics Packaging Logic Families Datasheets 2 Important IC Parameters DC Supply Voltage Logic Levels Noise Margin Propagation Delay Fanout & Fanin Power 3 Variations of TTL 4 TTL vs CMOS Transistor Types TTL Operation & Evolution 5 CMOS Operation & Evolution

3 Packaging Integrated Circuits Known as IC or chip Packaging From 4-6 pins to hundreds Several packaging technologies available In ceramic or plastic These packages have metal leads that are the conductive wire that connect electricity from the outside world to the silicon inside the package Leads between packages are connected with small copper traces on a printed circuit board (PCB), and the package leads are soldered to the PCB

4 Packaging IC Levels of Integration Complexity Number of gates Example SSI 12 Individual gates MSI Flip-flops, registers LSI ,000 Microcontroller VLSI 10,000 1,000, microprocessor ULSI 1,000,000 i7 microprocessor

5 Logic Families Logic Families Logic Family : A collection of different IC s that have similar circuit characteristics The circuit design of the basic gate of each logic family is the same The most important parameters for evaluating and comparing logic families include: Logic Levels Power Dissipation Propagation delay Noise margin Fan-out ( loading )

6 Logic Families Example Logic Families RTL (resistor-transistor logic), DTL (diode-transistor logic) Earliest developed TTL (transistor-transistor logic) Still available, used occasionally 7400 series, refined over generations Most rugged least susceptible to electrical damage Consumes more power than CMOS not suitable for battery operated devices CMOS (complimentary metal-oxide semiconductor) Lowest power consumption Used to be slow, but fast today Most common logic family used in all microprocessors Easily damaged by static discharge & voltage spikes BiCMOS, ECL, GaAs Speedy, but use more power, more expensive or harder to use

7 , h H K H h, L w W / GN! =ds:r/l du H Symbol Parameter Min Ty p Max Unit V== SupplyRVoltage L, /, Td OperatingRdmbientRTemperatureRRange L, /, IOH OutputR=urrentR High L,xR/, g, md IOL OutputR=urrentR Low L, /,,gl,g/l L,,, SNL,LSXXJ SN/,LSXXN SN/,LSXX!!=R=HdRd=T:RISTI=SROV:RROP:RdTINGRT:MP:RdTUR:RRdNG:RMunlessRotherwiseRspecifiedi Limits Lg Lg HL HL LgL LgHL HL /,g Wg JRSU""IX =:RdMI= =ds:rwhhu W NRSU""IX PLdSTI= =ds:rw,wu w =eramic Plastic SOI=!RSU""IX SOI= Symbol Parameter Min Ty p Max Unit TestR=onditions VIH InputRHIGHRVoltage Hg V Input LOW Voltage L, g/ /, gw V V = md GuaranteedRInputRHIGHRVoltageRfor dllrinputs GuaranteedRInputRLOWRVoltageRfor dllrinputs VIK InputR=lampR!iodeRVoltage gwl gl V V== XRMINxRIIN XR WRmd Output HIGH Voltage Output LOW Voltage Input HIGH =urrent /, Hg/ hgl V /, ghl gl V IOL XRWg Rmd == OH IN IH orrvil perrtruthrtable H O d V== XRMdXxRVIN XRHg/RV g md V== XRMdXxRVIN XR/g RV IIL InputRLOWR=urrent g, md V== XRMdXxRVIN XR g,rv IOS ShortR=ircuitR=urrentRMNoteR i H md V== XRMdX == PowerRSupplyR=urrent TotalxROutputRLOW Note Y Not more than one output should be shorted at a timex nor for more than secondg d=r=hdrd=t:risti=srmtd XRHLy=i Limits perrtruthrtable Symbol Parameter Min Ty p Max Unit TestR=onditions tphl TurnuOnR!elayxRInputRtoROutput L ns,g, == == =L XR LRp" Datasheets Datasheets QUd!RHuINPUTRNdN!RGdT: SNL,./,LS :S!RcRhL RVolts QUd!RHuINPUTRNdN!RGdT: LOWRPOW:RRS=HOTTKY V== GUdRdNT::!ROP:RdTINGRRdNG:S VIL VOH VOL IIH I== OR!:RINGRIN"ORMdTION L, HgL hgl V V== XRMINxRIOH XRMdXxRVIN XRVIH L,x /, ghl g, V IOL XR,g Rmd V== XRV== MINx VIN XRVIL orrvih TotalxROutputRHIGH gw md V== XRMdX Pinouts Packages/Dimensions Voltages and Currents Noise Margin Power Dissipation Propagation Delay Speed-Power Product Fan-In, Fan-Out tplh TurnuOffR!elayxRInputRtoROutput Kg L ns V== XRLg RV

8 DC Supply Voltage DC Supply Voltage All digital ICs have at least two pins that are connected to the power rails. TTL CMOS Positive supply voltage V CC V DD Negative supply voltage GND or V EE V SS For TTL, V CC is +5 V ± 0.5 V. A TTL gate may be destroyed if the limit is exceeded. CMOS gates are tolerant to power supply voltage variations The power supply ranges from +1.8 V to +18 V. voltage, power consumption voltage, speed.

9 Logic Levels Logic Levels TTL and CMOS use voltages to represent logic levels. Ideally, a single voltage value is specified for each logic level. V CC (power) Logic 1 GND (ground) Logic 0 In reality, a range of voltages is specified for each logic level.

10 Logic Levels HIGH Level Electrical Parameters For a high-state gate driving a second gate, we define: Parameter V OH V IH I OH I IH Description High-level output voltage, the minimum voltage level that a logic gate will produce as a logic 1 output. High-level input voltage, the minimum voltage level that a logic gate will recognize as a logic 1 input. Voltage below this level will not be accepted as high. High-level output current, current that flows from an output in the logic 1 state under specified load conditions. High-level input current, current that flows into an input when a logic 1 voltage is applied to that input.

11 Logic Levels LOW Level Electrical Parameters For a low-state gate driving a second gate, we define: Parameter V OL V IL I OL I IL Description Low-level output voltage, the maximum voltage level that a logic gate will produce as a logic 0 output. Low-level input voltage, the maximum voltage level that a logic gate will recognize as a logic 0 input. Voltage below this level will not be accepted as low. Low-level output current, current that flows from an output in the logic 0 state under specified load conditions. Low-level input current, current that flows into an input when a logic 0 voltage is applied to that input.

12 Logic Levels TTL vs CMOS Logic Levels V CC = V V CC = 5 V High V OH = 4.9 V High V IH = 3.85 V V OH = 2.8 V V IH = 2.4 V Undefined Undefined V IL = 1.35 V V IL = 0.8 V Low V OL = 0.4 V Low V OL = 0.1 V TTL. CMOS.

13 Noise Margin Noise Margin If noise in the circuit is high enough it can push a logic 0 up or drop a logic 1 down into the indeterminate or illegal region Noise margin is maximum amount of noise that the circuit can withstand. 5V 5V High High level noise margin High V OH= 2.8V V IH = 2.4V Not allowed Undefined V OL= 0.4V 0V Low V OH V OL Low-level noise margin V V IH IL Low V IL = 0.8V 0V

14 Noise Margin Noise Margin Noise Margin for logic high is: Noise Margin for logic low is: V NH = V OH V IH V NL = V IL V OL

15 Propagation Delay Propagation Delay Propagation delay is the delay from a change in input to a change on the output. t PHL delay from an input is given to the time the output changes from high to low. t PLH delay from an input is given to the time the output changes from low to high. Input 50% Output 50% t PLH t PHL

16 Fanout & Fanin Fanout for TTL The fanout is the number of standard loads that an output can drive. Exceeding the fanout may result in incorrect circuit operation and may destroy the devices

17 Fanout & Fanin Fanout for CMOS Fanout is much higher for CMOS devices than for TTL devices. I IL and I IH are extremely small for CMOS (< 1µA). Calculating fanout as we did for TTL might yield fanout of 4000 for CMOS, compared to 10 for standard TTL. However, increased fanout results in increased delay due to input capacitance.

18 Fanout & Fanin Fan-In Number of input signals to a gate. Not an electrical property Function of the manufacturing process NAND gate with a fan in of 8.

19 Power Power Dissipation Static/quiescent Due to passive components No input signal Dynamic Due to charging and discharging capacitances through resistances Varies with operating frequency Example: 74LS-TTL power dissipation : 5 mw/gate, regardless of frequency 74HC-CMOS power dissipation : µw/gate static, but increase proportionally to frequency At 1 MHz, both consume about the same power

20 Power Speed-Power Product Speed (propagation delay) and power consumption are the two most important performance parameters of a digital IC. Speed-power product (SPP) a simple means for measuring and comparing the overall performance of an IC family (the smaller, the better). Example, an IC has: an average propagation delay of 10 ns an average power dissipation of 5 mw the speed-power product = (10 ns) x (5 mw) = 50 picojoules (pj)

21 Power SPP of Various Logic Families CMOS TTL 74HC S 74LS 74AS 74ALS 74F Propagation delay (ns) Power consumption (mw/gate) Static khz Max clock freq. (MHz) Speed-Power 100 khz(pj) Fan-Out: LS loads Same series >100 > Low-level input current (ma)

22 Wired-AND Open collector outputs connected together to a common pull-up resistor Any collector can pull the signal line low Logically an AND gate V CC A ABC B C

23 Tri-State Logic Usually used to bus multiple signals on the same wire Only one gate output is enabled, all others must be disabled Disabled gates look like high-impedance (Hi-Z) to bus and therefore do not interfere with other gates putting signals on the bus 32 Communications bus Device 1 (e.g., CPU) Device 2 (e.g., Memory) Device 3 (e.g., I/O)

24 Transistor Types TTL vs CMOS TTL Transistor-Transistor Logic Uses BJT (bipolar junction transistor) MOS Metal Oxide Semiconductor Uses FET (field effect transistor) MOS has three subfamilies PMOS (P-channel FET) NMOS (N-channel FET) CMOS (Complimentary, uses both types, most common)

25 TTL Operation & Evolution TTL Circuit Operation A standard TTL gate A B I CQ1 Q1 Q2 Q3 Q4 Y ON OFF OFF ON ON OFF OFF ON ON OFF OFF ON OFF ON ON OFF 0

26 TTL Operation & Evolution TTL Evolution

27 CMOS Circuit Operation CMOS Inverter Input Q1 Q2 Output 0 ON OFF 1 1 OFF ON 0

28 CMOS Evolution

29 CMOS Logic Trends Reduction in supply voltages 12V 5V 3.3V 2.5V 1.8V 1.5V Reduction in power dissipation results in Lower cost Higher integration Improved reliability Approximately double the number of transistors per chip every 18 months The famous Moore s Law observed by Gordon Moore in 1965

30 Moore s Law

31 SKEE