High speed laser machining using polygon scanner technology. Ronny De Loor CEO, Next Scan Technology

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1 High speed laser machining using polygon scanner technology Ronny De Loor CEO, Next Scan Technology

2 Overview Company introduction Polygon scanner system Applications Future developments

3 Mission statement Next Scan Technology delivers novel scanning solutions to enable highest processing speed

4 Value proposition Introduced fast (polygon) scanner technology to laser processing market Today this solution delivers times more throughput in dedicated applications Technology is similar to desktop laser printers but tailored for: Very high laser pulse power handling Very high resolution and accuracy High quality spot size Sophisticated laser/scanner synchronisation

5 Team knowhow NST High throughput OEM systems Drum scanners offset print, flexo, PCB Scan area : up to 1600 x 2400 mm Resolution : DPI Multi-beam : Flatbed laser printers offset print, PCB Scan area : up to 1350 x 2000 mm Repetition acc. : < 3 µm 10µm : > 200 m/s Pixel speed : up to 150 Mpxl/sec UV, 355 nm, 457 x 610 mm Gemini PCB resist writer Installed base > units

6 Company Fact Sheet Next Scan Technology B.V. The Netherlands Founded 2010 by Lars Penning & Ronny De Loor Next Scan Technology bvba Belgium, Ghent (2013)* Activities (8 FTE, Belgium): R&D Production Demo & test services * New build facilities 700m² 1 hour drive to IMEC, 1.5 hour Eindhoven

7 Technology Custom patent pending 2 mirror diffraction limited design Scan line always perpendicular on the substrate Spot is round and constant along scanned path Line straightness within ± 5 um* Handling both IR and GR in one design Proprietary modulation and laser/scanner synchronization for high repeatibility Multiplier in throughput by: polygon (speed) scan optics (size) * Line distortion mirror optics First product LSE170 delivers a full telecentric scan line of 170 mm Concept launch at PW2014 Two additional scan formats: LSE050 & LSE300 GateMaster Modulation TrueRaster Positioning

8 Technology trade-off Laser beam Vacuum chuck Y- d Fast X movement by polygon stage Slow Y movement by stage or web Speed : max m/s Speed : m/s (constant) >>100 m/s possible Scan field* : limited up to 100 mm Scan field : up to 300 mm without stitching Spot size : down to 7 um (355 nm) * Full telecentric processing f-theta lens > 100 mm deliver less scan efficiency and limit small spot size processing

9 Next Scan Technology controller synchronises laser, scanner, stage and pattern data transfer.

10 How to operate A rectangular region (bitmap) is formed by equally spaced parallel lines (line spacing) Higher rep rate or less scan speed gives: spot overlap (lines) or spot spacing (holes) (multi pass) line scanning enables high speed processing for applications like: Laser patterning Surface texturing High density Hole Drilling Grooving & Dicing 2.5D Micromachining HOWEVER...

11 Timing jitter & SuperSync 1 Mhz Pulse Repetition Rate at 100 m/s gives a spot positioning error of 100 um Bitmap pattern No SuperSync Multi-pass operation at 100 m/s SuperSync Multi-pass operation at 100 m/s SuperSync is a electronic solution to reduce timing jitter of pulsed lasers* SuperSync enables < 3 µm spot positioning error or repetition accuracy * certified laser interface needed

12 SuperSync Interface Proprietary synchronization method for pulsed lasers Required for 'synchronised skywriting' Specific daughterboard Available for Time Bandwidth PicoBlade TRUMPF TruMicro AMPHOS Amplitude Systemes Lumera HyperRapid IPG In validation Ekspla, OneFive, EdgeWave, Eolite Spectra Physics, Coherent, Menlo Systems PolarOnyx, Attodyne

13 Processing quality Uncontrolled processing quality at ramp up/down Improved quality at constant speed with existing timing jitter Highest quality at constant speed through eliminated timing jitter Courtesy Bern University Applied Sciences: Research by B. Neuenschwander/B. Jäggi/M. Zimmerman

14 Applications Customers are system integrators and high tech production companies in: Display: patterning, texturing Semicon: microdrilling, grooving & dicing Security: perforation, micromachining Automotive: patterning, micromachining Medical: microdrilling, micromachining Technology validation in all domains

15 Demo & Application Lab Next Scan Technology (B) Lumera HyperRapid 50W 2 MHz PRR External Multi MHz in development Time Bandwidth (CH) Time Bandwidth PicoBlade 50W ~ 4 MHz PRR (8 MHz) Bern University (CH) Time Bandwidth Fuego 50W ~ 4 MHz PRR (8 MHz) Amplitude Satsuma 20W 3 MHz PRR USA & ASIA Work in Progress

16 On site testing Process Development Kit Compact lab-ready set up Easy commissioning Installation & operator training Bitmap raster scan training course Evaluation and suggestions for future improvements on performance Rental and buy solution

17 Surface processing Apply any texture 100 meters/sec is 400 lines/sec Linear speed stage is 1 cm/s at 25 um Surface speed is 17 cm²/sec at 4 MHz Multi-pass for 'deeper' structures Applications Thin film patterning High throughput marking Volume ablation (holes/slots) Additive printing (LIFT, STL) Annealing, LLO

18 Wafer processing Scribing, grooving and dicing Speed set by PRR and spot spacing Linear stage in stepping mode or moves at constant speed with TrueRaster Technology* Application example - 2 MHz PRR - 25 um spot spacing - 50 meters/sec (200 lines/sec) - 40 passes/kerf - 3 kerfs/second * Release Q3 2014

19 High Density Hole Drilling Low PRR with high pulse energy Percussion drilling by SuperSync Scan speed to separate the holes Stage in stepping mode Application example Khz PRR um spot spacing through 100 meters/sec is 400 lines/sec passes per hole is 4 lines/sec - 6 inch board is 600 holes per line at 4 lines/sec is > holes per second

20 2.5 D Micromachining Each layer is processed by different bitmap Spot overlap and PRR set the scan speed Stage in constant speed mode Application example - dimensions 108 x 65 mm MHz PRR* - scan speed 59,45 m/s um spot spacing (1.750 dpi) - 24 seconds per layer different layers - Maximum depth about 100 um This work was supported by the FP7 project APPOLO and executed by B. Neuenschwander/B. Jäggi/M. Zimmerman * TimeBandwidth FUEGO 50 W

21 Outlook 2014 LSE050 and LSE300 UV mirror optics Higher NA for smaller spot sizes GateMaster Modulation for CW and ns pulsed fiber lasers TrueRaster Positioning for absolute accuracy* Multi-beam scanning technology for unparalleled precision and highest throughput * Line straightness ± 1 um No more pyramidical error