AME. Low Dropout 1A CMOS Regulator AME8827. General Description. Typical Application. Features. Function Block Diagram. Applications AME8827

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1 General Description The family of positive, CMOS linear regulators and provide low dropout voltage 1A) and excellent PSRR, thus making them ideal for power-saving systems. These rugged devices have both Thermal Shutdown, and Current limit to prevent device failure under the "Worst" of operating conditions. The is stable with an output capacitance of 4.7µF or larger. Typical Application V IN C1 1µF IN EN GND OUT V OUT C2 4.7µF Features Function Block Diagram Low Dropout 1A Guaranteed 1A Drive current Over-Temperature Shutdown Current Limiting protection Excellent PSRR : 60dB(typ.) Factory Pre-set Output Voltages Low Temperature Coefficient Input Voltage Range (2.5V - 5.5V) Output Voltage Range (1.2V - 3.6V) All AME's Green Products Meet RoHS Standards IN Overcurrent Shutdown Thermal Shutdown Bandgap Reference R2 R1 OUT GND Applications Motherboard, Desktop, and Computer Peripherals LCD monitor Handheld Device Data-communication 1

2 Pin Configuration SOT-223 Top View TO Top View -AGTxxx 1. IN 2. GND (TAB) 3. OUT -ACSxxx 1. IN 2. GND (TAB) 3. OUT Die Attach: Conductive Epoxy Die Attach: Conductive Epoxy SOT-223 Top View SOP-8 Top View BGTxxx 1. GND 2. OUT (TAB) 3. IN Die Attach: Non-Conductive Epoxy AHAxxx 1. EN 2. IN 3. OUT 4. NC 5. GND 6. GND 7. GND 8. GND Die Attach: Conductive Epoxy 8 SOP-8/PP Top View BZAxxx 1. EN 2. IN 3. OUT 4. NC 5. GND 6. GND 7. GND 8. GND Die Attach: Conductive Epoxy Note: The area enclosed by dashed line represents Exposed Pad and connect to GND. 2

3 Pin Description Pin Name IN Pin Description Input voltage pin; should be decoupled with 1µF or greater capacitor. GND OUT EN NC Ground connection pin. LDO voltage regulator output pin; should be decoupled with a 4.7µF or greater value low ESR ceramic capacitor. Enable pin. When pulled low, the PMOS pass transistor turns off, current consuming less than 10µA. No connection. 3

4 Ordering Information - x x x xxx Output Voltage Number of Pins Package Type Pin Configuration Pin Configuration Package Type Number of Pins Output Voltage A 1. IN G: SOT-223 T: 3 120: 1.2V (SOT-223) 2. GND C: TO-252 S: 2 125: 1.25V 3. OUT H: SOP A: 8 150: 1.5V Z: SOP/PP 180: 1.8V A 1. IN 250: 2.5V (TO-252-2) 2. GND 300: 3.0V 3. OUT 330: 3.3V B (SOT-223) A (SOP-8) B (SOP-8/PP) 1. GND 2. OUT 3. IN 1. EN 2. IN 3. OUT 4. NC 5. GND 6. GND 7. GND 8. GND 1. EN 2. IN 3. OUT 4. NC 5. GND 6. GND 7. GND 8. GND 4

5 Available Options Part Number -AGT120 -AGT180 -AGT250 -AGT330 -ACS120 -ACS125 -ACS180 -ACS250 -ACS330 -BGT120 -BGT150 -BGT180 -BGT250 -BGT330 -AHA330 -BZA330 Marking* AKyMXX AIyMXX AGyMXX AByMXX BKyMXX BRyMXX BIyMXX BGyMXX BByMXX EKyMXX EJyMXX EIyMXX EGyMXX EByMXX FByMXX GByMXX Output Voltage Package Operating Ambient Temperature Range 1.2V SOT O C to +85 O C 1.8V SOT O C to +85 O C 2.5V SOT O C to +85 O C 3.3V SOT O C to +85 O C 1.2V TO O C to +85 O C 1.25V TO O C to +85 O C 1.8V TO O C to +85 O C 2.5V TO O C to +85 O C 3.3V TO O C to +85 O C 1.2V SOT O C to +85 O C 1.5V SOT O C to +85 O C 1.8V SOT O C to +85 O C 2.5V SOT O C to +85 O C 3.3V SOT O C to +85 O C 3.3V SOP-8-40 O C to +85 O C 3.3V SOP-8/PP -40 O C to +85 O C Note: 1. The first 2 places represent product code. It is assigned by AME such as AK. 2. y is year code and is the last number of a year. Such as the year code of 2008 is A bar on top of first letter represents Green Part such as. 4. The last 3 places MXX represent Marking Code. It contains M as date code in "month", XX as LN code and that is for AME internal use only. Please refer to date code rule section for detail information. 5. Please consult AME sales office or authorized Rep./Distributor for the availability of output voltage and package type. 5

6 Absolute Maximum Ratings Parameter Symbol Maximum Unit Input Voltage V IN -0.3 to 6 V Output Current I OUT P D /(V IN -V OUT ) ma Output Voltage V OUT GND-0.3 to V IN +0.3 V ESD Classification B* Caution: Stress above the listed absolute maximum rating may cause permanent damage to the device. * HBM B:2000V~3999V Recommended Operating Conditions Parameter Symbol Rating Unit Ambient Temperature Range T A -40 to +85 Junction Temperature Range T J -40 to +125 o C Storage Temperature Range T STG -65 to

7 Thermal Information Parameter Package Die Attach Symbol Maximum Unit Thermal Resistance* (Junction to Case) Conductive Epoxy 25 Non-Conductive Epoxy θ JC 31 o C / W Thermal Resistance (Junction to Ambient) SOT-223 Conductive Epoxy 120 Non-Conductive Epoxy θ JA 135 Conductive Epoxy 900 Internal Power Dissipation Non-Conductive Epoxy P D 800 mw Thermal Resistance* (Junction to Case) Thermal Resistance (Junction to Ambient) TO Conductive Epoxy θ JC 5 θ JA 90 o C / W Internal Power Dissipation PD 1200 mw Thermal Resistance** (Junction to Case) Thermal Resistance (Junction to Ambient) SOP-8 Conductive Epoxy θ JC 60 θ JA 150 o C / W Internal Power Dissipation P D 810 mw Thermal Resistance* (Junction to Case) Thermal Resistance (Junction to Ambient) SOP-8/PP Conductive Epoxy θ JC 19 θ JA 84 o C / W Internal Power Dissipation P D 1450 mw Solder Iron (10 Sec)*** 350 o C * Measure θ JC on backside center of tab. ** Measure θ JC on center of molding compound if IC has no tab. *** MIL-STD-202G 210F 7

8 Electrical Specifications V IN = V OUT(NOM) + 0.5V, ( for V OUT < 2V, V IN =2.5V ), V EN =V IN, I OUT =1mA, and C OUT = 4.7µF, C IN =1µF unless otherwise noted. Typical values are at T A = 25 o C. Parameter Symbol Test Condition Min Typ Max Units Input Voltage V IN (Note 1) 5.5 V Output Accuracy V OUT,ACC -2 2 % Dropout Voltage V DROP (Note2) Quiescent Current I Q V IN =5.5V, I OUT =1mA µa Line Regulation VOUT 100% VIN V OUT REG LINE I O =1A, V OUT(NOM) 2.0V I O =1A, 2.0V<V OUT(NOM) 2.5V I O =1A, 2.6V V OUT(NOM) 3.0V I O =1A, V OUT(NOM) >3.1V for V OUT V<V IN <3.5V for 2.0V<V OUT 2.8V V OUT +1V<V IN <V OUT +2V for V OUT >2.8V V OUT +1V<V IN <V OUT +2V mv %/V Load Regulation VOUT 100% VOUT I OUT V IN =V OUT +1V REG LOAD %/ma 10mA< I LOAD <1A Output Current Limit I LIM V OUT =0.9 x V OUT(NOM) A Short Circuit Current Isc V IN =V OUT(NOM) +1V, Vo<0.6V 0.6 A Power Supply Rejection Ratio PSRR C OUT =4.7µF, F=1KHz, I OUT =100mA 60 db Enable High (enabled) V EN(HI) V IN(MIN) V IN 5.5V 1.4 V IN V Enable Low (shutdown) V EN(LO) V IN(MIN) V IN 5.5V V Enable Pin Current (enabled) I EN V EN = V IN µa Shutdown Current I SHDN V EN =0V, V IN(MIN) V IN 5.5V 5 10 µa 8

9 Electrical Specifications (Contd.) V IN = V OUT(NOM) + 0.5V, ( for V OUT < 2V, V IN =2.5V ), V EN =V IN, I OUT =1mA, and C OUT = 4.7µF, C IN =1µF unless otherwise noted. Typical values are at T A = 25 o C. Parameter Symbol Test Condition Min Typ Max Units Thermal Shutdown Temperature TSHDN Shutdown, temperature increasing Restore, temperature decreasing Note 1: V IN(MIN) =V OUT +V DROP or V IN(MIN) =2.5V, whichever is greater. Note 2: For V OUT below 2.0V, Dropout Voltage is the input (MIN) to output differential o C 9

10 Detailed Description The is low-dropout; low quiescent current linear regulator designed for motherboard, notebook and LCD monitor applications. The output voltage range from 1.2V to 3.6V, and can drive 1A loading current. Capacitor Selection and Regulator Stability Use 1µF for input capacitor and 4.7µFor great for output capacitor on the. Larger input capacitor value and low ESR provide better supply noise rejection and improve line transient response. To reduce output noise and load transient response, use output capacitor greater than 4.7µF. Calculating the Maximum Output Power The maximum output power of the is limited by the maximum power dissipation of the package. By calculation the power dissipation of the package as a function of the input voltage, output voltage and output current, the maximum input voltage can be obtained. The maximum power dissipation should not exceed the package's maximum power rating. P MAX = ( V IN.MAX - V OUT ) x I OUT Where: V IN.MAX = maximum input voltage P MAX = maximum power dissipation of the package 10

11 Characterization Curve(For reference only) V OUT (V) V OUT vs. Temperature V OUT = 1.2V I OUT = 1mA Temperature ( o C) Quiesent Curr ent (ma) Quiesent Current vs Temperature V OUT = 3.3V I OUT =1mA I OUT=1A Temperature ( o C) Current Limit vs Input Voltage Current Limit vs Input Voltage V OUT = 1.2V V OUT = 3.3V Current Limit (ma) Current Limit (ma) Input Voltage (V) Input Voltage (V) Dropout Voltage vs Load Current Power Supply Rejection Ratio Dropout Voltage (mv) V OUT = 3.3V I OUT = 0mA~1000mA T A=125 O C T A=-40 O C T A =25 O C PSRR (db) I OUT =10mA I OUT =100mA V OUT = 3.3V Load Current (ma) 0 1K 10K 100K 1M Frequency (Hz) 11

12 Characterization Curve(For reference only) Line Transient Response Load Transient Response VOUT (10mV/DIV) VIN(1V/DIV) V IN = 2.5V~3.5V V OUT = 1.2V I OUT = 10mA TIME (100mSec/DIV) IOUT (1A/DIV) VOUT (50mV/DIV) V OUT = 1.2V I OUT = 10mA~1000mA TIME (100mSec/DIV) Short Circuit Current IOUT (500mA/DIV) VOUT (2V/DIV) TIME (100mSec/DIV) V OUT = 3.3V C IN = 10µF C OUT = 4.7µF 12

13 Date Code Rule Month Code 1: January 7: July 2: February 8: August 3: March 9: September 4: April A: October 5: May B: November 6: June C: December Tape & Reel Dimensions SOT-223 P W AME AME PIN 1 Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size SOT ±0.1 mm 4.0±0.1 mm 2500pcs 330±1 mm 13

14 Tape & Reel Dimensions TO P PIN 1 W AME AME Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size TO ±0.1 mm 4.0±0.1 mm 2500pcs 330±1 mm SOP-8 P PIN 1 W AME AME Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size SOP ±0.1 mm 4.0±0.1 mm 2500pcs 330±1 mm 14

15 Tape & Reel Dimensions SOP-8/PP P PIN 1 W AME AME Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size SOP-8/PP 12.0±0.1 mm 4.0±0.1 mm 2500pcs 330±1 mm 15

16 Package Dimension SOT-223 Top View D B1 Side View C SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX A B H E 13 o (4X) B C D PIN 1 E e e 2.30 BSC BSC F F Front View 13 o (4X) H q 0 o 10 o 0 o 10 o A1 B 16

17 Package Dimension TO TOP VIEW E K B A SIDE VIEW L D1 F E1 PIN1 J H G C D SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX A B C D E F G H * 2.30 * J K L D REF REF E *: Typical Value Notes: 1. Controlling dimension: Millimeters. 2. Maximum lead thickness includes lead finish thickness Minimum lead thickness is the minimum thickness of base material. 17

18 Package Dimension SOP-8 Top View Side View C SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX A A A REF REF H E B C PIN 1 D L D E e 1.27 BSC BSC Front View L o (4X) H y A2 A q 0 o 8 o 0 o 8 o e A1 B 18

19 Package Dimension SOP-8/PP TOP VIEW SIDE VIEW D 1 θ SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX E 2 E E 1 L1 A A A C PIN 1 D C E E L b D A 2 A e BSC BSC b e FRONT VIEW A 1 q 0 o 8 o 0 o 8 o E D

20 Life Support Policy: These products of AME, Inc. are not authorized for use as critical components in life-support devices or systems, without the express written approval of the president of AME, Inc. AME, Inc. reserves the right to make changes in the circuitry and specifications of its devices and advises its customers to obtain the latest version of relevant information. AME, Inc., January 2011 Document: 1271-DS8827-A.11 Corporate Headquarter AME, Inc. 2F, 302 Rui-Guang Road, Nei-Hu District Taipei 114, Taiwan, R.O.C. Tel: Fax:

AME. General Description. Functional Block Diagram. Features. Typical Application. Applications

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