STPS2L30. Low drop power Schottky rectifier. Features. Description

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1 STPS2L3 Low drop power Schottky rectifier Features Low cost device with low drop forward voltage for less power dissipation Optimized conduction/reverse losses trade-off which lead to the highest yield in the applications Surface mount miniature packages Avalanche capability specified K A SMA STPS2L3A Description Single Schottky rectifier suited to switched mode power supplies and high frequency DC to DC converters, freewheel diode and integrated circuit latch up protection. Packaged in SMA and low profile SMA and SMB, this device is especially intended for use in parallel with MOSFETs in synchronous rectification. Table 1. Device summary K A SMB flat STPS2L3UF I F(AV) 2 A V RRM 3 V T j (max) 15 C V F (max).375 V K A SMA flat STPS2L3AF April 28 Rev 6 1/1 1

2 Characteristics STPS2L3 1 Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 3 V SMA flat T L = 13 C δ =.5 I F(AV) Average forward current SMA T L = 12 C δ =.5 2 A SMB flat T L = 135 C δ =.5 I FSM Surge non repetitive forward current t p =1 ms sinusoidal 75 A P ARM Repetitive peak avalanche power t p = 1 µs Tj = 25 C 15 W T stg Storage temperature range -65 to + 15 C T j Operating junction temperature (1) 15 C 1. dptot dtj Rth ( j a) condition to avoid thermal runaway for a diode on its own heatsink Table 3. Thermal resistance Symbol Parameter Value Unit SMA flat 2 R th(j-l) Junction to lead SMA 3 C/W SMB flat 15 Table 4. Static electrical characteristics Symbol Parameter Test Conditions Min. Typ. Max. Unit I R (1) V F (1) Reverse leakage current Forward voltage drop T j = 25 C 2 µa V R = V RRM T j = 1 C 6 15 ma T j = 25 C 5 I F = 2 A T j = 125 C V T j = 25 C.53 I F = 4 A T j = 125 C Pulse test: t p = 38 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 4 x I F(AV) + 68 I F 2 (RMS) 2/1

3 STPS2L3 Characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (δ =.5) SMA P (W) F(AV) δ = δ = δ = δ =.5 δ = 1 T I F(AV) (A) δ=tp/t tp I F(AV) (A) δ=tp/t R th(j-a) =12 C/W T tp R =Rth(j-l) th(j-a) SMA T amb( C) Figure 3. Average forward current versus ambient temperature (δ =.5) SMB flat Figure 4. Average forward current versus ambient temperature (δ =.5) SMA flat I F(AV) (A) δ=tp/t R th(j-a) =12 C/W T tp R th(j-a) =Rth(j-l) T amb( C) SMB flat I F(AV) (A) T δ=tp/t tp R th(j-a) =R th(j-l) SMA-Flat R th(j-a) =2 C/W T amb( C) Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) SMA Figure 6. Non repetitive surge peak forward current versus overload duration (maximum values) SMB flat I (A) M SMA 3 25 I (A) M SMB flat (non exposed pad) IM t δ=.5 t(s) T a=25 C T a=75 C T a=125 C 1.E-3 1.E-2 1.E-1 1.E IM t δ=.5 t(s) T L=25 C T L=75 C T L=125 C 1.E-3 1.E-2 1.E-1 1.E+ 3/1

4 Characteristics STPS2L3 Figure I (A) M Non repetitive surge peak forward current versus overload duration (maximum values) SMA flat SMA-Flat Figure 8. 1 P ARM(t p) P ARM(1µs) Normalized avalanche power derating versus pulse duration 5 4 T a =25 C IM t δ =.5 T a=75 C T a=125 C t(s) 1 1.E-3 1.E-2 1.E-1 1.E t p(µs) Figure 9. Normalized avalanche power derating versus junction temperature Figure 1. Relative variation of thermal impedance, junction to ambient, versus pulse duration - SMA 1.2 P ARM(T) j P ARM(25 C).9 Z th(j-a) /Rth(j-a) SMA 1.7 T ( C) j Single pulse t (s) p δ=tp/t 1.E-2 1.E-1 1.E+ 1.E+1 1.E+2 1.E+3 T tp Figure 11. Relative variation of thermal impedance junction to lead versus pulse duration - SMB flat Figure 12. Relative variation of thermal impedance junction to ambient versus pulse duration - SMA flat Z th(j-l) /Rth(j-l) SMB flat Z th(j-a) /Rth(j-a) SMA-Flat Single pulse t (s) p 1.E-4 1.E-3 1.E-2 1.E-1 1.E+ 1.E+1 Single pulse t (s) p 1.E-2 1.E-1 1.E+ 1.E+1 1.E+2 1.E+3 4/1

5 STPS2L3 Characteristics Figure 13. Reverse leakage current versus reverse voltage applied (typical values) Figure 14. Junction capacitance versus reverse voltage applied (typical values) 1.E+2 1.E+1 I (ma) R T j=15 C T j=125 C 1 C(pF) F=1MHz V OSC=3mVRMS T j=25 C T j=1 C 1.E+ 1 1.E-1 1.E-2 T j=25 C 1.E-3 V (V) R V (V) R Figure 15. Forward voltage drop versus forward current (high level) Figure 16. Forward voltage drop versus forward current ( low level) I FM(A) 1 I FM(A) T j =125 C (maximum values) 2. T j=125 C (maximum values) 1.5 T j =125 C (typical values) T j=25 C (maximum values) V FM(V) T j=125 C (typical values).5 V FM(V) T j=25 C (maximum values).3.5 Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, copper thickness = 35 µm) (SMA, SMB flat) Figure 18. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, copper thickness = 35 µm) (SMA flat) R th(j-a) ( C/W) SMA SMB flat) S CU(Cm²) R th(j-a) ( C/W) S CU(Cm²) SMA-Flat /1

6 Package Information STPS2L3 2 Package Information Epoxy meets UL94, V In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at Table 5. SMA dimensions Dimensions E1 Ref. Millimeters Inches Min. Max. Min. Max. D A A b E c A1 D C L A2 b E E L Figure 19. SMA footprint (dimensions in mm) /1

7 STPS2L3 Package Information Table 6. SMA flat (non exposed pad) dimensions Dimensions Ref. Millimeters Inches E E1 D b A L 2x L c L1 2x L2 2x Min. Typ. Max. Min. Typ. Max. A b c D E E L L L Figure 2. SMA flat (non exposed pad) footprint dimensions 5.52 (17) 1.52 (6) 1.2 (47) 3.12 (23) 1.2 (47) millimeters (inches) 7/1

8 Package Information STPS2L3 Table 7. SMB flat dimensions Dimensions Ref. Millimeters Inches E E1 D b A L L c L2 L1 Min. Typ. Max. Min. Typ. Max. A b (1) c (1) D E E L L1 16 L Applies to plated leads Figure 21. SMB flat footprint (dimensions in mm) /1

9 STPS2L3 Ordering information 3 Ordering information Table 8. Ordering information Order code Marking Package Weight Base qty Delivery mode STPS2L3A G3 SMA 68 g 5 Tape and reel STPS2L3UF FG3 SMB flat 5 g 5 Tape and reel STPS2L3AF F3 SMA flat 35 g 1 Tape and reel 4 Revision history Table 9. Document revision history Date Revision Changes Jul-23 3A Last update. Aug Jan-27 5 SMA package dimensions update. Reference A1 max. changed from 2.7mm (6inc.) to 2.3mm (8). Reformatted to current standard. Added ECOPACK statement. Added SMB flat package. 23-Apr-28 6 Reformatted to current standards. Added SMA flat package. 9/1

10 STPS2L3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. 28 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 1/1

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