LOW DROPOUT LINEAR REGULATOR. Features. Applications

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General Description The is a low dropout three-terminal regulator. The has been optimized for low voltage where transient response and minimum input voltage are critical.

On-chip thermal shutdown provides protection against a combination of high current and ambient temperature that would create excessive junction temperature. The is available in 1.2, 1.5, 1.8, 2.5, 3.

1 General Description The is a low dropout three-terminal regulator. The has been optimized for low voltage where transient response and minimum input voltage are critical. It provides current limit and thermal shutdown. Its circuit includes a trimmed bandgap reference to assure output voltage accuracy to be within ±1%. On-chip thermal shutdown provides protection against a combination of high current and ambient temperature that would create excessive junction temperature. The is available in 1.2, 1.5, 1.8, 2.5, 3.3, 5.0 fixed output voltage vesions and ADJ output voltage version. The fixed versions integrate the adjust resistors. It is also available in an adjustable version which can set the output voltage with two external resistors. Features Current Limit: 1.0A (Typ.) Output Noise from Hz to KHz: 0.003% of OUT PSRR at I OUT =300mA and f=120hz: 70dB Output oltage Accuracy: ±1% On-chip Thermal Shutdown Maximum Quiescent Current: I QMAX =6mA Operation Junction Temperature: -20 to 125 o C Applications USB Device Add-on Card DD Player PC Motherboard The is available in the industry-standard TO (1), TO (2), TO (3), SOT-223 and SOT-89 power packages. SOT-223 SOT-89 TO (1) TO (2) TO (3) Figure 1. Package Type of 1

2 Pin Configuration H Package (SOT-223) R Package (SOT-89) 3 INPUT 3 INPUT OUT 2 OUTPUT OUT 2 OUTPUT 1 ADJ/GND 1 ADJ/GND (TO (1)) D Package (TO (2)) (TO (3)) 3 INPUT 3 INPUT 3 INPUT OUT 2 OUTPUT OUT 2 OUTPUT OUT 2 OUTPUT 1 ADJ/GND 1 ADJ/ GND 1 ADJ/GND Figure 2. Pin Configuration of (Top iew) 2

3 Functional Block Diagram 3 INPUT Thermal - Protection + 2 OUTPUT For Adjustable Output, disconnect A1 and A2, connect B For Fixed Output, connect A1 and A2, disconnect B A1 B A2 1 ADJ/GND Figure 3. Functional Block Diagram of 3

4 Ordering Information - Circuit Type Package H: SOT-223 D: TO (1)/(2)/(3) R: SOT-89 E1: Lead Free G1: Green TR: Tape and Reel ADJ: Adjustable Output 1.2: Fixed Output : Fixed Output : Fixed Output : Fixed Output : Fixed Output : Fixed Output 5.0 Package Temperature Range Part Number Marking ID Lead Free Green Lead Free Green Packing Type SOT-223 TO (1)/ TO (2)/ TO (3) -20 to 125 o C -20 to 125 o C H-ADJTRE1 AZ1117H-ADJTRG1 EH17K GH17K Tape & Reel H-1.2TRE1 AZ1117H-1.2TRG1 EH17P GH17P Tape & Reel H-1.5TRE1 AZ1117H-1.5TRG1 EH17Q GH17Q Tape & Reel H-1.8TRE1 AZ1117H-1.8TRG1 EH17L GH17L Tape & Reel H-2.5TRE1 AZ1117H-2.5TRG1 EH17N GH17N Tape & Reel H-3.3TRE1 AZ1117H-3.3TRG1 EH17M GH17M Tape & Reel H-5.0TRE1 AZ1117H-5.0TRG1 EH17R GH17R Tape & Reel D-ADJE1 AZ1117D-ADJG1 D-ADJE1 AZ1117D-ADJG1 Tube D-ADJTRE1 AZ1117D-ADJTRG1 D-ADJE1 AZ1117D-ADJG1 Tape & Reel D-1.2E1 AZ1117D-1.2G1 D-1.2E1 AZ1117D-1.2G1 Tube D-1.2TRE1 AZ1117D-1.2TRG1 D-1.2E1 AZ1117D-1.2G1 Tape & Reel D-1.5E1 AZ1117D-1.5G1 D-1.5E1 AZ1117D-1.5G1 Tube D-1.5TRE1 AZ1117D-1.5TRG1 D-1.5E1 AZ1117D-1.5G1 Tape & Reel D-1.8E1 AZ1117D-1.8G1 D-1.8E1 AZ1117D-1.8G1 Tube D-1.8TRE1 AZ1117D-1.8TRG1 D-1.8E1 AZ1117D-1.8G1 Tape & Reel D-2.5E1 AZ1117D-2.5G1 D-2.5E1 AZ1117D-2.5G1 Tube D-2.5TRE1 AZ1117D-2.5TRG1 D-2.5E1 AZ1117D-2.5G1 Tape & Reel D-3.3E1 AZ1117D-3.3G1 D-3.3E1 AZ1117D-3.3G1 Tube D-3.3TRE1 AZ1117D-3.3TRG1 D-3.3E1 AZ1117D-3.3G1 Tape & Reel D-5.0E1 AZ1117D-5.0G1 D-5.0E1 AZ1117D-5.0G1 Tube D-5.0TRE1 AZ1117D-5.0TRG1 D-5.0E1 AZ1117D-5.0G1 Tape & Reel 4

5 Ordering Information (Continued) Package Temperature Range Part Number Marking ID Lead Free Green Lead Free Green Packing Type SOT to 125 o C R-ADJTRE1 AZ1117R-ADJTRG1 E31F G31F Tape & Reel R-1.2TRE1 AZ1117R-1.2TRG1 E31G G31G Tape & Reel R-1.5TRE1 AZ1117R-1.5TRG1 E31H G31H Tape & Reel R-1.8TRE1 AZ1117R-1.8TRG1 E31J G31J Tape & Reel R-2.5TRE1 AZ1117R-2.5TRG1 E31K G31K Tape & Reel R-3.3TRE1 AZ1117R-3.3TRG1 E31L G31L Tape & Reel R-5.0TRE1 AZ1117R-5.0TRG1 E31M G31M Tape & Reel BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with "G1" suffix are available in green packages. 5

6 Absolute Maximum Ratings (Note 1) Parameter Symbol alue Unit Input oltage IN 18 Operating Junction Temperature Range T J 150 o C Storage Temperature Range T STG -65 to 150 o C SOT Thermal Resistance (No Heatsink) θ JA TO-252-2(1)/TO-252-2(2) TO-252-2(3) 128 o C/W SOT-89 2 Lead Temperature (Soldering, sec) T LEAD 260 o C Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability. Recommended Operating Conditions Parameter Symbol Min Max Unit Input oltage IN 15 Operating Junction Temperature Range T J o C 6

7 Electrical Characteristics -ADJ Electrical Characteristics Operating Conditions: IN = OUT +2, I OUT =ma, T J =25 o C, unless otherwise specified. (P maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20 o C to 125 o C. Parameter Symbol Conditions Min Typ Max Uni Reference oltage REF 1.5 IN - OUT Line Regulation RLINE 1.5 IN - OUT Load Regulation RLOAD % Dropout oltage DROP REF =1%, I OUT =0.8A 0.2 SOT TO-252-2(1)/(2)/(3) 1.4 SOT Current Limit I LIMIT A Adjust Pin Current µa Adjust Pin Current Change 1.5 ( IN - OUT ) µa Minimum Load Current 1.5 ( IN - OUT ) ma % Ripple Rejection PSRR f=120hz, C OUT =22µF ( IN - OUT )=3, I OUT =300mA 70 db Temperature Stability 0.5 % RMS Output Noise (% of OUT ) T A =25 o C, Hz f KHz % Thermal Shutdown Junction Temperature 160 o C Thermal Shutdown Hysteresis 16 o C Thermal Resistance θ JC TO (1)/TO (2)/TO (3) 22 SOT SOT o C/ W 7

8 Electrical Characteristics (Continued) -1.2 Electrical Characteristics Operating Conditions: IN, I OUT =ma, T J =25 o C, unless otherwise specified. (P maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20 o C to 125 o C. Parameter Symbol Conditions Min Typ Max Unit Output oltage OUT 3.2 IN Line Regulation RLINE 1.5 IN - OUT m Load Regulation RLOAD 2 15 m SOT OUT =1%, I OUT =0.8A Dropout oltage DROP TO-252-2(1)/(2)/(3) 1.4 SOT Current Limit I LIMIT A Quiescent Current I Q I OUT =0 4 6 ma Ripple Rejection PSRR f=120hz, C OUT =22µF ( IN - OUT )=3, I OUT =300mA 70 db Temperature Stability 0.5 % RMS Output Noise (% of OUT ) T A =25 o C, Hz f KHz % Thermal Shutdown Junction Temperature 160 o C Thermal Shutdown Hysteresis 16 o C Thermal Resistance θ JC TO (1)/TO (2)/TO (3) 22 SOT SOT o C/ W 8

9 Electrical Characteristics (Continued) -1.5 Electrical Characteristics Operating Conditions: IN, I OUT =ma, T J =25 o C, unless otherwise specified. (P maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20 o C to 125 o C. Parameter Symbol Conditions Min Typ Max Unit Output oltage OUT 3.5 IN Line Regulation RLINE 1.5 IN - OUT m Load Regulation RLOAD 2 15 m SOT OUT =1%, I OUT =0.8A Dropout oltage DROP TO-252-2(1)/(2)/(3) 1.4 SOT Current Limit I LIMIT A Quiescent Current I Q I OUT =0 4 6 ma Ripple Rejection PSRR f=120hz, C OUT =22µF ( IN - OUT )=3, I OUT =300mA 70 db Temperature Stability 0.5 % RMS Output Noise (% of OUT ) T A =25 o C, Hz f KHz % Thermal Shutdown Junction Temperature 160 o C Thermal Shutdown Hysteresis 16 o C Thermal Resistance θ JC TO (1)/TO (2)/TO (3) 22 SOT SOT o C/ W 9

10 Electrical Characteristics (Continued) -1.8 Electrical Characteristics Operating Conditions: IN, I OUT =ma, T J =25 o C, unless otherwise specified. (P maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20 o C to 125 o C. Parameter Symbol Conditions Min Typ Max Unit Output oltage OUT 3.8 IN Line Regulation RLINE 1.5 IN - OUT m Load Regulation RLOAD 2 15 m SOT Dropout oltage DROP OUT =1%, I OUT =0.8A TO-252-2(1)/(2)/(3) 1.4 SOT Current Limit I LIMIT A Quiescent Current I Q I OUT =0 4 6 ma Ripple Rejection PSRR f=120hz, C OUT =22µF ( IN - OUT )=3, I OUT =300mA 70 db Temperature Stability 0.5 % RMS Output Noise (% of OUT ) T A =25 o C, Hz f KHz % Thermal Shutdown Junction Temperature 160 o C Thermal Shutdown Hysteresis 16 o C Thermal Resistance θ JC TO (1)/TO (2)/TO (3) 22 SOT SOT o C/ W

11 Electrical Characteristics (Continued) -2.5 Electrical Characteristics Operating Conditions: IN, I OUT =ma, T J =25 o C, unless otherwise specified. (P maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20 o C to 125 o C. Parameter Symbol Conditions Min Typ Max Unit Output oltage OUT 4.5 IN Line Regulation RLINE 1.5 IN - OUT m Load Regulation RLOAD 2 15 m SOT Dropout oltage DROP OUT =1%, I OUT =0.8A TO-252-2(1)/(2)/(3) 1.4 SOT Current Limit I LIMIT A Quiescent Current I Q I OUT =0 4 6 ma Ripple Rejection PSRR f=120hz, C OUT =22µF ( IN - OUT )=3, I OUT =300mA 70 db Temperature Stability 0.5 % RMS Output Noise (% of OUT ) T A =25 o C, Hz f KHz % Thermal Shutdown Junction Temperature 160 o C Thermal Shutdown Hysteresis 16 o C Thermal Resistance θ JC TO (1)/TO (2)/TO (3) 22 SOT SOT o C/W 11

12 Electrical Characteristics (Continued) -3.3 Electrical Characteristics Operating Conditions: IN, I OUT =ma, T J =25 o C, unless otherwise specified. (P maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20 o C to 125 o C. Parameter Symbol Conditions Min Typ Max Unit Output oltage OUT 5.3 IN Line Regulation RLINE 1.5 IN - OUT m Load Regulation RLOAD 2 15 m SOT Dropout oltage DROP OUT =1%, I OUT =0.8A TO-252-2(1)/(2)/(3) 1.4 SOT Current Limit I LIMIT A Quiescent Current I Q I OUT =0 4 6 ma Ripple Rejection PSRR f=120hz, C OUT =22µF ( IN - OUT )=3, I OUT =300mA 70 db Temperature Stability 0.5 % RMS Output Noise (% of OUT ) T A =25 o C, Hz f KHz % Thermal Shutdown Junction Temperature 160 o C Thermal Shutdown Hysteresis 16 o C Thermal Resistance θ JC TO (1)/TO (2)/TO (3) 22 SOT SOT o C/W 12

13 Electrical Characteristics (Continued) -5.0 Electrical Characteristics Operating Conditions: IN, I OUT =ma, T J =25 o C, unless otherwise specified. (P maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20 o C to 125 o C. Parameter Symbol Conditions Min Typ Max Unit Output oltage OUT 6.5 IN =1%, I =0.8A Line Regulation RLINE 1.5 IN - OUT m Load Regulation RLOAD 2 15 m SOT Dropout oltage DROP OUT OUT TO-252-2(1)/(2)/(3) 1.4 SOT Current Limit I LIMIT A Quiescent Current I Q I OUT =0 4 6 ma Ripple Rejection PSRR f=120hz, C OUT =22µF ( IN - OUT )=3, I OUT =300mA 70 db Temperature Stability 0.5 % RMS Output Noise (% of OUT ) T A =25 o C, Hz f KHz % Thermal Shutdown Junction Temperature 160 o C Thermal Shutdown Hysteresis 16 o C Thermal Resistance θ JC TO (1)/TO (2)/TO (3) 22 SOT SOT o C/W 13

14 Typical Performance Characteristics Line Regulation(m) IN =4.5~ I OUT =ma Load Regulation(m) IN =4.5 I OUT =ma-800ma Junction Temperature( o C) Junction Temperature( o C) Figure 4. Line Regulation vs. Junction Temperature Figure 5. Load Regulation vs. Junction Temperature Reference oltage () Reference oltage -ADJ IN =4.5 I OUT =ma Output oltage () IN =4.5 I OUT =ma Junction Temperature ( o C) Junction Temperature ( o C) Figure 6. Reference oltage vs. Junction Temperature Figure 7. Output oltage vs. Junction Temperature 14

15 Typical Performance Characteristics (Continued) 3 0 Minimum Load Current(mA) Minimum Load Current -ADJ IN =4.5 Adjust Pin Current(µA) ADJ IN = Junction Temperature( o C) Junction Temperature( o C) Figure 8. Minimum Load Current vs. Junction Temperature Figure 9. Adjust Pin Current vs. Junction Temperature 1.4 Dropout oltage () IN = o C -25 o C 25 o C 0 o C SOT-223 Power Dissipation (W) AZ SOT-223 No Heatsink Output Current (ma) Case Temperature ( o C) Figure. Dropout oltage vs. Output Current Figure 11. Power Dissipation vs. Case Temperature 15

16 Typical Performance Characteristics (Continued) OUT (0.1/Div) OUT (50m/Div) IN (0.5/Div) I OUT (0.3A/Div) ma Time (20µs/Div) Time (µs/div) Figure 12. Line Transient Response Figure 13. Load Transient Response PSRR (db) Current Limit (A) IN =4.5 No OUT = OUT (nom)x98% k k 0k Frequency (Hz) Junction Temperature( o C) Figure 14. PSRR vs. Frequency Figure 15. Current Limit vs. Junction Temperature 16

17 Typical Performance Characteristics (Continued) Dropout oltage () mA 400mA 600mA 800mA SOT Junction Temperature ( o C) Figure 16. Dropout oltage vs. Junction Temperature 17

18 Typical Applications IN =11 -ADJ 9 µf IN OUT µF ADJ R1 124Ω R2 768Ω OUT = REF * ( 1+R2/R1) + I ADJ * R2 IN =5.3 IN -3.3 OUT + + µf 22µF GND 3.3 Figure 17. Typical Applications of 18

19 Mechanical Dimensions SOT-223 Unit: mm(inch) 6.300(0.248) 6.700(0.264) 2.900(0.114) 3.0(0.122) 0.900(0.035) MIN 0.250(0.0) 0.350(0.014) 6.700(0.264) 7.300(0.287) 3.300(0.130) 3.700(0.146) 0.250(0.0) 1.750(0.069) TYP 2.300(0.091) 0.6(0.024) TYP 4.500(0.177) 0.8(0.032) (0.185) 0.020(0.001) 0.0(0.004) 1.500(0.059) 1.700(0.067) 1.520(0.060) 1.800(0.071) 19

20 Mechanical Dimensions (Continued) TO (1) Unit: mm(inch) 1.350(0.053) 1.650(0.065) 6.450(0.254) 6.650(0.262) 5.200(0.205) 5.400(0.213) 0.450(0.018) 0.580(0.023) 2.200(0.087) 2.400(0.094) 4.300(0.169) 5.400(0.213) 9.500(0.374) 9.900(0.390) 0.600(0.024) 0.900(0.035) 2.300TYP 4.500(0.177) 4.700(0.185) 0.000(0.000) 0.127(0.005) (0.028) 0.900(0.035) 0.500(0.020) 0.700(0.028) 1.400(0.055) 1.780(0.070) (0.018) 0.580(0.023) 5.450(0.215) 6.250(0.246) 2.550(0.0) 2.900(0.114) 3.800REF(0.150REF) 4.800(0.189) 6.500(0.256) 20

21 Mechanical Dimensions (Continued) TO (2) Unit: mm(inch) 0.900(0.035) 1.250(0.049) 6.500(0.256) 6.700(0.264) 5.230(0.206) 5.430(0.214) 1.2± REF 0.470(0.019) 0.600(0.024) 6.000(0.236) 6.200(0.244) 1.80REF 0.600(0.024) 1.000(0.039) 1.150(0.045) 1.500(0.059) 9.800(0.386).40(0.409) REF (0.035) 1.0(0.043) (0.055) 1.700(0.067) (0.087) 2.380(0.094) 5.250REF 0.770(0.030) 1.0(0.433) 2.28BSC 0.770(0.030) 0.890(0.035) 21

22 Mechanical Dimensions (Continued) TO (3) Unit: mm(inch) 0.900(0.035) 1.250(0.049) 6.500(0.256) 6.700(0.264) 5.130(0.202) 5.460(0.215) 1.29± REF 0.470(0.019) 0.600(0.024) 6.000(0.236) 6.200(0.244) 1.800REF 0.150(0.006) 0.750(0.030) 0.600(0.024) 1.000(0.039) 5.250REF 9.800(0.386).40(0.409) (0.035) 1.0(0.043) 0.720(0.028) 0.900(0.035) 2.286(0.090) BSC (0.028) 0.850(0.033) 2.900REF 1.400(0.055) 1.700(0.067) (0.087) 2.380(0.094) 22

23 Mechanical Dimensions (Continued) SOT-89 Unit: mm(inch) 1.550(0.061)REF 4.400(0.173) 4.600(0.181) 1.030(0.041)REF 1.400(0.055) 1.600(0.063) (0.156) 4.250(0.167) 2.300(0.091) 2.600(0.2) 2.060(0.081)REF 0.900(0.035) 1.0(0.043) 0.320(0.013) 0.520(0.020) 3.000(0.118) TYP 0.320(0.013) 0.520(0.020) 0.480(0.019) (0.014) 0.450(0.018) 1.500(0.059) 1.800(0.071) 0.320(0.013)REF 3 2.2(0.087)REF 1.620(0.064)REF R0.150(0.006) 23

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24 IMPORTANT NOTICE reserves the right to make changes without further notice to any products or specifications herein. does not assume any responsibility for use of any its products for any particular purpose, nor does assume any liability arising out of the application or use of any its products or circuits. does not convey any license under its patent rights or other rights nor the rights of others. MAIN SITE BCD - Headquarters Semiconductor Manufacturing Limited - Wafer BCD FabSemiconductor Manufacturing Limited BCD - Wafer Semiconductor Fab Manufacturing Limited Shanghai - IC Design SIM-BCD Group Semiconductor Manufacturing Co., Ltd. No. Shanghai 1600, Zi SIM-BCD Xing Road, Semiconductor Shanghai ZiZhu Manufacturing Science-based Limited Industrial Park, , China 800 Yi Advanced Shan Road, Analog Shanghai Circuits , (Shanghai) China Corporation Tel: 800, , Yi Shan Road, Shanghai Fax: , China Tel: F, Zone B, 900, 1491, Yi Fax: Shan Road, Shanghai , China Tel: , Fax: Tel: , Fax: REGIONAL SALES OFFICE REGIONAL Shenzhen OfficeSALES OFFICE Shenzhen Shanghai SIM-BCD Office Semiconductor Manufacturing Co., Ltd., Shenzhen Office Shanghai Unit A Room SIM-BCD 1203, Skyworth Semiconductor Bldg., Gaoxin Manufacturing Ave.1.S., Nanshan Co., Ltd. District, Shenzhen Shenzhen, Office Advanced China Analog Circuits (Shanghai) Corporation Shenzhen Office Taiwan Office BCD Taiwan Semiconductor Office (Taiwan) Company Limited 4F, 298-1, BCD Rui Semiconductor Guang Road, (Taiwan) Nei-Hu District, Company Taipei, Limited Taiwan 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, USA Office USA BCD Office Semiconductor Corp. BCD Semiconductor Huntwood Ave. Corporation Hayward, CA 94544, Huntwood USA Ave. Hayward, Room Tel: E, 5F, Noble 7951 Center, No.06, 3rd Fuzhong Road, Futian District, Shenzhen , China Tel: Taiwan 2808 CA Tel : 94544, U.S.A Tel: Fax: Fax: Fax: Tel: Fax: Tel Fax: : Fax:

600mA LOW DROPOUT LINEAR REGULATOR 600mA ULDO REGULATOR WITH ENABLE. Features. Applications

600mA LOW DROPOUT LINEAR REGULATOR 600mA ULDO REGULATOR WITH ENABLE. Features. Applications General Description The is a series of ultra low dropout regulators optimized for low voltage applications where transient response and minimum input voltage are critical. The provides current limit and