Magnetic and Electromagnetic Microsystems. 4. Example: magnetic read/write head

Size: px
Start display at page:

Download "Magnetic and Electromagnetic Microsystems. 4. Example: magnetic read/write head"

Transcription

1 Magnetic and Electromagnetic Microsystems 1. Magnetic Sensors 2. Magnetic Actuators 3. Electromagnetic Sensors 4. Example: magnetic read/write head (C) Andrei Sazonov 2005,

2 Magnetic microsystems Electromagnetic microsystems - Application areas: 1. Magnetic Field Measurements (characterization, quality control - ). 2. Proximity and Angle Detectors (vehicle detection, machinery part motion, orientation systems magnetic compass). 3. Power meters (electric current sensors). 4. Medical Systems (brain electrical activity sensors) 5. Magnetic recording and storage (read/write heads, magnetic tapes, hard drives). (C) Andrei Sazonov 2005,

3 Hall effect (Hall plates, magnetodiodes, ) Tunnel diode Magnetic sensors Magnetometers (carrier domain, flux gate, ) SQUIDs (superconducting) (C) Andrei Sazonov 2005,

4 Magnetic sensors: 1. Hall effect based. Hall effect = charge carriers traveling in the presence of a perpendicular magnetic field are deflected by the Lorentz force, thus building up a voltage between two sides of a conductive slab. Hall voltage is proportional to: - current (directly); - magnetic flux density (directly); - plate thickness (inversely); - carrier density (directly). Hall voltage: V Hall = R Hall I x B z /T = R Hall J x WB z R Hall Hall coefficient. Therefore, thin semiconductor membranes are the best for Hall sensors. (C) Andrei Sazonov 2005,

5 Various Hall sensor configurations: Sense contacts Drive contacts L W >> T Applications: External magnetic field sensors. Problem offset voltages (due to mask misalignment, fabrication caused or external stress and thermal drift). Correction is possible through the circuitry: for example, periodically reverse the sensing and driving terminals and to average the output signals. (C) Andrei Sazonov 2005,

6 Hall plates are easy to integrate with any BJT or CMOS process as the fabrication mainly involves the contact fabrication. Hall sensor in BJT process: - p+ pockets for isolation; - n+ contacts; - metal deposition and patterning. Hall sensor MOS process: same as MOSFET fabrication. (C) Andrei Sazonov 2005,

7 Magnetoresistor. Due to deflection, charge carriers in the magnetic field travel longer distances across the materials; thus, the conductivity decreases: σ(b z ) = σ 0 (1-r 2 μ 2 B z ), μ mobility; r constant (0.8 to 2.0). Magnetodiode. Consider thin film wide diode. Under forward bias, recombination of carriers on the interfaces largely exceeds that in the bulk and depends on the interface quality. If such a diode is fabricated, so that one interface is much more defective than the other, then carrier deflection in external magnetic field can modulate diode current depending on the field direction. p+ Si SiO 2 i- Si n+ Si substrate (C) Andrei Sazonov 2005,

8 Substrate is chosen so that recombination rate on its interface with Si is much higher than that of SiO 2 (say, sapphire, a-sin x ). Under forward bias, electrons and holes are injected into intrinsic layer drifting in opposite directions. Therefore, magnetic field will deflect them in the same direction (resulting in high or low recombination and thus modulating the current). Advantage: High sensitivity (about 10 times more sensitive than Hall sensor). Drawbacks: - non-linearity; - temperature dependent. (C) Andrei Sazonov 2005,

9 Magnetotransistor: a BJT with one emitter and several collectors and bases to pick up the current depending on where it is deflected by magnetic field. Example: Dual collector vertical npn device; the current is split between two collectors; by adjusting the base voltages they can be independently controlled. Split-drain MAGFET: a MOSFET with an extra drain; the difference between the two drain currents is induced by external magnetic field. (C) Andrei Sazonov 2005,

10 2. Magnetometers. Carrier domain based magnetometers. Carrier domain a region of semiconductor containing a high density of carriers of equal concentrations. The carriers are confined within the domain by potential gradients. Lorentz force moves the entire domain providing changes in the signal. Example: symmetric BJT structure with body bias. Consists of 2 BJTs: npn and pnp. npn collector is the pnp base. pnp collector is the npn base. Lateral BJT size is large, therefore, we have current crowding in the central region, thus forming carrier domain. External magnetic field slightly moves it resulting in the difference between left and right side contacts. (C) Andrei Sazonov 2005,

11 Flux gate based magnetometers. Recall a B-H diagram for the ferromagnetics. Between P and Q, magnetic flux density linearly increases with proportionality coefficient μ magnetic permeability. Between Q and R, all domains are aligned saturation occurs, i.e., permeability changes. If we have a solenoid with ferroelectric core brought close to Q, then external magnetic field variation will provide changes in μ, therefore, changes in the solenoid inductance: L = μ o μn 2 A/l S -H c B s B r -B r B O -B s P Q H c R H N number of coils, A cross sectional area, l length. Application: solid state compasses. (C) Andrei Sazonov 2005,

12 Fabrication: thin film deposition, electroplating. Example: 30 turns coil, permalloy core (μ r = 100,000), length of 1.5 mm, cross-sectional area of 100μm 2 (1μm x 100μm). Inductance, L = 1.26x10-6 * 10 5 * 30 2 * 1x10-10 / 1.5x10-3 = 7.6x10-6 H. To measure L, RLC circuit is used. AC signal is applied, and external magnetic field changes parameters of the circuit; the change in the voltage or in the current can be measured. Sensitivity: 0.1 nt. (C) Andrei Sazonov 2005,

13 Tunneling magnetometers. Fabricated by bulk micromachining. Tunneling tip is fabricated at the bottom of Si cavity. Silicon nitride membrane (500nm-1μm thick, 2.5mmx2.5mm) with electrodes deposited on the bottom side and thin film planar coil on the top side is excited by oscillating current. The Lorentz force generated: F = NL w IBsinθ, N number of coil loops; L W length of coil segments; I coil current; θ - angle between magnetic field vector and coil segments. 200Hz AC excitation current is used; the voltage to keep tunneling current constant is proportional to F. Advantages:- low power (< 100 mw); - high sensitivity (~ 1 nt). (C) Andrei Sazonov 2005,

14 3. SQUID = superconductive quantum interference devices. Based on Josephson effect: superconductive current flows through thin insulating layer that separates two superconductors (due to tunneling). If the current exceeds threshold value I m, a voltage drop occurs between superconductors, and AC current is generated: J s = J 0 sin(φ 0 t + φ), φ 0 = 2qV/h If external magnetic flux passes through the loop, the current will shift through the allowed modes: 2πnW o =LI, W o magnetic flux quantum; n number of quanta; L inductance of the loop; I I loop current. I m V (C) Andrei Sazonov 2005,

15 SQUID is made of two Josephson junctions with 5-20 nm SiO 2 barrier. External circuit maintains the bias current I bias > I m. External magnetic flux results in the current oscillations that are dependent on the flux: I ~ cos(πφ/φ 0 ) Φ 0 = h/2q I = I max sin(φ + 2πf), f = 2qV/h I bias For V = 1 μv, f ~ 500 MHz. Advantage: high sensitivity. I 1 I 2 Threshold for SQUID: 1 ft Magnetic field of heart:50,000 ft Magnetic field of brain: a few ft Applications: biomedical electronics. (C) Andrei Sazonov 2005,

16 Micromotors Eddy current Magnetic actuators Magnetostrictive Read/write heads (C) Andrei Sazonov 2005,

17 Hard disk drive read/write head: HDD top view. Combined inductive/gmr read/write head. Writing is currently done by inductive head; reading by GMR head. Advantage of inductive head Advantage of GMR head stronger magnetic fields achievable. higher spatial resolution achievable. (C) Andrei Sazonov 2005,

18 Inductive read/write head a device that combines a sensor and an actuator. HDD magnetic storage is based on magnetic domains spatial areas in magnetic coatings with aligned spins. Magnetic coatings are polycrystalline, ideally - with each crystal being a single magnetic domain. Single magnetic domain size is 0.1 μm. When magnetic domains are of that scale, their orientation may be influenced by orientation of neighboring domains. Therefore, coercive field in that case has to be high. That means, high magnetic field strength has to be generated by the writing head. Currently, only inductive heads can achieve the fields required to rewrite the information in high-performance HDDs. H gap = H head L head /L gap (C) Andrei Sazonov 2005,

19 Inductive head: - based on the electromagnetic induction in the thin film coil; the gap is about 0.1-1μm. Fabrication: surface micromachining (thin film technology). Dimensions: ~100μm x 200μm. Gap size: 0.2 μm. Problem: at L gap 0.1 μm, ferromagnetic materials reach saturation. (C) Andrei Sazonov 2005,

20 GMR heads are comprised of four layers of thin material sandwiched together into a single structure: Free Layer: the sensing layer made of a nickel-iron alloy. It is free to rotate in response to the magnetic patterns on the HD. Spacer: non-magnetic layer, typically made of copper. It magnetically separates free layer and pinned layer. Pinned Layer: Made of cobalt, it is held in a fixed magnetic orientation by virtue of its adjacency to the exchange layer. Exchange Layer: Made of an antiferromagnetic material (iron and manganese alloy), it fixes the pinned layer's magnetic orientation. (C) Andrei Sazonov 2005,

21 Magnetoresistive read heads: -based on the change in electrical resistance due to carrier deflection by magnetic field (5-10%). - based on a tri-layer consisting of magnetoresistive (MR) material (a tri-layer of NiFe, FeMn, and Mo), non-magnetic film (SiO 2 ) and magnetic film (NiFe) shielded from outside fields (by metal films). When the head passes over a magnetic field of certain polarity (say, a "0" on the disk), the electron orbits in the free layer turn to be aligned with those of the pinned layer. This decreases electrical resistance in the entire head structure. When the head passes over a magnetic field of the opposite polarity ("1"), the electron orbits in the free layer rotate so that they are not aligned with those of the pinned layer. This causes an increase in the resistance of the overall structure. These structures are called spin valves because the electron orbit rotation is caused by spin interaction. If you imagine a plumbing pipe with a shut-off rotating valve, that's the general concept behind the name. Advantage over electromagnetic head: higher sensitivity and resolution (combined thickness of all layers 50 nm). (C) Andrei Sazonov 2005,

Semiconductor Physics and Devices

Semiconductor Physics and Devices Metal-Semiconductor and Semiconductor Heterojunctions The Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) is one of two major types of transistors. The MOSFET is used in digital circuit, because

More information

INTRODUCTION: Basic operating principle of a MOSFET:

INTRODUCTION: Basic operating principle of a MOSFET: INTRODUCTION: Along with the Junction Field Effect Transistor (JFET), there is another type of Field Effect Transistor available whose Gate input is electrically insulated from the main current carrying

More information

Solid State Devices- Part- II. Module- IV

Solid State Devices- Part- II. Module- IV Solid State Devices- Part- II Module- IV MOS Capacitor Two terminal MOS device MOS = Metal- Oxide- Semiconductor MOS capacitor - the heart of the MOSFET The MOS capacitor is used to induce charge at the

More information

Field-Effect Transistor (FET) is one of the two major transistors; FET derives its name from its working mechanism;

Field-Effect Transistor (FET) is one of the two major transistors; FET derives its name from its working mechanism; Chapter 3 Field-Effect Transistors (FETs) 3.1 Introduction Field-Effect Transistor (FET) is one of the two major transistors; FET derives its name from its working mechanism; The concept has been known

More information

EE 5611 Introduction to Microelectronic Technologies Fall Thursday, September 04, 2014 Lecture 02

EE 5611 Introduction to Microelectronic Technologies Fall Thursday, September 04, 2014 Lecture 02 EE 5611 Introduction to Microelectronic Technologies Fall 2014 Thursday, September 04, 2014 Lecture 02 1 Lecture Outline Review on semiconductor materials Review on microelectronic devices Example of microelectronic

More information

I E I C since I B is very small

I E I C since I B is very small Figure 2: Symbols and nomenclature of a (a) npn and (b) pnp transistor. The BJT consists of three regions, emitter, base, and collector. The emitter and collector are usually of one type of doping, while

More information

Power Bipolar Junction Transistors (BJTs)

Power Bipolar Junction Transistors (BJTs) ECE442 Power Semiconductor Devices and Integrated Circuits Power Bipolar Junction Transistors (BJTs) Zheng Yang (ERF 3017, email: yangzhen@uic.edu) Power Bipolar Junction Transistor (BJT) Background The

More information

Superconducting quantum interference device (SQUID) and its application in science and engineering. A presentation Submitted by

Superconducting quantum interference device (SQUID) and its application in science and engineering. A presentation Submitted by Superconducting quantum interference device (SQUID) and its application in science and engineering. A presentation Submitted by S.Srikamal Jaganraj Department of Physics, University of Alaska, Fairbanks,

More information

FEM SIMULATION FOR DESIGN AND EVALUATION OF AN EDDY CURRENT MICROSENSOR

FEM SIMULATION FOR DESIGN AND EVALUATION OF AN EDDY CURRENT MICROSENSOR FEM SIMULATION FOR DESIGN AND EVALUATION OF AN EDDY CURRENT MICROSENSOR Heri Iswahjudi and Hans H. Gatzen Institute for Microtechnology Hanover University Callinstrasse 30A, 30167 Hanover Germany E-mail:

More information

Fabrication and application of a wireless inductance-capacitance coupling microsensor with electroplated high permeability material NiFe

Fabrication and application of a wireless inductance-capacitance coupling microsensor with electroplated high permeability material NiFe Journal of Physics: Conference Series Fabrication and application of a wireless inductance-capacitance coupling microsensor with electroplated high permeability material NiFe To cite this article: Y H

More information

Lecture 18: Photodetectors

Lecture 18: Photodetectors Lecture 18: Photodetectors Contents 1 Introduction 1 2 Photodetector principle 2 3 Photoconductor 4 4 Photodiodes 6 4.1 Heterojunction photodiode.................... 8 4.2 Metal-semiconductor photodiode................

More information

SRM INSTITUTE OF SCIENCE AND TECHNOLOGY (DEEMED UNIVERSITY)

SRM INSTITUTE OF SCIENCE AND TECHNOLOGY (DEEMED UNIVERSITY) SRM INSTITUTE OF SCIENCE AND TECHNOLOGY (DEEMED UNIVERSITY) QUESTION BANK I YEAR B.Tech (II Semester) ELECTRONIC DEVICES (COMMON FOR EC102, EE104, IC108, BM106) UNIT-I PART-A 1. What are intrinsic and

More information

EDDY CURRENT INSPECTION FOR DEEP CRACK DETECTION AROUND FASTENER HOLES IN AIRPLANE MULTI-LAYERED STRUCTURES

EDDY CURRENT INSPECTION FOR DEEP CRACK DETECTION AROUND FASTENER HOLES IN AIRPLANE MULTI-LAYERED STRUCTURES EDDY CURRENT INSPECTION FOR DEEP CRACK DETECTION AROUND FASTENER HOLES IN AIRPLANE MULTI-LAYERED STRUCTURES Teodor Dogaru Albany Instruments Inc., Charlotte, NC tdogaru@hotmail.com Stuart T. Smith Center

More information

ELECTRONIC DEVICES AND CIRCUITS

ELECTRONIC DEVICES AND CIRCUITS ELECTRONIC DEVICES AND CIRCUITS 1. At room temperature the current in an intrinsic semiconductor is due to A. holes B. electrons C. ions D. holes and electrons 2. Work function is the maximum energy required

More information

Magnetic tunnel junction sensor development for industrial applications

Magnetic tunnel junction sensor development for industrial applications Magnetic tunnel junction sensor development for industrial applications Introduction Magnetic tunnel junctions (MTJs) are a new class of thin film device which was first successfully fabricated in the

More information

Semiconductor Devices

Semiconductor Devices Semiconductor Devices Modelling and Technology Source Electrons Gate Holes Drain Insulator Nandita DasGupta Amitava DasGupta SEMICONDUCTOR DEVICES Modelling and Technology NANDITA DASGUPTA Professor Department

More information

Department of Electrical Engineering IIT Madras

Department of Electrical Engineering IIT Madras Department of Electrical Engineering IIT Madras Sample Questions on Semiconductor Devices EE3 applicants who are interested to pursue their research in microelectronics devices area (fabrication and/or

More information

In an unmagnetized piece of iron, the atoms are arranged in domains. In each domain the atoms are aligned, but the domains themselves are random.

In an unmagnetized piece of iron, the atoms are arranged in domains. In each domain the atoms are aligned, but the domains themselves are random. 4/7 Properties of the Magnetic Force 1. Perpendicular to the field and velocity. 2. If the velocity and field are parallel, the force is zero. 3. Roughly (field and vel perp), the force is the product

More information

CONTENTS. 2.2 Schrodinger's Wave Equation 31. PART I Semiconductor Material Properties. 2.3 Applications of Schrodinger's Wave Equation 34

CONTENTS. 2.2 Schrodinger's Wave Equation 31. PART I Semiconductor Material Properties. 2.3 Applications of Schrodinger's Wave Equation 34 CONTENTS Preface x Prologue Semiconductors and the Integrated Circuit xvii PART I Semiconductor Material Properties CHAPTER 1 The Crystal Structure of Solids 1 1.0 Preview 1 1.1 Semiconductor Materials

More information

Magnetic Spin Devices: 7 Years From Lab To Product. Jim Daughton, NVE Corporation. Symposium X, MRS 2004 Fall Meeting

Magnetic Spin Devices: 7 Years From Lab To Product. Jim Daughton, NVE Corporation. Symposium X, MRS 2004 Fall Meeting Magnetic Spin Devices: 7 Years From Lab To Product Jim Daughton, NVE Corporation Symposium X, MRS 2004 Fall Meeting Boston, MA December 1, 2004 Outline of Presentation Early Discoveries - 1988 to 1995

More information

Integrated diodes. The forward voltage drop only slightly depends on the forward current. ELEKTRONIKOS ĮTAISAI

Integrated diodes. The forward voltage drop only slightly depends on the forward current. ELEKTRONIKOS ĮTAISAI 1 Integrated diodes pn junctions of transistor structures can be used as integrated diodes. The choice of the junction is limited by the considerations of switching speed and breakdown voltage. The forward

More information

INTRODUCTION TO MOS TECHNOLOGY

INTRODUCTION TO MOS TECHNOLOGY INTRODUCTION TO MOS TECHNOLOGY 1. The MOS transistor The most basic element in the design of a large scale integrated circuit is the transistor. For the processes we will discuss, the type of transistor

More information

ECE 340 Lecture 37 : Metal- Insulator-Semiconductor FET Class Outline:

ECE 340 Lecture 37 : Metal- Insulator-Semiconductor FET Class Outline: ECE 340 Lecture 37 : Metal- Insulator-Semiconductor FET Class Outline: Metal-Semiconductor Junctions MOSFET Basic Operation MOS Capacitor Things you should know when you leave Key Questions What is the

More information

Fundamentals of Power Semiconductor Devices

Fundamentals of Power Semiconductor Devices В. Jayant Baliga Fundamentals of Power Semiconductor Devices 4y Spri ringer Contents Preface vii Chapter 1 Introduction 1 1.1 Ideal and Typical Power Switching Waveforms 3 1.2 Ideal and Typical Power Device

More information

MEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications

MEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications MEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications Part I: RF Applications Introductions and Motivations What are RF MEMS? Example Devices RFIC RFIC consists of Active components

More information

COMMERCIAL APPLICATIONS OF SPINTRONICS TECHNOLOGY

COMMERCIAL APPLICATIONS OF SPINTRONICS TECHNOLOGY Presented at Nanomaterials 2004, Stamford, CT, October 25, 2004 COMMERCIAL APPLICATIONS OF SPINTRONICS TECHNOLOGY Carl H. Smith Senior Physicist, Advanced Technology Group NVE Corporation 11409 Valley

More information

UNIT 3 Transistors JFET

UNIT 3 Transistors JFET UNIT 3 Transistors JFET Mosfet Definition of BJT A bipolar junction transistor is a three terminal semiconductor device consisting of two p-n junctions which is able to amplify or magnify a signal. It

More information

Power Semiconductor Devices

Power Semiconductor Devices TRADEMARK OF INNOVATION Power Semiconductor Devices Introduction This technical article is dedicated to the review of the following power electronics devices which act as solid-state switches in the circuits.

More information

UNIT-VI FIELD EFFECT TRANSISTOR. 1. Explain about the Field Effect Transistor and also mention types of FET s.

UNIT-VI FIELD EFFECT TRANSISTOR. 1. Explain about the Field Effect Transistor and also mention types of FET s. UNIT-I FIELD EFFECT TRANSISTOR 1. Explain about the Field Effect Transistor and also mention types of FET s. The Field Effect Transistor, or simply FET however, uses the voltage that is applied to their

More information

An introduction to Depletion-mode MOSFETs By Linden Harrison

An introduction to Depletion-mode MOSFETs By Linden Harrison An introduction to Depletion-mode MOSFETs By Linden Harrison Since the mid-nineteen seventies the enhancement-mode MOSFET has been the subject of almost continuous global research, development, and refinement

More information

9/28/2010. Chapter , The McGraw-Hill Companies, Inc.

9/28/2010. Chapter , The McGraw-Hill Companies, Inc. Chapter 4 Sensors are are used to detect, and often to measure, the magnitude of something. They basically operate by converting mechanical, magnetic, thermal, optical, and chemical variations into electric

More information

97.398*, Physical Electronics, Lecture 21. MOSFET Operation

97.398*, Physical Electronics, Lecture 21. MOSFET Operation 97.398*, Physical Electronics, Lecture 21 MOSFET Operation Lecture Outline Last lecture examined the MOSFET structure and required processing steps Now move on to basic MOSFET operation, some of which

More information

value of W max for the device. The at band voltage is -0.9 V. Problem 5: An Al-gate n-channel MOS capacitor has a doping of N a = cm ;3. The oxi

value of W max for the device. The at band voltage is -0.9 V. Problem 5: An Al-gate n-channel MOS capacitor has a doping of N a = cm ;3. The oxi Prof. Jasprit Singh Fall 2001 EECS 320 Homework 10 This homework is due on December 6 Problem 1: An n-type In 0:53 Ga 0:47 As epitaxial layer doped at 10 16 cm ;3 is to be used as a channel in a FET. A

More information

Detection Beyond 100µm Photon detectors no longer work ("shallow", i.e. low excitation energy, impurities only go out to equivalent of

Detection Beyond 100µm Photon detectors no longer work (shallow, i.e. low excitation energy, impurities only go out to equivalent of Detection Beyond 100µm Photon detectors no longer work ("shallow", i.e. low excitation energy, impurities only go out to equivalent of 100µm) A few tricks let them stretch a little further (like stressing)

More information

MOSFET & IC Basics - GATE Problems (Part - I)

MOSFET & IC Basics - GATE Problems (Part - I) MOSFET & IC Basics - GATE Problems (Part - I) 1. Channel current is reduced on application of a more positive voltage to the GATE of the depletion mode n channel MOSFET. (True/False) [GATE 1994: 1 Mark]

More information

Inductive Sensors. Fig. 1: Geophone

Inductive Sensors. Fig. 1: Geophone Inductive Sensors A voltage is induced in the loop whenever it moves laterally. In this case, we assume it is confined to motion left and right in the figure, and that the flux at any moment is given by

More information

INTRAWEAPON WIRELESS COMMUNICATION

INTRAWEAPON WIRELESS COMMUNICATION INTRAWEAPON WIRELESS COMMUNICATION Robert A. Sinclair, Dr. Carl Smith, Robert W. Schneider NVE Corporation, Eden Prairie, MN Technology in Fuzing 48th Annual Fuze Conference Charlotte, North Carolina April

More information

EE 330 Lecture 19. Bipolar Devices

EE 330 Lecture 19. Bipolar Devices 330 Lecture 19 ipolar Devices Review from last lecture n-well n-well n- p- Review from last lecture Metal Mask A-A Section - Section Review from last lecture D A A D Review from last lecture Should now

More information

Lesson 5. Electronics: Semiconductors Doping p-n Junction Diode Half Wave and Full Wave Rectification Introduction to Transistors-

Lesson 5. Electronics: Semiconductors Doping p-n Junction Diode Half Wave and Full Wave Rectification Introduction to Transistors- Lesson 5 Electronics: Semiconductors Doping p-n Junction Diode Half Wave and Full Wave Rectification Introduction to Transistors- Types and Connections Semiconductors Semiconductors If there are many free

More information

Body-Biased Complementary Logic Implemented Using AlN Piezoelectric MEMS Switches

Body-Biased Complementary Logic Implemented Using AlN Piezoelectric MEMS Switches University of Pennsylvania From the SelectedWorks of Nipun Sinha 29 Body-Biased Complementary Logic Implemented Using AlN Piezoelectric MEMS Switches Nipun Sinha, University of Pennsylvania Timothy S.

More information

Alternatives to standard MOSFETs. What problems are we really trying to solve?

Alternatives to standard MOSFETs. What problems are we really trying to solve? Alternatives to standard MOSFETs A number of alternative FET schemes have been proposed, with an eye toward scaling up to the 10 nm node. Modifications to the standard MOSFET include: Silicon-in-insulator

More information

FIELD EFFECT TRANSISTOR (FET) 1. JUNCTION FIELD EFFECT TRANSISTOR (JFET)

FIELD EFFECT TRANSISTOR (FET) 1. JUNCTION FIELD EFFECT TRANSISTOR (JFET) FIELD EFFECT TRANSISTOR (FET) The field-effect transistor (FET) is a three-terminal device used for a variety of applications that match, to a large extent, those of the BJT transistor. Although there

More information

UNIT VIII-SPECIAL PURPOSE ELECTRONIC DEVICES. 1. Explain tunnel Diode operation with the help of energy band diagrams.

UNIT VIII-SPECIAL PURPOSE ELECTRONIC DEVICES. 1. Explain tunnel Diode operation with the help of energy band diagrams. UNIT III-SPECIAL PURPOSE ELECTRONIC DEICES 1. Explain tunnel Diode operation with the help of energy band diagrams. TUNNEL DIODE: A tunnel diode or Esaki diode is a type of semiconductor diode which is

More information

THE METAL-SEMICONDUCTOR CONTACT

THE METAL-SEMICONDUCTOR CONTACT THE METAL-SEMICONDUCTOR CONTACT PROBLEM 1 To calculate the theoretical barrier height, built-in potential barrier, and maximum electric field in a metal-semiconductor diode for zero applied bias. Consider

More information

MTLE-6120: Advanced Electronic Properties of Materials. Semiconductor transistors for logic and memory. Reading: Kasap

MTLE-6120: Advanced Electronic Properties of Materials. Semiconductor transistors for logic and memory. Reading: Kasap MTLE-6120: Advanced Electronic Properties of Materials 1 Semiconductor transistors for logic and memory Reading: Kasap 6.6-6.8 Vacuum tube diodes 2 Thermionic emission from cathode Electrons collected

More information

5.1 BJT Device Structure and Physical Operation

5.1 BJT Device Structure and Physical Operation 11/28/2004 section 5_1 BJT Device Structure and Physical Operation blank 1/2 5.1 BJT Device Structure and Physical Operation Reading Assignment: pp. 377-392 Another kind of transistor is the Bipolar Junction

More information

TRANSISTOR TRANSISTOR

TRANSISTOR TRANSISTOR It is made up of semiconductor material such as Si and Ge. Usually, it comprises of three terminals namely, base, emitter and collector for providing connection to the external circuit. Today, some transistors

More information

Reg. No. : Question Paper Code : B.E./B.Tech. DEGREE EXAMINATION, NOVEMBER/DECEMBER Second Semester

Reg. No. : Question Paper Code : B.E./B.Tech. DEGREE EXAMINATION, NOVEMBER/DECEMBER Second Semester WK 5 Reg. No. : Question Paper Code : 27184 B.E./B.Tech. DEGREE EXAMINATION, NOVEMBER/DECEMBER 2015. Time : Three hours Second Semester Electronics and Communication Engineering EC 6201 ELECTRONIC DEVICES

More information

AE53/AC53/AT53/AE103 ELECT. DEVICES & CIRCUITS DEC 2015

AE53/AC53/AT53/AE103 ELECT. DEVICES & CIRCUITS DEC 2015 Q.2 a. By using Norton s theorem, find the current in the load resistor R L for the circuit shown in Fig.1. (8) Fig.1 IETE 1 b. Explain Z parameters and also draw an equivalent circuit of the Z parameter

More information

Optodevice Data Book ODE I. Rev.9 Mar Opnext Japan, Inc.

Optodevice Data Book ODE I. Rev.9 Mar Opnext Japan, Inc. Optodevice Data Book ODE-408-001I Rev.9 Mar. 2003 Opnext Japan, Inc. Section 1 Operating Principles 1.1 Operating Principles of Laser Diodes (LDs) and Infrared Emitting Diodes (IREDs) 1.1.1 Emitting Principles

More information

Organic Electronics. Information: Information: 0331a/ 0442/

Organic Electronics. Information: Information:  0331a/ 0442/ Organic Electronics (Course Number 300442 ) Spring 2006 Organic Field Effect Transistors Instructor: Dr. Dietmar Knipp Information: Information: http://www.faculty.iubremen.de/course/c30 http://www.faculty.iubremen.de/course/c30

More information

DEEP FLAW DETECTION WITH GIANT MAGNETORESISTIVE (GMR) BASED SELF-NULLING PROBE

DEEP FLAW DETECTION WITH GIANT MAGNETORESISTIVE (GMR) BASED SELF-NULLING PROBE DEEP FLAW DETECTION WITH GIANT MAGNETORESISTIVE (GMR) BASED SELF-NULLING PROBE Buzz Wincheski and Min Namkung NASA Langley Research Center Hampton, VA 23681 INTRODUCTION The use of giant magnetoresistive

More information

Field Effect Transistors (npn)

Field Effect Transistors (npn) Field Effect Transistors (npn) gate drain source FET 3 terminal device channel e - current from source to drain controlled by the electric field generated by the gate base collector emitter BJT 3 terminal

More information

UNIT-1 Bipolar Junction Transistors. Text Book:, Microelectronic Circuits 6 ed., by Sedra and Smith, Oxford Press

UNIT-1 Bipolar Junction Transistors. Text Book:, Microelectronic Circuits 6 ed., by Sedra and Smith, Oxford Press UNIT-1 Bipolar Junction Transistors Text Book:, Microelectronic Circuits 6 ed., by Sedra and Smith, Oxford Press Figure 6.1 A simplified structure of the npn transistor. Microelectronic Circuits, Sixth

More information

Digital Electronics. By: FARHAD FARADJI, Ph.D. Assistant Professor, Electrical and Computer Engineering, K. N. Toosi University of Technology

Digital Electronics. By: FARHAD FARADJI, Ph.D. Assistant Professor, Electrical and Computer Engineering, K. N. Toosi University of Technology K. N. Toosi University of Technology Chapter 7. Field-Effect Transistors By: FARHAD FARADJI, Ph.D. Assistant Professor, Electrical and Computer Engineering, K. N. Toosi University of Technology http://wp.kntu.ac.ir/faradji/digitalelectronics.htm

More information

Review Energy Bands Carrier Density & Mobility Carrier Transport Generation and Recombination

Review Energy Bands Carrier Density & Mobility Carrier Transport Generation and Recombination Review Energy Bands Carrier Density & Mobility Carrier Transport Generation and Recombination Current Transport: Diffusion, Thermionic Emission & Tunneling For Diffusion current, the depletion layer is

More information

2.8 - CMOS TECHNOLOGY

2.8 - CMOS TECHNOLOGY CMOS Technology (6/7/00) Page 1 2.8 - CMOS TECHNOLOGY INTRODUCTION Objective The objective of this presentation is: 1.) Illustrate the fabrication sequence for a typical MOS transistor 2.) Show the physical

More information

NAME: Last First Signature

NAME: Last First Signature UNIVERSITY OF CALIFORNIA, BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences EE 130: IC Devices Spring 2003 FINAL EXAMINATION NAME: Last First Signature STUDENT

More information

Spatial detection of ferromagnetic wires using GMR sensor and. based on shape induced anisotropy

Spatial detection of ferromagnetic wires using GMR sensor and. based on shape induced anisotropy Spatial detection of ferromagnetic wires using GMR sensor and based on shape induced anisotropy Behrooz REZAEEALAM Electrical Engineering Department, Lorestan University, P. O. Box: 465, Khorramabad, Lorestan,

More information

Lecture - 18 Transistors

Lecture - 18 Transistors Electronic Materials, Devices and Fabrication Dr. S. Prarasuraman Department of Metallurgical and Materials Engineering Indian Institute of Technology, Madras Lecture - 18 Transistors Last couple of classes

More information

MOS Field-Effect Transistors (MOSFETs)

MOS Field-Effect Transistors (MOSFETs) 6 MOS Field-Effect Transistors (MOSFETs) A three-terminal device that uses the voltages of the two terminals to control the current flowing in the third terminal. The basis for amplifier design. The basis

More information

UNIT IX ELECTRONIC DEVICES

UNIT IX ELECTRONIC DEVICES UNT X ELECTRONC DECES Weightage Marks : 07 Semiconductors Semiconductors diode-- characteristics in forward and reverse bias, diode as rectifier. - characteristics of LED, Photodiodes, solarcell and Zener

More information

PHYS 3050 Electronics I

PHYS 3050 Electronics I PHYS 3050 Electronics I Chapter 4. Semiconductor Diodes and Transistors Earth, Moon, Mars, and Beyond Dr. Jinjun Shan, Associate Professor of Space Engineering Department of Earth and Space Science and

More information

Micro-sensors - what happens when you make "classical" devices "small": MEMS devices and integrated bolometric IR detectors

Micro-sensors - what happens when you make classical devices small: MEMS devices and integrated bolometric IR detectors Micro-sensors - what happens when you make "classical" devices "small": MEMS devices and integrated bolometric IR detectors Dean P. Neikirk 1 MURI bio-ir sensors kick-off 6/16/98 Where are the targets

More information

Towards a Reconfigurable Nanocomputer Platform

Towards a Reconfigurable Nanocomputer Platform Towards a Reconfigurable Nanocomputer Platform Paul Beckett School of Electrical and Computer Engineering RMIT University Melbourne, Australia 1 The Nanoscale Cambrian Explosion Disparity: Widerangeof

More information

The RADFET: TRANSDUCERS RESEARCH Transducers Group

The RADFET:   TRANSDUCERS RESEARCH Transducers Group Page 1 of 5 TRANSDUCERS RESEARCH Transducers Group Introduction Research Teams Analog and Sensor Interface BioAnalytical Microsystems Chemical Microanalytics e-learning Instrumentation and software development,

More information

6.012 Microelectronic Devices and Circuits

6.012 Microelectronic Devices and Circuits Page 1 of 13 YOUR NAME Department of Electrical Engineering and Computer Science Massachusetts Institute of Technology 6.012 Microelectronic Devices and Circuits Final Eam Closed Book: Formula sheet provided;

More information

Chapter 2 : Semiconductor Materials & Devices (II) Feb

Chapter 2 : Semiconductor Materials & Devices (II) Feb Chapter 2 : Semiconductor Materials & Devices (II) 1 Reference 1. SemiconductorManufacturing Technology: Michael Quirk and Julian Serda (2001) 3. Microelectronic Circuits (5/e): Sedra & Smith (2004) 4.

More information

Chapter 3 Basics Semiconductor Devices and Processing

Chapter 3 Basics Semiconductor Devices and Processing Chapter 3 Basics Semiconductor Devices and Processing 1 Objectives Identify at least two semiconductor materials from the periodic table of elements List n-type and p-type dopants Describe a diode and

More information

Chapter 3: Basics Semiconductor Devices and Processing 2006/9/27 1. Topics

Chapter 3: Basics Semiconductor Devices and Processing 2006/9/27 1. Topics Chapter 3: Basics Semiconductor Devices and Processing 2006/9/27 1 Topics What is semiconductor Basic semiconductor devices Basics of IC processing CMOS technologies 2006/9/27 2 1 What is Semiconductor

More information

United States Patent [19]

United States Patent [19] United States Patent [19] Simmonds et al. [54] APPARATUS FOR REDUCING LOW FREQUENCY NOISE IN DC BIASED SQUIDS [75] Inventors: Michael B. Simmonds, Del Mar; Robin P. Giffard, Palo Alto, both of Calif. [73]

More information

ECE 440 Lecture 39 : MOSFET-II

ECE 440 Lecture 39 : MOSFET-II ECE 440 Lecture 39 : MOSFETII Class Outline: MOSFET Qualitative Effective Mobility MOSFET Quantitative Things you should know when you leave Key Questions How does a MOSFET work? Why does the channel mobility

More information

MSE 410/ECE 340: Electrical Properties of Materials Fall 2016 Micron School of Materials Science and Engineering Boise State University

MSE 410/ECE 340: Electrical Properties of Materials Fall 2016 Micron School of Materials Science and Engineering Boise State University MSE 410/ECE 340: Electrical Properties of Materials Fall 2016 Micron School of Materials Science and Engineering Boise State University Practice Final Exam 1 Read the questions carefully Label all figures

More information

EE301 Electronics I , Fall

EE301 Electronics I , Fall EE301 Electronics I 2018-2019, Fall 1. Introduction to Microelectronics (1 Week/3 Hrs.) Introduction, Historical Background, Basic Consepts 2. Rewiev of Semiconductors (1 Week/3 Hrs.) Semiconductor materials

More information

Semiconductor Physics and Devices

Semiconductor Physics and Devices Nonideal Effect The experimental characteristics of MOSFETs deviate to some degree from the ideal relations that have been theoretically derived. Semiconductor Physics and Devices Chapter 11. MOSFET: Additional

More information

1 Introduction to analog CMOS design

1 Introduction to analog CMOS design 1 Introduction to analog CMOS design This chapter begins by explaining briefly why there is still a need for analog design and introduces its main tradeoffs. The need for accurate component modeling follows.

More information

Integrated Circuits: FABRICATION & CHARACTERISTICS - 4. Riju C Issac

Integrated Circuits: FABRICATION & CHARACTERISTICS - 4. Riju C Issac Integrated Circuits: FABRICATION & CHARACTERISTICS - 4 Riju C Issac INTEGRATED RESISTORS Resistor in a monolithic IC is very often obtained by the bulk resistivity of one of the diffused areas. P-type

More information

Section 2.3 Bipolar junction transistors - BJTs

Section 2.3 Bipolar junction transistors - BJTs Section 2.3 Bipolar junction transistors - BJTs Single junction devices, such as p-n and Schottkty diodes can be used to obtain rectifying I-V characteristics, and to form electronic switching circuits

More information

S1. Current-induced switching in the magnetic tunnel junction.

S1. Current-induced switching in the magnetic tunnel junction. S1. Current-induced switching in the magnetic tunnel junction. Current-induced switching was observed at room temperature at various external fields. The sample is prepared on the same chip as that used

More information

Student Lecture by: Giangiacomo Groppi Joel Cassell Pierre Berthelot September 28 th 2004

Student Lecture by: Giangiacomo Groppi Joel Cassell Pierre Berthelot September 28 th 2004 Student Lecture by: Giangiacomo Groppi Joel Cassell Pierre Berthelot September 28 th 2004 Lecture outline Historical introduction Semiconductor devices overview Bipolar Junction Transistor (BJT) Field

More information

Laboratory #5 BJT Basics and MOSFET Basics

Laboratory #5 BJT Basics and MOSFET Basics Laboratory #5 BJT Basics and MOSFET Basics I. Objectives 1. Understand the physical structure of BJTs and MOSFETs. 2. Learn to measure I-V characteristics of BJTs and MOSFETs. II. Components and Instruments

More information

Lecture #29. Moore s Law

Lecture #29. Moore s Law Lecture #29 ANNOUNCEMENTS HW#15 will be for extra credit Quiz #6 (Thursday 5/8) will include MOSFET C-V No late Projects will be accepted after Thursday 5/8 The last Coffee Hour will be held this Thursday

More information

Lecture 020 ECE4430 Review II (1/5/04) Page 020-1

Lecture 020 ECE4430 Review II (1/5/04) Page 020-1 Lecture 020 ECE4430 Review II (1/5/04) Page 020-1 LECTURE 020 ECE 4430 REVIEW II (READING: GHLM - Chap. 2) Objective The objective of this presentation is: 1.) Identify the prerequisite material as taught

More information

Quantum Condensed Matter Physics Lecture 16

Quantum Condensed Matter Physics Lecture 16 Quantum Condensed Matter Physics Lecture 16 David Ritchie QCMP Lent/Easter 2018 http://www.sp.phy.cam.ac.uk/drp2/home 16.1 Quantum Condensed Matter Physics 1. Classical and Semi-classical models for electrons

More information

Lecture 020 ECE4430 Review II (1/5/04) Page 020-1

Lecture 020 ECE4430 Review II (1/5/04) Page 020-1 Lecture 020 ECE4430 Review II (1/5/04) Page 020-1 LECTURE 020 ECE 4430 REVIEW II (READING: GHLM - Chap. 2) Objective The objective of this presentation is: 1.) Identify the prerequisite material as taught

More information

Downloaded from

Downloaded from SOLID AND SEMICONDUCTOR DEVICES (EASY AND SCORING TOPIC) 1. Distinction of metals, semiconductor and insulator on the basis of Energy band of Solids. 2. Types of Semiconductor. 3. PN Junction formation

More information

3D SOI elements for System-on-Chip applications

3D SOI elements for System-on-Chip applications Advanced Materials Research Online: 2011-07-04 ISSN: 1662-8985, Vol. 276, pp 137-144 doi:10.4028/www.scientific.net/amr.276.137 2011 Trans Tech Publications, Switzerland 3D SOI elements for System-on-Chip

More information

COE/EE152: Basic Electronics. Lecture 5. Andrew Selasi Agbemenu. Outline

COE/EE152: Basic Electronics. Lecture 5. Andrew Selasi Agbemenu. Outline COE/EE152: Basic Electronics Lecture 5 Andrew Selasi Agbemenu 1 Outline Physical Structure of BJT Two Diode Analogy Modes of Operation Forward Active Mode of BJTs BJT Configurations Early Effect Large

More information

ECE520 VLSI Design. Lecture 2: Basic MOS Physics. Payman Zarkesh-Ha

ECE520 VLSI Design. Lecture 2: Basic MOS Physics. Payman Zarkesh-Ha ECE520 VLSI Design Lecture 2: Basic MOS Physics Payman Zarkesh-Ha Office: ECE Bldg. 230B Office hours: Wednesday 2:00-3:00PM or by appointment E-mail: pzarkesh@unm.edu Slide: 1 Review of Last Lecture Semiconductor

More information

MAGNETORESISTIVE random access memory

MAGNETORESISTIVE random access memory 132 IEEE TRANSACTIONS ON MAGNETICS, VOL. 41, NO. 1, JANUARY 2005 A 4-Mb Toggle MRAM Based on a Novel Bit and Switching Method B. N. Engel, J. Åkerman, B. Butcher, R. W. Dave, M. DeHerrera, M. Durlam, G.

More information

Lakeshore Hall Probe SOP Revision /16/18 Page 1 of 10. Lakeshore Hall Probe SOP

Lakeshore Hall Probe SOP Revision /16/18 Page 1 of 10. Lakeshore Hall Probe SOP Page 1 of 10 Lakeshore Hall Probe SOP The Lake Shore 7507 Series Hall effect/electronic transport measurement system (HMS) is designed to measure electronic transport properties of electrically conductive

More information

Physics 160 Lecture 5. R. Johnson April 13, 2015

Physics 160 Lecture 5. R. Johnson April 13, 2015 Physics 160 Lecture 5 R. Johnson April 13, 2015 Half Wave Diode Rectifiers Full Wave April 13, 2015 Physics 160 2 Note that there is no ground connection on this side of the rectifier! Output Smoothing

More information

We are IntechOpen, the world s leading publisher of Open Access books Built by scientists, for scientists. International authors and editors

We are IntechOpen, the world s leading publisher of Open Access books Built by scientists, for scientists. International authors and editors We are IntechOpen, the world s leading publisher of Open Access books Built by scientists, for scientists 3,800 116,000 120M Open access books available International authors and editors Downloads Our

More information

NOTICE. The above identified patent application is available for licensing. Requests for information should be addressed to:

NOTICE. The above identified patent application is available for licensing. Requests for information should be addressed to: Serial Number 09/548.387 Filing Date 11 April 2000 Inventor Theodore R. Anderson Edward R. Javor NOTICE The above identified patent application is available for licensing. Requests for information should

More information

Power MOSFET Zheng Yang (ERF 3017,

Power MOSFET Zheng Yang (ERF 3017, ECE442 Power Semiconductor Devices and Integrated Circuits Power MOSFET Zheng Yang (ERF 3017, email: yangzhen@uic.edu) Evolution of low-voltage (

More information

Magnetoresistance (MR) Transducers

Magnetoresistance (MR) Transducers Magnetoresistance (MR) Transducers And How to Use Them as Sensors 1st. Edition, July 2004 Perry A. Holman, Ph.D. Acronyms AMR EA GMR HA HDD MR Anisotropic Magnetoresistance (interchangeable with MR) Easy

More information

Lecture 8 Optical Sensing. ECE 5900/6900 Fundamentals of Sensor Design

Lecture 8 Optical Sensing. ECE 5900/6900 Fundamentals of Sensor Design ECE 5900/6900: Fundamentals of Sensor Design Lecture 8 Optical Sensing 1 Optical Sensing Q: What are we measuring? A: Electromagnetic radiation labeled as Ultraviolet (UV), visible, or near,mid-, far-infrared

More information

FIELD EFFECT TRANSISTORS MADE BY : GROUP (13)/PM

FIELD EFFECT TRANSISTORS MADE BY : GROUP (13)/PM FIELD EFFECT TRANSISTORS MADE BY : GROUP (13)/PM THE FIELD EFFECT TRANSISTOR (FET) In 1945, Shockley had an idea for making a solid state device out of semiconductors. He reasoned that a strong electrical

More information

GLOSSARY OF TERMS FLUX DENSITY:

GLOSSARY OF TERMS FLUX DENSITY: ADSL: Asymmetrical Digital Subscriber Line. Technology used to transmit/receive data and audio using the pair copper telephone lines with speed up to 8 Mbps. AMBIENT TEMPERATURE: The temperature surrounding

More information

Eddy Current Nondestructive Evaluation Using SQUID Sensors

Eddy Current Nondestructive Evaluation Using SQUID Sensors 73 Eddy Current Nondestructive Evaluation Using SQUID Sensors Francesco Finelli Sponsored by: LAPT Introduction Eddy current (EC) nondestructive evaluation (NDE) consists in the use of electromagnetic

More information