600mA CMOS LDO REGULATOR WITH ENABLE. Features
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1 General Description The is CMOS process low dropout linear regulator with enable function, the regulator delivers a guaranteed 600mA (min.) continuous load current. The provides 1.2, 1.8, 2.5, 2.6, 2.8 and 3.3 regulated output and 0.8 to 5 adjustable output, and provides excellent output accuracy ±1.5%, also provides an excellent load regulation, line regulation and excellent load transient performance due to very fast loop response. The has built-in auto discharge function. The regulator features low power consumption, and provides SOT-23-5, SOT-89-5, and SOIC-8 packages. Features Output oltage Accuracy: ±1.5% Output Current: 600mA (Min.) Foldback Short Current Protection: 50mA Enable Function to Turn ON/OFF Low Dropout oltage (3.3): 250m =600mA Excellent Load Regulation: 0.2%/A (Typ.) Excellent Line Regulation: 0.02%/ (Typ.) Low Quiescent Current: 55μA (Typ.) Low Standby Current: 0.01μA (Typ.) Low Output Noise: 50μ RMS PSRR: 100Hz -65dB, 1kHz -65dB OTSD Protection Stable with 1.0μF Flexible Cap: Ceramic, Tantalum and Aluminum Electrolytic Operation Temperature Range: -40 C to 85 C ESD: MM 400, HBM 4000 Applications Laptop Computer Portable DD LCD Monitor SOT-23-5 SOT-89-5 SOIC-8 (Option 1) SOIC-8 (Option 2) Figure 1. Package Types of 1
2 Pin Configuration K Package SOT-23-5 M Package SOIC-8 R5 R5/R5A Package SOT-89-5 OUT R5A IN EN GND NC Figure 2. Pin Configuration of (Top iew) Pin Descriptions PIN No. SOT-23-5 SOT-89-5 SOIC-8 Name IN Input oltage 2 2 6, 7 GND GND 3 3 (R5) 1 (R5A) 4 ADJ/NC 1 (R5) 3 (R5A) Descriptions 5 EN Chip Enable, H normal work, L shutdown output 2, 3, 4 NC No Connection OUT Output oltage Adjust Output for ADJ version/no Connection for Fixed ersion 2
3 Functional Block Diagram EN 3(1){5}[3] Shutdown Logic 4(4){8}[1] IN Thermal Shutdown Foldback Current Limit 3MΩ 5(5){1}[5] OUT REF GND 2(2){6,7}[2] A (B){C}[D] A: SOT-89-5 (R5) B: SOT-89-5 (R5A) C: SOIC-8 D: SOT-23-5 Figure 3. Functional Block Diagram of for Fixed ersion EN 3 Shutdown Logic 1 IN Thermal Shutdown Foldback Current Limit 3mΩ 5 OUT 4 ADJ/NC GND 2 REF SOT-23-5 Figure 4. Functional Block Diagram of for Adjustable ersion 3
4 Ordering Information - Circuit Type Package K: SOT-23-5 M: SOIC-8 R5/R5A: SOT-89-5 G1: Green Blank: Tube TR: Tape & Reel 1.2: Fixed Output : Fixed Output : Fixed Output : Fixed Output : Fixed Output : Fixed Output 3.3 ADJ: Adjustable Output Package Temperature Range SOT to 85 C SOIC-8-40 to 85 C SOT to 85 C SOT to 85 C Condition Part Number Marking ID Packing Type 1.2 K-1.2TRG1 G3L Tape & Reel 1.8 K-1.8TRG1 G3M Tape & Reel 2.5 K-2.5TRG1 G3N Tape & Reel 2.6 K-2.6TRG1 G5N Tape & Reel 2.8 K-2.8TRG1 G3Q Tape & Reel 3.3 K-3.3TRG1 G3P Tape & Reel ADJ K-ADJTRG1 G3T Tape & Reel M-1.2G1 2112M-1.2G1 Tube M-1.2TRG1 2112M-1.2G1 Tape & Reel M-1.8G1 2112M-1.8G1 Tube M-1.8TRG1 2112M-1.8G1 Tape & Reel M-2.5G1 2112M-2.5G1 Tube M-2.5TRG1 2112M-2.5G1 Tape & Reel M-2.6G1 2112M-2.6G1 Tube M-2.6TRG1 2112M-2.6G1 Tape & Reel M-3.3G1 2112M-3.3G1 Tube M-3.3TRG1 2112M-3.3G1 Tape & Reel 1.2(R5) R5-1.2TRG1 G37D Tape & Reel 1.8(R5) R5-1.8TRG1 G37E Tape & Reel 2.5(R5) R5-2.5TRG1 G37F Tape & Reel 2.6(R5) R5-2.6TRG1 G13F Tape & Reel 3.3(R5) R5-3.3TRG1 G37G Tape & Reel 1.2(R5A) R5A-1.2TRG1 G33C Tape & Reel 1.8(R5A) R5A-1.8TRG1 G33E Tape & Reel 2.5(R5A) R5A-2.5TRG1 G28G Tape & Reel 2.6(R5A) R5A-2.6TRG1 G13E Tape & Reel 3.3(R5A) R5A-3.3TRG1 G28H Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and Green. 4
5 Absolute Maximum Ratings (Note 1) Parameter Symbol alue Unit Power Supply oltage CC 6.5 Operating Junction Temperature Range T J 150 ºC Storage temperature Range T STG -65 to 150 ºC Lead Temperature (Soldering, 10 Seconds) T LEAD 260 ºC SOT Thermal Resistance (Junction to Ambient)(No Heatsink) θ JA SOIC C /W SOT ESD (Machine Model) 400 ESD (Human Body Model) 4000 Note 1: Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings for extended periods may affect device reliability. Recommended Operating Conditions Parameter Symbol Min Max Unit Supply oltage Ambient Operation Temperature Range C 5
6 Electrical Characteristics -1.2 Electrical Characteristic (Note 2) =2.5, C IN =1.0μF (Ceramic), C OUT =1.0μF (Ceramic), Typical =25 C, unless otherwise specified (Note 3). Parameter Symbol Test Conditions Min Typ Max Unit Output oltage =2.5, 1mA 30mA Maximum Output Current Load Regulation Line Regulation (MAX) OUT / )/ OUT / )/ =2.5, =1.182 to *98.5% 1.2 *101.5% 600 ma =2.5, 1mA 600mA %/A 2.5 6, =30mA %/ =10mA Dropout oltage DROP =300mA m =600mA Quiescent Current I Q =2.5, =0mA μa Standby Current I STD =2.5, EN in OFF mode μa Power Supply Rejection Ratio Output oltage Temperature Coefficient PSRR Ripple 0.5p-p =2.5, =100mA OUT / )/ T =30mA =-40 C to 85 C f=100hz 65 f=1khz 65 db ±100 ppm/ C Short Current Limit I SHORT =0 50 ma RMS Output Noise NOISE No Load, 10Hz f 100kHz 50 μ RMS EN High oltage IH Enable logic high, regulator on EN Low oltage IL Enable logic low, regulator off Start-up Time t S No Load 20 μs EN Pull Down Resistor R PD 3.0 MΩ Discharge Resistor R DCHG Set EN pin at Low 60 Ω Temperature T OTSD 160 Hysteresis T HYOTSD 25 C SOT Thermal Resistance θ JC SOIC-8 75 C/W SOT Note 2: To prevent the Short Circuit Current protection feature from being prematurely activated, the input voltage must be applied before a current source load is applied. Note 3: Production testing at =25 C. Over temperature specifications guaranteed by design only. 6
7 Electrical Characteristics (Continued) -1.8 Electrical Characteristic (Note 2) =2.8, C IN =1.0μF (Ceramic), C OUT =1.0μF (Ceramic), Typical =25 C, unless otherwise specified (Note 3). Parameter Symbol Test Conditions Min Typ Max Unit Output oltage =2.8, 1mA 30mA Maximum Output Current Load Regulation Line Regulation (MAX) OUT / )/ OUT / )/ =2.8, =1.773 to =1.8, = +1, 1mA 600mA *98.5% 1.8 *101.5% 600 ma %/A 2.8 6, =30mA %/ =10mA Dropout oltage DROP =300mA m =600mA Quiescent Current I Q =2.8, =0mA μa Standby Current I STD =2.8, EN in OFF mode μa Power Supply Rejection Ratio Output oltage Temperature Coefficient PSRR Ripple 0.5p-p =2.8, =100mA OUT / )/ T =30mA =-40 C to 85 C f=100hz 65 f=1khz 65 db ±100 ppm/ C Short Current Limit I SHORT =0 50 ma RMS Output Noise NOISE No Load, 10Hz f 100kHz 50 μ RMS EN High oltage IH Enable logic high, regulator on EN Low oltage IL Enable logic low, regulator off Start-up Time t S No Load 20 μs EN Pull Down Resistor R PD 3.0 MΩ Discharge Resistor R DCHG Set EN pin at Low 60 Ω Temperature T OTSD 160 Hysteresis T HYOTSD 25 C SOT Thermal Resistance θ JC SOIC-8 75 C/W SOT Note 2: To prevent the Short Circuit Current protection feature from being prematurely activated, the input voltage must be applied before a current source load is applied. Note 3: Production testing at =25 C. Over temperature specifications guaranteed by design only. 7
8 Electrical Characteristics (Continued) -2.5 Electrical Characteristic (Note 2) =3.5, C IN =1.0μF (Ceramic), C OUT =1.0μF (Ceramic), Typical =25 C, unless otherwise specified (Note 3). Parameter Symbol Test Conditions Min Typ Max Unit Output oltage =3.5, 1mA 30mA Maximum Output Current Load Regulation Line Regulation (MAX) OUT / )/ OUT / )/ =3.5, =2.463 to =2.5, = +1, 1mA 600mA *98.5% 2.5 *101.5% 600 ma %/A 3.5 6, =30mA %/ =10mA 5 8 Dropout oltage DROP =300mA m =600mA Quiescent Current I Q =3.5, =0mA μa Standby Current I STD =3.5, EN in OFF mode μa Power Supply Rejection Ratio Output oltage Temperature Coefficient PSRR Ripple 0.5p-p =3.5, =100mA OUT / )/ T =30mA =-40 C to 85 C f=100hz 65 f=1khz 65 db ±100 ppm/ C Short Current Limit I SHORT =0 50 ma RMS Output Noise NOISE No Load, 10Hz f 100kHz 50 μ RMS EN High oltage IH Enable logic high, regulator on EN Low oltage IL Enable logic low, regulator off Start-up Time t S No Load 20 μs EN Pull Down Resistor R PD 3.0 MΩ Discharge Resistor R DCHG Set EN pin at Low 60 Ω Temperature T OTSD 160 Hysteresis T HYOTSD 25 C SOT Thermal Resistance θ JC SOIC-8 75 C/W SOT Note 2: To prevent the Short Circuit Current protection feature from being prematurely activated, the input voltage must be applied before a current source load is applied. Note 3: Production testing at =25 C. Over temperature specifications guaranteed by design only. 8
9 Electrical Characteristics (Continued) -2.6 Electrical Characteristic (Note 2) =3.6, C IN =1.0μF (Ceramic), C OUT =1.0μF (Ceramic), Typical =25 C, unless otherwise specified (Note 3). Parameter Symbol Test Conditions Min Typ Max Unit Output oltage =3.6, 1mA 30mA Maximum Output Current Load Regulation Line Regulation (MAX) OUT / )/ OUT / )/ =3.6, =2.561 to =2.6, = +1, 1mA 600mA *98.5% 2.6 *101.5% 600 ma %/A 3.6 6, =30mA %/ =10mA 5 8 Dropout oltage DROP =300mA m =600mA Quiescent Current I Q =3.6, =0mA μa Standby Current I STD =3.6, EN in OFF mode μa Power Supply Rejection Ratio Output oltage Temperature Coefficient PSRR Ripple 0.5p-p =3.6, =100mA ( / )/ T =30mA =-40 C to 85 C f=100hz 65 f=1khz 65 db ±100 ppm/ C Short Current Limit I SHORT =0 50 ma RMS Output Noise NOISE No Load, 10Hz f 100kHz 50 μ RMS EN High oltage IH Enable logic high, regulator on EN Low oltage IL Enable logic low, regulator off Start-up Time t S No Load 20 μs EN Pull Down Resistor R PD 3.0 MΩ Discharge Resistor R DCHG Set EN pin at Low 60 Ω Temperature T OTSD 160 Hysteresis T HYOTSD 25 C SOT Thermal Resistance θ JC SOIC-8 75 C/W SOT Note 2: To prevent the Short Circuit Current protection feature from being prematurely activated, the input voltage must be applied before a current source load is applied. Note 3: Production testing at =25 C. Over temperature specifications guaranteed by design only. 9
10 Electrical Characteristics (Continued) -2.8 Electrical Characteristic (Note 2) =3.8, C IN =1.0μF (Ceramic), C OUT =1.0μF (Ceramic), Typical =25 C, unless otherwise specified (Note 3). Parameter Symbol Test Conditions Min Typ Max Unit Output oltage =3.8, 1mA 30mA Maximum Output Current Load Regulation Line Regulation (MAX) OUT / )/ OUT / )/ =3.8, =2.758 to =2.8, = +1, 1mA 600mA *98.5% 2.8 *101.5% 600 ma %/A 3.8 6, =30mA %/ =10mA 5 8 Dropout oltage DROP =300mA m =600mA Quiescent Current I Q =3.8, =0mA μa Standby Current I STD =3.8, EN in OFF mode μa Power Supply Rejection Ratio Output oltage Temperature Coefficient PSRR Ripple 0.5p-p =3.8, =100mA OUT / )/ T =30mA =-40 C to 85 C f=100hz 65 f=1khz 65 db ±100 ppm/ C Short Current Limit I SHORT =0 50 ma RMS Output Noise NOISE No Load, 10Hz f 100kHz 50 μ RMS EN High oltage IH Enable logic high, regulator on EN Low oltage IL Enable logic low, regulator off Start-up Time t S No Load 20 μs EN Pull Down Resistor R PD 3.0 MΩ Discharge Resistor R DCHG Set EN pin at Low 60 Ω Temperature T OTSD 160 Hysteresis T HYOTSD 25 C SOT Thermal Resistance θ JC SOIC-8 75 C/W SOT Note 2: To prevent the Short Circuit Current protection feature from being prematurely activated, the input voltage must be applied before a current source load is applied. Note 3: Production testing at =25 C. Over temperature specifications guaranteed by design only. 10
11 Electrical Characteristics (Continued) -3.3 Electrical Characteristic (Note 2) =4.3, C IN =1.0μF (Ceramic), C OUT =1.0μF (Ceramic), Typical =25 C, unless otherwise specified (Note 3). Parameter Symbol Test Conditions Min Typ Max Unit Output oltage =4.3, 1mA 30mA Maximum Output Current Load Regulation Line Regulation (MAX) OUT / )/ OUT / )/ =4.3, =3.251 to *98.5% 3.3 *101.5% 600 ma =4.3, 1mA 600mA %/A 4.3 6, =30mA %/ =10mA 5 8 Dropout oltage DROP =300mA m =600mA Quiescent Current I Q =4.3, =0mA μa Standby Current I STD =4.3, EN in OFF mode μa Power Supply Rejection Ratio Output oltage Temperature Coefficient PSRR Ripple 0.5p-p =4.3, =100mA OUT / )/ T =30mA =-40 C to 85 C f=100hz 65 f=1khz 65 db ±100 ppm/ C Short Current Limit I SHORT =0 50 ma RMS Output Noise NOISE No Load, 10Hz f 100kHz 50 μ RMS EN High oltage IH Enable logic high, regulator on EN Low oltage IL Enable logic low, regulator off Start-up Time t S No Load 20 μs EN Pull Down Resistor R PD 3.0 MΩ Discharge Resistor R DCHG Set EN pin at Low 60 Ω Temperature T OTSD 160 Hysteresis T HYOTSD 25 C SOT Thermal Resistance θ JC SOIC-8 75 C/W SOT Note 2: To prevent the Short Circuit Current protection feature from being prematurely activated, the input voltage must be applied before a current source load is applied. Note 3: Production testing at =25 C. Over temperature specifications guaranteed by design only. 11
12 Electrical Characteristics (Continued) -ADJ Electrical Characteristic (Note 2) =2.5, C IN =1.0μF (Ceramic), C OUT =1.0μF (Ceramic), Typical =25 C, unless otherwise specified (Note 3). Parameter Symbol Conditions Min Typ Max Unit Reference oltage REF =2.5, 1mA 30mA Maximum Output Current Load Regulation Line Regulation REF 98.5% 0.8 REF 101.5% (Max) =2.5, REF =0.788 to ma OUT / )/ OUT / )/ =2.5, 1mA 600mA %/A 2.5 6, =30mA %/ Quiescent Current I Q =2.5, =0mA μa Standby Current I STD =2.5, EN in OFF mode μa Power Supply Rejection Ratio PSRR Ripple 0.5p-p =2.5, =100mA Output oltage Temperature Coefficient OUT/ )/ T =30mA =-40 C to 85 C f=100hz 65 f=1khz 65 db ±100 ppm/ C Short Current Limit I SHORT =0 50 ma RMS Output Noise NOISE No Load, 10Hz f 100kHz 50 μ RMS EN High oltage IH Enable logic high, regulator on EN Low oltage IL Enable logic low, regulator off Start-up Time t S No Load 20 μs EN Pull Down Resistor R PD 3.0 MΩ OUT Resistor Thermal Temperature Thermal Hysteresis Discharge Shutdown Shutdown R DCHG Set EN pin at Low 60 Ω T OTSD 160 T HYOTSD 25 Thermal Resistance θ JC SOT C /W Note 2: To prevent the Short Circuit Current protection feature from being prematurely activated, the input voltage must be applied before a current source load is applied. Note 3: Production testing at =25 C. Over temperature specifications guaranteed by design only. C 12
13 Typical Performance Characteristics Output oltage () NO Load =-40 o C =25 o C =85 o C =1.2 Output oltage () No Load =-40 o C =25 o C =85 o C = Input oltage () Input oltage () Figure 5. Output oltage vs. Input oltage Figure 6. Output oltage vs. Input oltage 70 Quiescent Current (μa) =2.5 No Load Quiescent Current (μa) No Load =-40 O C =25 O C =85 O C Temperature ( o C) Input oltage () Figure 7. Quiescent Current vs. Temperature Figure 8. Quiescent Current vs. Input oltage 13
14 Typical Performance Characteristics (Continued) =2.5 C IN =1μF C OUT =1μF =4.3 C IN =1μF C OUT =1μF Output oltage () =10mA =100mA =300mA =600mA Output oltage () =10mA =100mA =300mA =600mA Temperature ( o C) Temperature( o C) Figure 9. Output oltage vs. Temperature Figure 10. Output oltage vs. Temperature Output oltage () = -40 o C =25 o C =85 o C Output oltage () =4.3 =-40 o C = 25 o C = 85 o C = Output Current (A) Output Current (A) Figure 11. Output oltage vs. Output Current Figure 12. Output oltage vs. Output Current 14
15 Typical Performance Characteristics (Continued) Output oltage () =2 =2.5 =5 =5.5 =6 =25 o C C IN =1μF C OUT =1μF Output oltage () =4.0 =4.3 =5.0 =5.5 =6.0 =25 o C C IN =1μF C OUT =1μF Output Current (A) Output Current (A) Figure 13. Output oltage vs. Output Current Figure 14. Output oltage vs. Output Current Dropout oltage (m) =-40 o C = 25 o C = 85 o C =3.3 Ground Current (μa) =-40 o C = 25 o C = 85 o C = Output Current (A) Output Current (A) Figure 15. Dropout oltage vs. Output Current Figure 16. Ground Current vs. Output Current 15
16 Typical Performance Characteristics (Continued) =2.5, C IN =1μF, C OUT =1μF PSRR (db) =10mA =100mA =300mA =1.2 =2.5 Ripple=0.5 CH1: 10m/div CH2: 200mA/div 600mA 0mA k 10k 100k Frequency (Hz) Figure 17. PSRR vs. Frequency Figure 18. Load Transient IN (2/div) IN (2/div) EN (2/div) EN (2/div) OUT (2/div) OUT (2/div) 20μs/div 200μs/div Figure 19. Enable On Figure 20. Enable Off 16
17 Typical Application (Note 4) Note 4: It is recommended to use X7R or X5R dielectric capacitor if 1.0μF ceramic capacitor is selected as input/output capacitors. Figure 21. Typical Application 17
18 Mechanical Dimensions SOT-23-5 Unit: mm(inch) 2.820(0.111) 3.100(0.122) 0.100(0.004) 0.200(0.008) 2.650(0.104) 3.000(0.118) 1.500(0.059) 1.700(0.067) 0.300(0.012) 0.600(0.024) 0.200(0.008) 0.700(0.028) REF 0.950(0.037) TYP 1.800(0.071) 2.000(0.079) 0.300(0.012) 0.500(0.020) (0.057) MAX 0.000(0.000) 0.150(0.006) 0.900(0.035) 1.300(0.051) 18
19 Mechanical Dimensions (Continued) SOT-89-5 Unit: mm(inch) 4.400(0.173) 4.600(0.181) 1.400(0.055) 1.600(0.063) 3.950(0.156) 4.250(0.167) 2.300(0.091) 2.600(0.102) 2.060(0.081)REF (0.013) 0.320(0.013) 0.540(0.021) Option (0.021) 3.000(0.118) TYP (0.014) 0.450(0.018) R0.150(0.006) 10 Option 1 Option (0.035) 1.100(0.043) 1.550(0.061)REF 1.030(0.041)REF (0.013)REF R 0.200(0.008) 0.650(0.026) 0.950(0.037) 2.210(0.087)REF 1.620(0.064)REF 2.630(0.104) 2.930(0.115) 0.900(0.035) 1.100(0.043) 0.650(0.026) 0.950(0.037) 0.480(0.019) TYP 1.500(0.059) 1.800(0.071) 0.500(0.020) 0.620(0.024) 1.620(0.064) 1.830(0.072) 19
20 Mechanical Dimensions (Continued) SOIC-8 Unit: mm(inch) (0.185) 5.100(0. 201) 1.350(0.053) 1.750(0.069) 0.320(0.013) TYP (0. 039) TYP Option (0. 050) TYP 0.100(0. 004) 0.300(0. 012) R0.150(0.006) 3.800(0.150) 4.000(0.157) 0.675(0.027) 0.725(0.029) D 0 8 D 20: (0.228) 6.200(0.244) 8 Option (0. 012) 0.510(0. 020) 0.150(0. 006) 0.250(0. 010) 0.900(0. 035) TYP (0. 017) 0.800(0. 031) R0.150(0.006) Option (0. 014) TYP Note: Eject hole, oriented hole and mold mark is optional. 20
21 IMPORTANT NOTICE reserves the right to make changes without further notice to any products or specifications herein. does not assume any responsibility for use of any its products for any IMPORTANT NOTICE particular purpose, nor does assume any liability arising out of the application or use of any its products or circuits. does not convey any license under its patent rights or reserves the right to make changes without further notice to any products or specifications herein. does not assume any responsibility for use of any its products for any particular purpose, nor does assume any liability arising out of the application or use other rights nor the rights of others. MAIN SITE - of Headquarters any its products or circuits. BCD Semiconductor Manufacturing - Wafer Limited Fab does not convey any license under its patent rights or BCD other (Shanghai) rights Micro-electronics nor the rights Limited of others. Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, , P. R.C. 800 Yishan Road, Shanghai , China Tel: , Fax: Tel: , Fax: MAIN SITE BCD REGIONAL - Headquarters Semiconductor SALES Manufacturing OFFICE Limited - Wafer BCD FabSemiconductor Manufacturing Limited Shenzhen BCD - Wafer Semiconductor Fab Office Manufacturing Limited Taiwan Shanghai Office - IC Design SIM-BCD (Taipei) Group Semiconductor Manufacturing Co., Ltd. Shanghai No. 1600, Zi SIM-BCD Xing Road, Semiconductor Shanghai ZiZhu Manufacturing Science-based Co., Limited Industrial Ltd., Shenzhen Park, , Office China BCD 800 Semiconductor Yi Advanced Shan Road, Analog (Taiwan) Shanghai Circuits Company , (Shanghai) China Limited Corporation Unit Tel: 800, , A Yi Room Shan Road, 1203,Skyworth Shanghai Fax: Bldg., , Gaoxin ChinaAve.1.S., Nanshan District 3F, No.17, Tel: F, Lane Zone 171, B, 900, Sec. 1491, 2, Yi Fax: Jiu-Zong Shan Road, Rd., Shanghai Nei-Hu 0008Dist., , Taipei(114), China Taiwan, R.O.C Shenzhen Tel: , 1491, China Fax: Tel: Tel: , Fax: Tel: REGIONAL , SALES OFFICE Fax: Fax: / REGIONAL Shenzhen OfficeSALES OFFICE Taiwan Office USA Office Taiwan Shenzhen Shanghai Office SIM-BCD Office (Hsinchu) Semiconductor Manufacturing Co., Ltd., Shenzhen Office BCD Shanghai Unit A Semiconductor Room SIM-BCD 1203, Skyworth Semiconductor (Taiwan) Bldg., Company Gaoxin Manufacturing Limited Ave.1.S., Nanshan Co., Ltd. District, Shenzhen Shenzhen, Office 8F, Advanced China No.176, Analog Sec. 2, Gong-Dao Circuits (Shanghai) 5th Road, Corporation East District Shenzhen Office USA BCD Office Taiwan Semiconductor Office (Taiwan) Company Limited Korea OfficeUSA BCD Office Semiconductor Corp. BCD 4F, Semiconductor 298-1, BCD Rui Semiconductor Guang Corp. Road, (Taiwan) Nei-Hu District, Company Taipei, BCD Limited Semiconductor BCD Semiconductor Huntwood Limited Korea Ave. Corporation Hayward, office Taiwan Kato 4F, Road, 298-1, Fremont, Rui Guang CA Road, 94538, Nei-Hu USA District, Room Taipei, , CA Digital-Empire 94544, Huntwood USA Ave. II, 486 Hayward, Sin-dong, HsinChu Room Tel: E, City 5F, Noble 300, Taiwan, 7951 Center, No.1006, R.O.C 3rd Fuzhong Road, Futian District, Shenzhen , China Tel: Tel: Taiwan 2808 Yeongtong-Gu, CA Tel Suwon-city, : 94544, U.S.A Gyeonggi-do, Korea Tel: Fax: , Fax: Fax: Fax: Fax: Tel: Fax: Tel: Tel Fax: : Fax:
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FEATURES DESCRIPTION V IN Range: 2.0V to 6.0V Low Dropout Voltage: 0.22V (Typ) (V OUT = 3.3V, I OUT = 150mA) Output Current: 150mA High Ripple Rejection: 75dB (Typ)(f= 1kHz) Excellent Line Regulation:
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