Since

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1 Since

2 Advanced Laserr Technology at KORTherm Science S Since founded in 1999 we put our endeavor into building a specialized business, focusing on the application of lasers and NANO/MEMS with high hest quality. quality With the laser micro-machining system and LD laser system at our research center, we have been dedicating ourselves to develop a total laser solution such as solar cell scribing, hole drilliing, laser patterning, welding, and grooving tools. As one of the leading laser system integrators of ph hotovoltaic industry, we promise to provide the best products worldwide with respect to value, performa ance, range, and efficiency. Thanks to ceaseless encouragement from our cusstomers and partners over the world, we have greatly achieved so much success to place KORTherm m among the best companies in the laser micromachining sector. By responding to our customer's needs more proactively with continuous efforts in R&D and management innovation, we will keep growing to be the world's leading company in the laser micromachining g sector. Sincerely, Ju-Sam Byeon, CEO 2

3 Contribution to green industry through our technology and experience we have accumulated. Leaping to the best enterprise in order to make better world. Creation of value through technical t renovation. Solar cell c Pattern ning Laser Cutting FPD Medical Device ELA Laser Drilling Laser Patterning Marking Scribing 3

4 HISTORY µ-solar, a solar cell scribing tool, has been launched Currently developing a laser water-jet production technology. Headquarter moved to Bupyeong, Incheon. Uniquely deveoped proprietary software Head office moved to Seoul. 10th anniversary Selected as an INNO-BIZ Z company in response to innovation technology technology. esearch Set up the center of the re institute for laser application technology. ng Developed laser patternin technology for large sized d glass Developed KOS series: laser micro machining system Founded at Saha-Gu, Busan,Korea.

5 PRODCUCT LINE Advanced Laser Technology KOS LP Series The KOS LP Series are large flat panel multipurpose laser cutting systems built from state of the art technology. These systems are equipped with a high power energy-efficient DPSS laser and advanced linear motion control platform. μ-combo µ-combo is a compact and versatile laser micromachining tool with multiple wavelengths applying to drilling, scribing and cutting operations, specifically designed for the development of high- precision micromachining applications. KOS Ablator Series The KOS Ablator Series are designed to cut the wafer with a high powered and energy efficient DPSS laser. Compared to other laser cutting machine, the KOS Ablator offers a lighter weight design and the fastest cutting speed. μ-solar μ-solar provides ideal solutions for photovoltaic cell production with a high-precision laser technology. KORTherm Science offers a range of powers and frequencies of micromachining systems for scribing of accurate and small width of line patterning (30~50 um). With the appropriate choice of lasers, this system provides users with powerful solution for Si wafer and thin-film solar cell production. Laser Diode System We produce Laser Diode System (LDS) with UV, visible, and IR wavelength. Especially, current and temperature controller can offer laser power up to 10W and wavelength with promising high current and temperature stability. 5

6 KOS LP Series Micromachining Tool for Large Area Laser processing of display devices The KOS LP is an ideal laser micromachining system to pattern various kinds of materials. It has been specially developed by KORTherm in order to meet the demanding challenges of large area tools for in-line: LCD, PDP, OLED, and a solar cell line. The KOS LP has reduced running costs with a high efficiency. Coping with the various requirements, we are always ready to follow up the customer s needs whatever it takes. Less than 20um band scribing Raster scanning to cover large areas with micro-structures Automatically loading/unloading This tool comes with robot loading and manual sheet loading. High speed processing more than 1200mm/s Alternative tool replacing chemica al process KOS LP Series can scribe glass panel and thin film with a high speed. Auto alignment system High resolution alignment optics module corrects the glass panel position. KOS LP Series use angular offset spatially. Customized beam relay and homogenization optics Air-floating chuck system When patterning the large area with KOS LP Series, thin film (metal, organic, TCO etc.) on the substrate can be processed through the air floating chuck and the air base clamp. 6

7 Large substrate capability Microstructuring and selective ablation Micro-drilling and engraving PDP/LCD panel cutting Environmentally friendly process High accuracy Advanced optical technique transports the high quality laser beam incident on the solar cell substrate. Work piece Laser Wavelength Cooling Line Width Stage Resolution Processing Speed Power Consumption Up to 10G sized panel DPSS / Excimer 355, 532, 1064nm Air / Water 5~100μm Conveyor / Air floating 0.5 um More than 1200mm/s 6.0 kva Processed Material Dimension Weight ITO, metal, Si, ceramic, GaAs etc mm x 4000 mm x 2000mm (5G) 4800 kg (5G) 7

8 µ-combo Dual Laser Microprocessing System Dual laser stand alone system for R&D µ-combo is a compact and versatile laser micromachining tool with multiple wavelengths applying to drilling, scribing and cutting operations. Specifically designed for the development of high-precisionh ii micromachining i applications, it can be implemented in R&D environment as a stand-alone system. The µ-combo machining tool covers a range of micro sized materials on glass including metal, Si, polymer etc. High quality processing Proven laser technologies guarantee high precision processing. µ-combo has high speed scribing more than 1200mm/s. Ultra thin substrates t (less than 5um) can be processed. Dual laser tool Multi leveled layers can be processed with both diode pumped laser and excimer laser µ-combo fits with both a solid-state laser and a high pulsed repetition rate of excimer laser. Polymer masters for replication in metal. Auto alignment with spatial and angular offset A dual vision system makes easier to align offset. Software An easy-to-use Windows user interface enables rapid and powerful control of the operation of the µ-combo. 8

9 Dual laser systems with various applications 3D manufacturing Laser hole drilling and engravingg Solar cell scribing Wafer / PCB/ metal cutting Single step process (eliminating complex lithography) ITO layer on polyester substrate Work piece Laser Wavelength Cooling Line Width Resolution Processing Speed Power Consumption Cutting Thickness Dimension(mm) Weight 300mm (12 inches) DPSS, Excimer 193, 248, 266, 355, 532, 1064 nm Air / Water 5~100um 0.5 um More than 1200 mm/sec 6.0 kva ~50um 1800 x 1700 x 2000(mm) 1800 kg 9

10 KOS Ablator Series Laser Ablating System High-precision and powerful laser method for wafer-cutting! KOS Ablator Series provide ideal solutions for ultra-thin wafers with a high-precision laser technology created by KORTherm Science. With a dual vision system, KOS Ablator Series recognize the state-of-the-art alignment together with a high performance stage. The visualized software designed to control all units makes it possible to cut curvilinear shape as well as process 3D structures including trenches in controlled depth. The KOS Ablator also gives better performance in damages for patterned materials on glass than Blade dicing. TheKOSAblator is a laser-based micromachining tool specifically designed for the rapid removal of thin layers of material from wafer in a chemical-free and single-state process. Improved dicing speed The KOS Ablator Series recognize high speed cutting for 200µm thickness at a speed than 500mm/s Improved yield As the wafer is cut internally by avoiding any damage to the wafer surface, the KOS Ablator minimizes chipping/cracking on the bottom surface of the wafer and improves flexural strength and tact in the die bonding process as well as contributes to better yield. High reliability When irradiating the reverse side with a lase er, the wafer can be conveyed by support handing. Low cost of ownership No use of blades reduces the running costs, and labor is not required for blade replacement and quality control of blade wear and tear. 10

11 High precision i and powerful meth od for cutting and dicing i Plastic/Fabric cutting Metal cutting PCB cutting Glass cutting Ceramic cutting Flex circuit machining Wafer Size Laser Wavelength Cooling Line Width Resolution Processing Speed Power Consumption Assist Gas Pressure Cutting Thickness Dimension Weight 300mm (12 inches) DPSS / Fiber laser 266, 355, 532, 1064nm Air / water Less than 50um 0.5 um More than 500 mm/sec 6.0 kva < 0.7 Mpa Up to 300μm 1800 mm x 1600 mm x 1900mm 1800 kg 11

12 µ-solar Laser Solar Cell Scribing Tool Laser scribing tool for silicon based solar cell µ-solar provides us with ideal solutions for photovoltaic cell production with a high-precision laser technology. KO ORTherm Science offers a range of powers and frequencies of micromachining systems for scribing of accurate and small width of line patterning (30 ~50 um). With the appropriate choice of lasers, this system provides users with powerful solutions for Si wafer and thin-film solar cell production. The visualized software designed to co ontrol all units makes it possible to process line shape as well as edge isolation. µ-solar also provides us with the low damage and low cost during wafer/thin film patterning process compared with lithography /etching process. High quality processing Solar cell scribing thin layers High speed scribing up to 800mm/s of c-si and thin films Large throughput Faster scribing than chemical process µ-solar is able to scribe wafer/glass of thickness 100um or thinner at a speed of 800mm/s, contributing significantly to improved throughput Improved yield As wafers are scribing internally, µ-solar avoids damage on the wafer surface and chipping on the bottom surface of the wafer. Wafer s support handling helps loading time Low cost of ownership 12

13 Powerful laser method for photo ovoltaic c-si Edge Isolation c-si Wafer Marking V-shape Grooving on Wafer Laser Drilling for Back-Contact Ce ell Design Laser Fired Contact Si- wafer Patterning CIGS/CIS Patterning Glass Cutting Customized optics shape, homogenise and transport the laser beam for optimum fiber exposure illumination Wafer Size Laser Wavelength Cooling Line Width Resolution Processing Speed Power Consumption Dimension Weight Up to 210mm x 210mm DPSS / Fiber laser 355, 532, 1064nm Air / Water 20 ~ 50um 0.5 um More than 1200 mm/sec 6.0 kva 1800 mm x 1600 mm x 1900mm 1800 kg 13

14 Laser Diode Driver Bench-top Laser Diode Current and Temperature Controller By improving both the current and temperature stability, it becomes small and light-weighed powered laser diode light source. With our advanced laser technology for a decade, we have access to both expertise and processes that allow us to create unique and cost effective solutions for our standard products as well as our OEM partners. Applications Solid-state laser pumping Medical/ Ophthalmic Fiberoptic communication Beacons Scientific experimentation Industrial Specifications Current control characteristics Current control Drive current Analog modulation Current display resolution Constant current mode with analog modulation DC 1.5A, 5A, 10A, 20A, 50A External input 0.1mA, 1 ma, 5mA, 10mA Temperature control characteristics Temperature control Temperature monitor I.C. sensor for temperature display Temperature display resolution TEC Currents PID control Internal thermistor LM35D(Accuracy@25 : ±1.0 ) 0.1 ±4A 14

15 Laser Diode System Bench-top Laser Diode Current and Temperature Controller KORTherm Science produces Laser Diode System ( LDS) with UV, visible, and IR wavelength. Especially, current and temperature controller can offer laser power up to 10W and wavelength with promising high current and temperature stability. The controller supplying user adjustable rise and fall time offers both laboratory/bench-top and OEM application with high performance pulse characteristics and integrated diode protection. LDS can be equipped with a fiber laser if equired. Blue-Violet Laser Diode System High Power Laser Diode System Wavelength 375 nm 405 nm 445 nm Wavelength 650 nm RED 680 nm 690 nm 730 ~ 795 nm INFRARED Pulsed Laser Diode System 808 nm 940 ~ 980 nm 1064 ~ 1930 nm Wavelength 850 nm 870 nm 905 nm 1550 nm Power 20 mw 5, 35, 120, 200 mw 50 mw Power < 0.5 W <10 W <10 W < 20 W 3, 4.5 W < 10 W < 10 W Power <10 W < 20, 25, 30 W < 25, 75W < 12 W 15

16 C-1203B, Woolim Lions Valley, 425, Chengchen-dong, Bupyeong-gu, Incheon, South Korea phone : ~ ~4 fax : sales@kortherm.co.kr