SMM4F12AVCL. 400 W low clamping voltage Transil. Features. Description. Complies with the following standards

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1 400 W low clamping voltage Transil Features Typical peak pulse power: 400 W (10/1000 µs) 2.4 kw (8/20 µs) Stand off voltage: 12 V Unidirectional type Low clamping factor Low leakage current: 0.2 µa at 25 C 1 µa at 85 C Operating T j max: 175 C High power capability at 85 C: 385 W JEDEC registered package outline RoHS package Halogen free molding compound Complies with the following standards IEC level 4: 15 kv (air discharge) 8 kv (contact discharge) MIL STD 883G-Method : class3 25 kv (human body model) K Description STmite flat (DO222-AA) The SMM4F12AVCL Transil series has been designed to protect sensitive equipment against electro-static discharges according to IEC , MIL STD 883 Method 3015, and electrical over stress such as IEC and 5. They are generally for surges below 400 W 10/1000 µs. This planar technology makes it compatible with high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. Their low clamping voltages provide a better safety margin to protect sensitive circuits with extended life time expectancy such as HDD power combo voltage regulators. Packaged in STmite flat, this minimizes PCB space consumption (footprint in accordance with IPC 7531 standard). A TM: Transil is a trademark of STMicroelectronics September 2011 Doc ID Rev 1 1/7 7

2 Characteristics SMM4F12AVCL 1 Characteristics Table 1. Absolute ratings (T amb = 25 C) Symbol Parameter Value Unit V PP Peak pulse voltage (IEC contact discharge) 30 kv P PP Peak pulse power dissipation (1) T j initial = T amb 400 W P Power dissipation on infinite heatsink T amb = 125 C 2.5 W T stg Storage temperature range -65 to +175 C T j Operating junction temperature range -55 to +175 C T L Maximum lead temperature for soldering during 10 s 260 C 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Table 2. Thermal resistances Symbol Parameter Value Unit R th(j-l) Junction to leads 20 R th(j-a) Junction to ambient on PCB with recommended pad layout 250 C/W Figure 1. Electrical characteristics - parameter definitions I Symbol Parameter VRM Stand-off voltage VBR Breakdown voltage VCL Clamping voltage IRM Leakage VRM IPP Peak pulse current at Voltage temperature coefficient VF Forward voltage drop R Dynamic resistance D Unidirectional V CL V BR V RM I F I RM I R I PP V F V Figure 2. Definition of I PP pulse %I Pulse waveform x/y µs 0 t tp = x µs y µs 2/7 Doc ID Rev 1

3 Characteristics Table 3. Electrical characteristics - parameter values (T amb = 25 C) (1) Type I RM max@v RM V R (2) V PP 10/1000 µs R D (3) 10/1000 µs V PP 8/20 µs R D (3) 8/20 µs αt(4) 25 C 85 C min typ max max max max µa V V ma V A Ω V A Ω 10-4/ C SMM4F12AVCL Surge capability given for both directions 2. Pulse test: t p <50ms. 3. To calculate maximum clamping voltage at other surge currents, use the following formula V CLmax = R D x I PP + V BRmax 4. To calculate V BR versus junction temperature, use the following formula: V T j = V 25 C x (1 + αt x (T j - 25)) Figure 3. Peak power dissipation versus initial junction temperature Figure 4. Peak pulse power versus exponential pulse duration (T j initial = 25 C) PPP[Tj initial] / PP P[Tjinitial =25 C] T j initial ( C) 10/1000 µs P PP(kW) t (ms) p T j initial = 25 C 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 5. Clamping voltage versus peak pulse current (exponential waveform, maximum values) IPP(A) T j initial=25 C tp = 8/20us µs tp = 10/1000 µs 0.1 VCL(V) Doc ID Rev 1 3/7

4 Ordering information scheme SMM4F12AVCL Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 7. Thermal resistance junction to ambient versus copper surface under each lead Z th(j-a)/r th(j-a) 1.00 On recommended pad layout Printed circuit board FR4 copper thickness = 35 µm 0.10 R th(j-a)( C/W) Printed circuit board FR4 copper thickness = 35 µm t (S) p 1.0E E E E E E E S CU(cm 2) Ordering information scheme Figure 8. Ordering information scheme SM M 4F 12 A VCL Surface mount Package M = STmite package Surge rating 4F = 400 W in flat package Stand off voltage example - 12 = 12 V Type A = Unidirectional Low clamping voltage 4/7 Doc ID Rev 1

5 Package information 3 Package information Case: JEDEC DO-222AA molded plastic over Planar junction Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: The band indicates cathode. Flammability: Epoxy meets UL94V-0 RoHS package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. Table 4. STmite flat dimensions Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. E1 L L1 L2 A b D b b2 b c E c L3 A D E E L L L L Figure 9. STmite flat footprint dimensions Figure 10. Marking information (0.033) (.025) (0.079) (.026) Cathode bar 0.65 (0.026) 4.13 (0.163) (0.037) (0.077) y w w x x x Y: Year WW: week XXX: Marking millimeters (inches) Doc ID Rev 1 5/7

6 Ordering information SMM4F12AVCL 4 Ordering information Table 5. Ordering information Order code Marking Package Weight Base qty Delivery mode SMM4F12AVCL 4UL STmite flat 16.7 mg Tape and reel 5 Revision history Table 6. Document revision history Date Revision Changes 13-Sep First issue. 6/7 Doc ID Rev 1

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