Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 100 V I F(RMS) RMS forward current 10 A

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1 High voltage power Schottky rectifier Main product characteristics I F(AV) V RRM T j (max) V F (max) Features and Benefits Negligible switching losses Low leakage current Good trade off between leakage current and forward voltage drop Low thermal resistance Avalanche capability specified Description 2 x 7.5 A V 75 C.67 V Dual center tab Schottky rectifier suited for switched mode power supply and high frequency DC to DC converters. Packaged in DPAK and IPAK, this device is intended for use in high frequency inverters. K A A2 A STPS5HCB DPAK A2 K K A2 A K STPS5HCH IPAK Table. Absolute Ratings (limiting values, per diode) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage V I F(RMS) RMS forward current A I F(AV) Average forward current T c = 35 C Per diode 7.5 δ =.5 Per device 5 A I FSM Surge non repetitive forward current t p = ms sinusoidal 75 A I RRM Peak repetitive reverse current t p = 2 µs square F= khz A P ARM Repetitive peak avalanche power t p = µs Tj = 25 C 66 W T stg Storage temperature range -65 to + 75 C T j Maximum operating junction temperature () 75 C dv/dt Critical rate of rise of reverse voltage V/µs. dptot dtj Rth ( j a) condition to avoid thermal runaway for a diode on its own heatsink June 26 Rev 4 /8 8

2 Characteristics STPS5HC Characteristics Table 2. Thermal resistance Symbol Parameter Value Unit R th(j-c) Junction to case Per diode 4 Total 2.4 R th(c) Coupling.7 C/W When the diodes and 2 are used simultaneously : T j (diode ) = P(diode) x R th(j-c) (Per diode) + P(diode 2) x R th(c) Table 3. Static electrical characteristics (per diode) Symbol Parameter Test Conditions Min. Typ. Max. Unit I R () V F (.) Reverse leakage current Forward voltage drop T j = 25 C 3 µa V R = V RRM T j = 25 C.3 4 ma T j = 25 C I F = 7.5 A.8 T j = 25 C I F = 7.5 A T j = 25 C I F = 2 A.85 T j = 25 C I F = 2 A T j = 25 C I F = 5 A.89 T j = 25 C I F = 5 A.7.76 V. Pulse test: tp = 38 µs, δ < 2% To evaluate the conduction losses use the following equation: P =.58 x I F(AV) +.2 I F 2 (RMS) 2/8

3 Characteristics Figure PF(av)(W) Conduction losses versus average current δ =.5 δ =. δ =.2 IF(av)(A) δ =.5 δ=tp/t δ = T tp Figure 2. IF(av)(A) δ=tp/t T Average forward current versus ambient temperature (δ =.5) tp Rth(j-a)=7 C/W Rth(j-a)=Rth(j-c) Tamb( C) Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature P ARM(t p) P ARM(µs) P ARM(t p) P ARM(25 C) t p(µs).2 T j( C) Figure 5. IM(A) 9 8 Non repetitive surge peak forward current versus overload duration (maximum values) Figure 6. Zth(j-c)/Rth(j-c)..9.8 Relative variation of thermal impedance junction to case versus pulse duration 7 6 Tc=25 C.7.6 δ =.5 5 Tc=75 C δ = Tc=25 C IM t δ=.5 t(s).e-3.e-2.e-.e δ =. Single pulse T tp(s) δ=tp/t tp.e-3.e-2.e-.e+ 3/8

4 Characteristics STPS5HC Figure 7. Reverse leakage current versus reverse voltage applied (typical values) Figure 8. Junction capacitance versus reverse voltage applied (typical values).e+.e+ IR(mA) Tj=5 C Tj=25 C. C(nF) F=MHz Vosc=3mV Tj=25 C.E- Tj= C.E-2 Tj=75 C. Tj=5 C.E-3 Tj=25 C VR(V).E VR(V) Figure 9. IFM(A) Forward voltage drop versus forward current Tj=25 C (Maximum values) Figure. Rth(j-a)( C/W) Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu: 35µm) Tj=25 C (Typical values) Tj=25 C (Maximum values) VFM(V) S(cm²) /8

5 Package Information 2 Package Information Epoxy meets UL94,V Table 4. DPAK Package mechanical data Dimensions Ref Millimeters Inches Min. Max. Min. Max. A A A B B C C D E G H L2.8 typ..3 typ. L V2 8 8 Figure. DPAK Footprint (dimensions in mm) /8

6 Package Information STPS5HC Table 5. IPAK Package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A A A E B2 L2 C2 A B B B B D C C H L L B3 B V A D E e e B5 C G G A3 H L L L V 6/8

7 Ordering Information 3 Ordering Information Ordering type Marking Package Weight Base qty Delivery mode STPS5HCB S5H DPAK.3 g 75 Tube STPS5HCB-TR S5H DPAK.3 g 25 Tape andreel STPS5HCH S5HCH IPAK.35 g 75 Tube 4 Revision History Date Revision Changes Mar-24 3 Last issue 8-Jun-26 4 Reformatted to current standard. Added IPAK. 7/8

8 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. 26 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 8/8

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