rovence Microelectronics Center Georges Charpak Site Gardanne France
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1 rovence Microelectronics Center Georges Charpak Site Gardanne France
2 «Ecole des Mines» Group Key figures: 1783, Foundation of the Ecole Royale des Mines de Paris 1816, Foundation of the Ecole des Mines de Saint Etienne 2003, Provence Microelectronics Center 6200 students, all fields of study combined, 18% foreign students 2200 graduate degrees per year, including 1000 engineering Master's and 220 PhDs 43 research labs 1000 faculty members and 1000 doctoral students publications 250 partnerships with universities all over the world % of the total turnover from research contracts signed in France between university research labs and corporations Gardanne tember
3 Ecole des mines de Saint Etienne: Graduate & Post-graduate School of engineering Ranked in the top ten French engineering schools (240) French ministry of Industry (MINEFE) Mission: Contribute to companies competitiveness Train high qualified managers with strong technical & scientific skills Develop applied research to meet the needs of industry Key figures 1 school 2 campuses 6 research and training centers 4 masters degrees 7 post master programs 1200 students 300 permanent staff 120 researchers/teachers tember
4 Provence Microelectronics Center 2008 : new campus : temporary buildings tember
5 Missions Engineer formation needed by electronics / microelectronics manufacturers and user sectors. Applied research in partnership with industry and universities, Industrial development & technical incubation for enterprise creation projects. tember
6 Georges Charpak Campus FACILITIES m 2 : total area m 2 : buildings 1000 m 2 : clean room OALS Multi-cultural Campus 130 permanent staff 660 students 250 researchers/enginners tember
7 Provence Alpes Côte d Azur (PACA): a strategic location 35% of national production in semiconductors jobs 100 companies 3 main sectors and derived activities (equipments, supplies) : Integrated Device Manufacturers (STMicroelectronics, Atmel) Smart cards (Gemalto) Computer assisted Design (Philips, TI, Cadence, ARM, Mentor Graphics,..) Competitiveness Cluster «MINALOGIC» EMSE-CMP Competitiveness Cluster «Secured communication solutions» tember
8 September 2008 Permanent staff 82 permanents with 48 researchers/teachers Students 362 graduate students (152 in continuing education program) 17 PhD students (13 thesis in partnership with industry) Key figures 7 graduate programs International partnerships Jiao Tong University (Shanghai) Seoul National University 3 research teams 1 joint R&D team with CEA-LETI 2 R&D platforms (design / Micropackaging / IC security) tember
9 Academic programs 4 MASTERS OF SCIENCE (3 years) Joint MS "Ingénieur Civil des Mines" (generalist engineers) (ICM) MS in microelectronics (specialized engineers) (ISMIN) MS in micro & nanoelectronics (PhD preparation) (MINELEC) MS in Electronics & Industrial Information technology (part time, continuing education) (ISFEn) 2 POST-MASTER PROGRAMS (1 year) Microelectronics technology & Manufacturing management (TMPM) Security of Integrated Systems & Applications (SISA) tember
10 Research: 3 departments Manufacturing Sciences & Logistics (SFL) Pr S. Dauzère Pérès 9 researchers, 2 engineers-technicians, 8 PhD students Advanced Equipment & Process Control (AEC / APC) Modeling, optimization and decision control Supply chain management Packaging & Flexible Substrates (PS2) Pr P. Benaben 14 researchers, 5 engineers-technicians, 5 PhD students Plastic / Printed electronics Micro-packaging and advanced interconnections Secured Architectures & Systems (SAS) A. Tria (CEA-Leti) 13 researchers, 4 engineers-technicians, 4 PhD students (joint research team with CEA-LETI) Hardware security Applied cryptography tember
11 R&D partnerships Industry ST Microelectronics ATMEL GEMALTO Paca SME s Research agency CEA-DRT: Liten, Leti Universities University of Montpellier (LIRMM) University of Grenoble (IMEP, LTPCM, TIMA) University of Marseille (IM2NP, LP3, CINAM) Networks OEA: Organic Electronic Association (European Industry) CIMPACA: Microelectronics integrated Center of PACA SCS: Competitiveness cluster «Secured Communicating Solutions» tember
12 Ressources (mostly in public/private partnership) Clean rooms Micro-Packaging prototyping line (CIMPACA) Printed electronics platform (CIMPACA) Class 1000 Microfabrication facilities Security labs CIMPACA labs SAS labs CAD labs CIMPACA platform Conception CNFM ressources for education Mechanical tests & reliability labs (CIMPACA) tember
13 inancing FEDER - FSE Thank you for your attentio tember
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