Pan Pacific Microelectronics Symposium and Tabletop Exhibition 2011

Transcription

1 Pan Pacific Microelectronics Symposium and Tabletop Exhibition 2011 Kamuela, xxx Hawaii, USA January 2011 ISBN:

2 Printed from e-media with permission by: Curran Associates, Inc. 57 Morehouse Lane Red Hook, NY Some format issues inherent in the e-media version may also appear in this print version. Copyright (2011) by Surface Mount Technology Association (SMTA) All rights reserved. Printed by Curran Associates, Inc. (2011) For permission requests, please contact Surface Mount Technology Association (SMTA) at the address below. Surface Mount Technology Association (SMTA) 5200 Wilson Road Suite 215 Edina, MN Phone: (952) Fax: (952) Additional copies of this publication are available from: Curran Associates, Inc. 57 Morehouse Lane Red Hook, NY USA Phone: Fax: Web:

3 TABLE OF CONTENTS SESSION TA1: 3D PACKAGE ON PACKAGE Simulation and Modeling of Capacitive Coupling Interconnection for 3D Integration... 1 Yu-Jung Huang, Shen-Li Fu, Yi-Lung Lin, Ming-Kun Chen Over-Molded Electronics and Printed Hybrid Systems... 7 Jukka-Tapani Makinen, Kimmo Keranen, Teemu Alajoki, Matti Koponen, Antti Keranen, Antti Kemppainen, Kari Ronka SESSION TA2: MATERIALS ADVANCES: CONNECTIONS Influence of Filler Modifications on the Performance of a Novel Anisotropic Conductive Adhesive Under Temperature/Humidity Aging...14 S. Manian Ramkumar, Alex Chen, Hari Venugopalan, Kumar Khanna The Stability Window and Mechanical Properties of the Interfacial Intermetallic in Lead-free Solder Joints Keith Sweatman, Tetsuro Nishimura, Kazuhiro Nogita, Hideaki Tsukamoto Voiding Control at QFN Assembly Derrick Herron, Yan Liu, Ning-Cheng Lee Assembly and Rework of Large Surface Mount Connectors with Wafers Phil Isaacs, Sven Peng, Seow Wah Sng, Wai Mun Lee, Alex Chen Copper Wire Bonding on Pure Palladium Surface Finishes - Eliminating the Gold Cost From the Electronic Package Mustafa Ozkok, Hugh Roberts, Horst Clauberg SESSION TA3: STRATEGIC MANUFACTURING: RELIABILITY Damage Accumulation in Pb-Free Solder Joints for Complex Loading Histories Peter Borgesen, Linlin Yang, Awni Qasaimeh, Babak Arfaei, Liang Yin, Brian Roggeman, Michael Meilunas Laminate Resistance to Pad Crater Defects: Comparative Spherical Bend Testing John McMahon, Brian Gray TP1: PLENARY SESSION 3D Packaging Initiatives M. Juergen Wolf, Klaus-Dieter Lang Improved Performance, Reliability, and Cost Through Integration of Simple Components Passives! Franck Murray Energy, Electronics, and Ecology: Turning a Negative into a Positive Charles E. Bauer, Herbert J. Neuhaus Developments in Nano Enabled Interconnects Alan Rae KEYNOTE PRESENTATION I 3D Nanofabrication Using Heated Probes Towards MHZ Patterning Rates A.W. Knoll, P. Paul, F. Holzner, M. Despont, U. Duerig, J.L. Hedrick SESSION WP1: 3D THROUGH SILICON VIAS (TSV) Economic Considerations in Choosing a TSV Deposition Technology Steve Lerner Integration of Magnetics, Semiconductors and PCBs in One Component Tamim P. Sidiki, Abel Pot, Frank van der Burgt, See-Wee Ong, Rinus van der Berg, Horst Roehm

4 Device Level 3D Integration Technologies for High Performance/Reliability Modules Paul Houston, Brian Lewis, Keck Pathammavong, Tim Sparks, Daniel F. Baldwin Low-cost Silicon and Glass Interposers and Packages Rao Tummala, Venky Sundaram, Tapobrata Bandyopadhyay, Vivek Sridaran, Vijay Sukumaran SESSION WP2: STRATEGIC MANUFACTURING: CHALLENGES EU RoHS Recast Are You Ready? Krista Botsford Crotty Solutions Against ESD (Electrostatic Discharge) in a Production Line (SMT) - Today and in the Future International ESD and Semiconductor Roadmap Hartmut Berndt Advancements in High Frequency, High Resolution Acoustic Micro Imaging for Thin Silicon Applications Janet E. Semmens Eco-Compliance Audit Will You Pass? Krista Botsford Crotty SESSION WP3: MATERIALS ADVANCES: SUBSTRATES Geometrical Downscaling A Challenge for Process Chemicals and Materials Sven Lamprecht, Hugh Roberts, Chisato Okawa Silicon Interposer for Compact Right Angle Coupling of Flip Chip VCSEL and Detector Arrays to Multi-Facet Endface Optical Fibers Terry Bowen, Marcel Buijs, Jeroen Duis, Mirko Schurink New Process and Cost Reduction Developments in Tin Silver Electroplating of Wafers Robert S. Forman Innovative High Throw Copper Electroplating Process for Metallization of PCB Maria Nikolova, Jim Watkowski SESSION WP4: 3D PACKAGING Thin Wafer Processing and Chip Stacking for 3D Integration Thorsten Matthias, Daniel Burgstaller, Markus Wimplinger, Paul Lindner Development of Accurate Wafer Thinning and Low Stress Die Separation and Handling Technology Chuichi Miyazaki, Haruo Shimamoto, Toshihide Uematsu, Yoshiyuki Abe, Kosuke Kitaichi Emerging Embedded Devices into Substrate for More Than Moore Era Henry Hisanobu Utsunomiya SESSION THA1: GREEN ELECTRONICS: DESIGN Design for Green Electronics Tamim P. Sidiki, Ine Cox Past, Present and Future of Solderless Assembly Joseph Fjelstad SESSION THA2: MATERIALS ADVANCES: RELIABILITY Conformal Coating Evaluation for Use in Harsh Environments Utilizing a Modified SIR Test Protocol Casey H. Cooper Enabling MSL-1 Capability for QFN and Other Design Leadframe Packages - Part II Dan Hart, John Ganjei, Nilesh Kapadia Pb-Free Thermal Cycle Acceleration Factors Phil Isaacs, Eddie Kobeda

5 SESSION THA3: LIGHTING AND DISPLAYS: LEDS Backlight Illumination Structure Based On Embedded Inorganic LED Chips and Hot Laminated Multilayer Polymer Kimmo Keranen, Jukka-Tapani Makinen, Mikko Heikkinen, Marianne Hiltunen, Markku Lahti, Antti Sunnari, Kari Ronka Assembly Interconnect Reliability in Solid State Lighting Applications - Part I Rahul Raut, Ravi Bhatkal, Westin Bent, Bawa Singh, Sujatha Chegudi, Ranjit Pandher, Justin Kolbe, Sanjay Misra HB-LED Cavity Encapsulation Horatio Quinones, Tom Ratledge, Heakyoung Park SESSION THA4: LASER PROCESSES Solder Paste Manufacturing Methods and Their Impact on Precision and Accuracy Ahne Oosterhof, Stephan Schmidt Laser Direct Structuring for Innovative Electronics Designs Tamim P. Sidiki, Abel Pot, Frank van der Burgt Author Index