Benefits. Applications

Transcription

1 LTEA Pro/5G LNA IC DZA0004 Key Features Low Noise Amplification in 3G/4G/LTE/5G Bands in Frequency Range 1500 to 700 MHz 1 db Gain (± 1.0 db) from 1500 to 700 MHz 0.4 db Noise Figure (NF) Typical Operating Current = 40 ma (Pdiss = 0.13 Wdc 3.3 Vdc) Operating Current = 65 ma (Pdiss = 0.35 Wdc 5 Vdc) Single Power Supply Input (3.3 or 5 Vdc) VBIAS can power the device up and down during operation Fastest InClass TurnOn time 0.05 μs Fastest InClass TurnOff time 0.05 μs Compliant with 3GPP Releases 11 through 14 for worldwide FDD and TDD operation Compliant with IEEE 80.11a/b/g/n/ac/af/ax WiFi/WLAN standards Integrated I/O matching reduces external SMT passive requirements and reduces landed product footprint Input Return Loss (IRL) and Output Return Loss (ORL) are bestinclass without external to package matching. LeadFree xx0.75 mm PDFN8 with Exposed Pad (EP) SMT Plastic Package Benefits Integrated I/O matching reduces external SMT passive requirements and reduces landed product footprint Input Return Loss (IRL) and Output Return Loss (ORL) are bestinclass without external to package matching User controllable current dissipation versus linearity A direct dropin replacement for narrowband LNA MMICs offered in the PDFN8 with EP Package Applications 3GPP Release 11 through 14 Worldwide Compliant BTS and HetNet Class Receivers LTEA Pro Antenna Arrays and HetNet Small Cell Receivers IEEE 80.11a/b/g/n/ac/af/ax WiFi/WLAN standard compliant CPE and Infrastructure Product Description Duet Microelectronic s DZA000X Family of LNA MMICs perform ultralow noise amplification with gain and linearity of all 31 cellular frequency division duplex (FDD) uplink (UL) bands and all 16time division duplex (TDD) bands defined for LTEAPro by 3GPP and TriBand WiFi/WLAN signals transmitted in accordance with (IAW) IEEE80.11a/b/g/n/ac/ah standards from 900 to 98 MHz, 400 to MHz, and between 4.9 and 5.95 GHz. The DZA0004 combines low NF, high linearity, high gain, bestinclass return loss in the 1500 to 700 MHz frequency range with exceptional turnon/turnoff times, flexible input voltage operation, low total supply current, and high electrostatic discharge (ESD) standoff ratings.

2 Functional Block Diagram Pin 1 Reference Mark Vbias 1 8 RF In 7 RF Out 3 6 Shut Down 4 5 Backside Paddle RF/DC GND Absolute Minimum and Maximum Ratings Parameter Min Max Units Supply 0 6 Vdc RF Power at the Input 10 dbm Case Operating Temperature Range, T C C Storage Temperature C Soldering Temperature 60 C Soldering Time 5 seconds Stresses more than the absolute ratings may cause permanent damage. Functional operation is not implied under these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability. Operating Ranges Parameter Min Typ Max Units RF Input/Output Frequency MHz Supply Voltage V DC Case Temperature, T C C The device may be operated safely over these conditions; however, parametric performance is guaranteed only over the conditions defined in the Electrical Specification.

3 Electrical Specifications (Ta = 5 C, Vdd = 5 VDC, f = 1500 to 700 MHz, 50 Ω I/O) RF Input Parameter Min Typ Max Units Conditions RF Input Power 10 0 dbm Operating, F = 1500 to 700 MHz Receive F = 1500 to 700 MHz RF Gain 1 db LNA BYPASS OFF; See Note 1 Gain Flatness 1 / db Calculated from Linear Best Fit, 1500 to 700 MHz Noise Figure (NF) 0.4 db F = 1500 to 700 MHz RF Output Level 10 dbm Input Return Loss db Output Return Loss db OP1dB 3 dbm OIP3 30 dbm ±1.5 dbm Rx MER db Rx EVM %RMS LNA ENABLE ON Time, T ON μs Utilizing VBIAS LNA ENABLE OFF Time, TOFF μs Utilizing VBIAS Supply Current 40 ma Vdd = 3.3 Vdc Supply Current 65 ma Vdd = 5 Vdc ±0.5 dbm; evaluation board circuit in operation including internal & external AGC circuit Rx Input Power 60 to 10 dbm; See Note Rx Input Power 60 to 10 dbm; See Note ESD HBM MM Package Moisture Sensitivity Level (MSL) 1 Notes: All specifications as measured using Duet evaluation assembly. 1. Measured in application circuit.. Measured using OFDM and 64QAM. V HBM (JESDA114) MM (JESDA115) Measured pintopin or pintoground PDFN8 with exposed pad (EP), SMT, x x 0.75 mm (L x W x H) maximum dimensions, 8pads

4 Package Dimensions DZA0004 REV 1 DESCRIPTION RELEASE REVISIONS D NEXT ASSY USED ON UNLESS OTHERWISE SPECIFIED ALL DIMENSIONS AND TOLERAES ARE IN IHES TOLERAES FRACTIONS 3 PLACE DECIMALS PLACE DECIMALS ANGLES CONTRACT NO. PREPARED CHECKED ENG W. Palmer dmicroelectronics uet APPLICATION MATERIAL FINISH ENG A SIZE SCALE FSCM NO. D000 SH

5 Pad Configuration Pin 1 Reference Mark Vbias 1 8 RF In 7 RF Out 3 6 Shut Down 4 5 Backside Paddle RF/DC GND Pad Number Pad Name Description 1 VBIAS Sets the bias point for the device. RFIN Singleended (SE) RF Input pin. A DC Block is required. 6 7 Shut Down RF Out Plus DC Bias Voltage >1.17Vdc turns off the device. If the pin is pulled to ground or driven with a voltage less than 0.63V, then the device will operate under LNA ON state. SE RF Output pin. DC bias will also need to be injected through a RF bias choke/ inductor for operation. 3, 4, 5, 8 N/C No electrical connection. Provide grounded land pads for PCB mounting integrity. 9 Exposed Pad (EP) Notes: All specifications as measured using Duet evaluation assembly. 1. Duet recommends connecting unused pads to GROUND.. The exposed pad (EP) centered on the package bottom RF, DC, and thermal GROUNDS. RF/DC ground. Use recommended via pattern to minimize inductance and thermal resistance; see PCB Mounting Pattern for suggested footprint.

6 Ordering Information Order Number DZA0004P0 DZA0004V0 DZA0004PCBA Temperature Range 0 to 100 C 0 to 100 C Package Description Plastic, dualflat noleads (PDFN) 8pad xx0.75 mm with exposed pad (EP) Plastic, dualflat noleads (PDFN) 8pad xx0.75 mm with exposed pad (EP) 40 to 85 C 50Ω I/O Evaluation Board (EVB) Component Packaging Gel Pak, 1 to 100 each 1500 each, T&R EVB Kit with five (5) piece IC sample ESD bag Duet Microelectronics 575 Route 8, Suite 100 Raritan, NJ USA DUET (3838) info@duetmicro.com Important Notice Duet Microelectronics LLC reserves the right to make changes to its products or to discontinue any product at any time without notice. The product specifications contained in Advanced Data Sheets are subject to change prior to a product s formal introduction. Information in Data Sheets have been carefully checked and are assumed to be reliable; however, Duet Microelectronics assumes no responsibilities for inaccuracies. Duet Microelectronics strongly urges customers to verify that the information they are using is current before placing orders. Warning Duet Microelectronics products are not intended for use in life support appliances, devices or systems. Use of a Duet Microelectronics product in any such application without written consent is prohibited.