ICALEO 2007, October 29 November 1, Hilton in the WALT DISNEY WORLD Resort, Orlando, FL, USA

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1 WHAT IS THE BEST CHOICE FOR LASER MATERIAL PROCESSING ROD, DISK, SLAB OR FIBER? Paper 201 Erwin Steiger Erwin Steiger LaserService, Graf-Toerring-Strasse 68, Maisach, Bavaria, 82216, Germany Abstract Laser material processing for industrial manufacturing applications is today a widely spread procedure for welding, cutting, marking and micro-machining of metal and plastic parts and components. With the invent of new and alternative laser sources like the fiber laser discussions have emerged which of the solid-state laser sources rod, disk, slab or fiber is best suited for all these laser procedures. It will be shown on selected laser-processed examples that the laser source itself is often not the decisive part for the final result. Material properties also play an important role, especially when slightly modified to special laser parameters. disk or fiber is best suited for all laser material procedures outlined in figure 1. After a review of the most important laser material processing parameters in view of these solid-state laser configurations two major application areas will be shown in detail : laser marking and laser cutting. Introduction Since the first laser demonstration by Theodore Maiman in 1960 researchers and engineers have eagerly looked for practical applications of this coherent radiation source in new material processing and manufacturing procedures that couldn t be performed with the existing technologies. In 1989 the worldwide sales of laser systems for material processing exceeded the 1 billion Euro level for the first time with up and downs in the following decades. In 2006 the value toped to 6.1 billion Euro with an ongoing upward trend. 70% of the 2006 worldwide sold laser systems for material processing were used for welding, cutting, marking and engraving procedures, 23% for micro-machining and 7% for other macro-machining applications (Figure 1). Although the old CO 2 laser still is the workhorse in the material processing area especially in the power range over 500 W new solid-state laser systems, either flashlamp- or diode-pumped rod and slab systems or diode-pumped disk and fiber laser configurations are gaining ground in the low, medium and high power regime [1-6]. In the course of this development and with the invent of new and alternative solid-state laser sources discussions have emerged which of the laser configuration rod, slab, Figure 1: Laser systems for material processing : Worldwide sales 2006 Processing Parameters Relevant For Rod, Slab, Disk Or Fiber Lasers Table 1 shows a survey of the most important laser material processing parameters that must be considered before performing a specific processing task with one of the four laser configurations. The laser wavelength (UV, Visible, Near IR) strongly determines the starting point of the process and is responsible how much of the power or energy of the laser system is reflected, absorbed or scattered. With the onset of a surface plasma the parameter wavelength is no longer of importance due to the wavelength-independent energy absorption process. Page 1 of 6

2 Table 1: Important laser material processing parameters Laser Material Processing Parameter Wavelength Peak Power Pulse Duration Beam Quality (M 2 / BPP) Repetition Rate Scan Speed Material Properties The laser peak power and the pulse duration, directly correlated to the peak power, are the most important laser processing parameters to be considered. They determine if material is ablated, melted or only heated. In nonthermal laser marking without carbonisation or in engraving applications a high peak power is absolutely necessary when choosing a special laser configuration. A laser beam delivering the same pulse energy shows a complete different effect on the target if the peak power is either high or low compared to the threshold for material processing. But even if the peak power of two laser systems may be nearly in the same range the pulse shape could also be quite different. Figure 2 shows the pulse shape of the SPI Lasers model G2-20W, figure 3 that of the IPG Photonics model YLP 1/100/20 for different repetition rates, but both with an average power of 20 W. The two different pulse shapes lead to completely different processing results and target impressions. The laser beam quality defined by the beam quality factor (M 2 ) and the beam parameter product (BPP) directly relates to the degree the laser beam can be focused. This also determines the power or energy density on the target surface as will be shown later. Table 2 shows BPP values for rod, slab, disk and fiber laser systems at the same wavelength in the cw power output range of 1 4 kw [7]. It is obvious that fiber lasers can be focused to a much smaller spot size with the same lens than all other laser configurations even the disk configuration. Nevertheless, the BPP of fiber lasers increases linear with the core diameter of the active part as shown in figure 4. With a linear fit the BPP increases by 0,04 mm x mrad per µm core diameter. Therefore only single-mode fiber laser systems with core diameters around 10 µm can be focused to very small spot sizes. Figure 2: Pulse shape of fiber laser G2-20W (SPI Lasers) for different repetition rates Figure 3: Pulse shape of fiber laser YLP 1/100/20 (IPG Photonics) for different repetition rates Table 2: BPP values for the different laser configurations in the power range 1 4 kw Configuration BPP (mm x mrad) Rod / Slab Disk Fiber < The repetition rate strongly influences the peak power and the pulse duration (see figure 2 and 3). With higher repetition rates the peak power reduces drastically as well as the possible energy per pulse defined by the maximum average power of the laser system. Figure 5 demonstrates the parameter ranges for the peak power, the pulse duration and the repetition rate of two fiber Page 2 of 6

3 ICALEO 2007, October 29 November 1, 2007 laser systems (SPI Lasers: SP-20P, IPG Photonics: YLP 1/100/20) and a diode-pumped rod laser system (Quanta System: FORMULA F2), all with a maximum average power of 20 W. The SP-20P shows the highest possible repetition rate whereas the FORMULA F2 shows the highest peak power of all systems, nearly ten times larger than the best fiber laser. The diodepumped rod laser also shows the best M2 value : 1.2 (IPG: 1.6, SPI: 20W. The scan speed is a measure for the process duration at a specific material thickness. Figure 6 shows the measured cutting speed for a fiber, disk and rod laser system, respectively, at an output power of 1 kw versus the material thickness (always the same material). Due to the much better beam quality of the fiber laser compared to the rod laser the cutting speed of the fiber laser is nearly 4 times as fast at a material thickness of 0.5 mm. The thicker the material the less pronounced is the cutting speed difference between the three laser configurations. The disk laser is only remarkably faster than the rod laser for a material thickness < 1 mm. For the same laser source (fiber) the cutting speed relates nearly linear to the output power at a fixed focal spot size (Figure 7). Figure 4: BPP of fiber laser systems versus active core diameter Figure 6: Cutting speed of different laser configurations at 1kW output versus material thickness Figure 5: Parameter ranges for different laser configurations For the best marking results, for example, the user therefore must define an appropriate combination of energy and pulse duration at a determined repetition rate for a given average power ( working window ) for his processing task, either to engrave, ablate, change colour or anneal. Figure 7: Cutting speed of a fiber laser with different output powers versus material thickness Page 3 of 6

4 The last very important laser material processing parameter is the material property itself. Transmission, reflection and scattering of the laser radiation, heat conduction, melting and transition points and numerous other material properties can even play a much more pronounced influence on the process result than a specific laser configuration. Process Examples PC with 0.2% Lazerflair 825 (Figure 9) and PA with 0.3% Lazerflair 830 (Figure 10), respectively. A unique set of laser parameters (repetition rate, pulse energy, scan speed) defines the best transparent/black or black/white contrast for each material. Other additives in the formulation such as stabilizers, flame retardants or fillers can additionally effect the final marking result. Marking The marking of manufactured goods has become a standard feature either for security reasons or traceability purposes. (Figure 8). However, the majority of plastics, either transparent, white, coloured or black, cannot be marked economically with adequate or high contrast results for reading with special image processing devices. To improve the markability of difficult to mark plastics like PE, ABS, PA or PC laser-active pigments in low volume concentrations are added to the plastic batch (e.g. Lazerflair of company Merck). Depending on the type of plastic, the absorption of the laser radiation results either in carbonisation or foaming of the surrounding polymer. By varying the pigment concentration or by adding different pigments the polymer reaction can be influenced and is, except of the laser wavelength, not dependant on the specific laser configuration mentioned above. Figure 9: Marked PC with 0.2% Lazerflair 825 Figure 10: Marked PA with 0.3% Lazerflair 830 Figure 8: Marked plastic parts Lazerflair 830, for example, has a black pigment colour, Lazerflair 825 a transparent blue grey impression. Figures 9 and 10 show the marking results with a Nd:YAG rod laser at 1064 nm at fixed marking speed for each formulation and a focal spot size of 55 µm as a function of repetition rate and pulse energy for Cutting In industrial cutting processes of metal sheets a very high power density is necessary to machine metals at high cutting speeds, even at a material thickness larger than 3 mm. Figure 6 has displayed measured cutting speeds of fiber, disk and rod laser systems at 1kW Page 4 of 6

5 output power for a material thickness up to 2 mm. At given spot sizes of 75µm, 112 µm and 225 µm this transforms to power densities of 0.28 MW/cm 2, 0.10 MW/cm 2 and MW/cm 2, respectively, at the target surface. Compared to the rod laser the fiber laser has a ten times higher power density which is responsible for the fast cutting speeds to machine thin metal sheets, e.g. stencils. At a smaller spot size below 10 µm the power density of fiber lasers exceed 100 MW/cm 2 at output powers of only 200 W. Figure 11 demonstrates the calculated power density of fiber lasers up to 200 W focused by a lens with either long (100 mm) or short (50 mm) focal length and spot sizes of 29.4 µm or 7.3 µm, respectively. Together with the very small BPP values (see Table 2) the fiber laser also has the largest focal depth for the different laser machining processes. Figure 12 shows an enlarged SEM picture of a medical stent machined with a 100 W fiber laser of SPI Lasers before polishing. Obvious is the extreme smooth cutting impression even at the side walls of the round and straight webs. Figure 12: SEM picture of a fiber laser machined medical stent (SPI Lasers) Figure 11: Calculated power density of fiber laser systems versus laser output power and spot size Although the BPP values of rod and slab laser systems are much larger than the fiber laser values it is also possible with a flashlamp-pumped pulsed Nd:YAG rod laser to receive excellent cutting results on metal sheets made of CuBe, CuSn, CrNi or pure copper with material thickness up to 3 mm. Figure 13 shows the cutting result of these metals with a repetition rate of Hz and a pulse duration in the range of µs for the rod laser system. Only the thickest part shows some debris at the backside, the thinner parts were perfectly cut. Figure 13: Copper, brass and stainless steel samples cut with a flashlamp-pumped pulsed Nd:YAG rod laser Summary What is now the best choice for laser material processing rod, disk, slab or fiber? In view of the foregoing discussion about the influence of all the laser material processing parameters that must be considered in a laser machining process and the examples shown for marking and cutting the answer is : The application will decide what the best laser configuration really is. And last but not least the customer will decide in view of system and running costs what his personally best choice will be. Page 5 of 6

6 References [1] Giesen, A. et al (2007) Thin-disk lasers come of age, Photonics Spectra, May, [2] Giesen, A. et al (1994) Scalable concept for diode-pumped high-power solid-state lasers, Applied Physics B 58, [3] Di Teodoro, F., Brooks, C.D. (2006) Fiber sources reach multimegawatt peak power in ns pulses, Laser Focus World, November, [4] Hummelt, G. (2006) TEM 00 cw green laser source is a powerful tool, Laser Focus World, August, [5] Hansen, K.P., Broeng, J. (2006) High-power photonic crystal fiber lasers, Photonics Spectra, May, [6] Hoult, T. et al (2006) Micro-processing with Fiber Lasers, ICALEO 2006, Scottsdale, USA [7] Shiner, B. (2005) Fiber Lasers: Emerging in Major Market, The 2005 Photonics Handbook, H-235 Meet The Author The author has more than 25 years industrial experience in solid-state laser technology and applications like laser welding, cutting, drilling, marking and micro-processing. He worked for laser companies like Dornier MedTech, Baasel LaserTech (Rofin/Baasel) and Unitek Miyachi. He is now a consultant for laser material processing technologies. Winner of the Photonics Circle of Excellence Award Page 6 of 6

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