STTH108. High voltage ultrafast rectifier. Features. Description
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1 High voltage ultrafast rectifier Features Low forward voltage drop High reliability High surge current capability Soft switching for reduced EMI disturbances Planar technology Description The STTH108, which is using ST ultrafast high voltage planar technology, is specially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications. K Table 1. SM (JEDEC DO-214C) STTH108 Symbol Device summary K DO-41 STTH108 Value I F(V) 1 V RRM 800 V T j (max) 175 C V F (max) 1.25 V October 2009 Doc ID 9342 Rev 3 1/6 6
2 Characteristics STTH108 1 Characteristics Table 2. bsolute ratings (limiting values) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 800 V V (RMS) Voltage rms 560 V I F(V) verage forward current SM T L = 110 C δ = 0.5 DO-41 T L = 130 C δ = I FSM Forward Surge current t = 8.3 ms SM 20 DO T stg Storage temperature range -50 to C T j Maximum operating junction temperature 175 C Table 3. Thermal resistance Symbol Parameter Value Unit SM 30 R th(j-l) Junction to lead Lead length = 10 mm DO R th(j-a) Junction to ambient Lead length = 10 mm DO C/W Table 4. Static electrical characteristics Symbol Parameter Tests conditions Min. Typ. Max. Unit I R Reverse leakage current 5 V R = 800 V T j = 125 C 1 50 µ V F Forward voltage drop 1.65 I F = 1 T j = 125 C V To evaluate the conduction losses use the following equation: P = 5 x I F(V) I F 2 (RMS) Table 5. Dynamic electrical characteristics Symbol Parameter Tests conditions Min. Typ. Max. Unit t rr t fr V FP Reverse recovery time Forward recovery time I F = 0.5, I rr = 0.25 I R = 1 I F = 1, di F /dt = 50 /ms V FR = 1.1 x V F max Forward recovery voltage I F = 1, di F /dt = 50 /ms 75 ns 200 ns 12 V 2/6 Doc ID 9342 Rev 3
3 Characteristics Figure 1. Conduction losses versus average current Figure 2. Forward voltage drop versus forward current P(W) δ = 0.05 δ = 0.1 δ = 0.2 δ = I FM() T j=150 C (maximum values) 1.2 δ = T j=150 C (typical values) T j=25 C (maximum values) 0.4 T I F(V) () δ=tp/t tp V FM (V) Figure Z th(j-c) /Rth(j-c) Relative variation of thermal impedance junction ambient versus pulse duration (DO-41) epoxy FR4, leads = 10 mm Figure Z th(j-c) /Rth(j-c) Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4) (SM) δ = δ = δ = 0.2 δ = 0.1 Single pulse t (s) p δ=tp/t 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 T tp δ = 0.2 δ = 0.1 Single pulse t (s) p δ=tp/t 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 T tp Figure R th(j-a) ( C/W) Thermal resistance junction to ambient versus copper surface under each lead (DO-41) epoxy printed circuit board FR4, copper thickness: 35 µm S(cm²) Figure R th(j-a) ( C/W) Thermal resistance junction to ambient versus copper surface under each lead (SM) epoxy printed circuit board FR4, copper thickness: 35 µm S(cm²) Doc ID 9342 Rev 3 3/6
4 Package information STTH108 2 Package information Epoxy meets UL 94, V0 Band indicates cathode Bending method (DO-41): see pplication note N1471 In order to meet environmental requirements, ST offers these devices in different grades of ECOPCK packages, depending on their level of environmental compliance. ECOPCK specifications, grade definitions and product status are available at: ECOPCK is an ST trademark. Table 6. SM dimensions Dimensions E1 Ref. Millimeters Inches Min. Max. Min. Max. D b E c C L 1 2 b D E E L Figure 7. Footprint (dimensions in mm) Table 7. DO-41 (plastic) package dimensions Dimensions Ref. Millimeters Inches ØD ØB Min. Max. Min. Max C C B C D /6 Doc ID 9342 Rev 3
5 Ordering information 3 Ordering information Table 8. Ordering information Order code Marking Package Weight Base qty Delivery mode STTH108 STTH108 DO g 2000 mmopack STTH108 H08 SM g 5000 Tape and reel STTH108RL STTH108 DO g 5000 Tape and reel 4 Revision history Table 9. Document revision history Date Revision Changes Jan Last update. 30-Sep Updated table 7 package dimensions. Doc ID 9342 Rev 3 5/6
6 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. ll ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST S TERMS ND CONDITIONS OF SLE ST DISCLIMS NY EXPRESS OR IMPLIED WRRNTY WITH RESPECT TO THE USE ND/OR SLE OF ST PRODUCTS INCLUDING WITHOUT LIMITTION IMPLIED WRRNTIES OF MERCHNTBILITY, FITNESS FOR PRTICULR PURPOSE (ND THEIR EQUIVLENTS UNDER THE LWS OF NY JURISDICTION), OR INFRINGEMENT OF NY PTENT, COPYRIGHT OR OTHER INTELLECTUL PROPERTY RIGHT. UNLESS EXPRESSLY PPROVED IN WRITING BY N UTHORIZED ST REPRESENTTIVE, ST PRODUCTS RE NOT RECOMMENDED, UTHORIZED OR WRRNTED FOR USE IN MILITRY, IR CRFT, SPCE, LIFE SVING, OR LIFE SUSTINING PPLICTIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FILURE OR MLFUNCTION MY RESULT IN PERSONL INJURY, DETH, OR SEVERE PROPERTY OR ENVIRONMENTL DMGE. ST PRODUCTS WHICH RE NOT SPECIFIED S "UTOMOTIVE GRDE" MY ONLY BE USED IN UTOMOTIVE PPLICTIONS T USER S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. ll other names are the property of their respective owners STMicroelectronics - ll rights reserved STMicroelectronics group of companies ustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of merica 6/6 Doc ID 9342 Rev 3
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