th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2015)
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1 th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2015) Taipei, Taiwan October 2015 IEEE Catalog Number: ISBN: CFP1559B-POD
2 Copyright 2015 by the Institute of Electrical and Electronic Engineers, Inc All Rights Reserved Copyright and Reprint Permissions: Abstracting is permitted with credit to the source. Libraries are permitted to photocopy beyond the limit of U.S. copyright law for private use of patrons those articles in this volume that carry a code at the bottom of the first page, provided the per-copy fee indicated in the code is paid through Copyright Clearance Center, 222 Rosewood Drive, Danvers, MA For other copying, reprint or republication permission, write to IEEE Copyrights Manager, IEEE Service Center, 445 Hoes Lane, Piscataway, NJ All rights reserved. ***This publication is a representation of what appears in the IEEE Digital Libraries. Some format issues inherent in the e-media version may also appear in this print version. IEEE Catalog Number: CFP1559B-POD ISBN (Print-On-Demand): ISSN: Additional Copies of This Publication Are Available From: Curran Associates, Inc 57 Morehouse Lane Red Hook, NY USA Phone: (845) Fax: (845) curran@proceedings.com Web:
3 Sessions INDEX SESSION 2: Advanced Packaging I Topic Lead Author High Speed, Flexible, Robust and Low Power Processing Approach 38 material for the advanced mobile devices 42 Fabrication of a Hermetic Sealing Device Having 46 In-situ Observation of Electromigration Induced Failure 50 Packaging 54 Kanji Otsuka Kazuya Nomura Tiwei Wei Advanced Semiconductor Science Technology /15 $ IEEE 17
4 2015 SESSION 3: Modeling, Simulation & Design I Topic Lead Author 58 Takahiro Kinoshita Structural Analysis and Static Responses of Electrostatic Actuators for 3-DOF Micromanipulators in Phonomicrosurgery Thermomechanical Analysis and Reliability Performance Leadframe Design 75 A Novel Integrated Warpage Prediction Model Based on 79 Eakkachai Pengwang Institute of Field Robotics, Technology Thonburi Taiwan Semiconductor /15 $ IEEE 18
5 Sessions SESSION 4: Materials TW114-1 Topic Lead Author EcoFlash - Next Level of Enhanced Isotropic Etchants 83 Rami Haidar Industrial technology research institute /15 $ IEEE 19
6 2015 Topic Lead Author Advanced 3D ewlb-pop embedded Wafer Level Ball 96 AS121-1 TW136-1 Manufacturing 101 Effect of isothermal aging on microstructure and joint strength of Ag nanoporous bonding for high temperature die attach Erwan Le Roy Kim Min-Su Huai-Te Keng Processing 111 Y /15 $ IEEE 20
7 Sessions Topic Lead Author Dem Lee ist- Integrated Service Technology Boards 124 Dem Lee ist-integrated Service Technology Inc Experimental Design and Evaluation of Differential-Skew Dependence on Differential-Pair Orientation 130 Fuh Kuen-Fwu /15 $ IEEE 21
8 2015 Topic Lead Author 134 Frommer Aviv Orbotech after Singulation 137 MacDermid Inc /15 $ IEEE 22
9 Sessions SESSION 11: 3D Integration & Interconnection II Topic Lead Author A novel processing concept for reduction of substrate artifacts in ultrasound transducer arrays 145 of glass interposer 149 Enrichment of Annealing Twins in Ag-alloy Bonding Wires for Electronic Packaging Angel Savov Sara Hunegnaw Shigeo Onitake /15 $ IEEE 23
10 2015 SESSION 12: Electro Deposition and Electrochemical Processing Technology Topic Lead Author Filling and Through Hole Plating Manufacture 169 High performances PPR copper plating for high aspect ratio boards 173 Feng Liu Weigang Wu The Dow chemical company /15 $ IEEE 24
11 Sessions Topic Lead Author 177 Intel (Intel Microelectronics Asia /15 $ IEEE 25
12 2015 SESSION 14: Surface Activated Bonding - A low temperature bonding process for next generation interconnect technology AS143-1 Topic Lead Author Bonding of polymer and glass using nano-adhesion layer 180 Takeshi Matsumae /15 $ IEEE 26
13 Sessions SESSION 15: Thermal Management Topic Lead Author 184 Performance and Reliability of TIM in High Power 188 Hu Ian Freescale Semiconductor Malaysia Sdn. Bhd. ASE /15 $ IEEE 27
14 2015 SESSION 16: Advanced technology and Automation Topic Lead Author 192 Robin Taylor Application 196 Makoto Sakai ROHM AND HAAS /15 $ IEEE 28
15 Sessions Topic Lead Author A New Reliable Adhesion Enhancement Process for Kenichiroh Mukai EMI Shielding TW152-2 Modulator with Bio-sensor and Wireless Transducer on Tracheostomy Tube Application 207 Lifetime Prediction of the Epoxy Resin Adhesive due to the Optical Performance Degradation 213 Low Temperature Direct Bonding of Polyether Ether Ketone PEEK and Pt 217 Fu Weixin Science and Technology of Education /15 $ IEEE 29
16 2015 Topic Lead Author The Low Dk / Df adhesives for high frequency printed Takashi Tasaki circuit board using the novel solvent soluble polyimide 221 Enhanced Adhesion of Polyaniline Thin Films Deposited on Polydimethylsiloxane Surfaces Activated by Ozone Treatment and Aminosilanization 225 Wire during Tension 229 Priyadharsini Karuppuswamy Naoya Tada /15 $ IEEE 30
17 Sessions SESSION 22: Advanced Materials & Assembly II Topic Lead Author loading 233 Study of Self-Assembly Technology for 3D Integration Applications Industrial Technology Research Institute /15 $ IEEE 31
18 2015 Topic Lead Author TW124-2 Adhesive Nickel-phosphorous Electroless Plating on Silanized Silicon Wafer 245 Interposer 250 Sponsor of Taiwan PCB Student Best Award /15 $ IEEE 32
19 Sessions SESSION 24: Advanced Packaging III Topic Lead Author Lisheng Huang Module 269 Industrial Technology Research Institute TW115-1 Substrate 273 Advanced Semiconductor Engineering /15 $ IEEE 33
20 2015 SESSION 25: Modeling, Simulation & Design II TW123-1 Topic Lead Author Elastically-bossed Plate under Pretension 277 Finite Element Method 281 Process 285 Failure Mode Investigation of Die Pick Process with High 288 True Package and Ideal Modeling 292 A Novel Flow to Optimize Package Power Distribution Network Design 296 Package Application Ni Tom Hu Ian Mengkai Shih Powertech Technology Inc. ASE Advanced Semiconductor Engineering, Inc. Advanced Semiconductor Engineering, Inc. Advanced Semiconductor Engineering, Inc /15 $ IEEE 34
21 Sessions Poster Session_Packaging Topic Lead Author Reliability Lifetime Predictions on Long Term Biased Materials without Metallization Treatment 315 Industrial Technology Research 319 Institute Derivatives for Electrostatic Deposition on Aminosilanized 323 Liao Hung-Lun 326 Tuning Nanostructured Morphology in Polymers Based Materials 329 RayWen Hsu Design of a Thermal Sensitive MEMS Resonator and 332 Industrial Technology Research Institute The electrical characterizations of glass interposer for integrated reliability test 336 Industrial Technology Research Institute 340 ITRI Analysis of interconnection reliability of dielectric layer for wafer level chip scale package Reducing the Rework in the Photo-lithography Process of 351 and Technology TW112-1 Ag-based Wire-bonds 355 Hwang Lih-Tyng TW116-1 Product Design 359 Intel Microelectronics Asia Ltd. Taiwan Branch /15 $ IEEE 35
22 2015 Poster Session_Packaging Topic Lead Author Synthesis and Applications of Functionalized Polysiloxane 362 TW Kuo-Tsai Wu 369 NXP Semiconductors Taiwan Ltd /15 $ IEEE 36
23 Sessions Poster Session_PCB Topic Lead Author Heat Dissipation Improvement Design And Signal 374 Hung-Wen Lin Ribs 378 H. K. Lai 382 lithography Process 386 and Technology Temperature-Dependent Test Scheduling with TAM Bus 390 Shih-Hsu Huang Test Wrapper Bandwidth Assignment for Minimizing the 394 Shih-Hsu Huang /15 $ IEEE 37
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