Motivation Different Strategies for Induction integration. Package-Integrated VR with Intel Core 2 Duo Processor. ! Thru-Silicon-Vias (TSV) in future

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1 Optimization of soft magnetic thin films structures in on-chip inductors for Hao Wu, Donald S. Gardner, and Hongbin Yu Ira A. Fulton Schools of Engineering, Arizona State University, Tempe, AZ8587, United States. Intel Labs, Intel Corp., Santa Clara, CA9505, United States. Motivation Different Strategies for Induction integration Portable Electronics Need to integrate more functionalities into limited area Need better power management for longer battery life Discrete inductor on mother board Texas Instruments Surface mount inductor Inductor on/in package Mi s u z u In d u strie s Continued Power Control Sensors Analog/RF Passives Package Level (SiP) Inductors in package with magnetic cores Chip Level (SoC) Sub 00 µm size on-chip magnetic thin film inductors magnetic thin film inductors can benefit RF and power delivery applications: Package-Integrated VR with Intel Core Duo Processor Click to edit Design Master title Interposer Air core inductor integrated power chip-stack Magnetic Materials! Thru-Silicon-Vias (TSV) in future Direct integrationinterposer of magnetic core? design (will be compatible Vin = 3V, Vout = 0~.6V Advantages: Smaller footprint; profile with C4 package) low height f = 0~00 MHz Challenges: material compatibility; thermal effect peak Current = 50 Amps / 75 Amps Gains from on on--die magnetics Size = 37.6 mm, 30 nm CMOS A On-chip High inductance density -> Reduces area High quality factor -> Reduces loss Important Inductor on Si chip Cu WM = 5um Post CMOS: Intel section Magnetic SEM Cross magnetic material properties High permeability, high resistivity, high FMR, CMOS compatibility Material engineering required such as patterning and laminating Intel Haswell!Click C4 connection to IC, bond wire to edit Master text styles Large size & EMI connection to BGA package (.5D)! Quick/cheap method to demonstrate miniaturization at the system level: System Board Level TPS 867 MicroSiP Step-Down Converter r r B H dυ υ Si interposer: IBM/Columbia WM Energy density increased µr Slide 6 A W Volume shrinks Power Loss decreased Energy density in thin film magnetics volume compared with air core inductor is proportional to permeability µr which is typically > 000 Wa Wm υ m µ r l Ra P = a m R m Pm la

2 Materials Chnoice Optimization of soft magnetic thin films structures in on-chip inductors for Hao Wu, Donald S. Gardner, and Hongbin Yu Ira A. Fulton Schools of Engineering, Arizona State University, Tempe, AZ8587, United States. Intel Labs, Intel Corp., Santa Clara, CA9505, United States. Inductor Fabrication q High saturation magnetization tm L µµ 0 r q Controllable anisotropy f q High resistivity l w γ 4πM H FMR s k f cutoff = 4ρ /(πµ i d ) µ 4 πm / H d, film thickness q Single domain state, for low magnetic loss q Low magnetostriction to reduce the stress in fabrication Thin Film Growth and Characterization DC magnetron sputter deposition: Co-4%Zr-4%Ta-8%B (at.%) Co oxide is used as insulation layer in laminated film. An external DC magnetic field was applied during deposition. B-H loop was measured by VSM. Ni-Fe Co-Zr-Ta Co-Zr-Ta-B s k Deposit bottom-layer magnetic thin film Spin μm thick polyimide film as insulation layer Deposit μm thick Cu layer and another polyimide insulation layer Define magnetic via followed by O plasma etching Co -Zr-Ta -B Co -Zr-Ta -B CZTB µ < ρ 0 μω cm 00 μω cm 5 μω cm Sputter top-layer magnetic material film and Cu layer FMR 640 MHz.4GHZ.6GHz 0 μm

3 Optimization of soft magnetic thin films structures in on-chip inductors for Hao Wu, Donald S. Gardner, and Hongbin Yu Ira A. Fulton Schools of Engineering, Arizona State University, Tempe, AZ8587, United States. Intel Labs, Intel Corp., Santa Clara, CA9505, United States. Inductor Performance Mtaerials Comparison: NiFe vs CoZrTaB Fabricated inductor has Small size, high inductance density Ni-Fe Co-Zr-Ta-B Wei Xu, et al., IEEE EDL 3, 69 (0). Hao Wu, et al.,, IEEE Trans. Magn (0). Higher resistivity CoZrTaB leads to higher frequency response to GHz range 3

4 Magnetic Core Inductors Fabricated on Organic Substrates Hao Wu, Mahmoud Khdour, and Hongbin Yu Ira A. Fulton Schools of Engineering, Arizona State University, Tempe, AZ8587, United States. Improving Inductor Performance Lamination Effect 4-turn rectangular spiral inductors W: 88 μm, L:60 μm Laminations can suppress eddy current loss in the conductive magnetic films and skin depth effect resulting in better frequency response. Finger-shaped Via Finger-shaped magnetic via: W: 5 μm, L: 4 μm 3 Regular Magnetic Vias Finger-shaped Magnetic Vias 60 µm 60 µm 88 µm 30% increase 88 µm HFSS 3D EM Simulations at GHz 60% increase 4.3X Hao Wu, Shirong Zhao, Donald S. Gardner, and Hongbin Yu, Improved High Frequency Response and Quality Factor of On-Chip Ferromagnetic Thin Film Inductors by Laminating and Patterning Co-Zr-Ta-B Films, IEEE Trans. Magn., 49, 476 (03 With Co-Zr-Ta-B film, a maximum 3.5X inductance increase and a 3.9X increase in the Q-factor at GHz were achieved. Finger-shaped magnetic vias improved Q by >30%. Hao Wu, et al.,, IEEE Transactions on Magnetics (0). 4

5 Magnetic Core Inductors Fabricated on Organic Substrates Ira Hao Wu, Mahmoud Khdour, and Hongbin Yu A. Fulton Schools of Engineering, Arizona State University, Tempe, AZ8587, United States. Inductors Fabricated on Package substrate DC Current Bias DIE.5 Buildup layer In Package.0 0. Frequency (GHz) Fabricated inductors on ABF/glass substrate (scale bar: 80 µm) Buildup layer ma 0 ma 0 ma 30 ma 40 ma 50 ma 60 ma 70 ma 80 ma 90 ma 00 ma 0 ma 0 ma 30 ma 40 ma 50 ma 60 ma Current density (not saturated yet):.49 A/mm ; 6A/mm was achieved Inductor with fully saturated film have inductance of 0.4 nh L Glass/Epoxy core DC Current (ma) 0 Frequency (GHz) Acknowledgements Donald Gardner, Wei Xu, Tawab Dastigir. US National Science Foundation, Intel, Semiconductor Research Corporation, ASU Connection One. Publications.9X.6X Quartz DIE.7X Glass/Epoxy core 450 µm L baseline - J 0 ma 0 ma 0 ma 30 ma 40 ma 50 ma 60 ma 70 ma 80 ma 90 ma 00 ma 0 ma 0 ma 30 ma 40 ma 50 ma 60 ma 3.0 Q-Factor On Package/backside of package ABF Polyimide Hao Wu, et al., Integration of Magnetic Materials into Package RF and Power Inductors on Organic Substrates for System in Package (SiP) Applications, IEEE Electronic Components and Technology Conference, Orlando, FL, May 04 ü M. Khdour, H. Wu and H. Yu, "High DC Current Density On-Chip Strip-Line Inductors Integrated With Magnetic Film," in IEEE Transactions on Magnetics, vol. 5, no. 7, pp. -4, July 06. doi: 0.09/TMAG ü Hao Wu, Donald S. Gardner, Cheng Lv, Zhihua Zou and Hongbin Yu, Integration of Magnetic Materials intopackage RF and Power Inductorson Organic Substrates for System in Package (SiP) Applicatio ns, IEEE Electronic Components andtechnology Conference, Orlando, FL, May 04. ü Hao Wu, Donald S. Gardner, Shirong Zhao, Hai Huang, and Hongbin Yu Controlof magnetic flu x and eddy currents in magnetic filmsfor on-chip radio frequency inductors: Role of the magnetic vias, J. Appl. Phys. 5, 7E79 (04). ü Hao Wu Shirong Zhao, Donald S. Gardner, and Hongbin Yu, Aspect ratiodependent saturation field in patterned amorphous Co-Zr-Ta-B thin filmswith uniaxial anisotropy, J. Appl. Phys. 5, 7E904 (04). ü Hao Wu, Shirong Zhao, Donald S. Gardner, and Hongbin Yu, Improved Hig h Frequency Response and Quality Factor of On-Chip Ferromagnetic Thin Film Inductorsby Lamin ating andpatterning Co-Zr-Ta-B Films, IEEE Trans. Magn., 49, 476 (03). ü Hao Wu, Donald S. Gardner, Wei Xu, and Hongbin Yu, Integrated RF on-chip inductors with patterned Co-Zr-Ta-B Films, IEEE Trans. Magn. 48, 43 (0). ü Wei Xu, Saurabh Sinha, Hao Wu, Tawab Dastagir, Yu Cao and Hongbin Yu, On-Chip Spiral Inductors with Integrated Magnetic Materials, in Advanced Circuits for Emerging Technologies, John Wiley & Sons, Inc. 0. ü Wei Xu, Saurabh Sinha, Tawab Dastagir, Hao Wu, Bertan Bakkaloglu, Donald S. Gardner, Yu Cao and Hongbin Yu, Performance Enhancement of On-Chip Inductors with Permalloy Magnetic Rings, IEEE Elec. Dev. Lett., 3, 0.09, (0). ü Wei Xu, Hao Wu, Donald S. Gardner, SaurabhSinha, Tawab Dastagir, BertanBakkaloglu, Yu Cao and Hongbin Yu, Sub-00 µmand nh On-Chip Inductors with CoZrTa for GHz Applications, J. Appl. Phys. 09, 07A36 (0). ü Tawab Dastagir, Wei Xu, Saurabh Sinha, Hao Wu, Yu Cao and Hongbin Yu, Tuning the Permeability of Permalloy Film for On-Chip Inductor Applications, Appl. Phys. Lett., 97, 6506 (00). ü Wei Xu, Saurabh Sinha, Feng Pan, Tawab Dastagir, Yu Cao, and Hongbin Yu, Improved Frequency Response of On-Chip Inductors With Patterned Magnetic Dots, IEEE Elec. Dev. Lett. 3, 07 (00). ü Saurabh.Sinha, W. Xu, J. Velamala, M. Dastagir, B. Bakkaloglu, H. Yu, Y. Cao, Enabling resonant clock distribution with scaled on-chip magnetic inductors, International Conference on Computer Design, pp , (009). 5