THURSDAY, DECEMBER 4 TH

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2 THURSDAY, DECEMBER 4 TH 1.00 PM Welcome 1.30 PM Introduction ARCSIS (Rousset, France) & CMP (Gardanne, France) 1.45 PM Microelectronics in the competitiveness cluster Secured Communicating Solutions Georges Falessi, SCS cluster (Rousset, France) SESSION 1 PROCESS PACKAGING Chairmen: Béatrice Dubois (Gemalto), Olivier Brunet (SPS) 2.00 PM Introduction - Presentation of the Micro-PackS ressource Platform, Michel Thomas, Director 2.10 PM Keynote speaker Nicolas SILLON, CEA-LETI Minatec (Grenoble, France) 3D Perspectives 2.40 PM Advanced Equipment Solutions for C2W (Chip to Wafer Stacking) M. Gehmayer, Datacon (Radfeld, Austria) 3.00 PM Flip Chip vs. COB A production and cost comparison for real products J. Kloeser, M. Schmidt, T. Oppert, G. Azdasht, E. Zakel, Pac Tech Packaging Technologies, (Nauen, Germany), A. Ferber, AEMtec (Berlin, Germany) 3.20 PM Stacking Technique Of Fully Wafer Level Process Without Thru- Silicon Via - Commercial Applications C. Val, P. Couderc, N. Boulay, 3D Plus (Buc, France) 3.40 PM "CIWIS" - Chip In Wafer for Integrated System J.-C. Souriau, M.E. Faivre, N. Sillon, CEA-LETI Minatec (Grenoble, France) 4.00 PM TAIKO Process H. Douass, Disco Hi-Tec (Aix-en- Provence, France) 4.20 PM Break 4.50 PM Adhesive Flip-chip Interconnections for Inlays of Contact-less Smart Cards J. Lenkkeri, T. Jaakola, M. Lahti, VTT (Oulu, Finland), T. Kaskiala, Gemalto (Vantaa, Finland), M. Allen, VTT (Espoo, Finland) 5.10 PM Packaging of optoelectronic devices for half duplex communication in surfaceintegrated polymer-optical fibres M. Dumke, L. Overmeyer, Institute of Transport & Automation Technology (Garbsen, Germany) SESSION 2 PRINTED ELECTRONICS Chairmen: Philippe Collot (CMP), Michel Thomas (Gemalto) 5.30 PM Keynote speaker Jean-Luc MATE, Chairman, EURIPIDES (Paris, France) EURIPIDES : A strategic booster for innovative projects 5.45 PM «JETPAC», a semi-industrial prototyping tool for printed electronics I. Pages, C. Calmes, P. Benaben, A. Le Henry Provence Microelectronics Centre, (Gardanne, France)

3 6.05 PM Printed Electronics Technology Platform Initiative in France L. Jamet, R. Coppard, Sofileta (Bourgoin-Jallieu, France), F. Gaillard, CEA Liten (Grenoble, France) 6.25 PM Conference closure 7.00 PM Dinner FRIDAY, DECEMBER 5 th 8.45 AM Welcome SESSION 2 PRINTED ELECTRONICS Chairmen: Philippe Collot (CMP), Michel Thomas (Gemalto) 9.00 AM Organic transistor fabrication assisted by laser techniques: application in plastic microelectronics L. Rapp, C. Cibert, A.P. Alloncle, P. Delaporte, LP3 (Marseilles, France), S. Nenon, C. Videlot-Ackermann, F. Fages, CINaM (Marseilles, France) 9.20 AM Organic Thin Film Transistor: from unipolar transistor to complementary logic functions J.M. Verilhac, D. Boudinet, C. Bory, J. Bablet, J. Tallal, F. Sonier, M. Heitzmann, A.L. Seiler, S. Jacob, R. Gwoziecki, C. Serbutoviez, F. Gaillard, CEA Liten (Grenoble, France), M. Benwadih, H. Bracoud, K. Aissou, L. Jamet, R. Coppard, Sofileta (Bourgoin-Jallieu, France) 9.40 AM Development of Metal Coated Polymer Particles With Extremely Narrow Size Distribution for Electronic Interconnections H. Kristiansen, K. Redford, Conpart (Skjetten, Norway), Z. Zhang, J. Hee, T. Helland, NTNU (Norway) AM Electrical and physical characterization of nanoparticle silver ink lines printed by inkjet on plastic substrates B. Bensaid, X. Boddaert, K. Inal, M. Fenoll, S. Sanaur, Centre Microélectronique de Provence Georges Charpak (Gardanne, France) AM Break

4 SESSION 3 CHARACTERIZATION & MATERIALS Chairmen: Lucile Dossetto (Gemalto), Patrick Dessaux (NBS Technologies) AM New UV glob top resin for micropackaging encapsulation S. Rolland, Protavic International (Levallois, France) AM Hermeticity issues and assembly options for reliable cavity micropackaging using novel plastic materials and processes R. De Langlade, F. Caillot, NovaPack Technologies (Saint Egrève, France), M. Bois, AcuiPlast (France) AM Design for reliability of smart card module: numerical and experimental investigation M. Su, K. Inal, X. Boddaert, Centre Microélectronique de Provence Georges Charpak (Gardanne, France), A. Cauvin, R. Kubler, M. Desvignes, J.E. Masse, MécaSurf, Arts et Métiers ParisTech (Aix en Provence, France) AM Dupont Microcircuit Materials in Printed Electronics C. Labro, Dupont de Nemours (Puteaux, France) PARTNERSHIP 2008 IMAPS is an international society charged to promote Microelectronics, Interconnection and Packaging Industry and to support university research as well as industrial development of various sectors: High-density substrates (ceramics, printed circuit, flexible circuit), Hybrid circuit, MCM, COB, Chip packaging (ASIC, MEMS ) 3D assembly, wafer level, electronic chip assembly, CMS, connectors IMAPS society is also an international network with more than 70 representations and offers to its members the opportunity of international meetings. IMAPS assume the publication for its members who write technical items in professional magazines. IMAPS organize regularly technical meetings and forums where are presented new materials and components, new technologies as well as development, production and test equipments. IMAPS actors are engineers and technicians of SME s or big companies, searchers in independent, university or public laboratories, representatives or distributors working in the following fields: aeronautics and space, military, telecommunication, computer industry, transportation, scientific experimentation PM Conference closure PM Lunch NEXT EVENTS Technical Day on Connectic October 23 rd, 2008 Novotel La Defense, Paris - France 4 th European Advanced Technology Workshop on Micropackaging and Thermal Management February 4 th & 5 th, 2009 Mercure, La Rochelle - France

5 ARCSIS MICROPACKAGING DAYS 2008 For the last six years, ARCSIS has organized a number of technical and scientific days dedicated to Micropackaging, which is one of the industrial strengths of the Provence-Alps- Riviera region. This event will take place on December 4 th & 5 th, 2008 and is open to national and international microelectronics key actors working in this field. OBJECTIVES This meeting will consist of scientific and technical conferences presented by experts from Universities, research centres and industry. It will also provide the opportunity for suppliers and users to: become familiar with the most recent technical advances in micropackaging and advanced assembly techniques in particular new SIP packaging technologies (high density logic, RF blocks, analog sensors, new flexible substrates, very thin silicium, die to wafer stacking, new form factors, etc.), communicate on recent achievements in printed electronics, identify the needs of industry in diverse applications ranging from portable/mobile devices to medical microanalitycal systems, share information at the poster session and discuss the latest research results in an informal atmosphere, make new connections and open new prospects for partnership. LOCATION OF THE EVENT This Meeting will be hosted by the Provence Microelectronics Centre in Gardanne, a brand new education and research centre. It is located at the heart of a major Microelectronics cluster in France gathering leading manufacturers of semiconductor devices and smart cards. It is also 20kms from Aix en Provence, which is a city of art and culture, well-known for its architecture. Moreover, it is an ideal base for visiting the rest of Provence and its beautiful countryside all within a few kilometres: the Calanques, Camargue, the Luberon and the Riviera. For further information about Provence.

6 REGISTRATION FORM ARCSIS MICROPACKAGING DAYS 2008 Thin and Flexible Packaging PROVENCE MICROELECTRONICS CENTRE, GEORGES CHARPAK SITE, GARDANNE, FRANCE DECEMBER 4 th & 5 th, 2008 To send back by fax to: +33 (0) Deadline for registration: Friday, November 14 th, 2008 Company/ Organisation:... Last name, first name:... Function:... Activity: Company Research Center Organisation Address:... Zip code:... Town:... Country:... Phone:... Fax: I wish to attend: ARCSIS Micropackaging Days December 4 th & 5 th, 2008 Provence Microelectronics Centre, Gardanne (FRANCE) Dinner on December 4 th, 2008 I will pay by: Bank check to ARCSIS Bank Swift to BNP Aix-en-Provence BP 19 - Place Paul Borde Rousset Code banque : (France) Bank Code : FR I wish to receive: The list of hotels selected by ARCSIS The acces map to the Provence Microelectronics Centre (CMP-GC) REGISTRATION FEES ARCSIS MICROPACKAGING DAYS December 4 th & 5 th, 2008 (lunches, breaks and proceedings included) ARCSIS members 230 incl. VAT (200 incl. VAT for extra registrations) Non-members Deadline for registration: Friday, November 14 th, incl. VAT SCIENTIFIC STEERING COMMITTEE B. Dubois beatrice.dubois@gemalto.com Gemalto P. Collot collot@emse.fr Provence Microelectronics Centre L. Dossetto lucile.dossetto@gemalto.com Gemalto M. Thomas michel.thomas@gemalto.com CIM PACA Micro-PackS Platform P. Dessaux pdessaux@nbstech.com NBS Technologies O. Brunet olivier.brunet@s-p-s.com Smart Packaging Solutions CONTACT / INFORMATION Communication manager: Corinne Joachim Communication assistant: Coraline Hubin ARCSIS BP 19 - Place Paul Borde ROUSSET - FRANCE Tel: +33 (0) Fax: +33 (0) contact@arcsis.org Creation: / Photos: ARCSIS - Anne Loubet