Transient Load Tester for Time Domain PDN Analysis. Ethan Koether (Oracle) Istvan Novak (Oracle)

Size: px
Start display at page:

Download "Transient Load Tester for Time Domain PDN Analysis. Ethan Koether (Oracle) Istvan Novak (Oracle)"

Transcription

1 Transient Load Tester for Time Domain PDN Analysis Ethan Koether (Oracle) Istvan Novak (Oracle)

2 Speakers Ethan Koether Hardware Engineer, Oracle He is currently focusing on system power-distribution network design, measurement, and analysis. He received his master's degree in Electrical Engineering and Computer Science from the Massachusetts Institute of Technology. Istvan Novak Senior Principal Engineer, Oracle Besides signal integrity design of high-speed serial and parallel buses, he is engaged in the design and characterization of powerdistribution networks and packages for mid-range servers. He creates simulation models, and develops measurement techniques for power distribution. Istvan has twenty plus years of experience with high-speed digital, RF, and analog circuit and system design. He is a Fellow of IEEE for his contributions to signal-integrity and RF measurement and simulation methodologies. Image Image 2

3 Outline Motivation for Time Domain PDN Validation Transient Load Tester Circuit Design The GaN FET Transient Load Tester Implementation and Performance Conclusion 3

4 Outline Motivation for Time Domain PDN Validation Transient Load Tester Circuit Design The GaN FET Transient Load Tester Implementation and Performance Conclusion 4

5 Target Impedance Methodology Estimates upper bound for rail s impedance Voltage fluctuation on rail: V Maximum current step: I Target Impedance: Z Target = V/ I Valid for linear and time-invariant PDN Approximation unless impedance strictly resistive 1.E+00 Impedance magnitude [ohm] 1.E-01 1.E-02 Frequency [Hz] 1.E-03 1.E+02 1.E+04 1.E+06 1.E+08 5

6 Time Domain PDN Validation Load device under test (DUT) with current who s waveform follows input voltage waveform. Input Voltage Waveform Load Current t 0 t 0 For PDN design, can load DUT with worst case current in worst case time to analyze simulated behavior in live system. 6

7 Outline Motivation for Time Domain PDN Validation Transient Load Tester Circuit Design The GaN FET Transient Load Tester Implementation and Performance Conclusion 7

8 Transient Load Tester (TLT) Circuit Design GaN FET I Load Only works in one I-V quadrant 8

9 Outline Motivation for Time Domain PDN Validation Transient Load Tester Circuit Design The GaN FET Transient Load Tester Implementation and Performance Conclusion 9

10 The Gallium Nitride FET (GaN FET) Maximum Ratings V DS Drain-to-Source Voltage (up to 10,000 5ms pulses at 150 C) 48 Drain-to-Source Voltage (Continuous) 40 I D Continuous (T A = 25 C, R θja = 6 C/W) 53 A Pulsed (25 C, T PULSE = 300 µs) 235 Gate-to-Source Voltage 6 V GS Gate-to-Source Voltage -4 V T J Operating Temperature -40 to 150 T STG Storage Temperature -40 to 150 V C 10

11 The Gallium Nitride FET (GaN FET) The enhancement mode GaN FET used compared to silicon MOSFETs with similar electrical characteristics: Faster switching speeds and shorter delay time C GD is exceptionally small in value C GS is relatively small in value Lower threshold voltage Lower package inductance Lower R DS ON 11

12 Outline Motivation for Time Domain PDN Validation Transient Load Tester Circuit Design The GaN FET Transient Load Tester Implementation and Performance Conclusion 12

13 TLT Circuit Breadboard Implementation High Speed Op Amp DUT Sense Resistors 13

14 TLT Circuit Breadboard Implementation GaN FET Buffer Circuit 14

15 TLT Implementation and Test Results TLT voltages measured at inverting and non-inverting inputs of op amp For figure below: DUT voltage of 1V, rise/fall times of 100ns 15

16 TLT Implementation and Test Results TLT voltages measured at inverting and non-inverting inputs of op amp For figure below: DUT voltage of 1V, rise/fall times of 100ns 16

17 Current Step (A) Current Step (A) TLT Implementation and Test Results Limitation of max operating current of individual circuit can be overcome by operating circuits in parallel The measurements below were captured from boards operating alone with 100ns rise/fall time on a DUT supplying 1V TLT board #1 TLT board # Time (μs) Time (μs) 17

18 Current Step (A) TLT Implementation and Test Results The measurements below were captured from TLT boards #1 and #2 operating in parallel with 100ns rise/fall time on a DUT supplying 1V Time (µs) Parallel operation does not affect operational behavior of TLT circuit 18

19 TLT Full PCB Implementation Side and top views of 16 TLT circuits implemented in CPU BGA plug-in PCB for parallel operation Control Circuitry Loading GaN FETs 19

20 TLT Usage for DC-DC Converter and its PDN s Time Domain Performance Testing Verify PDN can supply necessary current to devices DUT can be tested with complex waveforms using arbitrary waveform generator TLT validation uses current pulse train with magnitude equal to max current step PDN must support Can vary frequency and duty cycle to explore exacerbations from resonances 20

21 MAX VOLTAGE FLUCTUATION (V) DUTY CYCLE (%) TLT Usage for DC-DC Converter and its PDN s Time Domain Performance Testing Verify PDN can supply necessary current to devices DUT can be tested with complex waveforms using arbitrary waveform generator TLT validation uses current pulse train with magnitude equal to max current step PDN must support Can vary frequency and duty cycle to explore exacerbations from resonances E+3 2E+3 3E+3 4E+3 5E+3 6E+3 7E+3 8E+3 9E+3 1E FREQUENCY (HZ) 21

22 Outline Motivation for Time Domain PDN Validation Transient Load Tester Circuit Design The GaN FET Transient Load Tester Implementation and Performance Conclusion 22

23 Conclusion Time domain validation of PDNs important for thorough PDN design and analysis The GaN FET offers faster turn on speeds and relatively low threshold voltage compared to silicon MOSFETs with similar electrical characteristics Implementation of GaN FET with TLT circuit topology along with parallel operation of TLT circuits delivers fast slew of current at 100ns rise/fall time with virtually unlimited current magnitude TLT allows for simulation of worst case loading conditions on a PDN in system within a lab setting for thorough PDN validation. 23

24 Acknowledgements The authors wish to thank for their help Kavitha Narayandass, Alex Miranda, Guy Phillips, Dan Sullivan, Dave Michaud, Bill Tata, Khan Nguyen, Dan Rich, Randy Luckenbihl, Jerome Gentillet, Sandra Brescia, Raja Burney, Gustavo Blando, Laura Kocubinski, all of Oracle Corporation. 24

25 More Information 25

26 Thank You! --- QUESTSIONS? 26

27 Current (A) Voltage (V) TLT Implementation and Test Results Inherent fight between V GS and V DS, convergence of which determines operational behavior of TLT Figures below captured with DUT supplying 1V, show V DS, V GS, and resulting load current at steps of 20A and 40A with 100ns rise and fall times Time (µs) Time (µs) VGS(ID=20A) VDS(ID=20A) VGS(ID=20A) VGS(ID=40A) VGS(ID=40A) VDS(ID=40A) 27

28 Current Load Step (A) TLT Implementation and Test Results PCB implementation of TLT circuits operating in parallel demands loading FETs be in close proximity to one another Little thermal dependence of TLT operational behavior Data below captured with TLT operating at 100ns rise/fall time connected to DUT supplying 1V Time (µs) 5 Degree C 10 Degree C 15 Degree C 20 Degree C 25 Degree C 30 Degree C 35 Degree C 40 Degree C 45 Degree C 28

Transient Load Tester for Time Domain PDN Validation

Transient Load Tester for Time Domain PDN Validation EDICon 217 Transient Load Tester for Time Domain PDN Validation Ethan Koether, Oracle Ethan.koether@oracle.com Istvan Novak, Oracle Istvan.novak@oracle.com Disclaimer: This presentation does not constitute

More information

DesignCon Panel discussion: What is New in DC-DC Converters? V. Joseph Thottuvelil GE Energy Chris Young Intersil Zilker Labs

DesignCon Panel discussion: What is New in DC-DC Converters? V. Joseph Thottuvelil GE Energy Chris Young Intersil Zilker Labs DesignCon 2012 Panel discussion: What is New in DC-DC Converters? Panelists: V. Joseph Thottuvelil GE Energy Chris Young Intersil Zilker Labs Steve Weir IPBLOX Istvan Novak* Oracle * panel organizer and

More information

235 W Maximum Power Dissipation (whole module) 470 T J Junction Operating Temperature -40 to 150. Torque strength

235 W Maximum Power Dissipation (whole module) 470 T J Junction Operating Temperature -40 to 150. Torque strength Discontinued PRODUCT SUMMARY (TYPICAL) V DS (V) 600 R DS(on) (m ) 30 GaN Power Hybrid HEMT Half-Bridge Module Features High frequency operation Free-wheeling diode not required Applications Compact DC-DC

More information

TPH3207WS TPH3207WS. GaN Power Low-loss Switch PRODUCT SUMMARY (TYPICAL) Absolute Maximum Ratings (T C =25 C unless otherwise stated)

TPH3207WS TPH3207WS. GaN Power Low-loss Switch PRODUCT SUMMARY (TYPICAL) Absolute Maximum Ratings (T C =25 C unless otherwise stated) PRODUCT SUMMARY (TYPICAL) V DS (V) 650 R DS(on) (m ) 35 Q rr (nc) 175 Features Low Q rr Free-wheeling diode not required Quiet Tab for reduced EMI at high dv/dt GSD pin layout improves high speed design

More information

TPH3202PS TPH3202PS. GaN Power Low-loss Switch PRODUCT SUMMARY (TYPICAL) TO-220 Package. Absolute Maximum Ratings (T C =25 C unless otherwise stated)

TPH3202PS TPH3202PS. GaN Power Low-loss Switch PRODUCT SUMMARY (TYPICAL) TO-220 Package. Absolute Maximum Ratings (T C =25 C unless otherwise stated) PRODUCT SUMMARY (TYPICAL) V DS (V) 600 R DS(on) ( ) 0.29 Q rr (nc) 29 Features Low Q rr Free-wheeling diode not required Low-side Quiet Tab for reduced EMI GSD pin layout improves high speed design RoHS

More information

MOSFET = 0V, I D = 10V, 29A) = 500V, V GS = 0V) = 0V, T C = 400V, V GS = ±30V, V DS = 0V) = 2.5mA)

MOSFET = 0V, I D = 10V, 29A) = 500V, V GS = 0V) = 0V, T C = 400V, V GS = ±30V, V DS = 0V) = 2.5mA) V A.65Ω POWER MOS 7 R MOSFET Power MOS 7 is a new generation of low loss, high voltage, N-Channel enhancement mode power MOSFETS. Both conduction and switching losses are addressed with Power MOS 7 by

More information

How the Braid Impedance of Instrumentation Cables Impact PI and SI Measurements

How the Braid Impedance of Instrumentation Cables Impact PI and SI Measurements How the Braid Impedance of Instrumentation Cables Impact PI and SI Measurements Istvan Novak (*), Jim Nadolny (*), Gary Biddle (*), Ethan Koether (**), Brandon Wong (*) (*) Samtec, (**) Oracle This session

More information

MOSFET UNIT V DSS. Volts I D W/ C T J. Amps E AR = 0V, I D = 10V, I D = 88A) = 200V, V GS = 0V) = 160V, V GS = 0V, T C = ±30V, V DS = 0V) = 5mA)

MOSFET UNIT V DSS. Volts I D W/ C T J. Amps E AR = 0V, I D = 10V, I D = 88A) = 200V, V GS = 0V) = 160V, V GS = 0V, T C = ±30V, V DS = 0V) = 5mA) APT2M11JLL 2V A.11Ω POWER MOS 7 R Lower Input Capacitance Lower Miller Capacitance Lower Gate Charge, Qg MAXIMUM RATINGS MOSFET Power MOS 7 is a new generation of low loss, high voltage, N-Channel enhancement

More information

APT1003RBLL APT1003RSLL

APT1003RBLL APT1003RSLL APT3RBLL APT3RSLL V A 3.Ω POWER MOS 7 R MOSFET Power MOS 7 is a new generation of low loss, high voltage, N-Channel enhancement mode power MOSFETS. Both conduction and switching losses are addressed with

More information

FREDFET FAST RECOVERY BODY DIODE UNIT V DSS. Volts I D W/ C T J. Amps E AR = 0V, I D = 10V, I D = 88A) = 200V, V GS = 0V) = 160V, V GS = 0V, T C

FREDFET FAST RECOVERY BODY DIODE UNIT V DSS. Volts I D W/ C T J. Amps E AR = 0V, I D = 10V, I D = 88A) = 200V, V GS = 0V) = 160V, V GS = 0V, T C APT2M11JFLL 2V A.11Ω POWER MOS 7 R FREDFET Power MOS 7 is a new generation of low loss, high voltage, N-Channel enhancement mode power MOSFETS. Both conduction and switching losses are addressed with Power

More information

MOSFET = 0V, I D = 16.5A) = 10V, I D = 200V, V GS = 0V) = 0V, T C = 160V, V GS = 0V) = ±30V, V DS. = 2.5mA)

MOSFET = 0V, I D = 16.5A) = 10V, I D = 200V, V GS = 0V) = 0V, T C = 160V, V GS = 0V) = ±30V, V DS. = 2.5mA) APT82JLL 8V A.2Ω POWER MOS 7 R Power MOS 7 is a new generation of low loss, high voltage, N-Channel enhancement mode power MOSFETS. Both conduction and switching losses are addressed with Power MOS 7 by

More information

How to Design a PDN for Worst Case?

How to Design a PDN for Worst Case? PCB Design 007 QuietPower columns How to Design a PDN for Worst Case? Istvan Novak, Oracle, December 205 In the previous column [] we showed that for Linear and Time Invariant (LTI) systems the Reverse

More information

APT30M30B2FLL APT30M30LFLL

APT30M30B2FLL APT30M30LFLL POWER MOS 7 R Power MOS 7 is a new generation of low loss, high voltage, N-Channel enhancement mode power MOSFETS. Both conduction and switching losses are addressed with Power MOS 7 by significantly lowering

More information

APT8052BLL APT8052SLL

APT8052BLL APT8052SLL APT82BLL APT82SLL 8V A.2Ω Power MOS 7 is a new generation of low loss, high voltage, N-Channel enhancement mode power MOSFETS. Both conduction and switching losses are addressed with Power MOS 7 by significantly

More information

Gallium Nitride MMIC Power Amplifier

Gallium Nitride MMIC Power Amplifier Gallium Nitride MMIC Power Amplifier August 2015 Rev 4 DESCRIPTION AMCOM s is an ultra-broadband GaN MMIC power amplifier. It has 21dB gain, and >41dBm output power over the 0.03 to 6GHz band. This MMIC

More information

Symbol Parameter Typical

Symbol Parameter Typical PRODUCT SUMMARY (TYPICAL) V DS (V) 600 R DS(on) ( ) 0.29 Q rr (nc) 29 Features Low Q rr Free-wheeling diode not required Low-side Quiet Tab for reduced EMI RoHS compliant High frequency operation Applications

More information

IRLR8103VPbF. Absolute Maximum Ratings. Thermal Resistance PD A DEVICE CHARACTERISTICS. IRLR8103V 7.9 mω Q G Q SW Q OSS.

IRLR8103VPbF. Absolute Maximum Ratings. Thermal Resistance PD A DEVICE CHARACTERISTICS. IRLR8103V 7.9 mω Q G Q SW Q OSS. PD - 95093A IRLR803VPbF N-Channel Application-Specific MOSFETs Ideal for CPU Core DC-DC Converters Low Conduction Losses Low Switching Losses Minimizes Parallel MOSFETs for high current applications 00%

More information

Symbol Parameter Typical

Symbol Parameter Typical PRODUCT SUMMARY (TYPICAL) V DS (V) 650 R DS(on) (m ) 110 Q rr (nc) 54 Features Low Q rr Free-wheeling diode not required Low-side Quiet Tab for reduced EMI RoHS compliant High frequency operation Applications

More information

EPC2015 Enhancement Mode Power Transistor

EPC2015 Enhancement Mode Power Transistor EPC5 EPC5 Enhancement Mode Power Transistor V DSS, 4 V R DS(ON), 4 mw I D, A PRELIMINARY EFFICIENT POWER CONVERSION HAL Gallium Nitride is grown on Silicon Wafers and processed using standard CMOS equipment

More information

APT5010B2FLL APT5010LFLL 500V 46A 0.100

APT5010B2FLL APT5010LFLL 500V 46A 0.100 POWER MOS 7 R FREDFET APT51B2FLL APT51LFLL 5V 46A.1 B2FLL Power MOS 7 is a new generation of low loss, high voltage, N-Channel enhancement mode power MOSFETS. Both conduction and switching losses are addressed

More information

MHz. The package options are ceramic/metal flange and pill package. Package Type: , PN: CGHV14250F, CGHV14250P

MHz. The package options are ceramic/metal flange and pill package. Package Type: , PN: CGHV14250F, CGHV14250P CGHV1425 25 W, 12-14 MHz, GaN HEMT for L-Band Radar Systems Cree s CGHV1425 is a gallium nitride (GaN) high electron mobility transistor (HEMT) designed specifically with high efficiency, high gain and

More information

CHAPTER 7 HARDWARE IMPLEMENTATION

CHAPTER 7 HARDWARE IMPLEMENTATION 168 CHAPTER 7 HARDWARE IMPLEMENTATION 7.1 OVERVIEW In the previous chapters discussed about the design and simulation of Discrete controller for ZVS Buck, Interleaved Boost, Buck-Boost, Double Frequency

More information

Absolute Maximum Ratings Parameter Symbol IRF7809A V Units Drain-Source Voltage V DS. 30 V Gate-Source Voltage V GS = 25 C I D

Absolute Maximum Ratings Parameter Symbol IRF7809A V Units Drain-Source Voltage V DS. 30 V Gate-Source Voltage V GS = 25 C I D PD - 95212A IRF7809AVPbF N-Channel Application-Specific MOSFETs Ideal for CPU Core DC-DC Converters Low Conduction Losses Low Switching Losses Minimizes Parallel MOSFETs for high current applications 0%

More information

Super Junction MOSFET

Super Junction MOSFET APT77N6BC6 APT77N6SC6 6V 77A.4Ω CO LMOS Power Semiconductors Super Junction MOSFET Ultra Low R DS(ON) TO-247 Low Miller Capacitance D 3 PAK Ultra Low Gate Charge, Q g Avalanche Energy Rated Extreme dv

More information

MOSFET = 0V, I D. Volts R DS(on) (V GS = 10V, 17.5A) = 500V, V GS = 0V) = 0V, T C = 400V, V GS = 0V) = ±30V, V DS. = 1mA)

MOSFET = 0V, I D. Volts R DS(on) (V GS = 10V, 17.5A) = 500V, V GS = 0V) = 0V, T C = 400V, V GS = 0V) = ±30V, V DS. = 1mA) APT14BLL(G) APT14SLL(G) V A.14 *G Denotes RoHS Compliant, Pb Free Terminal Finish. Power MOS 7 is a new generation of low loss, high voltage, N-Channel enhancement mode power MOSFETS. Both conduction and

More information

SMPS MOSFET. V DSS R DS(on) max I D

SMPS MOSFET. V DSS R DS(on) max I D SMPS MOSFET PD - 9506A IRFR8N5DPbF IRFU8N5DPbF HEXFET Power MOSFET Applications High frequency DC-DC converters Lead-Free l l V DSS R DS(on) max I D 50V 0.25Ω 8A Benefits l Low Gate to Drain Charge to

More information

EPC2014 Enhancement Mode Power Transistor

EPC2014 Enhancement Mode Power Transistor EPC4 EPC4 Enhancement Mode Power Transistor V DSS, V R DS(ON), 6 mw I D, A NEW PRODUCT EFFICIENT POWER CONVERSION HAL Gallium Nitride is grown on Silicon Wafers and processed using standard CMOS equipment

More information

VDS (V) min 650 VTDS (V) max 800 RDS(on) (mω) max* 60. Qrr (nc) typ 136. Qg (nc) typ 28. * Dynamic RDS(on)

VDS (V) min 650 VTDS (V) max 800 RDS(on) (mω) max* 60. Qrr (nc) typ 136. Qg (nc) typ 28. * Dynamic RDS(on) 650V Cascode GaN FET in TO-247 (source tab) Description The TPH3205WSB 650V, 49mΩ gallium nitride (GaN) FET is a normally-off device. Transphorm GaN FETs offer better efficiency through lower gate charge,

More information

Electrical and Thermal Consequences of Non-Flat Impedance Profiles

Electrical and Thermal Consequences of Non-Flat Impedance Profiles DesignCon 2016 Electrical and Thermal Consequences of Non-Flat Impedance Profiles Jae Young Choi, Oracle Jae.young.choi@oracle.com Ethan Koether, Oracle Ethan.koether@oracle.com Istvan Novak, Oracle Istvan.novak@oracle.com

More information

HCI70R500E 700V N-Channel Super Junction MOSFET

HCI70R500E 700V N-Channel Super Junction MOSFET HCI70R500E 700V N-Channel Super Junction MOSFET Features Very Low FOM (R DS(on) X Q g ) Extremely low switching loss Excellent stability and uniformity 100% Avalanche Tested Higher dv/dt ruggedness Application

More information

TPH3205WSB. 650V Cascode GaN FET in TO-247 (source tab)

TPH3205WSB. 650V Cascode GaN FET in TO-247 (source tab) 650V Cascode GaN FET in TO-247 (source tab) Description The TPH3205WSB 650V, 52mΩ gallium nitride (GaN) FET is a normally-off device. Transphorm GaN FETs offer better efficiency through lower gate charge,

More information

UF3C120080K4S. 1200V-80mW SiC Cascode DATASHEET. Description. Features. Typical applications CASE D (1) CASE G (4) KS (3) S (2) Rev.

UF3C120080K4S. 1200V-80mW SiC Cascode DATASHEET. Description. Features. Typical applications CASE D (1) CASE G (4) KS (3) S (2) Rev. 1V-8mW SiC Cascode Rev. A, January 19 DATASHEET UF3C18K4S CASE CASE D (1) Description United Silicon Carbide's cascode products co-package its highperformance F3 SiC fast JFETs with a cascode optimized

More information

IRF130, IRF131, IRF132, IRF133

IRF130, IRF131, IRF132, IRF133 October 1997 SEMICONDUCTOR IRF13, IRF131, IRF132, IRF133 12A and 14A, 8V and 1V,.16 and.23 Ohm, N-Channel Power MOSFETs Features Description 12A and 14A, 8V and 1V r DS(ON) =.16Ω and.23ω Single Pulse Avalanche

More information

EPC2007C Enhancement Mode Power Transistor

EPC2007C Enhancement Mode Power Transistor EPC7C EPC7C Enhancement Mode Power Transistor V DSS, V R DS(on), 3 mw I D, 6 A NEW PRODUCT EFFICIENT POWER CONVERSION HAL Gallium Nitride is grown on Silicon Wafers and processed using standard CMOS equipment

More information

Switch mode power supplies Low gate charge. Power factor correction modules Low intrinsic capacitance

Switch mode power supplies Low gate charge. Power factor correction modules Low intrinsic capacitance Description United Silicon Carbide's cascode products co-package its highperformance F3 SiC fast JFETs with a cascode optimized MOSFET to produce the only standard gate drive SiC device in the market today.

More information

IRF7700GPbF. HEXFET Power MOSFET V DSS R DS(on) max I D

IRF7700GPbF. HEXFET Power MOSFET V DSS R DS(on) max I D l Ultra Low On-Resistance l P-Channel MOSFET l Very Small SOIC Package l Low Profile (

More information

SMPS MOSFET. V DSS R DS(on) max I D

SMPS MOSFET. V DSS R DS(on) max I D Absolute Maximum Ratings SMPS MOSFET Applications l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use l High Frequency Buck Converters for Server Processor

More information

SMPS MOSFET. V DSS R DS(on) max I D

SMPS MOSFET. V DSS R DS(on) max I D SMPS MOSFET PD - 94445 HEXFET Power MOSFET Applications l High frequency DC-DC converters V DSS R DS(on) max I D 50V 85mΩ@V GS = V 2.6A Benefits l Low Gate to Drain Charge to Reduce Switching Losses l

More information

Switch mode power supplies Low gate charge. Power factor correction modules Low intrinsic capacitance

Switch mode power supplies Low gate charge. Power factor correction modules Low intrinsic capacitance Description United Silicon Carbide's cascode products co-package its highperformance F3 SiC fast JFETs with a cascode optimized MOSFET to produce the only standard gate drive SiC device in the market today.

More information

V DSS R DS(on) max I D 80V GS = 10V 3.6A

V DSS R DS(on) max I D 80V GS = 10V 3.6A HEXFET Power MOSFET Applications High frequency DC-DC converters Lead-Free l l V DSS R DS(on) max I D 80V 73m:@ = 0V 3.6A Benefits l Low Gate to Drain Charge to Reduce Switching Losses l Fully Characterized

More information

VDSS (V) 650 V(TR)DSS (V) 800. RDS(on)eff (mω) max* 85. QRR (nc) typ 90. QG (nc) typ 10

VDSS (V) 650 V(TR)DSS (V) 800. RDS(on)eff (mω) max* 85. QRR (nc) typ 90. QG (nc) typ 10 TP65H070L Series 650V GaN FET PQFN Series Preliminary Description The TP65H070L 650V, 72mΩ Gallium Nitride (GaN) FET are normally-off devices. It combines state-of-the-art high voltage GaN HEMT and low

More information

maintaining high gain and efficiency. Package Type: 3x4 DFN PN: CGHV1F025S Parameter 8.9 GHz 9.2 GHz 9.4 GHz 9.6 GHz Units = 37 dbm W

maintaining high gain and efficiency. Package Type: 3x4 DFN PN: CGHV1F025S Parameter 8.9 GHz 9.2 GHz 9.4 GHz 9.6 GHz Units = 37 dbm W Rev.1 July 017 CGHV1F05S 5 W, DC - 15 GHz, 40V, GaN HEMT Cree s CGHV1F05S is an unmatched, gallium nitride (GaN) high electron mobility transistor (HEMT) designed specifically for high efficiency, high

More information

MHz. The package options are ceramic/metal flange and pill package. Package Type: , PN: CGHV14250F, CGHV14250P

MHz. The package options are ceramic/metal flange and pill package. Package Type: , PN: CGHV14250F, CGHV14250P CGHV1425 25 W, 12-14 MHz, GaN HEMT for L-Band Radar Systems Cree s CGHV1425 is a gallium nitride (GaN) high electron mobility transistor (HEMT) designed specifically with high efficiency, high gain and

More information

VDS (V) min 600 VTDS (V) max 750 RDS(on) (mω) max* 180. Qrr (nc) typ 54. * Dynamic R(on)

VDS (V) min 600 VTDS (V) max 750 RDS(on) (mω) max* 180. Qrr (nc) typ 54. * Dynamic R(on) 600V Cascode GaN FET in TO-220 (drain tab) Description The 600V, 150mΩ gallium nitride (GaN) FET is a normally-off device. Transphorm GaN FETs offer better efficiency through lower gate charge, faster

More information

Super Junction MOSFET

Super Junction MOSFET 65V 94A * *G Denotes RoHS Compliant, Pb Free Terminal Finish. CO LMOS Power Semiconductors Super Junction MOSFET T-Max TM Ultra Low R DS(ON) Low Miller Capacitance Ultra Low Gate Charge, Q g Avalanche

More information

HGI290N10SL. Value T C =25 31 Continuous Drain Current (Silicon Limited) I D T C = Drain to Source Voltage. Symbol V DS

HGI290N10SL. Value T C =25 31 Continuous Drain Current (Silicon Limited) I D T C = Drain to Source Voltage. Symbol V DS , HGI29NSL P- Feature High Speed Power Switching, Logic Level Enhanced Body diode dv/dt capability Enhanced Avalanche Ruggedness % UIS Tested, % Rg Tested Lead Free, Halogen Free V N-Ch Power MOSFET V

More information

Linear Derating Factor 17 mw/ C V GS Gate-to-Source Voltage ± 12 V T J, T STG Junction and Storage Temperature Range -55 to C

Linear Derating Factor 17 mw/ C V GS Gate-to-Source Voltage ± 12 V T J, T STG Junction and Storage Temperature Range -55 to C l Ultra Low R DS(on) per Footprint Area l Low Thermal Resistance l P-Channel MOSFET l One-third Footprint of SOT-23 l Super Low Profile (

More information

N & P-Channel 100-V (D-S) MOSFET

N & P-Channel 100-V (D-S) MOSFET N & P-Channel -V (D-S) MOSFET Key Features: Low r DS(on) trench technology Low thermal impedance Fast switching speed Typical Applications: LED Inverter Circuits DC/DC Conversion Circuits Motor drives

More information

SSF6602. Main Product Characteristics. Features and Benefits. Description. Absolute Maximum Ratings (T A =25 C unless otherwise specified)

SSF6602. Main Product Characteristics. Features and Benefits. Description. Absolute Maximum Ratings (T A =25 C unless otherwise specified) Main Product Characteristics D2 S1 V (BR)DSS 30V -30V D1 58mΩ@10V 100mΩ@-10V G2 R DS(on)MAX 95mΩ@4.5V 150mΩ@-4.5V G1 S2 I D 3.5A -2.7A SOT-23-6L Schematic Diagram Features and Benefits Advanced MOSFET

More information

SMPS MOSFET. V DSS R DS(on) max (mω) I D

SMPS MOSFET. V DSS R DS(on) max (mω) I D SMPS MOSFET PD- 94048 IRFR220N IRFU220N HEXFET Power MOSFET Applications l High frequency DC-DC converters V DSS R DS(on) max (mω) I D 200V 600 5.0A Benefits l Low Gate to Drain Charge to Reduce Switching

More information

V DSS R DS(on) max I D

V DSS R DS(on) max I D PD - 95258A IRFL435PbF HEXFET Power MOSFET Applications l High frequency DC-DC converters V DSS R DS(on) max I D 50V 85mW@V GS = V 2.6A Benefits l Low Gate to Drain Charge to Reduce Switching Losses l

More information

Features. Symbol JEDEC TO-204AA GATE (PIN 1)

Features. Symbol JEDEC TO-204AA GATE (PIN 1) Semiconductor BUZB Data Sheet October 998 File Number 9. [ /Title (BUZ B) /Subject A, V,. hm, N- hannel ower OS- ET) /Author ) /Keyords Harris emionducor, N- hannel ower OS- ET, O- AA) /Creator ) /DOCIN

More information

EPC8004 Enhancement Mode Power Transistor

EPC8004 Enhancement Mode Power Transistor Enhancement Mode Power Transistor, V R DS(on), mω, A G D S EFFICIENT POWER CONVERSION HAL Gallium Nitride is grown on Silicon Wafers and processed using standard CMOS equipment leveraging the infrastructure

More information

FREDFET FAST RECOVERY BODY DIODE UNIT V DSS. Volts I D I DM. Watts P D Linear Derating Factor W/ C T J. Amps E AR E AS UNIT BV DSS = 0V, I D

FREDFET FAST RECOVERY BODY DIODE UNIT V DSS. Volts I D I DM. Watts P D Linear Derating Factor W/ C T J. Amps E AR E AS UNIT BV DSS = 0V, I D APTM35JVFR V A.35Ω POWER MOS V FREDFET Power MOS V is a new generation of high voltage N-Channel enhancement mode power MOSFETs. This new technology minimizes the JFET effect, increases packing density

More information

T C =25 unless otherwise specified. Symbol Parameter Value Units V DSS Drain-Source Voltage 40 V

T C =25 unless otherwise specified. Symbol Parameter Value Units V DSS Drain-Source Voltage 40 V 40V N-Channel Trench MOSFET June 205 BS = 40 V R DS(on) typ = 3.3mΩ = 30 A FEATURES Originative New Design Superior Avalanche Rugged Technology Excellent Switching Characteristics Unrivalled Gate Charge

More information

T C =25 unless otherwise specified

T C =25 unless otherwise specified 800V N-Channel MOSFET FEATURES Originative New Design Superior Avalanche Rugged Technology Robust Gate Oxide Technology Very Low Intrinsic Capacitances Excellent Switching Characteristics Unrivalled Gate

More information

HRLD150N10K / HRLU150N10K 100V N-Channel Trench MOSFET

HRLD150N10K / HRLU150N10K 100V N-Channel Trench MOSFET HRLD15N1K / HRLU15N1K 1V N-Channel Trench MOSFET FEATURES Originative New Design Superior Avalanche Rugged Technology Excellent Switching Characteristics Unrivalled Gate Charge : 8 nc (Typ.) Extended Safe

More information

Approved (Not Released) V DSS R DS(on) max Qg. 30V 3.5mΩ 36nC

Approved (Not Released) V DSS R DS(on) max Qg. 30V 3.5mΩ 36nC Approved (Not Released) PD - TBD Applications l Optimized for UPS/Inverter Applications l Low Voltage Power Tools Benefits l Best in Class Performance for UPS/Inverter Applications l Very Low RDS(on) at

More information

New Designs. Not Recommended for. 4V Drive Nch MOSFET RSD050N06. Data Sheet. 1/ Rev.B. Dimensions (Unit : mm)

New Designs. Not Recommended for. 4V Drive Nch MOSFET RSD050N06. Data Sheet. 1/ Rev.B. Dimensions (Unit : mm) 4V Drive Nch MOSFET RSD050N06 Structure Silicon N-channel MOSFET Features ) Low on-resistance. 2) Fast switching speed. 3) Drive circuits can be simple. 3) Parallel use is easy. Applications Switching

More information

HCA80R250T 800V N-Channel Super Junction MOSFET

HCA80R250T 800V N-Channel Super Junction MOSFET HCA80R250T 800V N-Channel Super Junction MOSFET Features Very Low FOM (R DS(on) X Q g ) Extremely low switching loss Excellent stability and uniformity 100% Avalanche Tested Application Switch Mode Power

More information

SMPS MOSFET. V DSS R DS(on) max I D

SMPS MOSFET. V DSS R DS(on) max I D PD - 95355A SMPS MOSFET IRFR5N20DPbF IRFU5N20DPbF HEXFET Power MOSFET Applications High frequency DC-DC converters Lead-Free l l V DSS R DS(on) max I D 200V 65Ω 7A Benefits Low Gate-to-Drain Charge to

More information

Second Generation egan FETs are Lead Free and Offer Improved Performance Alex Lidow, CEO, Efficient Power Conversion Corporation

Second Generation egan FETs are Lead Free and Offer Improved Performance Alex Lidow, CEO, Efficient Power Conversion Corporation Second Generation egan FETs are Lead Free and Offer Improved Performance Alex Lidow, CEO, Efficient Power Conversion Corporation EFFICIENT POWER CONVERSION Since March, 11 Efficient Power Conversion Corporation

More information

IRF9910PbF HEXFET Power MOSFET R DS(on) max

IRF9910PbF HEXFET Power MOSFET R DS(on) max Applications l Dual SO-8 MOSFET for POL converters in desktop, servers, graphics cards, game consoles and set-top box l Lead-Free S Benefits l Very Low R DS(on) at 4.5V l Low Gate Charge l Fully Characterized

More information

SMPS MOSFET. V DSS R DS(on) typ. I D

SMPS MOSFET. V DSS R DS(on) typ. I D Absolute Maximum Ratings SMPS MOSFET PD 93923B IRFPS40N50L Applications HEXFET Power MOSFET l Switch Mode Power Supply (SMPS) l UninterruptIble Power Supply V DSS R DS(on) typ. I D l High Speed Power Switching

More information

IRFR24N15DPbF IRFU24N15DPbF

IRFR24N15DPbF IRFU24N15DPbF PD - 95370B IRFR24N5DPbF IRFU24N5DPbF Applications l High frequency DC-DC converters HEXFET Power MOSFET S R DS(on) max I D 50V 95mΩ 24A Benefits l Low Gate-to-Drain Charge to Reduce Switching Losses l

More information

SMPS MOSFET. V DSS R DS(on) max I D

SMPS MOSFET. V DSS R DS(on) max I D Absolute Maximum Ratings SMPS MOSFET Applications l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use l High Frequency Buck Converters for Server Processor

More information

SMPS MOSFET. V DSS R DS(on) max I D

SMPS MOSFET. V DSS R DS(on) max I D PD - 95353A SMPS MOSFET IRFR12N25DPbF IRFU12N25DPbF HEXFET Power MOSFET Applications High frequency DC-DC converters Lead-Free l l V DSS R DS(on) max I D 250V 0.26Ω 14A Benefits Low Gate-to-Drain Charge

More information

transistor is available in a flange and pill package. Package Types: & PN s: CGH40045F & CGH40045P

transistor is available in a flange and pill package. Package Types: & PN s: CGH40045F & CGH40045P Rev 4.0 - May 2015 CGH40045 45 W, DC - 4 GHz RF Power GaN HEMT Cree s CGH40045 is an unmatched, gallium nitride (GaN) high electron mobility transistor (HEMT). The CGH40045, operating from a 28 volt rail,

More information

New Designs. Not Recommended for. 4V Drive Pch MOSFET. Data Sheet RSD140P06. 1/ Rev.A. Dimensions (Unit : mm)

New Designs. Not Recommended for. 4V Drive Pch MOSFET. Data Sheet RSD140P06. 1/ Rev.A. Dimensions (Unit : mm) 4V Drive Pch MOSFET RSD4P6 Structure Silicon P-channel MOSFET Features ) Low on-resistance. 2) Fast switching speed. 3) Drive circuits can be simple. 4) Parallel use is easy. Application Switching Packaging

More information

SMPS MOSFET. V DSS Rds(on) max I D

SMPS MOSFET. V DSS Rds(on) max I D Applications Switch Mode Power Supply ( SMPS ) Uninterruptable Power Supply High speed power switching Lead-Free Benefits Low Gate Charge Qg results in Simple Drive Requirement Improved Gate, Avalanche

More information

V DSS R DS(on) max I D

V DSS R DS(on) max I D PD - 95514A IRFR34PbF IRFU34PbF HEXFET Power MOSFET Applications High frequency DC-DC converters Lead-Free l l V DSS R DS(on) max I D V 39mΩ 31A Benefits Low Gate-to-Drain Charge to Reduce Switching Losses

More information

VDS (V) min 650 VTDS (V) max 800 RDS(on) (mω) max* 130. Qrr (nc) typ 54. * Dynamic R(on)

VDS (V) min 650 VTDS (V) max 800 RDS(on) (mω) max* 130. Qrr (nc) typ 54. * Dynamic R(on) 650V Cascode GaN FET in TO-220 (source tab) Description The TPH3208PS 650V, 110mΩ gallium nitride (GaN) FET is a normally-off device. Transphorm GaN FETs offer better efficiency through lower gate charge,

More information

GS66516B Bottom-side cooled 650 V E-mode GaN transistor Preliminary Datasheet

GS66516B Bottom-side cooled 650 V E-mode GaN transistor Preliminary Datasheet Features 650 V enhancement mode power switch Bottom-side cooled configuration R DS(on) = 25 mω I DS(max) = 60 A Ultra-low FOM Island Technology die Low inductance GaNPX package Easy gate drive requirements

More information

V DSS R DS(on) max Qg. 30V 4.8m: 15nC

V DSS R DS(on) max Qg. 30V 4.8m: 15nC PD - 9623 Applications l Optimized for UPS/Inverter Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification

More information

TPH3212PS. 650V Cascode GaN FET in TO-220 (source tab)

TPH3212PS. 650V Cascode GaN FET in TO-220 (source tab) 650V Cascode GaN FET in TO-220 (source tab) Description The TPH3212PS 650V, 72mΩ gallium nitride (GaN) FET is a normally-off device. Transphorm GaN FETs offer better efficiency through lower gate charge,

More information

High Voltage Pulser Circuits By Ching Chu, Sr. Applications Engineer

High Voltage Pulser Circuits By Ching Chu, Sr. Applications Engineer High Voltage Circuits By Ching Chu, Sr. Applications Engineer AN-H53 Application Note Introduction The high voltage pulser circuit shown in Figure 1 utilizes s complementary P- and N-channel transistors

More information

VDS (V) min 600 VTDS (V) max 750 RDS(on) (mω) max* 63. Qrr (nc) typ 136. * Dynamic R(on)

VDS (V) min 600 VTDS (V) max 750 RDS(on) (mω) max* 63. Qrr (nc) typ 136. * Dynamic R(on) 600V Cascode GaN FET in TO-247 (source tab) Not recommended for new designs see TP65H050WS Description The TPH3205WS 600V, 52mΩ gallium nitride (GaN) FET is a normally-off device. Transphorm GaN FETs offer

More information

HCD80R1K4E 800V N-Channel Super Junction MOSFET

HCD80R1K4E 800V N-Channel Super Junction MOSFET HCD80R1K4E 800V N-Channel Super Junction MOSFET Features Very Low FOM (R DS(on) X Q g ) Extremely low switching loss Excellent stability and uniformity 100% Avalanche Tested Application Switch Mode Power

More information

CGH40120P. 120 W, RF Power GaN HEMT FEATURES APPLICATIONS

CGH40120P. 120 W, RF Power GaN HEMT FEATURES APPLICATIONS Rev 3.1 - November 2017 CGH40120P 120 W, RF Power GaN HEMT Cree s CGH40120P is an unmatched, gallium nitride (GaN) high electron mobility transistor (HEMT). The CGH40120P, operating from a 28 volt rail,

More information

V DSS R DS(on) max (mw)

V DSS R DS(on) max (mw) Typical Applications Relay replacement Anti-lock Braking System Air Bag Benefits Advanced Process Technology Ultra Low On-Resistance Fast Switching Repetitive Avalanche Allowed up to Tjmax AUTOMOTIVE MOSFET

More information

V DSS R DS(on) max Qg (typ.) 30V GS = 10V 57nC

V DSS R DS(on) max Qg (typ.) 30V GS = 10V 57nC PD - 97407 Applications l Optimized for UPS/Inverter Applications l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use l Power Tools HEXFET Power MOSFET

More information

AOP608 Complementary Enhancement Mode Field Effect Transistor

AOP608 Complementary Enhancement Mode Field Effect Transistor AOP68 Complementary Enhancement Mode Field Effect Transistor General Description The AOP68 uses advanced trench technology MOSFETs to provide excellent and low gate charge. The complementary MOSFETs may

More information

Bias Stress Testing of SiC MOSFETs

Bias Stress Testing of SiC MOSFETs Bias Stress Testing of SiC MOSFETs Robert Shaw Manager, Test and Qualification August 15 th, 2014 Special thanks to the U.S. Department of Energy for funding this under SBIR DE-SC0011315. Outline Objectives

More information

V DSS R DS(on) max I D. 20V GS = 10V 8.9A. 71 P A = 25 C Power Dissipation 2.0 P A = 70 C Power Dissipation Linear Derating Factor

V DSS R DS(on) max I D. 20V GS = 10V 8.9A. 71 P A = 25 C Power Dissipation 2.0 P A = 70 C Power Dissipation Linear Derating Factor Applications Dual SO-8 MOSFET for POL converters in desktop, servers, graphics cards, game consoles and set-top box PD - 95858A IRF895 HEXFET Power MOSFET V DSS R DS(on) max I D 20V 8.3m:@V GS = V 8.9A

More information

SMPS MOSFET. V DSS R DS(on) max I D. Absolute Maximum Ratings Symbol Parameter Max 20 V V GS A I DM. 90 W P A = 70 C Maximum Power Dissipation e

SMPS MOSFET. V DSS R DS(on) max I D. Absolute Maximum Ratings Symbol Parameter Max 20 V V GS A I DM. 90 W P A = 70 C Maximum Power Dissipation e l High Frequency Buck Converters for Computer Processor Power l 0% R G Tested l Lead-Free Benefits l Ultra-Low R DS(on) l Very Low Gate Impedance l Fully Characterized Avalanche Voltage and Current SMPS

More information

HCS65R110FE (Fast Recovery Diode Type) 650V N-Channel Super Junction MOSFET

HCS65R110FE (Fast Recovery Diode Type) 650V N-Channel Super Junction MOSFET HCS65R110FE (Fast Recovery Diode Type) 650V N-Channel Super Junction MOSFET Features Very Low FOM (R DS(on) X Q g ) Extremely low switching loss Excellent stability and uniformity 100% Avalanche Tested

More information

C Soldering Temperature, for 10 seconds 300 (1.6mm from case )

C Soldering Temperature, for 10 seconds 300 (1.6mm from case ) Advanced Process Technology Dynamic dv/dt Rating 75 C Operating Temperature Fast Switching Fully Avalanche Rated Lead-Free G PD - 94822 IRFZ44EPbF HEXFET Power MOSFET D S V DSS = 60V R DS(on) = 0.023Ω

More information

IRF7338. HEXFET Power MOSFET. Ultra Low On-Resistance Dual N and P Channel MOSFET Surface Mount Available in Tape & Reel.

IRF7338. HEXFET Power MOSFET. Ultra Low On-Resistance Dual N and P Channel MOSFET Surface Mount Available in Tape & Reel. PD - 94372C HEXFET Power MOSFET l l l l Ultra Low On-Resistance Dual N and P Channel MOSFET Surface Mount Available in Tape & Reel S G S2 N-CHANNEL MOSFET 8 2 7 3 6 D D D2 N-Ch P-Ch DSS 2-2 G2 4 5 P-CHANNEL

More information

HP4410DY. Features. 10A, 30V, Ohm, Single N-Channel, Logic Level Power MOSFET. Symbol. Ordering Information. Packaging

HP4410DY. Features. 10A, 30V, Ohm, Single N-Channel, Logic Level Power MOSFET. Symbol. Ordering Information. Packaging HP441DY Data Sheet August 1999 File Number 4468.4 1A, 3V,.135 Ohm, Single N-Channel, Logic Level Power MOSFET This power MOSFET is manufactured using an innovative process. This advanced process technology

More information

VDSS (V) 650 V(TR)DSS (V) 800 RDS(on)eff (mω) max* 60. QRR (nc) typ 136. QG (nc) typ 28 VIN=230VAC; VOUT=390VDC VIN=380VDC; VOUT=240VAC

VDSS (V) 650 V(TR)DSS (V) 800 RDS(on)eff (mω) max* 60. QRR (nc) typ 136. QG (nc) typ 28 VIN=230VAC; VOUT=390VDC VIN=380VDC; VOUT=240VAC 650V GaN FET in TO-247 (source tab) Description The TPH3205WSB 650V, 49mΩ Gallium Nitride (GaN) FET is a normally-off device. It combines state-of-the-art high voltage GaN HEMT and low voltage silicon

More information

V DSS R DS(on) max (mω)

V DSS R DS(on) max (mω) PD- 94094 IRF7325 HEXFET Power MOSFET Trench Technology Ultra Low On-Resistance Dual P-Channel MOSFET Low Profile (

More information

APT80SM120B 1200V, 80A, 40mΩ

APT80SM120B 1200V, 80A, 40mΩ V, A, mω Package Silicon Carbide N-Channel Power MOSFET TO-247 DESCRIPTION Silicon carbide (SiC) power MOSFET product line from Microsemi increase your performance over silicon MOSFET and silicon IGBT

More information

SYNCHRONOUS RECTIFIER SURFACE MOUNT (SMD-2) 60V, N-CHANNEL. Absolute Maximum Ratings PD-94401B

SYNCHRONOUS RECTIFIER SURFACE MOUNT (SMD-2) 60V, N-CHANNEL. Absolute Maximum Ratings PD-94401B PD-9440B RAD-HARD SYNCHRONOUS RECTIFIER SURFACE MOUNT (SMD-2) 60V, N-CHANNEL Product Summary Part Number Radiation Level RDS(on) QG 00K Rads (Si) 6.mΩ 60nC IRHSLNA53064 300K Rads (Si) 6.mΩ 60nC IRHSLNA54064

More information

GS66516B Bottom-side cooled 650 V E-mode GaN transistor Preliminary Datasheet

GS66516B Bottom-side cooled 650 V E-mode GaN transistor Preliminary Datasheet Features 650 V enhancement mode power switch Bottom-side cooled configuration R DS(on) = 25 mω I DS(max) = 60 A Ultra-low FOM Island Technology die Low inductance GaNPX package Easy gate drive requirements

More information

Top View DFN5X6D PIN1 V DS V GS I D I DM I DSM I AS. 100ns V SPIKE 31 P D 12 P DSM. Junction and Storage Temperature Range T J, T STG

Top View DFN5X6D PIN1 V DS V GS I D I DM I DSM I AS. 100ns V SPIKE 31 P D 12 P DSM. Junction and Storage Temperature Range T J, T STG AON697 3V Dual Asymmetric N-Channel AlphaMOS General Description Latest Trench Power AlphaMOS (αmos LV) technology Very Low R DS (on) at 4.5V GS Low Gate Charge High Current Capability RoHS and Halogen-Free

More information

HCS80R1K4E 800V N-Channel Super Junction MOSFET

HCS80R1K4E 800V N-Channel Super Junction MOSFET HCS80R1K4E 800V N-Channel Super Junction MOSFET Features Very Low FOM (R DS(on) X Q g ) Extremely low switching loss Excellent stability and uniformity 100% Avalanche Tested Application Switch Mode Power

More information

LoadSlammer User Guide LS50 and LS1000

LoadSlammer User Guide LS50 and LS1000 LoadSlammer User Guide LS50 and LS1000 1 CONTENTS 2 Introduction... 2 2.1 Overview... 2 2.2 Hardware... 2 2.3 Specifications LS50... 3 2.4 Specifications LS1000... 4 3... 5 3.1 Physical Connection to DUT...

More information

SMPS MOSFET. V DS 200 V V DS (Avalanche) min. 260 V R DS(ON) 10V 54 m: T J max 175 C TO-220AB. IRFB38N20DPbF

SMPS MOSFET. V DS 200 V V DS (Avalanche) min. 260 V R DS(ON) 10V 54 m: T J max 175 C TO-220AB. IRFB38N20DPbF Applications High frequency DC-DC converters Plasma Display Panel Lead-Free l l l SMPS MOSFET Benefits l Low Gate-to-Drain Charge to Reduce Switching Losses l Fully Characterized Capacitance Including

More information

5.0V 5.0V. 20µs PULSE WIDTH Tj = 25 C. Tj = 150 C. V DS, Drain-to-Source Voltage (V) T J = 150 C 1.5. V GS, Gate-to-Source Voltage (V)

5.0V 5.0V. 20µs PULSE WIDTH Tj = 25 C. Tj = 150 C. V DS, Drain-to-Source Voltage (V) T J = 150 C 1.5. V GS, Gate-to-Source Voltage (V) 9MT050XF "FULL-BRIDGE" FREDFET MTP HEXFET Power MOSFET Features Low On-Resistance High Performance Optimised Built-in Fast Recovery Diodes Fully Characterized Capacitance and Avalanche Voltage and Current

More information