BAT54 Series. Small signal Schottky diodes. Main product characteristics. Features and benefits. Description. Order codes

Transcription

1 Small signal Schottky diodes Main product characteristics I F V RRM C (typ) T j (max) Features and benefits Low conduction and reverse losses Negligible switching losses Low forward and reverse recovery times Extremely fast switching Surface mount device Low capacitance diode Description 300 m 40 V 7 pf 150 C The BT54 series uses 40 V Schottky barrier diodes packaged in SOD- 23, SOD-323, SOD-523, SOT-23, SOT-323, or SOT-666. SOD-123 SOD-323 SOD-523 SOT-23 BT54ZFILM (Single) BT54JFILM (Single) BT54KFILM (Single) BT54FILM (Single) BT54FILM (Common anode) BT54SFILM (Series) BT54CFILM (Common cathode) Order codes Part Number Marking BT54FILM D86 BT54SFILM D88 BT54CFILM D87 BT54FILM D84 BT54WFILM D73 BT54SWFILM D78 BT54CWFILM D77 BT54WFILM D74 BT54JFILM 86 BT54KFILM 86 BT54-07P6FILM P4 BT54-09P6FILM Q4 BT54ZFILM D72 SOT-323 SOT-666 BT54WFILM (Single) BT54CWFILM (Common cathode) BT54WFILM (Common anode) BT54SWFILM (Series) BT54-07P6FILM (2 parallel diodes) BT54-09P6FILM (2 opposite diodes) Configurations in top view July 2006 Rev 9 1/13

2 Characteristics BT54 Series 1 Characteristics Table 1. bsolute ratings (limiting values at T j = 25 C, unless otherwise specified) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 40 V I F Continuous forward current 300 m I FSM Surge non repetitive forward current t p = 10 ms Sinusoidal 1 T stg Storage temperature range -65 to +150 C T j Operating junction temperature range -40 to +150 C T L Maximum soldering temperature 260 C Table 2. Thermal parameters Symbol Parameter Value Unit R th(j-a) Junction to ambient (1) SOT-323, SOD-323, 550 SOT-23, SOD SOD-523, SOT C/W 1. Epoxy printed circuit board with recommended pad layout Table 3. Static electrical characteristics Symbol Parameter Test conditions Min. Typ Max. Unit I R (1) Reverse leakage current T j = 25 C 1 V R = 30 V T j = 100 C 100 µ I F = 0.1 m 240 V F (2) Forward voltage drop T j = 25 C I F = 1 m 320 I F = 10 m 400 mv I F = 30 m 500 I F = 100 m Pulse test: t p = 5 ms, δ < 2 % 2. Pulse test: t p = 380 µs, δ < 2 % Table 4. Dynamic characteristics Symbol Parameter Test conditions Min. Typ Max. Unit C Diode capacitance V R = 1 V, F = 1 MHz 7 10 pf t rr Reverse recovery time I F = 10 m, I R = 10 m, T j = 25 C I rr = 1 m, R L = 100 Ω 5 ns 2/13

3 Characteristics Figure 1. verage forward power dissipation versus average forward current Figure 2. verage forward current versus ambient temperature (δ = 1) P(W) δ=0.05 δ=0.2 δ=0.1 δ=0.5 δ= I F(V) () T 0.10 T 0.05 IF(V)() δ=tp/t tp δ=tp/t tp T amb( C) Figure 3. Reverse leakage current versus reverse applied voltage (typical values) Figure 4. Reverse leakage current versus junction temperature 1.E+02 I R (µ) T j =100 C 1.E+04 I R [T j ]/I R [T j =25 C] V R =3V 1.E+01 1.E+03 1.E+02 T j =50 C 1.E+01 T j =25 C V R(V) 1.E T j( C) Figure 5. Junction capacitance versus reverse applied voltage (typical values) Figure 6. Forward voltage drop versus forward current (typical values) 10 C(pF) F=1MHz V OSC =30mV RMS T j =25 C I FM () T j =100 C 1.E-02 T j =50 C T j =25 C 1.E-03 T j =-40 C V R(V) V FM(V) 1.E /13

4 Characteristics BT54 Series Figure 7. Thermal resistance junction to ambient versus copper surface under each lead - epoxy FR4 with recommended pad layout, e CU = 35 µm (SOD-323) Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration - epoxy FR4 with recommended pad layout, e CU = 35 µm (SOD-323) R th(j-a) ( C/W) Epoxy FR4 e CU =35 µm Z th(j-a) /R th(j-a) Single pulse SOD S CU(mm²) E-02 Epoxy FR4 S CU =2.25 mm² t P(s) e CU =35 µm 1.E-03 1.E-03 1.E-02 1.E+01 1.E+02 1.E+03 Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration - aluminium oxide substrate 10 mm x 8 mm x 0.5 mm (SOT-23) Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration - epoxy FR4 with recommended pad layout, e CU = 35 µm (SOD-523) Z th(j-a) /R th(j-a) Single pulse SOT23 Z th(j-a) /R th(j-a) Single pulse SOD523 1.E-02 lumine substrate 10 x 8 x 0.5 mm t P(s) 1.E-02 1.E-03 1.E-02 1.E+01 1.E+02 Epoxy FR4 t P(s) e CU =35 µm 1.E-03 1.E-03 1.E-02 1.E+01 Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration - epoxy FR4 with recommended pad layout, e CU = 35 µm (SOT-666) Z th(j-a) /R th(j-a) Single pulse SOT666 Epoxy FR4 e CU =35 µm t P(s) 1.E-02 1.E-03 1.E-02 1.E+01 4/13

5 Ordering information scheme 2 Ordering information scheme BT54 xx xx FILM Signal Schottky diodes V RRM Package Packing = 40V Configuration No letter = Single diode = Common anode C = Common cathode S = Series diodes 07 = Parallel diodes 09 = Opposite diodes Blank = SOT-23 J = SOD-323 W = SOT-323 K = SOD-523 P6 = SOT-666 Z = SOD-123 FILM = Tape and reel 5/13

6 Package information BT54 Series 3 Package information Epoxy meets UL94, V0 Table 5. SOD-123 dimensions Dimensions H 2 1 Ref. Millimeters Inches Min. Max. Min. Max. E b D b 0.55 Typ Typ. c c 0.15 Typ Typ. D G E G H Figure 12. SOD-123 footprint (dimensions in mm) /13

7 Package information Table 6. SOD-323 dimensions Dimensions Ref. Millimeters Inches H b 1 Min. Max. Min. Max. E D b c Q1 c D E L H L Q Figure 13. SOD-323 footprint (dimensions in mm) /13

8 Package information BT54 Series Table 7. SOD-523 dimensions Dimensions E 0.15 M C B Ref. Millimeters Inches E1 B Min. Typ. Max. Min. Typ. Max. 2xb D SETING PLNE C 0.20 M C B L R0.1 c 7 8 E E D b c L1 L L Figure 14. SOD-523 footprint (dimensions in mm) /13

9 Package information Table 8. SOT-23 dimensions Dimensions Ref. Millimeters Inches E Min. Max. Min. Max B e e1 D B c S D e e H L c E H L 0.6 typ typ. S Figure 15. SOT-23 footprint (dimensions in mm) /13

10 Package information BT54 Series Table 9. SOT-323 dimensions Dimensions Ref. Millimeters Inches E Min. Typ. Max. Min. Typ. Max b e D b c D E e c θ H L H L q Figure 16. SOT-323 footprint (dimensions in mm) /13

11 Package information Table 10. SOT-666 dimensions Dimensions L1 b1 Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. L3 b D E b b E L2 3 D E E e L e L L Figure 17. SOT-666 footprint (dimensions in mm) In order to meet environmental requirements, ST offers these devices in ECOPCK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPCK is an ST trademark. ECOPCK specifications are available at: 11/13

12 Ordering information BT54 Series 4 Ordering information Part Number Marking Package Weight Base qty Delivery mode BT54FILM D86 SOT-23 Single 10 mg 3000 Tape and reel BT54SFILM D88 SOT-23 Serial 10 mg 3000 Tape and reel BT54CFILM D87 SOT-23 Common cathode 10 mg 3000 Tape and reel BT54FILM D84 SOT-23 Common anode 10 mg 3000 Tape and reel BT54WFILM D73 SOT-323 Single 6 mg 3000 Tape and reel BT54SWFILM D78 SOT-323 Serial 6 mg 3000 Tape and reel BT54CWFILM D77 SOT-323 Common cathode 6 mg 3000 Tape and reel BT54WFILM D74 SOT-323 Common anode 6 mg 3000 Tape and reel BT54JFILM 86 SOD mg 3000 Tape and reel BT54KFILM 86 SOD mg 3000 Tape and reel BT54-07P6FILM P4 SOT-666 Parallel 2.9 mg 3000 Tape and reel BT54-09P6FILM Q4 SOT-666 Opposite 2.9 mg 3000 Tape and reel BT54ZFILM D72 SOD mg 3000 Tape and reel 5 Revision history Date Revision Description of Changes Jun Last update. 24-Jul BT54,, C, S and BT54J / W / W / CW /SW datasheets merged. ECOPCK statement added. SOD- 123, SOD-523 and SOT-666 packages added. 12/13

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