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1 STGB8NC60KD - STGD8NC60KD STGF8NC60KD - STGP8NC60KD 600 V - 8 A - short circuit rugged IGBT Features Lower on voltage drop (V CE(sat) ) 2 Lower C RES / C IES ratio (no cross-conduction susceptibility) Very soft ultra fast recovery antiparallel diode Short circuit withstand time 10 µs TO DPAK 3 Applicatio 2 High frequency motor controls SMPS and PFC in both hard switch and resonant topologies TO-220FP 1 D ² PAK 3 Motor drivers Description This IGBT utilizes the advanced PowerMESH process resulting in an excellent trade-off between switching performance and low on-state behavior. Figure 1. Internal schematic diagram Table 1. Device summary Order codes Marking Package Packaging STGB8NC60KDT4 GB8NC60KD D²PAK Tape and reel STGD8NC60KDT4 GD8NC60KD DPAK Tape and reel STGF8NC60KD GF8NC60KD TO-220FP Tube STGP8NC60KD GP8NC60KD TO-220 Tube April 2008 Rev 2 1/

2 Contents STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Contents 1 Electrical ratings Electrical characteristics Electrical characteristics (curves) Test circuit Package mechanical data Packaging mechanical data Revision history /18

3 STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Electrical ratings 1 Electrical ratings Table 2. Absolute maximum ratings Value Symbol Parameter D²PAK TO-220 DPAK TO-220FP Unit V CES Collector-emitter voltage (V GE = 0) 600 V I C (1) Collector current (continuous) at T C = 25 C 15 7 A I C (1) Collector current (continuous) at T C = 100 C 8 4 A I CL (2) I CP (3) Turn-off latching current 30 A Pulsed collector current 30 A V GE Gate-emitter voltage ±20 V I F Diode RMS forward current at T C = 25 C 7 A I FSM V ISO Surge not repetitive forward current t p = 10 ms sinusoidal Iulation withstand voltage (RMS) from all three leads to external hea sink ( t=1 s; T C = 25 C) 20 A V P TOT Total dissipation at T C = 25 C W T j Operating junction temperature 55 to 150 C T scw Short circuit withstand time (V CE = 0.5 V BR(CES), T C = 125 C, R G = 10 Ω, V GE = 12 V) 10 µs 1. Calculated according to the iterative formula: 2. V clamp = 80% (V CES ), V GE =15 V, R G =10 Ω, T J =150 C T T I ( T ) = JMAX C C C R V ( T, I ) THJ C CESAT( MAX) C C 3. Pulse width limited by max junction temperature allowed Table 3. Thermal resistance Value Symbol Parameter D²PAK TO-220 DPAK TO-220FP Unit R thj-case R thj-case Thermal resistance junction-case max IGBT Thermal resistance junction-case max diode C/W C/W R thj-amb Thermal resistance junction-ambient max 62.5 C/W 3/18

4 Electrical characteristics STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD 2 Electrical characteristics (T CASE =25 C unless otherwise specified) Table 4. Static Symbol Parameter Test conditio Min. Typ. Max. Unit V (BR)CES Collector-emitter breakdown voltage (V GE = 0) I C = 1 ma 600 V V CE(sat) Collector-emitter saturation voltage V GE = 15 V, I C = 3 A V GE = 15 V, I C = 3 A, T C = 125 C V V V GE(th) Gate threshold voltage V CE = V GE, I C = 250 µa V I CES Collector cut-off current (V GE = 0) V CE = 600 V V CE = 600 V, T C = 125 C µa ma I GES Gate-emitter leakage current (V CE = 0) V GE = ±20 V ±100 na g fs (1) Forward traconductance V CE = 15 V, I C = 3 A 1.9 S 1. Pulse duration = 300 us, duty cycle 1.5 % Table 5. Dynamic Symbol Parameter Test conditio Min. Typ. Max. Unit C ies C oes C res Input capacitance Output capacitance Reverse trafer capacitance V CE = 25 V, f = 1 MHz, V GE = pf pf pf Q g Q ge Q gc Total gate charge Gate-emitter charge Gate-collector charge V CE = 390 V, I C = 3 A, V GE = 15 V, (see Figure 20) nc nc nc Table 6. Switching on/off (inductive load) Symbol Parameter Test conditio Min. Typ. Max. Unit t d(on) t r (di/dt) on Turn-on delay time Current rise time Turn-on current slope V CC = 390 V, I C = 3 A R G = 10 Ω, V GE = 15 V (see Figure 21) A/µs t d(on) t r (di/dt) on Turn-on delay time Current rise time Turn-on current slope V CC = 390 V, I C =3 A R G = 10 Ω, V GE = 15 V, T C = 125 C (see Figure 21) A/µs 4/18

5 STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Electrical characteristics Table 6. Switching on/off (inductive load) (continued) Symbol Parameter Test conditio Min. Typ. Max. Unit t r (V off ) t d ( off ) t f Off voltage rise time Turn-off delay time Current fall time V cc = 390 V, I C = 3 A, R GE = 10 Ω, V GE =15 V (see Figure 21) t r (V off ) t d ( off ) t f Off voltage rise time Turn-off delay time Current fall time V cc = 390 V, I C = 3 A, R GE =10 Ω, V GE =15 V, T C = 125 C (see Figure 21) Table 7. Switching energy (inductive load) Symbol Parameter Test conditio Min. Typ. Max. Unit (1) E on (2) E off E ts Turn-on switching losses Turn-off switching losses Total switching losses V CC = 390 V, I C = 3 A R G = 10 Ω, V GE =15 V (see Figure 21) µj µj µj (1) E on E (2) off E ts Turn-on switching losses Turn-off switching losses Total switching losses V CC = 390 V, I C = 3 A R G = 10 Ω, V GE = 15 V, T C = 125 C (see Figure 21) µj µj µj 1. Eon is the turn-on losses when a typical diode is used in the test circuit in figure 2. If the IGBT is offered in a package with a co-pak diode, the co-pack diode is used as external diode. IGBTs & Diode are at the same temperature (25 C and 125 C) 2. Turn-off losses include also the tail of the collector current Table 8. Collector-emitter diode Symbol Parameter Test conditio Min. Typ. Max. Unit V F Forward on-voltage I F = 3 A I F = 3 A, T C = 125 C V V t rr Q rr I rrm Reverse recovery time Reverse recovery charge Reverse recovery current I F = 3 A, V R = 30 V, di/dt = 100 A/µs (see Figure 22) nc A t rr Q rr I rrm Reverse recovery time Reverse recovery charge Reverse recovery current I F = 3 A,V R = 30 V, T C =125 C, di/dt = 100 A/µs (see Figure 22) nc A 5/18

6 Electrical characteristics STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD 2.1 Electrical characteristics (curves) Figure 2. Output characteristics Figure 3. Trafer characteristics Figure 4. Traconductance Figure 5. Collector-emitter on voltage vs temperature Figure 6. Gate charge vs gate-source voltage Figure 7. Capacitance variatio 6/18

7 STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Electrical characteristics Figure 8. Normalized gate threshold voltage vs temperature Figure 9. Collector-emitter on voltage vs collector current Figure 10. Normalized breakdown voltage vs temperature Figure 11. Switching losses vs temperature Figure 12. Switching losses vs gate resistance Figure 13. Switching losses vs collector current 7/18

8 Electrical characteristics STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Figure 14. Thermal impedance for TO-220/ D²PAK Figure 15. Turn-off SOA Figure 16. Forward voltage drop versus forward current Figure 17. Thermal impedance for DPAK Figure 18. Thermal impedance for TO-220FP 8/18

9 STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Test circuit 3 Test circuit Figure 19. Test circuit for inductive load switching Figure 20. Gate charge test circuit Figure 21. Switching waveform Figure 22. Diode recovery time waveform 9/18

10 Package mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditio are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specificatio are available at: 10/18

11 STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Package mechanical data TO-220 mechanical data mm inch Dim Min Typ Max Min Typ Max A b b c D D E e e F H J L L L L P Q /18

12 Package mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD TO-252 (DPAK) mechanical data DIM. mm. min. typ max. A A A b b c c D D E E e 2.28 e H L 1 L L L R 0.20 V2 0 o 8 o _G 12/18

13 STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Package mechanical data D²PAK (TO-263) mechanical data mm inch Dim Min Typ Max Min Typ Max A A b b c c D D E E e e H J L L L R V _M 13/18

14 Package mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD TO-220FP mechanical data Dim. mm. inch Min. Typ Max. Min. Typ. Max. A B D E F F F G G H L L L L L L Dia B D A E L6 L7 L3 Dia H G G1 F1 F L2 L5 F2 L I 14/18

15 STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Packaging mechanical data 5 Packaging mechanical data D 2 PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A B C D G N T TAPE MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A B D D E F K P P P R T W * on sales type BASE QTY BULK QTY /18

16 Packaging mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD DPAK FOOTPRINT All dimeio are in millimeters TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A B C D G N T TAPE MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A B B D D E F K P P P R W BASE QTY BULK QTY /18

17 STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Revision history 6 Revision history Table 9. Document revision history Date Revision Changes 02-Oct First release 01-Apr Updated Figure 14 and Figure 17 17/18

18 STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, correctio, modificatio or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST s terms and conditio of sale. Purchasers are solely respoible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No licee, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a licee grant by ST for the use of such third party products or services, or any intellectual property contained therein or coidered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER S OWN RISK. Resale of ST products with provisio different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 18/18

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