Status and Perspectives of the European Semiconductor Industry. Andreas Wild
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1 Status and Perspectives of the European Semiconductor Industry Andreas Wild
2 Content for the European Semiconductors Industry 2. Public-Private Partnership 3. Key Enabling Technologies: Pilot Lines 4. European Education 5. Conclusions 2
3 2011 for the European Semiconductors Industry 2011 in Semiconductors 1. The total available market in semiconductors reached for the first time $300B 2. The three early adopters of newest technologies (Intel, Samsung, TSMC) expanded their leadership growing faster than the market 3. The leading foundry (TSMC) reached $14B in sales, the only Integrated Device Manufacturers (IDMs) surpassing it are Intel and Samsung 4. For the first time, a fabless company ranks in the top five (Qualcomm, exceeding $10B in sales) 5. For the first time, a European company (ASML) ranks #1 in semiconductor equipment supply. 3
4 2011 for the European Semiconductors Industry The Electronics Value Chain 4
5 2011 for the European Semiconductors Industry 2011: European Highlights Infineon announced investments in power semiconductor Dialog ranked as 4 th fastest growing fabless company in the world Three European specialty foundries ranked in top 20 ASML raked as #1 IC equipment manufacturer Source: isupply, IC Insights, VLSI Research 5
6 Where Are We Now: The Nanoelectronics Value Chain(s) Assembly and Packaging Fabless Foundries IDM STM Infineon NXP #5 #10 #17 #5 #11 #19 #7 #13 #17 #7 #12 #16 Bosch Not in Not in Top 50 Top 50 #45 #41 TAM isupply on Wikipedia + IC Insights Fabless STEricsson CSR Lantiq Dialog N/A #12 N/A N/A #7 #16 N/A #30 #8 #16 #21 #33 #10 #14 #20 #21 TAM IC Insights (STEricsson@100%) Integrated Devices Manufacturers Equipment, Materials, EDA Foundry X-Fab #7 #13 #13 #14 Altis N/A N/A N/A #16 LFoundry N/A N/A N/A #20 TAM Pure-play Si, isupply, IC Insights Equipment ASML ASM #2 #9 #3 #7 #3 #7 N/A N/A Carl Zeiss SMT #7 #12 #9 N/A Aixtron #15 #13 N/A TAM ENIAC JU, VLSI research Materials SOITEC Europe N/A N/A TAM IC Insight, SOITEC EDA ARM TAM tbd tbd tbd ARM 6
7 2011 for the European Semiconductors Industry Market Share of European Leaders 7
8 2011 for the European Semiconductors Industry Innovation Chain Diversification: MEMS, Sensors, Actuators Diversification: NVM, BiCMOS, Power <= 200mm Advanced users: Communication processors Early adopters: High speed μprocessors, Memories, Advanced foundries 300mm Equipment, Materials 450mm 8
9 Public-Private Partnership Public Support in Europe 1. National Programmes 2. Member States Collaborative Programmes Sharing the Vision, Mission, Strategy (AENEAS Contribution) EUREKA Cluster CATRENE o Funding: EU Member States, according to national procedures ENIAC Joint Undertaking o Funding: 2/3 ENIAC member States,1/3 ENIAC Joint Undertaking 3. European Commission o European Research Council o Framework Programme 7 (FP7) o Competitiveness and Innovation Framework Programme (CIP) o European Institutes of Technology (EIT) 9
10 Public-Private Partnership Increase in R&D Resources ( Additionality ) Full Time Equivalent researchers engaged in the projects 10
11 Public-Private Partnership 11
12 Public-Private Partnership National Contributions (commitments) 12
13 Intelligent Electric Vehicle Safety in Traffic Co-operative Traffic Management Internet Multimedia Services Evolution to a Digital Lifestyle Self-organizing Networks Short-range Convergence Sustainable and Efficient Energy Generation Energy Distribution and Management - Smart Grid Reduction of Energy Consumption Home Healthcare Hospital Healthcare Heuristic Healthcare Consumer and Citizen Security Securing the European Challenging Applications Enabling Technologies for Trust, Security and Safety Automotive and Transport Communication and Digital Lifestyle Energy Efficiency Health Care and Aging Society Safety and Security EUREKA Cluster CATRENE and ENIAC JU Research Agenda ENIAC JU Multi Annual Strategy Plan Design Technology Semiconductor Process and Integration Equipment, Materials and Manufacturing Managing Complexity Managing Diversity Designing for Reliability and Yield Know-how on Advanced and Emerging Semiconductor Processes Competitiveness through Semiconductor Process Differentiation Opportunities in System in Package Advanced CMOS - 1Xnm & 450mm More than Moore Manufacturing 13
14 Public-Private Partnership Running ENIAC JU Projects 14
15 Public-Private Partnership ENIAC Joint Undertaking Total Eligible Costs Distribution
16 Public-Private Partnership Ecosystem Participation 16
17 KET Pilot Lines Key Enabling Technologies for Europe Nanotechnology Micro- and nanoelectronics, including semiconductors, are essential for all goods and services which need intelligent control in sectors as diverse as automotive and transportation, aeronautics and space. Smart industrial control systems permit more efficient management of electricity generation, storage, transport and consumption through intelligent electrical grids and devices; Photonics Advanced materials Biotechnology Commission communication Preparing for our future: Developing a common strategy for key enabling technologies in the EU, Brussels, , COM(2009)
18 KET Pilot Lines The Three Pillar Bridge and the Technology Readiness Levels 18
19 KET Pilot Lines 2012 : Pilot Line Projects Implementation in ENIAC JU Second Pillar Pilot Line Project Executed by an industrial consortium Using an innovative technology ENIAC JU compatibility Developing an innovative product, meeting a social challenge Demonstrating its value and potential Establishing a realistic environment, a facility Having a deployment plan to a real life European manufacturing site Source: High-Level Group on Key Enabling Technologies, Final Reoprt, June 2011 R&D Part 19
20 KET Pilot Lines Pilot Line Expressions of Interest Number of proposals per research area 20
21 Equipment, Materials Academic Research Education Technology Pipeline Advanced Research Advanced Modules Process Development Process Integration 21
22 Education Accreditation U.S.A.: ABET France: Commission des titre d ingénieur Germany: ASIIN e.v. Japan Accreditation Board for Engineering Education (JABEE) Accreditation Board for Engineering Education of Korea (ABEEK) Etc. 22
23 Education ABET Criteria for Accrediting Engineering Technology Programs Effective for Reviews during the Accreditation Cycle GENERAL CRITERIA Criterion 1. Students Criterion 2. Program Educational Objectives Criterion 3. Student Outcomes Criterion 4. Continuous Improvement Criterion 5. Curriculum Criterion 6. Faculty Criterion 7. Facilities Criterion 8. Institutional Support 23
24 Education ABET Criteria for Accrediting Engineering Technology Programs Criterion 3. Student Outcomes B. For baccalaureate degree programs, these student outcomes must include, but are not limited to, the following learned capabilities: a)an ability to select and apply the knowledge, techniques, skills, and modern tools of the discipline to broadly-defined engineering technology activities; b)an ability to select and apply a knowledge of mathematics, science, engineering, and technology to engineering technology problems that require the application of principles and applied procedures or methodologies c)an ability to conduct standard tests and measurements; to conduct, analyze, and interpret experiments; and to apply experimental results to improve processes; d)an ability to design systems, components, or processes for broadly-defined engineering technology problems appropriate to program educational objectives; e)an ability to function effectively as a member or leader on a technical team; f)an ability to identify, analyze, and solve broadly-defined engineering technology problems; g)an ability to apply written, oral, and graphical communication in both technical and non-technical environments; and an ability to identify and use appropriate technical literature; h)an understanding of the need for and an ability to engage in self-directed continuing professional development; i)an understanding of and a commitment to address professional and ethical responsibilities including a respect for diversity; j)a knowledge of the impact of engineering technology solutions in a societal and global context; and k)a commitment to quality, timeliness, and continuous improvement. 24
25 AMIS 0.7μ + HV, 0.5μ μ austriamicrosystems 0.35μ + HV + SiGeBiCMOS,0.18μ IHP 0.25μ + SiGe:C TSMC 0.25μ, 0.18μ + HV, 0.13μ, 90nm, 65nm, 40nm UMC 0.18μ + RF + Image Sensor 1P4M, 0.13μ, 110nm, 90nm, 65nm TRONICS MEMSOI MEMSCAP METALMUMPS, PolyMUMPS, SOIMUMPS imec SiGeMEMS epixfabimec SiPhotonics LFoundry 0.15μ Foundry for Education (and not only ) Foundry Technology EURO PRACTICE AMIS 0.7μ + HV, 0.5μ μ # austriamicrosystems 0.35μ + HV + SiGeBiCMOS, 0.18μ # # epixfabimec SiPhotonics # IHP 0.25μ + SiGe:C # imec SiGeMEMS # Leti-CEA 20nm FDSOI # LFoundry 0.15μ # MEMSCAP METAL-, Poly-, SOIMUMPS # # STMicroelectronics 0.35μ + HV + Flash, 0.18μ + HV, 0.13μ+HV+SOI+SiGe BiCMO, 65nm + SOI, 40nm, 28nmn Tezzaron/GFoundries 0.13μ + 3D # TriQuint 0.15μ GaAs # TRONICS MEMSOI # TSMC 0.25μ, 0.18μ + HV, 0.13μ, 90nm, 65nm, 40nm # UMC 0.18μ + RF + Image Sens., 0.13μ, 110nm, 90nm, 65nm # 25 CMP #
26 Conclusion Conclusions The European semiconductor industry must focus its efforts in three strategic areas 1. Development and industrialization of advanced CMOS technologies on 300mm substrates 2. Diversification processes technologies on 200mm substrates and their evolution towards 300mm substrates 3. Preparation of the transition to 450mm substrates Public-private partnership: the only way to reach the needed economy of scale to re-engage The performance of the European education institutions is part of the solution, not of the problem 26
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