unless otherwise noted) Symbol Parameter Ratings Units Drain Current Continuous (Note 1a) 8.8 Pulsed 50 (Note 1b) 1.2 (Note 1c) 1

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1 P-Channel Enhancement Mode Field Effect Transistor General Description This P-Channel MOSFET is a rugged gate version of MOS-TECH Semiconductor s advanced PowerTrench process. It has been optimized for power management applications requiring a wide range of gave drive voltage (4.5V - 25V). Features 8.8 A, 3 V R DS(ON) = 2 m = V R DS(ON) = 35 m VGS = 4.5 V Low gate charge (7nC typical) Fast switching speed High performance trench technology for extremely low R DS(ON) High power and current handling capability Application Power management Load switch Battery protection Absolute Maximum Ratings(TA =25 unless otherwise noted) D D D D S S S G SO-8 Symbol Parameter Ratings Units V DSS Drain-Source Voltage 3 V S Gate-Source Voltage ±25 V I D Drain Current Continuous (Note a) 8.8 Pulsed 5 A P D Power Dissipation for Single Operation (Note a) 2.5 (Note b).2 (Note c) T J, T STG Operating and Storage Junction Temperature Range 55 to +75 C Thermal Characteristics R θja Thermal Resistance, Junction-to-Ambient (Note a) 5 C/W R θja Thermal Resistance, Junction-to-Ambient (Note c) 25 C/W R θjc Thermal Resistance, Junction-to-Case (Note ) 25 C/W Package Marking and Ordering Information Device Marking Device Reel Size Tape width Quantity 3 2mm 25 units W

2 Electrical Characteristics T A = 25 C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BV DSS Drain Source Breakdown Voltage = V, I D = 25 μa 3 V ΔBVDSS Breakdown Voltage Temperature I ΔT J Coefficient D = 25 μa, Referenced to 25 C 2 mv/ C I DSS Zero Gate Voltage Drain Current V DS = 24 V, = V μa I GSSF Gate Body Leakage, Forward = 25 V, V DS = V na I GSSR Gate Body Leakage, Reverse = 25 V, V DS = V na On Characteristics (Note 2) (th) Gate Threshold Voltage V DS =, I D = 25 μa.7 3 V ΔVGS(th) Gate Threshold Voltage ΔT J Temperature Coefficient I D = 25 μa, Referenced to 25 C 5 mv/ C R DS(on) Static Drain Source = V, I D = 8.8 A 5 2 mω On Resistance = 4.5 V, I D = 6.7 A = V, I D = 8.8A, T J=25 C 9 32 I D(on) On State Drain Current = V, V DS = 5 V 5 A g FS Forward Transconductance V DS = 5 V, I D = 8.8 A 24 S Dynamic Characteristics C iss Input Capacitance V DS = 5 V, = V, 64 pf C oss Output Capacitance f =. MHz 48 pf Reverse Transfer Capacitance 22 pf C rss Switching Characteristics (Note 2) t d(on) Turn On Delay Time V DD = 5 V, I D = A, 3 23 ns t r Turn On Rise Time = V, R GEN = 6 Ω ns t d(off) Turn Off Delay Time ns t f Turn Off Fall Time 25 4 ns Q g Total Gate Charge V DS = 5 V, I D = 8.8 A, 7 24 nc Q gs Gate Source Charge = 5 V 5 nc Q gd Gate Drain Charge 6 nc Drain Source Diode Characteristics and Maximum Ratings I S Maximum Continuous Drain Source Diode Forward Current 2. A V SD Drain Source Diode Forward Voltage = V, I S = 2. A (Note 2).73.2 V Notes:. R θja is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R θjc is guaranteed by design while R θca is determined by the user's board design. a) 5 C/W when mounted on a in 2 pad of 2 oz copper b) 5 C/W when mounted on a.4 in 2 pad of 2 oz copper c) 25 C/W when mounted on a minimum pad. Scale : on letter size paper 2. Pulse Test: Pulse Width < 3μs, Duty Cycle < 2.%

3 Typical Characteristics -I D, DRAIN CURRENT (A) = -V -6.V -4.5V V -4.V -3.5V -3.V R DS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE =-4.5V -4.5V -5.V -6.V -7.V -8.V -V 2 3 -V DS, DRAIN TO SOURCE VOLTAGE (V) I D, DRAIN CURRENT (A) Figure. On-Region Characteristics. Figure 2. On-Resistance Variation with Drain Current and Gate Voltage. R DS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE I D = -8.8A = -V T J, JUNCTION TEMPERATURE ( o C) R DS(ON), ON-RESISTANCE (OHM).7 I D = -4.4A T A = 25 o C.3.2 T A = 25 o C , GATE TO SOURCE VOLTAGE (V) Figure 3. On-Resistance Variation with Temperature. Figure 4. On-Resistance Variation with Gate-to-Source Voltage. -I D, DRAIN CURRENT (A) V DS = -5V T A = -55 o C 25 o C 25 o C -I S, REVERSE DRAIN CURRENT (A)... =V T A = 25 o C 25 o C -55 o C , GATE TO SOURCE VOLTAGE (V) V SD, BODY DIODE FORWARD VOLTAGE (V) Figure 5. Transfer Characteristics. Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature.

4 Typical Characteristics -, GATE-SOURCE VOLTAGE (V) V I D = -8.8A DS = -5V -V 8-5V Q g, GATE CHARGE (nc) CAPACITANCE (pf) C OSS C ISS f = MHz = V C RSS V DS, DRAIN TO SOURCE VOLTAGE (V) Figure 7. Gate Charge Characteristics. Figure 8. Capacitance Characteristics. -I D, DRAIN CURRENT (A).. R DS(ON) LIMIT = -V SINGLE PULSE R θja = 25 o C/W T A = 25 o C μ s ms ms ms s s DC. -V DS, DRAIN-SOURCE VOLTAGE (V) P(pk), PEAK TRANSIENT POWER (W) SINGLE PULSE R θja = 25 C/W T A = 25 C... t, TIME (sec) Figure 9. Maximum Safe Operating Area. Figure. Single Pulse Maximum Power Dissipation. r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE.. D = SINGLE PULSE R θja(t) = r(t) + R θja R θja = 25 o C/W TJ - TA = P * R θja(t) Duty Cycle, D = t / t t, TIME (sec) Figure. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note c. Transient thermal response will change depending on the circuit board design. P(pk) t t2

5 5

6 ELECTRO MAGN ETI C, MAG NETIC O R R ADIO ACTIVE FI ELD S TNR DATE PT NUMBER PEEL STRENGTH MIN gms MAX gms SOIC-8 Tape and Reel Data SOIC(8lds) Packaging Configuration: Figure. ELECTROSTATIC SENSITIVE DEVICES DO NO T SHI P OR STO RE N EAR STRO NG ELECTROSTATIC ESD Label Antistatic Cover Tape Packaging Description: SOIC-8 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped with 2,5 units per 3" or 33cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (antistatic coated). Other option comes in 5 units per 7" or 77cm diameter reel. This and some other options are further described in the Packaging Information table. Static Dissipative Embossed Carrier Tape These full reels are individually barcode labeled and placed inside a standard intermediate box (illustrated in figure.) made of recyclable corrugated brown paper. One box contains two reels maximum. And these boxes are placed inside a barcode labeled shipping box which comes in different sizes depending on the number of parts shipped. ACTR Label Customized Label SOIC (8lds) Packaging Information Pin Packaging Option Packaging type Standard (no flow code) ACTR L86Z Rail/Tube F TNR D84Z TNR SOIC-8 Unit Orientation Qty per Reel/Tube/Bag 2,5 95 4, 5 Reel Size 3" Dia - 3" Dia 7" Dia Box Dimension (mm) 343x64x343 53x3x83 343x64x343 Max qty per Box 5, 3, 8, 84x87x47, Weight per unit (gm) Weight per Reel (kg) Note/Comments 343mm x 342mm x 64mm Standard Intermediate box ACTR Label sample Label ACTR Label ESD Label XH ACTR 25 QTY: 25 XH2 C97H22K2--K43 P6756 SPEC: -MOS-TECH SEMICONDUCTOR LTD- SOIC(8lds) Tape Leader and Trailer Configuration: Figure 2. Carrier Tape Cover Tape Trailer Tape 64mm minimum or 8 empty pockets Components Leader Tape 68mm minimum or 2 empty pockets

7 SOIC-8 Tape and Reel Data, continued SOIC(8lds) Embossed Carrier Tape Configuration: Figure 3. T P D E F K Wc B E2 W Tc A P D User Direction of Feed Dimensions are in millimeter Pkg type A B W D D E E2 F P P K T Wc Tc SOIC(8lds) (2mm) 6.5 +/ / / / / /-..25 min 5.5 +/ / / / / / /-.2 Notes: A, B, and K dimensions are determined with respect to the EIA/Jedec RS-48 rotational and lateral movement requirements (see sketches A, B, and C). 2 deg maximum.5mm maximum B Typical component cavity center line.5mm maximum 2 deg maximum component rotation Sketch A (Side or Front Sectional View) Component Rotation SOIC(8lds) Reel Configuration: Figure 4. A Sketch B (Top View) Component Rotation Typical component center line Sketch C (Top View) Component lateral movement W Measured at Hub Dim A Max Dim A max Dim N 7" Diameter Option See detail AA B Min Dim C See detail AA W3 Dim D min 3" Diameter Option W2 max Measured at Hub DETAIL AA Tape Size Reel Option Dimensions are in inches and millimeters Dim A Dim B Dim C Dim D Dim N Dim W Dim W2 Dim W3 (LSL-USL) 2mm 7" Dia / / / / mm 3" Dia / / / /

8 Notes regarding these materials. This document is provided for reference purposes only so that customers may select the appropriate products for their use. neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of or any third party with respect to the information in this document. 2. shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any products listed in this document, please confirm the latest product information with a sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by such as that disclosed through our website. ( ) 5. has used reasonable care in compiling the information included in this document, but assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document. 6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability of such information to the intended application. makes no representations, warranties or guaranties regarding the suitability of its products for any particular application and specifically disclaims any liability arising out of the application and use of the information in this document or products. 7. With the exception of products specified by as suitable for automobile applications, products are not designed, manufactured or tested for applications or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication transmission. If you are considering the use of our products for such purposes, please contact a sales office beforehand. shall have no liability for damages arising out of the uses set forth above. 8. Notwithstanding the preceding paragraph, you should not use products for the purposes listed below: () artificial life support devices or systems (2) surgical implantations (3) healthcare intervention (e.g., excision, administration of medication, etc.) (4) any other purposes that pose a direct threat to human life shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use products in any of the foregoing applications shall indemnify and hold harmless Technology Corp., its affiliated companies and their officers, directors, and employees against any and all damages arising out of such applications. 9. You should use the products described herein within the range specified by, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. shall have no liability for malfunctions or damages arising out of the use of products beyond such specified ranges.. Although endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you.. In case products listed in this document are detached from the products to which the products are attached or affixed, the risk of accident such as swallowing by infants and small children is very high. You should implement safety measures so that products may not be easily detached from your products. shall have no liability for damages arising out of such detachment. 2. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from. 3. Please contact a sales office if you have any questions regarding the information contained in this document, semiconductor products, or if you have any other inquiries.

9 Cutions ( Keep safety first in your circuit designs!. Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.

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