Data Sheet. MGA GHz WiMAX Power Amplifier Module. Features. Description. At 2.5 GHz (BCTRL = 2.8 V) Functional Block Diagram

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1 MGA WiMAX Power Amplifier Module Data Sheet Description Avago Technologies MGA-223 power amplifier module is designed for mobile and fixed wireless data applications in the 2.5 to frequency range. The aggressive gain shape limits the noise injected into radio receivers colocated in the same device. The PA is optimized for IEEE WiMAX modulation but can be used for any high linearity applications. The PA exhibits flat gain and good match while providing linear power efficiency to meet stringent mask conditions. It utilizes Avago Technologies proprietary GaAs Enhancement-mode phemt technology for superior performance across voltage and temperature levels. The MGA-223 is packaged in a 3 x 3 x 1 mm package for space-constrained applications. Functional Block Diagram RFIN 1 16 VCC VCC Features Advanced GaAs E-pHEMT 5 all RF ports 25dB gain step in low power mode with reduced Idsq Integrated CMOS compatible pins for shutdown and low power mode 3 to 5 V supply Adjustable bias current with BCTRL pin Small size: 3 x 3 x 1 mm Stable under all loads or conditions C to +85 C operation At (BCTRL = 2.8 V) Gain of 34 db PAE of 21% at SEM compliant Pout = Meets masks at Pout, 16 QAM WiMAX with 3.3 V and 437 ma 16 QAM WiMAX EVM < -32 db (2.5%) at Low power Idd, 85 ma at Pout = dbm 2 3 ISMN BIAS NETWORK OMN RFOUT 11 Applications Portable WiMAX applications with stringent coexistence requirements Package Diagram BCTRL 4 BSPLY 5 BSW PMOD N/C N/C 9 RFIN 1 VCC1 VCC RFOUT 4 NC BSPLY BSW PAMOD NC BCTRL 19

2 Electrical ifications Absolute Minimum and Maximum Ratings Table 1. Minimum and Maximum Ratings Parameter ifications Description Pin Min. Max. Unit Comments Supply Voltage VCC1 5.5 V VCC2 Bias Supply BSPLY V Bias Control BCTRL V Bias ON/OFF BSW V Mode Control PAMOD V RF Input Power RFIN 15 dbm Using 16 QAM ¾ MSL MSL3 Channel Temperature 15 C Storage Temperature C Table 2. Recommended Operating Range Parameter ifications Description Pin Min. Typical Max. Unit Comments Supply Voltage VCC V VCC2 Bias Supply BSPLY V 13 ma Bias Control BCTRL V.7 A Bias ON/OFF BSW V 7 ua Mode Control PAMOD V 17 A RF Output Power RFOUT dbm Using 16 QAM ¾ Frequency Range 2.5 Thermal Resistance, ch-b 23.4 C/W Channel to board Case Temperature +85 C 2

3 WiMAX (82.16e) Electrical ifications All data measured on an FR4 demo board at Vcc1 = Vcc2 = 3.3 V, BCTRL = 2.8 V, Tc = 25 C, 5 at all ports. Unless otherwise specified, all data is taken with OFDM 16-QAM ¾ convolutional coding modulated signal per IEEE 82.16e with MHz BW operating over the BW of to. Table 3. RF Electrical Characteristics Parameter Performance Min. Typical Max. Unit Comments Input Return Loss - db Gain Flatness 1 db Over any MHz Gain Variation (V CC) -1 1 db 3 V to 5 V High EVM -34 db Vcc = 3.3 V Power Vcc = 3.6 V Mode 5.5 MHz -13 dbm/ khz IBW = khz 6.5 MHz -13 dbm/mhz IBW = 1 MHz MHz MHz MHz MHz -37 Pout (SEM Compliant) e Total DC Current 437 ma Pout = Gain db Low EVM -36 db Pout = dbm Power Gain Step db Mode Total DC Current 85 ma Pout = dbm P1dB 31 dbm CW Single Tone Psat 32 dbm CW Single Tone 2fo -36 dbm/mhz Settling Time.2.5 S Icc leakage current 4 A Max current specified at 85 C Noise Power in Cell Band -146 dbm/hz Noise Power in GPS Band -149 dbm/hz Noise Power in PCS -144 dbm/hz 3

4 Selected performance plots EVM [db] EVM Frequency Sweep (Vcc = 3. to 5. V) Tambient = 25 C and Pout = 3V 3V3 3V6 4V2 5V EVM [db] EVM Frequency Sweep (Vcc = 3. to 5. V) Tambient = 25 C and Pout = 26 dbm 3V3 3V6 4V2 5V Frequency [MHz] Figure 1. EVM Frequency Sweep at 25 C and Pout = over Vcc Frequency [MHz] Figure 2. EVM Frequency Sweep at 25 C and Pout = 26 dbm over Vcc EVM [db] Frequency [MHz] Figure 3. EVM Frequency Sweep at Vcc = 3.3 V and Pout = over Tambient EVM [db] EVM Frequency Sweep (Tambient = C to +85 C) Vcc = 3.3 V and Pout = EVM Power Sweep (Freq = 2.5 to ) Tambient = C and Vcc = 3.3 V C 25 C +85 C Figure 5. EVM Power Sweep at Vcc = 3.3 V and C over Frequency EVM [db] EVM Power Sweep (Freq = 2.5 to ) Tambient = 25 C and Vcc = 3.3V Figure 4. EVM Power Sweep at Vcc = 3.3 V and 25 C over Frequency EVM [db] EVM Power Sweep (Freq = 2.5 to ) Tambient = +85 C and Vcc = 3.3 V Figure 6. EVM Power Sweep at Vcc = 3.3 V and +85 C over Frequency 4

5 Gain [db] Gain Frequency Sweep (Vcc = 3. to 5. V) Tambient = 25 C and Pout = Figure 7. Gain Frequency Sweep at 25 C and Pout = over Vcc Gain [db] Gain Power Sweep (Freq = 2.5 to ) Tambient = 25 C and Vcc = 3.3V Figure 9. Gain Power Sweep at Vcc = 3.3 V and 25 C over Pout 3V 3V3 3V6 4V2 5V Frequency [MHz] Gain [db] Gain Frequency Sweep (Tambient = C to +85 C) Vcc = 3.3 V and Pout = Frequency [MHz] Figure 8. Gain Frequency Sweep at Vcc = 3.3 V and Pout = over Tambient Gain [db] Gain Power Sweep (Freq = 2.5 to ) Tambient = C and Vcc = 3.3 V Figure. Gain Power Sweep at Vcc = 3.3 V and C over Pout C 25 C +85 C Gain [db] Gain Power Sweep (Freq = 2.5 to ) Tambient = +85 C and Vcc = 3.3 V Figure 11. Gain Power Sweep at Vcc = 3.3 V and +85 C over Pout 5

6 Itotal [A] Total Current Frequency Sweep (Vcc = 3. to 5. V) Tambient = 25 C and Pout = Figure 12. Total Current Frequency Sweep at 25 C and Pout = over Vcc Itotal [A] Frequency [MHz] Total Current Power Sweep (Freq = 2.5 to ) Tambient = 25 C and Vcc = 3.3 V 3V 3V3 3V6 4V2 5V Figure 14. Total Current Power Sweep at 3.3 V and 25 C over Frequency Itotal [A] Total Current Frequency Sweep (Tambient = C to +85 C) Vcc = 3.3 V and Pout = Frequency [MHz] Figure 13. Total Current Frequency Sweep at 3.3 V and Pout = over Tambient Itotal [A] C 25 C +85 C Total Current Power Sweep (Freq = 2.5 to ) Tambient = C and Vcc = 3.3 V Figure 15. Total Current Power Sweep at 3.3 V and C over Frequency Itotal [A] Total Current Power Sweep (Freq = 2.5 to ) Tambient = +85 C and Vcc = 3.3 V Figure 16. Total Current Power Sweep at 3.3 V and +85 C over Frequency 6

7 - WiMAX trum Emission Mask, 82.16e (16QAM ¾) Pout =, Vcc = 3.3 V and Tambient = 25 C Figure 17. SEM Frequency Sweep at Vcc = 3.3 V and 25 C (2 db Post-PA loss - WiMAX trum Emission Mask, 82.16e (16QAM ¾) Pout =, Vcc = 4.2 V and Tambient = 25 C Figure 19. SEM Frequency Sweep at Vcc = 4.2 V and 25 C (2 db Post-PA loss - WiMAX trum Emission Mask, 82.16e (16QAM ¾) Pout =, Freq = and Tambient = 25 C 3V 3V3 3V6 4V2 5V Figure 21. SEM at Vcc = 3.3 V, 25 C and over Vcc (2 db Post-PA loss - WiMAX trum Emission Mask, 82.16e (16QAM ¾) Pout =, Vcc = 3.6 V and Tambient = 25 C Figure 18. SEM Frequency Sweep at Vcc = 3.6 V and 25 C (2dB Post-PA loss - WiMAX trum Emission Mask, 82.16e (16QAM ¾) Pout =, Freq = and Tambient = 25 C Figure. SEM at Vcc = 3.3 V, 25 C and over Vcc (2dB Post-PA loss - 3V 3V3 3V6 4V2 5V WiMAX trum Emission Mask, 82.16e (16QAM ¾) Pout =, Freq = and Tambient = 25 C 3V 3V3 3V6 4V2 5V Figure 22. SEM at Vcc = 3.3 V, 25 C and over Vcc (2dB Post-PA loss 7

8 - WiMAX trum Emission Mask, 82.16e (16QAM ¾) Vcc = 3.3 V, Freq = and Tambient = C Figure 23. SEM at Vcc = 3.3 V, C and over Vcc (2 db Post-PA loss - WiMAX trum Emission Mask, 82.16e (16QAM ¾) Vcc = 3.3 V, Freq = and Tambient = C Figure 25. SEM at Vcc = 3.3 V, C and over Vcc (2 db Post-PA loss - WiMAX trum Emission Mask, 82.16e (16QAM ¾) Vcc = 3.3 V, Freq = and Tambient = 25 C Figure 27. SEM at Vcc = 3.3 V, 25 C and over Vcc (2 db Post-PA loss - WiMAX trum Emission Mask, 82.16e (16QAM ¾) Vcc = 3.3 V, Freq = and Tambient = C Figure 24. SEM at Vcc = 3.3 V, C and over Vcc (2 db Post-PA loss - WiMAX trum Emission Mask, 82.16e (16QAM ¾) Vcc = 3.3 V, Freq = and Tambient = 25 C Figure 26. SEM at Vcc = 3.3 V, 25 C and over Vcc (2 db Post-PA loss WiMAX trum Emission Mask, 82.16e (16QAM ¾) Vcc = 3.3 V, Freq = and Tambient = 25 C Figure 28. SEM at Vcc = 3.3 V, 25 C and over Vcc (2 db Post-PA loss 8

9 - WiMAX trum Emission Mask, 82.16e (16QAM ¾) Vcc = 3.3 V, Freq = and Tambient = 85 C Figure 29. SEM at Vcc = 3.3 V, +85 C and over Vcc (2 db Post-PA loss - WiMAX trum Emission Mask, 82.16e (16QAM ¾) Vcc = 3.3 V, Freq = and Tambient = 85 C Figure 31. SEM at Vcc = 3.3 V, +85 C and over Vcc (2 db Post-PA loss - WiMAX trum Emission Mask, 82.16e (16QAM ¾) Vcc = 3.3 V, Freq = and Tambient = 85 C Figure. SEM at Vcc = 3.3 V, +85 C and over Vcc (2 db Post-PA loss 9

10 Evaluation Board Description Table 4. Pin Description: Top Pin No. Function Bottom Pin No. Function 1 VCC2 2 VCC2 3 B_SPLY 4 5 VCC1 6 7 NC 8 9 PAMOD 11 NC NC 14 B_SW 15 B_CTRL NC NC Recommended turn on sequence Apply VCC1 and VCC2 Apply BSPLY Apply BCTRL Apply BSW For HPM Apply PAMOD HI For LPM Apply PAMOD LO Apply RF Input not to exceed 15 dbm Turn off in reverse order Table 5. Typical Test Conditions: Pin HPM LPM VCC1, V 3.3 V Supply Voltage PAMOD 1.8 V V Low Power Mode B_SPLY 3.3 V 3.3 V Bias Voltage B_CTRL 2.8 V 2.8 V Bias Control B_SW 1.8 V 1.8 V PA Enable Notes: VCC1, VCC2 and B_SPLY can be tied together to reduce supply voltages, but B_CTRL needs to be a regulated voltage which is optimized for 2.8 V at Vcc of 3.3 V. Other bias points are described under flexible BCTRL optimization section. Demoboard Top Pins Demoboard Bottom Pins

11 Application Circuit MGA-223 Vdd1 Vdd2 47 F.1 F pf F F pf 16 VCC VCC2 13 RF In 1 RF In 2 12 RF Out 11 RF Out BCTRL 3 4 BCTRL NC 9.1 F pf pf 5 BSPLY 6 BSW 7 PAMOD 8 NC pf pf BSPLY BSW PAMOD Using 3.3 V or 5 V Supply and connecting Vcc1, Vcc2, BSLPY and BCTRL Vbat Vcc1 Vcc2 BSPLY R 1 R 2 BCTRL Notes: BCTRL regulates the device current, thus R1 and R2 should have good tolerance rating. If available, a voltage regulator is the preferred method of bias. In this example we set R2 at MOhm and solve for R1 with simple voltage divider equation. Use high resistance values to limit leakage current. 3.3 V Example: Given: 5. V Example: Given: R V BCTRL = 2 *V BATT R 1 + R 2 M 2.85 V = *3.3 V R 1 + M R 1 = M V BCTRL = 2.85 V V BAT = 3.3 V R 2 = M R 1 =? R V BCTRL = 2 *V BATT R 1 + R 2 M 2.85 V = *5. V R 1 + M R 1 = 7.54 M V BCTRL = 2.85 V V BAT = 5. V R 2 = M R 1 =? R 2 = M R 2 = M 11

12 Land Pattern 3.±. 3.±. 3.±. 1.5±. RFIN ±. BCTRL VCC VCC RFOUT NC.±. 3.±. RFIN VCC1 1.6± VCC2 13 BCTRL RFOUT NC.±..55±. BSPLY BSW PAMOD NC.±. Top view through package.±..55±. BSPLY BSW PAMOD NC Top view through package.4±..65±. Figure 32. Recommended footprint Figure 33. Recommended soldermask opening 3.±. 3.±. 1.5±. RFIN BCTRL 4.15±. VCC1 VCC2 1.5± BSPLY BSW PAMOD NC RFOUT 9 NC.±..±..±. Notes: 1. All units are in millimeters 2. Package is symmetrical Figure 34. Package dimensions Top view through package 12

13 Handling and Storage Typical SMT Reflow Profile for Maximum Temperature = 26+/-5 C tp T P RAMP UP CRITICAL ZONE T L TO T P TEMPERATURE T L Ts max Ts min t L ts PREHEAT RAMP DOWN 25 t 25 C TO PEAK TIME Profile Feature Sn-Pb Solder Pb-Free Solder Average ramp-up rate (TL to TP) 3 C/sec max 3 C/sec max Preheat Temperature Min (Tsmin) Temperature Max (Tsmax) Time (mon to max) (ts) C 15 C 6-1 sec C 15 C 6-18 sec Tsmax to TL Ramp-up Rate 3 C/sec max Time maintained above: Temperature (TL) Time (TL) 183 C 6-15 sec 217 C 6-15 sec Peak temperature (Tp) 24 +/-5 C 26 +/-5 C Time within 5 C of actual Peak Temperature (tp) sec sec Ramp-down Rate 6 C/sec max 6 C/sec max Time 25 C to Peak Temperature 6 min max 8 min max MGA-223 Part Number Ordering Information Part Number Devices Per Container Container MGA-223-BLKG 7 Reel MGA-223-TR1G 13 Reel 13

14 Tape and Reel Information For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright 511 Avago Technologies. All rights reserved. AV2-2812EN - June 28, 11