STPS3150. Power Schottky rectifier. Features. Description

Transcription

1 STPS315 Power Schottky rectifier Features Negligible switching losses Low forward voltage drop for higher efficiency and extented battery life Low thermal resistance ECOPACK 2 compliant component K A STPS315U K A DO-21AD STPS315 Description 15 V Power Schottky rectifier are suited for switch mode power supplies on up to 24 V rails and high frequency converters. Packaged in Axial,, and low-profile, this device is intended for use in consumer and computer applications like TV, STB, PC and DVD where low drop forward voltage is required to reduce power dissipation. Table 1. Symbol K Device summary Value I F(AV) 3 A V RRM 15 V T j (max) 175 C V F (max).67 V A flat STPS315UF July 211 Doc ID 9474 Rev 5 1/

2 Characteristics STPS315 1 Characteristics Table 2. Absolute Ratings (limiting values) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 15 V T L = 13 C δ =.5 I F(AV) Average forward current DO-21AD T L = 14 C δ =.5 3 A flat T L = 15 C δ =.5 8 I FSM Surge non repetitive forward current DO-21AD t p = ms sinusoidal A flat 8 T stg Storage temperature range -65 to C T j Operating junction temperature (1) 175 C 1. dptot condition to avoid thermal runaway for a diode on its own heatsink dtj Rth ( j a) Table 3. Thermal resistance Symbol Parameter Value Unit flat R th(j-l) Junction to lead 2 C/W Lead length = mm DO-21AD 15 Table 4. Static electrical characteristics Symbol Parameter Tests conditions Min. Typ. Max. Unit I R (1) V F (2) Reverse leakage current Forward voltage drop T j = 25 C.4 2. µa V R = V RRM T j = 125 C.6 2. ma T j = 25 C I F = 3 A T j = 125 C V T j = 25 C I F = 6 A T j = 125 C t p = 5 ms, δ < 2% 2. t p = 38 µs, δ < 2% To evaluate the conduction losses use the following equation: P =.59 x I F(AV) +.23 I F 2 (RMS) 2/ Doc ID 9474 Rev 5

3 STPS315 Characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (δ =.5) (DO-21AD / ) P F(AV) (W) δ =.1 δ =.2 δ =.5 δ =.5 δ = 1 T I F(AV) (A) δ=tp/t tp I F(AV) (A) δ=tp/t T tp R th(j-a) =75 C/W R =Rth(j-I) th(j-a) DO-21AD T amb( C) Figure 3. Average forward current versus ambient temperature (δ =.5) ( flat) Figure 4. Non repetitive surge peak forward current versus overload duration (maximum values) I F(AV) (A) δ=tp/t T tp R th(j-a) =Rth(j-l) T amb( C) flat R th(j-a) =4 C/W 2. S CU=2.5 cm I (A) M IM t δ=.5 t(s) T a=25 C T a=75 C T a=125 C 1.E-3 1.E-2 1.E-1 1.E+ Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) Figure 6. Non repetitive surge peak forward current versus overload duration (maximum values) I (A) M DO-21AD I (A) M flat T a=25 C T a=75 C T L=25 C T L=75 C 4 T a=125 C 15 T L=125 C IM 2 t δ=.5 t(s) 1.E-3 1.E-2 1.E-1 1.E+ IM t 5 δ=.5 t(s) 1.E-3 1.E-2 1.E-1 1.E+ Doc ID 9474 Rev 5 3/

4 Characteristics STPS315 Figure 7. Normalized avalanche power derating versus pulse duration Figure 8. Normalized avalanche power derating versus junction temperature 1 P P ARM ARM (tp) (1µs) P ARM(T) j P ARM(25 C) t (µs) T j( C) p Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration Figure. Relative variation of thermal impedance junction to ambient versus pulse duration 1..9 Z th(j-a) /Rth(j-a) 1..9 Z th(j-a) /Rth(j-a) DO-21AD Single pulse t (s) p δ=tp/t 1.E-2 1.E-1 1.E+ 1.E+1 1.E+2 1.E+3 T tp Single pulse t (s) p δ=tp/t 1.E-1 1.E+ 1.E+1 1.E+2 1.E+3 T tp Figure 11. Relative variation of thermal impedance junction to lead versus pulse duration Figure 12. Reverse leakage current versus reverse voltage applied (typical values) Z th(j-l) /Rth(j-l) flat 1.E+4 1.E+3 1.E+2 I (µa) R T j=15 C T j=125 C T j= C.5 1.E+1 T j=75 C E+ T j=5 C.2.1. Single pulse t (s) p 1.E-4 1.E-3 1.E-2 1.E-1 1.E+ 1.E+1 1.E-1 1.E-2 T j=25 C V (V) R / Doc ID 9474 Rev 5

5 STPS315 Characteristics Figure 13. Junction capacitance versus reverse voltage applied (typical values) Figure 14. Forward voltage drop versus forward current C(pF) F=1MHz V OSC=3mVRMS T j=25 C I FM(A) T j=125 C (maximum values) T j=125 C (typical values) T j=25 C (maximum values) V (V) R 1 V FM (V) Figure 15. Thermal resistance junction to ambient versus copper surface under each lead R th(j-a) ( C/W) 1 epoxy printed board copper thickness = 35 µm S Cu(cm²) Figure 16. Rth( C/W) Thermal resistance junction to ambient versus copper surface under each lead Rth(j-a) Rth(j-I) DO-21AD epoxy printed board copper thickness = 35 µm L leads(mm) Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board copper thickness = 35 µm) R th(j-a) ( C/W) flat S CU(cm²) Doc ID 9474 Rev 5 5/

6 Package information STPS315 2 Package information Epoxy meets UL94, V Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. Table 5. dimensions E1 Ref. Dimensions Millimeters Inches Min. Max. Min. Max. D A A b E c C A1 A2 E E L b D L Figure 18. footprint (dimensions in mm) / Doc ID 9474 Rev 5

7 STPS315 Package information Table 6. Flat dimensions Dimensions Ref. Millimeters Inches E E1 D b A L L c L2 L1 Min. Typ. Max. Min. Typ. Max. A b (1) c (1) D E E L L L Applies to plated leads Figure 19. Flat footprint (dimensions in mm) Doc ID 9474 Rev 5 7/

8 Package information STPS315 Table 7. DO-21AD dimensions Dimensions B A B REF. Millimeters Inches Note 1 E E Note 1 Min. Max. Min. Max. ØD ØC Note 2 A B C D (1) E Note 2 (2) The lead diameter D is not controlled over zone E 2. The minimum length, which must stay straight between the right angles after bending, is 15 mm (.59 ) 8/ Doc ID 9474 Rev 5

9 STPS315 Ordering information 3 Ordering information Table 8. Ordering information Order code Marking Package Weight Base qty Delivery mode STPS315U G315.7 g 25 Tape and reel STPS315UF FG315 flat.5 g 5 Tape and reel STPS315 STPS315 DO-21AD 1.12 g 6 Ammopack STPS315RL STPS315 DO-21AD 1.12 g 19 Tape and reel 4 Revision history Table 9. Document revision history Date Revision Changes May-23 2A Last update. 31-May-26 3 Reformatted to current standard. Added ECOPACK statement. Updated footprint in Figure 12. Changed nf to pf in Figure 8. 8-Feb-27 4 Added flat and flat e package. 2-Jul Updated Table 2. Doc ID 9474 Rev 5 9/

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