School of Electrical and Computer Engineering,
|
|
- Myrtle Bryant
- 5 years ago
- Views:
Transcription
1 Copyright 2017 Transfer Office School of Electrical and Computer Engineering, College of Engineering, University of Tehran. Design by M.M. Mahdizade All rights reserved. This book or any portion thereof may not be reproduced or used in any manner whatsoever without the express written permission of the publisher except for the use of brief quotations in a book review. 1 st edition, Summer 2017 Transfer Office (TTO), School of Electrical and Computer Engineering, College of Engineering, University of Tehran, North Kargar st., Tehran, Iran. P.O.Box: Tel: +98 (21) Fax: +98 (21) tto.ece@ece.ut.ac.ir Web: Page 1 School of ECE, University of Tehran
2 Digital Systems Learning Systems, Robotics, & Control Software BioMedical School of ECE School of ECE Information Electronics Power
3 Electronic Devices Lithium Ion Batteries Supplying energy for electronic devices, transportation, industrial, and home appliance Fabrication of Li-ion batteries using nano/micro structures in anode, cathode or separator. These structures can result in significant improvement in the battery performance. Page 3 School of ECE, University of Tehran
4 Electronic Devices Microfluidic Device for Size-based Separation Size-based cell separation in microfluidic channels This lab on chip separates cells based on cell size and interaction between cells and microfluidic chip walls. Each specific size cells is then introduced to a specific microchannel. School of ECE, University of Tehran Page 4
5 Electronic Devices Miniaturized Sensors Nanoelectronics Pressure sensors Bio-sensors A high sensitivity sensor based on arrays of carbon nanotubes, which can be used for acceleration and pressure sensing. The use of branched carbon nanotubes would lead to a high sensitivity over a suspended bridge. Page 5 School of ECE, University of Tehran
6 Electronic Devices Ion-Sensitive Transistors Bio-sensors ph sensors This is a high sensitivity ion selective transistor based on grass nanostructures. The presence of tiny nanostructures results in higher extension of diffuse layer and subsequently higher sensitivity. School of ECE, University of Tehran Page 6
7 Electronic Devices Three Dimensional MEMS Structures Nanoelectronics Pressure sensors MEMS These are three dimensional features on silicon and silicon based materials, which have unique properties for MEMS applications. They can also be used as a holder for electrochromic materials in future display applications. Page 7 School of ECE, University of Tehran
8 Electronic Devices Diffusion Furnace Dry oxidation with O2, N2 Phosphor diffusion with POCl3, N2, O2 Boron diffusion with BBr3, N2, O2 o Temperatures up to 1100 C o Set up for more than 100 Wafers (4") o o High uniformity The recipes can be modified to generate new recipes for different structures School of ECE, University of Tehran Page 8
9 Electronic Devices Sheet Resistance Scan P/N determination Emitter sheet resistance mapping using 4-point probe method Uniformity determination o o Sample material: multi crystalline and mono crystalline silicon Sample shape: square, semi-square, rectangle, circle Page 9 School of ECE, University of Tehran
10 Electronic Devices Lifetime Measurement Data output is in the form of color maps Detect crystal defects Detect impurities due to heavy metal and transition metal contaminations o o Measuring lifetime via microwave photoconductive decay (microwave PCD or µ- PCD) technique Sample shape: square, semi-square, rectangle, circle o Uniformity determination School of ECE, University of Tehran Page 10
11 Electronic Devices Electrochemical Capacitance-Voltage Profiling Monitor the doping concentration (depth resolution: 1nm) Monitor the concentration of electrically activated dopants Monitor the doping type (n or p) o o o Sample shape: square, semi-square, rectangle, circle Sample material: multi crystalline and mono crystalline silicon Concentration resolution: < 1012 cm-3 to > 1021 cm-3 o Depth resolution: 1 nm to 100 µm Page 11 School of ECE, University of Tehran
12 Electronic Devices CORESCAN Surface mapping of contact resistance between the emitter and the metallization grid of solar cells Other mappings: shunt resistance, short circuit current (LBIC), and open circuit voltage (V OC ) Sample shape: Square, rectangle, and circle solar cells with maximum 5 Bus-bars School of ECE, University of Tehran Page 12
13 Electronic Devices Plasma-Enhanced Chemical Vapor Deposition Deposit poly silicon Deposit silicon dioxide Deposit silicon nitride o o PECVD is a process to deposit thin films in different ranges of pressure, temperature, gas flow and power The thickness can vary from 10nm to 2µm Page 13 School of ECE, University of Tehran
14 Electronic Devices Fourier Transform Infrared Spectroscopy Determination of compounds in silicon nitride films Non-destructive analysis A simple way to evaluate semiconductor materials o Sample material: thin film layers o High-speed data collection o High precision and accuracy School of ECE, University of Tehran Page 14
15 Electronic Devices Silk Print To create front and back contact of solar cells Two high precision free stand screen/stencil printing machine on large areas Screen printing is a printing technique whereby a mesh is used to transfer ink onto a substrate with high precision print head Page 15 School of ECE, University of Tehran
16 Electronic Devices Spectral Response A spectral response/qe/ipce system Extracting solar cell parameters including V OC, I SC, J SC, V max, I max, P max, and efficiency Characterizes different types of solar cells, including: Mono-crystalline Silicon solar cells (Si), Multi-crystalline Silicon solar cells (mcsi), Amorphous Silicon solar cells (asi), Gallium Arsenide solar cells (GaAs), Cadmium Telluride solar cells (CdTe), Dye sensitized solar cells (DSSC), Organic solar cells, Multijunction solar cells. School of ECE, University of Tehran Page 16
17 Electronic Devices I-V Measurement Current Voltage (I-V) measurement Extracting solar cell parameters including V OC, I SC, J SC, V max, I max, P max, and efficiency o o I-V measurement for mono-crystalline silicon solar cells (Si) I-V measurement for multi-crystalline silicon solar cells (mcsi) Page 17 School of ECE, University of Tehran
18 Electronic Devices Laser Cutter Laser cutting all kinds of silicon wafers, aluminum, glass, o o o o A technology that uses a laser to cut material High speed and precision cutting Wavelength: 1064 nm Maximum sample size: mm o Minimum cut width: 0.15 mm School of ECE, University of Tehran Page 18
19 Electronic Devices Ellipsometry Non destructive analysis Measure the refractive index and the thickness of semi-transparent thin films o o An optical technique for investigating dielectric properties (complex refractive index or dielectric function) of thin films Uniformity determination o Measure films, such as silicon oxides, nitrides, and photoresists Page 19 School of ECE, University of Tehran
20 Electronic Devices I-V and C-V Measurements I-V characteristics C-V characteristics o o Measuring device characteristics at currents from 10fA to 3A and voltages from 10µV to 1100V Programmable voltage and current output sweeps for fixed and linear stair pulses School of ECE, University of Tehran Page 20
21 Electronic Devices RF Sputtering Deposit thin films, including Au, Ti, Pt, ZnO, AZO (2%), Al, Al 2 O 3, Ni, Cu, Ag, ITO, Si, Si 3 N 4, SiO, Mo, TiO 2, NiO o o A technique that is used to create thin films Layer thicknesses are controlled by changing the sputtering time and power Page 21 School of ECE, University of Tehran
22 Electronic Devices Low Pressure Chemical Vapour Deposition Electronic fabrication Nano-technology Hard coating This is an important unit in fabrication of micro and nano electronic devices. It is a deposition reactor with great ability to control gas flows and pressure and temperature of reactor. Various layers as polysilicon, Silicon Nitride, Silicon oxides and nano-wires can be grown in this reactor. School of ECE, University of Tehran Page 22
23 Electronic Devices Plasma Enhanced Chemical Vapor Deposition Nanoelectronics Pressure sensors Bio-sensors This is a unit suitable for the growth of carbon nanotubes and nanofibers as well as graphene and various 2-D materials. The high control over the growth parameters makes this unit a favorable addition to any research institute. Page 23 School of ECE, University of Tehran
24 Electronic Devices Deep Reactive Ion Etching Nanoelectronics Pressure sensors Bio-sensors This is a unique facility to realize complex micro and nano electronic devices. By proper adjusting the gases and radio-frequency plasma, one is able to arrive at various exciting features for ion transport, MEMS devices and transistor fabrication. School of ECE, University of Tehran Page 24
25 Electronic Devices Low-Cost, Active, Paper-Based Lab-on-Chip Point-of-care test devices Medical tests in developing world Biosecurity Developing very low-cost technologies to fabricate lab-on-chip systems on paper substrate; including digital and channel based microfluidics, embedded sensors and actuators. Page 25 School of ECE, University of Tehran
26 Digital Systems Learning Systems, Robotics, & Control Software BioMedical School of ECE School of ECE Information Electronics Power
27 Electronics Terahertz Photoconductive Antenna Ultra fast imaging Security Material spectroscopy Terahertz PCAs (THz emitters/detectors) have been fabricated on LT-GaAs substrates. This product can generate 1 Thz frequency with power spectrum level of ~- 20db. Page 27 School of ECE, University of Tehran
28 Electronics Full Duplex Optical Transceiver Communications Infrastructures Dispatching house data communications High speed optical servers This is a full duplex optical communication system, which converts two optical-fiber communication systems to a single one. The system is reliable, durable and duplex the communication capacity. School of ECE, University of Tehran Page 28
29 Electronics Phase Array Transceiver Module Radars A 4-channel miniaturized X-band transceiver with independent and simultaneous operation, using die wire bonding. Page 29 School of ECE, University of Tehran
30 Electronics Low Noise High Frequency Amplifiers Transceivers Many industrial and commercial applications LNAs with wide frequency band of GHz and a variety of customized specifications. School of ECE, University of Tehran Page 30
31 Electronics Microwave, L and S Band Power Amplifiers Wireless communications Satellite communications Commercial RADAR (Weather RADAR, automobile, air traffic control, ) High power, reliable, and wide-band power amplifiers with adjustable parameters. Page 31 School of ECE, University of Tehran
32 Electronics Signal Generator R&D centres and educational university labs Part of many electronic systems Design and production of a signal generator with given specifications: Frequency in the range of 54MHz-13.6GHz With low phase noise, low power consumption, and high resolution School of ECE, University of Tehran Page 32
33 Electronics SAW-Based Radio Sensor Systems for Short-Range To measure physical parameters: Pressure Humidity Temperature Buildings vibrations to detect problems or monitor life time Structural safety in satellites/spacecrafts Wireless measurement of different physical parameters using a passive sensor (batteryless) for non/hard accessible places, like inside the tire or industrial tanks, etc. The system consists of a readout sub-system employing EM waves and a SAW-based sensor. Page 33 School of ECE, University of Tehran
34 Electronics Analysis, Design & Fabrication of Secure and Immunized Electronic Systems Secure and immune electronic systems for EMI/EMC The circuit/field analysis, measurement, and evaluation of electromagnetic susceptibility of electronic systems and proposing immune design solutions for EM protection. School of ECE, University of Tehran Page 34
35 Electronics Anechoic Test Chamber Antenna production industry Testing antennas output power for L, S, and X bands. Page 35 School of ECE, University of Tehran
36 Electronics Portable Spectrum Analyser R&D centres and educational university labs Part of many systems Spectrum analyser with operational frequencies up to 12GHz. Designed in three types: PCB, external module, and desktop equipment. School of ECE, University of Tehran Page 36
37 Electronics Instantaneous Frequency Measurement Electronic intelligence systems This is an instant frequency measurement (IFM) system, which is used for rapid detection, recognition, and characterization of signals. It benefits from very accurate and optimized filters, and precise digital system design. Page 37 School of ECE, University of Tehran
38 Electronics PSR-24x - Surveillance Radar Parameters Maximum Range Frequency Band Beamwidth-Azimuth Beamwidth-Elevation Wave Form Field of view Scan Rotation Rate Resolution Bandwidth Target Velocity Interface Supply Voltage Power Consumption Weight Environmental Operating Temperature PSR-24x Vehicle: Up to 2000m/Man: Up to 800m K Band 1 3 FMCW rpm 1m 8Mb/s 0-50m/s 10/100 Mb/s Ethernet V AC 24V DC 25Watts 15Kg IP67-20 C to + 60 C Radar threat detection Situation awareness for wide areas Perimeter security The PSR-24x is a compact, 360 scanning radar sensor that is designed for surveillance solution in combination with CCTV and intelligent software to provide unrivalled threat detection. School of ECE, University of Tehran Page 38
39 Electronics Jammer Generation of jamming signals for: Conference and meeting rooms Protected areas The product generates different jammer signals with adjustable parameters, including the centre frequency and bandwidth. The system can block signals in a wide bandwidth. Page 39 School of ECE, University of Tehran
40 Electronics High Frequency Scanning Imaging System Security and stand-off detection of threats This product is a millimetre-wave imager for stand-off detection of concealed object in the body. School of ECE, University of Tehran Page 40
41 Electronics Distributed Optical Fiber Sensor Pipeline monitoring Transportation industries Security Border protection This is a system for measurement of temperature, strain, and vibration along an optical fiber by detection and processing of the Raman, Brillouin, and Rayleigh scattering inside the fiber. Page 41 School of ECE, University of Tehran
42 Electronics Nano-Distance Measurement Nanopositioner Non-contact metrology Real-time high-precision measurements This is an optical distance measurement system, with nano-metric precision. School of ECE, University of Tehran Page 42
43 Electronics Altimeter Tester Mass production of altimeter system A user friendly tester to perform full functional test and troubleshooting of the whole system of an altimeter and all its parts, including PCB modules and active devices. The test procedure can be done automaticly or manually. Page 43 School of ECE, University of Tehran
44 Electronics Magnetic Sensor Detection System Security systems This is a system for automatic detection of the position, motion, and size of any metal object in the range of its network. School of ECE, University of Tehran Page 44
45 Electronics Far Field Gonio-Photometer Type C-ɤ Determination of the light distribution curve for luminaires This setup includes a rotating robot, a mobile robot with a lux-meter on top of it, which measures luminous intensity for luminaires. Page 45 School of ECE, University of Tehran
46 Electronics Gonio-Photometer Type B Luminous intensity metering of different sources, such as traffic lights The Luminous intensity metering system includes a metallic structure which has two degrees of freedom, a lux-meter sensor for measuring luminous intensity in different angles, and a signal processing software. School of ECE, University of Tehran Page 46
47 Electronics Ultraviolet-Visible Spectroscopy Material spectroscopy The UV-Vis spectroscope (Wavelength range: 200 to 800 nm) is capable of measuring absorption spectroscopy or reflectance spectroscopy in the ultravioletvisible spectral region. Page 47 School of ECE, University of Tehran
48 Electronics Hand Held Body Scanner Security Quick scanning The Hand Held Body Scanner provides an easy and fast way to scan the object using RF frequencies. It is easy to use and selfreliable. It may be used for security in airports, infrastructures, and similar places. School of ECE, University of Tehran Page 48
49 Electronics Lab-on-a-phone Colorometry Detection of Hg ions Water Inspection The Colorometry lab-on-a-phone system provides an easy and cheap way to measure the concentration of mercury and other heavy metal ions in water. It is a fast and easy way to test the health of the water. Page 49 School of ECE, University of Tehran
50 Electronics Fourier Transform Infrared High resolution material spectroscopy Electrical characterization Fourier transform infrared (FTIR) spectroscopy provides an effective way to obtain an infrared spectrum (1-25 m) of absorption or emission of a solid, liquid or gas. School of ECE, University of Tehran Page 50
51 Electronics Routers and Switches Data communication Cooperation offices High capacity routers and switches, from 20 to 640 Gbps (Giga bit per second), with all standard services, and supporting voice and data. Page 51 School of ECE, University of Tehran
52 Electronics ANN-Based CAD Tool Modelling and simulation of nonlinear circuits, with the help of computer clusters This is a CAD tool for simulation of circuits and systems based on neural network (ANN). Also, it can generate HSpice netlist from the developed CAD tool (Matlab). School of ECE, University of Tehran Page 52
Microprobe-enabled Terahertz sensing applications
Microprobe-enabled Terahertz sensing applications World of Photonics, Laser 2015, Munich Protemics GmbH Aachen, Germany Terahertz microprobing technology: Taking advantage of Terahertz range benefits without
More informationElectrical Characterization
Listing and specification of characterization equipment at ISC Konstanz 30.05.2016 Electrical Characterization µw-pcd (Semilab) PV2000 (Semilab) - spatially resolved minority charge carrier lifetime -diffusion
More informationLEDs, Photodetectors and Solar Cells
LEDs, Photodetectors and Solar Cells Chapter 7 (Parker) ELEC 424 John Peeples Why the Interest in Photons? Answer: Momentum and Radiation High electrical current density destroys minute polysilicon and
More informationA Laser-Based Thin-Film Growth Monitor
TECHNOLOGY by Charles Taylor, Darryl Barlett, Eric Chason, and Jerry Floro A Laser-Based Thin-Film Growth Monitor The Multi-beam Optical Sensor (MOS) was developed jointly by k-space Associates (Ann Arbor,
More informationMore specifically, I would like to talk about Gallium Nitride and related wide bandgap compound semiconductors.
Good morning everyone, I am Edgar Martinez, Program Manager for the Microsystems Technology Office. Today, it is my pleasure to dedicate the next few minutes talking to you about transformations in future
More informationCMOS Digital Integrated Circuits Lec 2 Fabrication of MOSFETs
CMOS Digital Integrated Circuits Lec 2 Fabrication of MOSFETs 1 CMOS Digital Integrated Circuits 3 rd Edition Categories of Materials Materials can be categorized into three main groups regarding their
More informationMicro-sensors - what happens when you make "classical" devices "small": MEMS devices and integrated bolometric IR detectors
Micro-sensors - what happens when you make "classical" devices "small": MEMS devices and integrated bolometric IR detectors Dean P. Neikirk 1 MURI bio-ir sensors kick-off 6/16/98 Where are the targets
More informationAIR-COUPLED PHOTOCONDUCTIVE ANTENNAS
AIR-COUPLED PHOTOCONDUCTIVE ANTENNAS Report: Air-Coupled Photoconductive Antennas In this paper, we present air-coupled terahertz photoconductive antenna (THz-PCAs) transmitters and receivers made on high-resistive
More informationEE C245 / ME C218 INTRODUCTION TO MEMS DESIGN FALL 2011 PROBLEM SET #2. Due (at 7 p.m.): Tuesday, Sept. 27, 2011, in the EE C245 HW box in 240 Cory.
Issued: Tuesday, Sept. 13, 2011 PROBLEM SET #2 Due (at 7 p.m.): Tuesday, Sept. 27, 2011, in the EE C245 HW box in 240 Cory. 1. Below in Figure 1.1 is a description of a DRIE silicon etch using the Marvell
More informationMEMS in ECE at CMU. Gary K. Fedder
MEMS in ECE at CMU Gary K. Fedder Department of Electrical and Computer Engineering and The Robotics Institute Carnegie Mellon University Pittsburgh, PA 15213-3890 fedder@ece.cmu.edu http://www.ece.cmu.edu/~mems
More information3D SOI elements for System-on-Chip applications
Advanced Materials Research Online: 2011-07-04 ISSN: 1662-8985, Vol. 276, pp 137-144 doi:10.4028/www.scientific.net/amr.276.137 2011 Trans Tech Publications, Switzerland 3D SOI elements for System-on-Chip
More information420 Intro to VLSI Design
Dept of Electrical and Computer Engineering 420 Intro to VLSI Design Lecture 0: Course Introduction and Overview Valencia M. Joyner Spring 2005 Getting Started Syllabus About the Instructor Labs, Problem
More informationElectromagnetic Applications in Nanotechnology
Electromagnetic Applications in Nanotechnology Carbon nanotubes (CNTs) Hexagonal networks of carbon atoms 1nm diameter 1 to 100 microns of length Layer of graphite rolled up into a cylinder Manufactured:
More informationInstruction manual and data sheet ipca h
1/15 instruction manual ipca-21-05-1000-800-h Instruction manual and data sheet ipca-21-05-1000-800-h Broad area interdigital photoconductive THz antenna with microlens array and hyperhemispherical silicon
More informationVisible Light Photon R&D in the US. A. Bross KEK ISS Meeting January 25, 2006
Visible Light Photon R&D in the US A. Bross KEK ISS Meeting January 25, 2006 Some History First VLPC History In 1987, a paper was published by Rockwell detailing the performance of Solid State PhotoMultipliers
More informationPhotolithography I ( Part 1 )
1 Photolithography I ( Part 1 ) Chapter 13 : Semiconductor Manufacturing Technology by M. Quirk & J. Serda Bjørn-Ove Fimland, Department of Electronics and Telecommunication, Norwegian University of Science
More informationCHAPTER 6 CARBON NANOTUBE AND ITS RF APPLICATION
CHAPTER 6 CARBON NANOTUBE AND ITS RF APPLICATION 6.1 Introduction In this chapter we have made a theoretical study about carbon nanotubes electrical properties and their utility in antenna applications.
More informationMaterial analysis by infrared mapping: A case study using a multilayer
Material analysis by infrared mapping: A case study using a multilayer paint sample Application Note Author Dr. Jonah Kirkwood, Dr. John Wilson and Dr. Mustafa Kansiz Agilent Technologies, Inc. Introduction
More informationGigahertz Ambipolar Frequency Multiplier Based on Cvd Graphene
Gigahertz Ambipolar Frequency Multiplier Based on Cvd Graphene The MIT Faculty has made this article openly available. Please share how this access benefits you. Your story matters. Citation As Published
More informationCMP for More Than Moore
2009 Levitronix Conference on CMP Gerfried Zwicker Fraunhofer Institute for Silicon Technology ISIT Itzehoe, Germany gerfried.zwicker@isit.fraunhofer.de Contents Moore s Law and More Than Moore Comparison:
More informationVLSI Design. Introduction
Tassadaq Hussain VLSI Design Introduction Outcome of this course Problem Aims Objectives Outcomes Data Collection Theoretical Model Mathematical Model Validate Development Analysis and Observation Pseudo
More informationApplications of Steady-state Multichannel Spectroscopy in the Visible and NIR Spectral Region
Feature Article JY Division I nformation Optical Spectroscopy Applications of Steady-state Multichannel Spectroscopy in the Visible and NIR Spectral Region Raymond Pini, Salvatore Atzeni Abstract Multichannel
More informationNanofluidic Diodes based on Nanotube Heterojunctions
Supporting Information Nanofluidic Diodes based on Nanotube Heterojunctions Ruoxue Yan, Wenjie Liang, Rong Fan, Peidong Yang 1 Department of Chemistry, University of California, Berkeley, CA 94720, USA
More informationUVISEL. Spectroscopic Phase Modulated Ellipsometer. The Ideal Tool for Thin Film and Material Characterization
UVISEL Spectroscopic Phase Modulated Ellipsometer The Ideal Tool for Thin Film and Material Characterization High Precision Research Spectroscopic Ellipsometer The UVISEL ellipsometer offers the best combination
More informationTechnology for the MEMS processing and testing environment. SUSS MicroTec AG Dr. Hans-Georg Kapitza
Technology for the MEMS processing and testing environment SUSS MicroTec AG Dr. Hans-Georg Kapitza 1 SUSS MicroTec Industrial Group Founded 1949 as Karl Süss KG GmbH&Co. in Garching/ Munich San Jose Waterbury
More informationMicro-PackS, Technology Platform. Security Characterization Lab Opening
September, 30 th 2008 Micro-PackS, Technology Platform Security Characterization Lab Opening Members : Micro-PackS in SCS cluster From Silicium to innovative & commucating device R&D structure, gathering
More informationM J.A. Woollam Co., Inc. Ellipsometry Solutions
M-2000 J.A. Woollam Co., Inc. Ellipsometry Solutions Speed Discover the Difference Focused M-2000 The M-2000 line of spectroscopic ellipsometers is engineered to meet the diverse demands of thin film characterization.
More informationPB T/R Two-Channel Portable Frequency Domain Terahertz Spectrometer
Compact, Portable Terahertz Spectroscopy System Bakman Technologies versatile PB7220-2000-T/R Spectroscopy Platform is designed for scanning complex compounds to precise specifications with greater accuracy
More informationHipoCIGS: enamelled steel as substrate for thin film solar cells
HipoCIGS: enamelled steel as substrate for thin film solar cells Lecturer D. Jacobs*, Author S. Efimenko, Co-author C. Schlegel *:PRINCE Belgium bvba, Pathoekeweg 116, 8000 Brugge, Belgium, djacobs@princecorp.com
More informationChapter 3 Basics Semiconductor Devices and Processing
Chapter 3 Basics Semiconductor Devices and Processing 1 Objectives Identify at least two semiconductor materials from the periodic table of elements List n-type and p-type dopants Describe a diode and
More informationNanotechnology, the infrastructure, and IBM s research projects
Nanotechnology, the infrastructure, and IBM s research projects Dr. Paul Seidler Coordinator Nanotechnology Center, IBM Research - Zurich Nanotechnology is the understanding and control of matter at dimensions
More informationTHz-Imaging on its way to industrial application
THz-Imaging on its way to industrial application T. Pfeifer Laboratory for Machine Tools and Production Engineering (WZL) of RWTH Aachen niversity Manfred-Weck Building, Steinbachstraße 19, D-52074 Aachen,
More informationMeasurement of Microscopic Three-dimensional Profiles with High Accuracy and Simple Operation
238 Hitachi Review Vol. 65 (2016), No. 7 Featured Articles Measurement of Microscopic Three-dimensional Profiles with High Accuracy and Simple Operation AFM5500M Scanning Probe Microscope Satoshi Hasumura
More informationHigh Power RF MEMS Switch Technology
High Power RF MEMS Switch Technology Invited Talk at 2005 SBMO/IEEE MTT-S International Conference on Microwave and Optoelectronics Conference Dr Jia-Sheng Hong Heriot-Watt University Edinburgh U.K. 1
More informationEE4800 CMOS Digital IC Design & Analysis. Lecture 1 Introduction Zhuo Feng
EE4800 CMOS Digital IC Design & Analysis Lecture 1 Introduction Zhuo Feng 1.1 Prof. Zhuo Feng Office: EERC 730 Phone: 487-3116 Email: zhuofeng@mtu.edu Class Website http://www.ece.mtu.edu/~zhuofeng/ee4800fall2010.html
More informationLithography. 3 rd. lecture: introduction. Prof. Yosi Shacham-Diamand. Fall 2004
Lithography 3 rd lecture: introduction Prof. Yosi Shacham-Diamand Fall 2004 1 List of content Fundamental principles Characteristics parameters Exposure systems 2 Fundamental principles Aerial Image Exposure
More informationLecture 0: Introduction
Lecture 0: Introduction Introduction Integrated circuits: many transistors on one chip. Very Large Scale Integration (VLSI): bucketloads! Complementary Metal Oxide Semiconductor Fast, cheap, low power
More informationOn-chip interrogation of a silicon-on-insulator microring resonator based ethanol vapor sensor with an arrayed waveguide grating (AWG) spectrometer
On-chip interrogation of a silicon-on-insulator microring resonator based ethanol vapor sensor with an arrayed waveguide grating (AWG) spectrometer Nebiyu A. Yebo* a, Wim Bogaerts, Zeger Hens b,roel Baets
More informationMajor Fabrication Steps in MOS Process Flow
Major Fabrication Steps in MOS Process Flow UV light Mask oxygen Silicon dioxide photoresist exposed photoresist oxide Silicon substrate Oxidation (Field oxide) Photoresist Coating Mask-Wafer Alignment
More informationGraphene electro-optic modulator with 30 GHz bandwidth
Graphene electro-optic modulator with 30 GHz bandwidth Christopher T. Phare 1, Yoon-Ho Daniel Lee 1, Jaime Cardenas 1, and Michal Lipson 1,2,* 1School of Electrical and Computer Engineering, Cornell University,
More informationChapter 3: Basics Semiconductor Devices and Processing 2006/9/27 1. Topics
Chapter 3: Basics Semiconductor Devices and Processing 2006/9/27 1 Topics What is semiconductor Basic semiconductor devices Basics of IC processing CMOS technologies 2006/9/27 2 1 What is Semiconductor
More informationattocfm I for Surface Quality Inspection NANOSCOPY APPLICATION NOTE M01 RELATED PRODUCTS G
APPLICATION NOTE M01 attocfm I for Surface Quality Inspection Confocal microscopes work by scanning a tiny light spot on a sample and by measuring the scattered light in the illuminated volume. First,
More informationTopic 3. CMOS Fabrication Process
Topic 3 CMOS Fabrication Process Peter Cheung Department of Electrical & Electronic Engineering Imperial College London URL: www.ee.ic.ac.uk/pcheung/ E-mail: p.cheung@ic.ac.uk Lecture 3-1 Layout of a Inverter
More informationGallium Nitride & Related Wide Bandgap Materials and Devices
Gallium Nitride & Related Wide Bandgap Materials and Devices Dr. Edgar J. Martinez Program Manager DARPATech 2000 GaAs IC Markets 1999 Market $11 Billion 2005 Market $20 Billion Consumers 2% Computers
More informationMEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications
MEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications Part I: RF Applications Introductions and Motivations What are RF MEMS? Example Devices RFIC RFIC consists of Active components
More informationLecture 19 Optical Characterization 1
Lecture 19 Optical Characterization 1 1/60 Announcements Homework 5/6: Is online now. Due Wednesday May 30th at 10:00am. I will return it the following Wednesday (6 th June). Homework 6/6: Will be online
More informationMicroprobe-enabled Terahertz sensing applications
Microprobe-enabled Terahertz sensing applications M. Nagel Protemics GmbH, Aachen, Germany TERAHERTZ LOW FREQUENCY MICROWAVES IR UV X-RAY RADIO WAVES VISIBLE GAMMA RAY THz frequency range 0.1 THz 1 THz
More information2007-Novel structures of a MEMS-based pressure sensor
C-(No.16 font) put by office 2007-Novel structures of a MEMS-based pressure sensor Chang-Sin Park(*1), Young-Soo Choi(*1), Dong-Weon Lee (*2) and Bo-Seon Kang(*2) (1*) Department of Mechanical Engineering,
More informationCharacterisation of Photovoltaic Materials and Cells
Standard Measurement Services and Prices No. Measurement Description Reference 1 Large area, 0.35-sun biased spectral response (SR) 2 Determination of linearity of spectral response with respect to irradiance
More informationCHAPTER 2 POLARIZATION SPLITTER- ROTATOR BASED ON A DOUBLE- ETCHED DIRECTIONAL COUPLER
CHAPTER 2 POLARIZATION SPLITTER- ROTATOR BASED ON A DOUBLE- ETCHED DIRECTIONAL COUPLER As we discussed in chapter 1, silicon photonics has received much attention in the last decade. The main reason is
More informationTechnician Licensing Class T6
Technician Licensing Class T6 Amateur Radio Course Monroe EMS Building Monroe, Utah January 11/18, 2014 January 22, 2014 Testing Session Valid dates: July 1, 2010 June 30, 2014 Amateur Radio Technician
More informationOptical Amplifiers. Continued. Photonic Network By Dr. M H Zaidi
Optical Amplifiers Continued EDFA Multi Stage Designs 1st Active Stage Co-pumped 2nd Active Stage Counter-pumped Input Signal Er 3+ Doped Fiber Er 3+ Doped Fiber Output Signal Optical Isolator Optical
More informationSupplementary Information
Supplementary Information Wireless thin film transistor based on micro magnetic induction coupling antenna Byoung Ok Jun 1, Gwang Jun Lee 1, Jong Gu Kang 1,2, Seung Uk Kim 1, Ji Woong Choi 1, Seung Nam
More informationData sheet for TDS 10XX system THz Time Domain Spectrometer TDS 10XX
THz Time Domain Spectrometer TDS 10XX TDS10XX 16/02/2018 www.batop.de Page 1 of 11 Table of contents 0. The TDS10XX family... 3 1. Basic TDS system... 3 1.1 Option SHR - Sample Holder Reflection... 4 1.2
More informationChapter 1. Introduction
Chapter 1 Introduction 1.1 Introduction of Device Technology Digital wireless communication system has become more and more popular in recent years due to its capability for both voice and data communication.
More informationBasic Components of Spectroscopic. Instrumentation
Basic Components of Spectroscopic Ahmad Aqel Ifseisi Assistant Professor of Analytical Chemistry College of Science, Department of Chemistry King Saud University P.O. Box 2455 Riyadh 11451 Saudi Arabia
More informationTransistor was first invented by William.B.Shockley, Walter Brattain and John Bardeen of Bell Labratories. In 1961, first IC was introduced.
Unit 1 Basic MOS Technology Transistor was first invented by William.B.Shockley, Walter Brattain and John Bardeen of Bell Labratories. In 1961, first IC was introduced. Levels of Integration:- i) SSI:-
More informationNew Pixel Circuits for Driving Organic Light Emitting Diodes Using Low-Temperature Polycrystalline Silicon Thin Film Transistors
Chapter 4 New Pixel Circuits for Driving Organic Light Emitting Diodes Using Low-Temperature Polycrystalline Silicon Thin Film Transistors ---------------------------------------------------------------------------------------------------------------
More informationSemiconductor Physics and Devices
Nonideal Effect The experimental characteristics of MOSFETs deviate to some degree from the ideal relations that have been theoretically derived. Semiconductor Physics and Devices Chapter 11. MOSFET: Additional
More informationEmbedded Sensors. We can offer you complete solutions for intelligent integrated sensor systems.
FRAUNHOFER-Institute For integrated Circuits IIS INTEGRATED CIRCUITS AND SYSTEMS ICS FROM AN IDEA TO A FINISHED PRODUCT WE ARE: CUSTOMER- ORIENTED PROFESSIONAL TIME-TO-MARKET- FOCUSED NETWORKED WE OFFER:
More informationVLSI Design. Introduction
VLSI Design Introduction Outline Introduction Silicon, pn-junctions and transistors A Brief History Operation of MOS Transistors CMOS circuits Fabrication steps for CMOS circuits Introduction Integrated
More informationIntegrated into Nanowire Waveguides
Supporting Information Widely Tunable Distributed Bragg Reflectors Integrated into Nanowire Waveguides Anthony Fu, 1,3 Hanwei Gao, 1,3,4 Petar Petrov, 1, Peidong Yang 1,2,3* 1 Department of Chemistry,
More informationTerahertz Spectroscopic/ Imaging Analysis Systems
Terahertz Spectroscopic/ Series Non-Destructive Analysis of Pharmaceuticals, Chemicals, Communication Materials, etc. Compact, High-Speed Terahertz Spectroscopic/ High-speed measurement functionality Compact,
More informationFunctional Materials. Optoelectronic devices
Functional Materials Lecture 2: Optoelectronic materials and devices (inorganic). Photonic materials Optoelectronic devices Light-emitting diode (LED) displays Photodiode and Solar cell Photoconductive
More informationWirelessly powered micro-tracer enabled by miniaturized antenna and microfluidic channel
Journal of Physics: Conference Series PAPER OPEN ACCESS Wirelessly powered micro-tracer enabled by miniaturized antenna and microfluidic channel To cite this article: G Duan et al 2015 J. Phys.: Conf.
More informationBasic Lighting Terms Glossary (Terms included in the basic lighting course are italicized and underlined)
Basic Lighting Terms Glossary (Terms included in the basic lighting course are italicized and underlined) Accent Lighting Directional lighting to emphasize a particular object or draw attention to a display
More informationPB T/R Two-Channel Portable Frequency Domain Terahertz Spectrometer
PB7220-2000-T/R Two-Channel Portable Frequency DATASHEET MA 2015 Compact, Portable Terahertz Spectroscopy System Bakman Technologies versatile PB7220-2000-T/R Spectroscopy Platform is designed for scanning
More informationFiberoptic and Waveguide Sensors
Fiberoptic and Waveguide Sensors Wei-Chih Wang Department of Mecahnical Engineering University of Washington Optical sensors Advantages: -immune from electromagnetic field interference (EMI) - extreme
More informationD. Impedance probe fabrication and characterization
D. Impedance probe fabrication and characterization This section summarizes the fabrication process of the MicroCard bioimpedance probes. The characterization process is also described and the main electrical
More informationCLUSTERLINE RAD VERSATILE DYNAMIC SPUTTER SYSTEM OPTOELECTRONICS, MEMS, PHOTONICS, WIRELESS
CLUSTERLINE RAD VERSATILE DYNAMIC SPUTTER SYSTEM OPTOELECTRONICS, MEMS, PHOTONICS, WIRELESS CLUSTERLINE RAD Enabling your roadmap in thin film deposition The combination of Evatec s process know-how and
More information64 Channel Flip-Chip Mounted Selectively Oxidized GaAs VCSEL Array
64 Channel Flip-Chip Mounted Selectively Oxidized GaAs VCSEL Array 69 64 Channel Flip-Chip Mounted Selectively Oxidized GaAs VCSEL Array Roland Jäger and Christian Jung We have designed and fabricated
More informationFundamentals of CMOS Image Sensors
CHAPTER 2 Fundamentals of CMOS Image Sensors Mixed-Signal IC Design for Image Sensor 2-1 Outline Photoelectric Effect Photodetectors CMOS Image Sensor(CIS) Array Architecture CIS Peripherals Design Considerations
More informationMonolithically integrated InGaAs nanowires on 3D. structured silicon-on-insulator as a new platform for. full optical links
Monolithically integrated InGaAs nanowires on 3D structured silicon-on-insulator as a new platform for full optical links Hyunseok Kim 1, Alan C. Farrell 1, Pradeep Senanayake 1, Wook-Jae Lee 1,* & Diana.
More informationLayout of a Inverter. Topic 3. CMOS Fabrication Process. The CMOS Process - photolithography (2) The CMOS Process - photolithography (1) v o.
Layout of a Inverter Topic 3 CMOS Fabrication Process V DD Q p Peter Cheung Department of Electrical & Electronic Engineering Imperial College London v i v o Q n URL: www.ee.ic.ac.uk/pcheung/ E-mail: p.cheung@ic.ac.uk
More informationEE 5611 Introduction to Microelectronic Technologies Fall Thursday, September 04, 2014 Lecture 02
EE 5611 Introduction to Microelectronic Technologies Fall 2014 Thursday, September 04, 2014 Lecture 02 1 Lecture Outline Review on semiconductor materials Review on microelectronic devices Example of microelectronic
More informationRF MEMS Simulation High Isolation CPW Shunt Switches
RF MEMS Simulation High Isolation CPW Shunt Switches Authored by: Desmond Tan James Chow Ansoft Corporation Ansoft 2003 / Global Seminars: Delivering Performance Presentation #4 What s MEMS Micro-Electro-Mechanical
More informationSILICON NANOWIRE HYBRID PHOTOVOLTAICS
SILICON NANOWIRE HYBRID PHOTOVOLTAICS Erik C. Garnett, Craig Peters, Mark Brongersma, Yi Cui and Mike McGehee Stanford Univeristy, Department of Materials Science, Stanford, CA, USA ABSTRACT Silicon nanowire
More informationЗдра вствуйте, това рищи!
Manufacturing of Smart Objects by Printing Technologies Здра вствуйте, това рищи! Moscow / RUS, June 05, 2013 Reinhard R. Baumann Chemnitz University of Technology Chair of Digital Printing Fraunhofer
More informationPlan Optik AG. Plan Optik AG PRODUCT CATALOGUE
Plan Optik AG Plan Optik AG PRODUCT CATALOGUE 2 In order to service the high demand of wafers more quickly, Plan Optik provides off the shelf products in sizes from 2 up to 300mm diameter. Therefore Plan
More informationEnd-of-line Standard Substrates For the Characterization of organic
FRAUNHOFER INSTITUTe FoR Photonic Microsystems IPMS End-of-line Standard Substrates For the Characterization of organic semiconductor Materials Over the last few years, organic electronics have become
More informationRobert G. Hunsperger. Integrated Optics. Theory and Technology. Sixth Edition. 4ü Spri rineer g<
Robert G. Hunsperger Integrated Optics Theory and Technology Sixth Edition 4ü Spri rineer g< 1 Introduction 1 1.1 Advantages of Integrated Optics 2 1.1.1 Comparison of Optical Fibers with Other Interconnectors
More informationFeature-level Compensation & Control
Feature-level Compensation & Control 2 Sensors and Control Nathan Cheung, Kameshwar Poolla, Costas Spanos Workshop 11/19/2003 3 Metrology, Control, and Integration Nathan Cheung, UCB SOI Wafers Multi wavelength
More informationCharacterization using laser-based technique for failure Si PV module
SAYURI-PV, Tsukuba, 4th Oct, 2016 Characterization using laser-based technique for failure Si PV module Y. Ishikawa, 1 M. A. Islam, 1 K. Noguchi, 1 H. Iida, 2 Y. Takagi, 2 and H. Nakahama 2 1: NAIST, 2:
More informationEtch, Deposition, and Metrology Options for Cost-Effective Thin-Film Bulk Acoustic Resonator (FBAR) Production
Etch, Deposition, and Metrology Options for Cost-Effective Thin-Film Bulk Acoustic Resonator (FBAR) Production Figure 1 Veeco is driving System on a Chip Technology Frank M. Cumbo, Kurt E. Williams, John
More informationNational Science Foundation Center for Lasers and Plasmas for Advanced Manufacturing. Mool C. Gupta Applied Research Center Old Dominion University
National Science Foundation Center for Lasers and Plasmas for Advanced Manufacturing Mool C. Gupta Applied Research Center Old Dominion University National Science Foundation Center - Center Mission -
More informationThe equipment used share any common features regardless of the! being measured. Electronic detection was not always available.
The equipment used share any common features regardless of the! being measured. Each will have a light source sample cell! selector We ll now look at various equipment types. Electronic detection was not
More informationLecture 18: Photodetectors
Lecture 18: Photodetectors Contents 1 Introduction 1 2 Photodetector principle 2 3 Photoconductor 4 4 Photodiodes 6 4.1 Heterojunction photodiode.................... 8 4.2 Metal-semiconductor photodiode................
More informationFiber Laser Chirped Pulse Amplifier
Fiber Laser Chirped Pulse Amplifier White Paper PN 200-0200-00 Revision 1.2 January 2009 Calmar Laser, Inc www.calmarlaser.com Overview Fiber lasers offer advantages in maintaining stable operation over
More informationFlexible Hybrid Electronics Fabricated with High-Performance COTS ICs using RTI CircuitFilm TM Technology
Flexible Hybrid Electronics Fabricated with High-Performance COTS ICs using RTI CircuitFilm TM Technology Scott Goodwin 1, Erik Vick 2 and Dorota Temple 2 1 Micross Advanced Interconnect Technology Micross
More informationDTU DANCHIP an open access micro/nanofabrication facility bridging academic research and small scale production
DTU DANCHIP an open access micro/nanofabrication facility bridging academic research and small scale production DTU Danchip National Center for Micro- and Nanofabrication DTU Danchip DTU Danchip is Denmark
More informationCharacterisation of Photovoltaic Materials and Cells
Standard Measurement Services and Prices Reference 1 Large area, 0.3-sun bias spectral response Wavelength measurement range: 300 1200 nm; Beam power monitoring and compensation; Measurement cell size:
More informationFabrication Techniques of Optical ICs
Fabrication Techniques of Optical ICs Processing Techniques Lift off Process Etching Process Patterning Techniques Photo Lithography Electron Beam Lithography Photo Resist ( Microposit MP1300) Electron
More informationChapter 3 Fabrication
Chapter 3 Fabrication The total structure of MO pick-up contains four parts: 1. A sub-micro aperture underneath the SIL The sub-micro aperture is used to limit the final spot size from 300nm to 600nm for
More informationHermetic Packaging Solutions using Borosilicate Glass Thin Films. Lithoglas Hermetic Packaging Solutions using Borosilicate Glass Thin Films
Hermetic Packaging Solutions using Borosilicate Glass Thin Films 1 Company Profile Company founded in 2006 ISO 9001:2008 qualified since 2011 Headquarters and Production in Dresden, Germany Production
More informationTerahertz Technologies
Terahertz Technologies Physics, Sources, and Applications SRJC, PHYS43 Spring 2013 Physics Terahertz corresponds with the frequencies between 100 GHz to 10 THz This rage is also called the Terahertz Gap
More informationSupporting Information. for. Visualization of Electrode-Electrolyte Interfaces in LiPF 6 /EC/DEC Electrolyte for Lithium Ion Batteries via In-Situ TEM
Supporting Information for Visualization of Electrode-Electrolyte Interfaces in LiPF 6 /EC/DEC Electrolyte for Lithium Ion Batteries via In-Situ TEM Zhiyuan Zeng 1, Wen-I Liang 1,2, Hong-Gang Liao, 1 Huolin
More informationMonitoring the plant water status with terahertz waves
Monitoring the plant water status with terahertz waves Dr. Gunter Urbasch Experimental Semiconductor Physics AG Martin Koch Fachbereich Physik Experimentelle Halbleiterphysik Arbeitsgruppe M. Koch Gunter
More information+1 (479)
Introduction to VLSI Design http://csce.uark.edu +1 (479) 575-6043 yrpeng@uark.edu Invention of the Transistor Vacuum tubes ruled in first half of 20th century Large, expensive, power-hungry, unreliable
More informationLaser Edge Isolation for High-efficiency Crystalline Silicon Solar Cells
Journal of the Korean Physical Society, Vol. 55, No. 1, July 2009, pp. 124 128 Laser Edge Isolation for High-efficiency Crystalline Silicon Solar Cells Dohyeon Kyeong, Muniappan Gunasekaran, Kyunghae Kim,
More informationConference Paper Cantilever Beam Metal-Contact MEMS Switch
Conference Papers in Engineering Volume 2013, Article ID 265709, 4 pages http://dx.doi.org/10.1155/2013/265709 Conference Paper Cantilever Beam Metal-Contact MEMS Switch Adel Saad Emhemmed and Abdulmagid
More information