STPS8L30. Low drop power Schottky rectifier. Main product characteristics. Features and benefits. Order codes. Description IPAK STPS8L30H DPAK

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1 STPS8L3 Low drop power Schottky rectifier Main product characteristics I F(V) V RRM 8 3 V K K T j 5 C V F (max) Features and benefits Low cost device with low drop forward voltage for less power dissipation and reduced heatsink Optimized conduction/reverse losses trade-off which leads to the highest yield in the application High power surface mount miniature package valanche capability specified Description.4 V NC Order codes Part Numbers STPS8L3B DPK STPS8L3B Marking LS3 K NC IPK STPS8L3H Single Schottky rectifier suited to Switched Mode Power Supplies and high frequency DC to DC converters. STPS8L3B-TR STPS8L3H LS3 STPS8L3H Packaged in DPK and IPK, this device is especially intended for use as a Rectifier at the secondary of 3.3 V SMPS or DC/DC units. wheeling and polarity protection applications. Table. bsolute Ratings (limiting values) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 3 V I F(RMS) RMS forward voltage 7 I F(V) verage forward current T c = 35 C δ =.5 8 I FSM Surge non repetitive forward current t p = ms sinusoidal 75 I RRM Peak repetitive reverse current t p = 2 µs F = khz square I RSM Non repetitive peak reverse current t p = µs square 2 P RM Repetitive peak avalanche power t p = µs T j = 25 C 3 W T stg Storage temperature range -65 to + 5 C T j Maximum operating junction temperature () 5 C dv/dt Critical rate of rise of reverse voltage V/µs dptot thermal runaway condition for a diode on its own heatsink dtj > Rth ( j a) March 26 Rev 4 /7 7

2 Characteristics STPS8L3 Characteristics Table 2. Thermal Parameters Symbol Parameter Value Unit R th(j-c) Junction to case 2.5 C/W Table 3. Static Electrical Characteristics Symbol Parameter Tests conditions Min. Typ Max. Unit I R () Reverse leakage current T j = 25 C V R = V RRM T j = C 5 4 m V F () Forward voltage drop T j = 25 C.49 I F = 8 T j = 25 C.35.4 T j = 25 C.63 I F = 6 T j = 25 C V. Pulse test:* t p = 38 µs, δ < 2% To evaluate the conduction losses use the following equation: P =.23 x I F(V) +.2 I F 2 (RMS) Figure. verage forward power dissipation versus average forward current Figure 2. verage forward current versus ambient temperature (δ =.5) P F(V) (W) δ =.5 δ =. δ =.2 δ =.5 I F(V) () R th(j-a) =Rth(j-c) 3. δ = T. I F(V) (). δ=tp/t tp R th(j-a) =7 C/W T amb( C) /7

3 STPS8L3 Characteristics Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature P RM(t p) P RM(µs).2 P RM(t p) P RM(25 C) t p(µs).2 T ( C) j Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration 2 I () M. Z th(j-c) /Rth(j-c) IM T c=25 C T c=75 C T c=25 C 2 t δ=.5 t(s) E-3 E-2 E- E δ =.5 δ =.2 δ =. Single pulse t p(s) δ=tp/t tp. E-4 E-3 E-2 E- E+ T Figure 7. Reverse leakage current versus reverse voltage applied (typical values) Figure 8. Junction capacitance versus reverse voltage applied (typical values) 3E+2 E+2 E+ I (m) R T j=5 C T j=25 C 2 C(pF) F=MHz V OSC=3mVRMS T j=25 C E+ 5 E- T j=25 C E-2 V R(V) E V R(V) 4 3/7

4 Packaging information STPS8L3 Figure 9. Forward voltage drop versus forward current Figure. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35 µm) (DPK) I FM(). T j=5 C (typical values) 8 R th(j-a) ( C/W).. T j=25 C (maximum values) T j=25 C (maximum values) V FM(V) S(mm²) Packaging information Table 4. DPK dimensions DIMENSIONS REF. Millimeters Inches E B2 C2 Min. Max Min. Max L B H L4 B R R D B C C D G C E G MIN. 2 H L2.8 typ..3 typ. V2 L V /7

5 STPS8L3 Packaging information Figure. DPK footprint dimensions (in mm) Table 5. IPK Dimensions DIMENSIONS REF. Millimeters Inches Min. Typ. Max. Min. Typ. Max B E B2 L2 C2 B B B D C H L L B3 B C D V E e G B5 C 3 e G H L L L V In order to meet environmental requirements, ST offers these devices in ECOPCK packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPCK is an ST trademark. ECOPCK specifications are available at: 5/7

6 Ordering information STPS8L3 3 Ordering information Ordering type Marking Package Weight Base qty Delivery mode STPS8L3B LS3 75 Tube DPK.3 g STPS8L3B-TR LS3 25 Tape and reel STPS8L3H STPS8L3H IPK.35 g 75 Tube 4 Revision history Date Revision Description of Changes Jul-22 2 Previous update. 6-pr-25 3 IPK package added. -Mar-26 4 IPK connector identifiers corrected on page. Ecopack statement added. Document reformatted to current standard. 6/7

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