Miniaturization trends in medical imaging enabled by full wafer level integration if micro camera modules

Transcription

1 Miniaturization trends in medical imaging enabled by full wafer level integration if micro camera modules

2 About AWAIBA o Excellence in Custom design & Standard Sensor components for Medical imaging and Machine Vision o Continued Innovation since 2004 o o Profitable and privately owned SME (part of CMOSIS International Group o 2006 first Image sensor in TSV package for Endoscopy. 0.5 x 0.65mm o 2009 first Truly wafer level assembled Camera (Wafer level optics, Wafer level package, Wafer level assembly) o 2010 Release ot of NanEye 1mm camera family o 2013 NanEye_Stereo module World record in size!

3 Medical Endoscopy Smaller sensors enable applications in lung, blood vessel, and urinary inspection Chip on Tip improves image quality Advanced packaging technologies reduce size SOC sensor permit disposable equipment Sub 1mm sensor diagonal

4 Because Size Matters! o Minimally Invasive surgery needs smallest possible dimensions o Possible economy of scale o >> disposable medical devices Size Comparision 0.6mm ~Spain on 1cnt coin

5 Main CSP & TSV package options o Classical approach: o (Shellcase; Tessera) Xintec CWLP etc Microlenses Glass 1 Silicon Glass 2 Cavity o TSV package o Via first o Via last Glass cap Chip with active pixel area, read out & bond pads Through Si via s Bumps for electrical connection and to glue chip on ceramic.

6 Via last TSV packaging Wafer o Advantages: o Separate backend process o Low temperature o Requires thinning; Requires carrier wafer (with cavity if u-lens is used

7 Via pictures

8 Waferlevel Lens Technologies

9 Waferlevel lens technology o Replicated Lens Wafer Wafer Press Master

10 Waferlevel lens technology o Plasma etched lens Structuring of aperture Layer Apply of Photoresist for Lenses Bonding of structured wafer on blank wafer Spin on glass Grinding of Lenswafer Reflow of Photoresist Apply of Photoresist for dams Etching of Lensplate AR Coating of Lensplate

11 Novel technologies: Glass formed Spherical and aspherical lenses possible K = K = 0 K = -1.4

12 Higher surface quality, more design freedom Accuracy: 0.07 µm rms (l/8 ; approx. 1 fringe) Ra = 1.2 nm

13 Wafer to Wafer Assembly o Classical Approach o Full Wafer Assembly Lens Wafer Bond Sensor Wafer Dice

14 Assembling the lens to Chip o Aligned Bond o Curing o pray o Dicing

15 Wafer Dicing o Dicing Glass & Silicon >1mm glass! o Dicing is one of the more critical processes o Easily leads to sever shape deviations or device loss

16 Sample Images Number of pixels: 250x250 Size: 1mm x 1mm x 1.6mm (W;L;H) ADC Resolution: 10bit (Bit serial LVDS output) No external components needed on tip 3D Stereo vision module available

17 3D-STEREO vision NanEye Stereo offers the possibility to implement 3D Endoscopy with < 3mm diameter endoscopes. 3D information was proved to accelerate the learning process of surgeons and increase the surgical quality. 3D information is mandatory for robot assisted surgery. Distance knowledge allows absolute measurements

18 Same technology used for pattern projectors to enhance 3D-point density Miniature Pattern Generator for projection of e.g. computer generated random pattern for stereo reconstruction Total size 1x1mm, compatible with 1mm POF fiber or LED Collaboration with TU Munic, Robotic and Embedded systems, (Transfer Project between Industry and Research) Light by POF or LED

19 Thank you for your attention Contacts: AWAIBA Lda MADEIRA TECNOPOLO Funchal Madeira Phone: Fax: AWAIBA GmbH Rollnerstrasse 110a Nürnberg Germany Phone: +49 (0) Fax: +49 (0) AWAIBA HOLDING SA Rue Galilée Yverdon-les-Bains Switzerland Phone: Fax: sales@awaiba.com Where innovation meets technology