Power Electronic Packaging, Co-Design and Reliability

Transcription

1 Power Electronic Packaging, Co-Design and Reliability Yong Liu, Corporate R & D May 29, 2018

2 Outline I. Power Electronics Packaging II. Current State of Art Co-Design in Power Electronics Packaging III. Challenges in Co-Design and Reliability IV. What is the Next? V. Summary

3 I. Power Electronic Packaging: Driven Capability Pout [W] Silicon : 12V 1700V -Best FOM, Packaging Options 10M SiC Superjunction: 650V 900V -Optimized HV solution 1M 100k Central PV* pile OBC** SiC: 900V above 1700 V -High power density performance GaN: 650V - High frequency performance 10k 1k Silicon Remains Mainstream Technology String PV* SJ GaN 1k 10k 100k 1M 10M fsw [Hz] * PV = photovoltaic inverter; ** OBC = onboard charger

4 I. Power Electronic Packaging: GaN & SiC Applications 4

5 I. Power Electronic Packaging: Evolution Pkg Transition (Discrete to Intelligent Package) Discrete Package Intelligent Power Module 10M 10M Inverter Motor Control GTO UPS Welder Automotive Capacity (VA) 1M 100k 10k 1 k SCR Module Triac Transistor Module IGBT Module MOSFET Module IGBT Module IPM MOSFET Air Conditioner Refrigerator Washing Machine TV (Display) 100 Operation Frequency (Hz) 1k 10k 100k 1M Courtesy of Former Fairchild CTO Dan Kinzer

6 I. Power Electronic Packaging: Core Technology S o u rc e : ORTHODYNE Al wire bonding Ribbon Bonding Interconnect US welding Clip /LF bonding Embedded die bonding M itsu b ish i In fin e o n Substrate L LF DBC/DBA/IMS Double DBC/spacer Microchannel DBC Substrate less Die Attach Soldering Vacuum soldering Ag/Cu sintering UC Irving Ag attach Encapsulation Gel EMC Potting Epoxy MUF

7 II. Current State of Art Co-Design in Power Electronic Packaging To Provide Differentiating & Cost Effective Co-design Infrastructure for Power Electronics Current Co-Design Platform Includes: Explore/Design + Simulation + Design Verification + Methodology + Development/Share Weakness: Case by Case Not strong in design sensitivity, optimization and probability Not Yet Ready for virtual prototyping Design Platform Simulation Tools Design Verification Design Methodology Development/Share

8 III. Challenges in Co-Design and Reliability Multi-Scale and Multi-Physics in Co-Design/Reliability: Reliability from Die design to system Assembly Reliability: Multi-Step Process/Variation/Probability

9 IV. What is the next: Co-Design Ecosystem for a Efficient Virtual Prototype The system will target: Co-design ecosystem Current CoDesign Various design and simulation software for co-design Platform Mat Lab for various mat properties test Multi-scale and Multi-physics in Design Sensitivity/Optimization/Probabilistic Analysis in Design, Assembly Process and Reliability Co-design vault and environment Te st La b fo r e le ctrica l, th e rm a l a n d m e ch a n ica l p e rfo rm a n ce 9

10 V. Summary Current state of art Co-Design includes Explore/Design + Simulation + Design Verification + Methodology + Development/Sharing Virtual Prototyping Key Challenges in Co-Design/Reliability include Multi-Scale and Multi-Physics, Multi-Step Process/Variation Probability Co-Design Ecosystem & Virtual Prototyping will happen soon in Power Electronics Industry