6-PIN DIP ZERO-CROSS PHOTOTRIAC DRIVER OPTOCOUPLER (600V PEAK)
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1 PACKAGE SCHEMATIC ANODE CATHODE 2 N/C 3 ZERO CROSSING CIRCUIT MAIN TERM. 5 NC* 4 MAIN TERM. *DO NOT CONNECT (TRIAC SUBSTRATE) DESCRIPTION The MOC30X-M and MOC3X-M devices consist of a GaAs infrared emitting diode optically coupled to a monolithic silicon detector performing the function of a zero voltage crossing bilateral triac driver. They are designed for use with a triac in the interface of logic systems to equipment powered from 5/240 VAC lines, such as solid-state relays, industrial controls, motors, solenoids and consumer appliances, etc. FEATURES Simplifies logic control of 5/240 VAC power Zero voltage crossing dv/dt of 000 V/µs guaranteed (MOC3X-M), 00 V/ms guaranteed (MOC30X-M) VDE recognized (File # 947) ordering option V (e.g., MOC303V-M) Underwriters Laboratories (UL) recognized (File #E90700, volume 2) APPLICATIONS Solenoid/valve controls Static power switches Temperature controls AC motor starters Lighting controls AC motor drives E.M. contactors Solid state relays Page of 0
2 ABSOLUTE MAXIMUM RATINGS (T A = 25 C unless otherwise noted) Parameters Symbol Device Value Units TOTAL DEVICE Storage Temperature T STG All -40 to +50 C Operating Temperature T OPR All -40 to +85 C Lead Solder Temperature T SOL All 20 for 0 sec C Junction Temperature Range T J All -40 to +00 C Isolation Surge Voltage (4) (peak AC voltage, 0Hz, sec duration) V ISO All 7500 Vac(pk) Total Device Power 25 C 250 mw P D All Derate above 25 C 2.94 mw/ C EMITTER Continuous Forward Current I F All 0 ma Reverse Voltage V R All V Total Power Dissipation 25 C Ambient 20 mw P D All Derate above 25 C.4 mw/ C DETECTOR Off-State Output Terminal Voltage V DRM All 00 V Peak Repetitive Surge Current (PW = 00 µs, 20 pps) I TSM All A Total Power 25 C Ambient 50 mw P D All Derate above 25 C.7 mw/ C Page 2 of 0
3 ELECTRICAL CHARACTERISTICS (TA = 25 C Unless otherwise specified) INDIVIDUAL COMPONENT CHARACTERISTICS Parameters Test Conditions Symbol Device Min Typ* Max Units EMITTER Input Forward Voltage I F = 30 ma V F All.3.5 V Reverse Leakage Current V R = V I R All µa DETECTOR MOC3X-M 0 00 Peak Blocking Current, Either Direction V DRM = 00V, I F = 0 (note ) I DRM MOC30X-M na Critical Rate of Rise of Off-State Voltage I F = 0 (figure 9, note 3) dv/dt MOC30X-M MOC3X-M 000 V/µs TRANSFER CHARACTERISTICS (T A = 25 C Unless otherwise specified.) DC Characteristics Test Conditions Symbol Device Min Typ* Max Units LED Trigger Current (rated I FT ) main terminal Voltage = 3V (note 2) I FT MOC30-M 5 MOC302-M/ MOC32-M 0 MOC303-M/ MOC33-M 5 Peak On-State Voltage, Either Direction I TM = 00 ma peak, I F = rated I FT V TM All.8 3 V Holding Current, Either Direction I H All 500 µa ZERO CROSSING CHARACTERISTICS Characteristics Test Conditions Symbol Device Min Typ* Max Units Inhibit Voltage (MT-MT2 voltage above which device will not trigger) Leakage in Inhibited State I F = Rated I FT V INH MOC302-M/3M 2 5 MOC30-M/2M/3M 2 20 I F = Rated I FT, V DRM = 00V, off state I DRM2 All µa ma V ISOLATION CHARACTERISTICS Characteristics Test Conditions Symbol Device Min Typ* Max Units Isolation Voltage f = 0 Hz, t = sec V ISO All 7500 V *Typical values at T A = 25 C Notes. Test voltage must be applied within dv/dt rating. 2. All devices are guaranteed to trigger at an I F value less than or equal to max I FT. Therefore, recommended operating I F lies between max I FT (5 ma for MOC30-M, 0 ma for MOC302-M & MOC32-M, 5 ma for MOC303-M & MOC33-M) and absolute max I F (0 ma). 3. This is static dv/dt. See Figure 9 for test circuit. Commutating dv/dt is a function of the load-driving thyristor(s) only. 4. Isolation surge voltage, V ISO, is an internal device dielectric breakdown rating. For this test, Pins and 2 are common, and Pins 4, 5 and are common. Page 3 of 0
4 .7 Figure. LED Forward Voltage vs. Forward Current. Figure 2. Trigger Current Vs. Temperature V F, FORWARD VOLTAGE (V) T A = -40 C T A = 25 C T A = 85 C I FT, NORMALIZED V TM = 3V NORMALIZED TO T A = 25 C I F, LED FORWARD CURRENT (ma) T A, AMBIENT TEMPERATURE ( C) Figure 3. LED Current Required to Trigger vs. LED Pulse Width Figure 4. Leakage Current, IDRM vs. Temperature 0000 I FT, LED TRIGGER CURRENT (NORMALIZED) T A = 25 C NORMALIZED TO PW IN >> 00µs 0 00 PW IN, LED TRIGGER PULSE WIDTH (µs) I DRM, LEAKAGE CURRENT (na) T A, AMBIENT TEMPERATURE ( C) Page 4 of 0
5 Figure 5. I DRM2, Leakage in Inhibit State vs. Temperature Figure. On-State Characteristics I DRM2, NORMALIZED I F = RATED I FT NORMALIZED TO T A = 25 C I TM, ON-STATE CURRENT (ma) T A = 25 C T A, AMBIENT TEMPERATURE ( C) V TM, ON-STATE VOLTAGE (VOLTS) 3.2 Figure 7. I H, Holding Current vs. Temperature.20 Figure 8. Inhibit Voltage vs. Temperature I H, HOLDING CURRENT (NORMALIZED) V INH, NORMALIZED NORMALIZED TO T A = 25 C T A, AMBIENT TEMPERATURE ( C) T A, AMBIENT TEMPERATURE ( C) Page 5 of 0
6 . 00x scope probes are used, to allow high speeds and voltages. 2. The worst-case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then removing the current. The variable vernier resistor combined with various capacitor combinations allows the dv/dt to be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. τ RC is measured at this point and recorded. 27 DIFFERENTIAL PREAMP X00 PROBE 2 X00 PROBE 4 V DRM/V RRM SELECT DUT 20k 2W 2W V WATT WIREWOUND V 470pF MOUNT DUT ON TEMPERATURE CONTROLLED Cµ PLATE dv dt VERNIER 00 2W 82 2W MEG 2W EACH.2 MEG 2W POWER TEST N V f = 0 Hz PW = 00 µs 50 Ω PULSE GENERATOR 5 2W 000 /4W N97A 8V RFP4N V 0mA ALL COMPONENTS ARE NON-INDUCTIVE UNLESS SHOWN Figure 9. Circuit for Static dv Measurement of Power Thyristors dt BASIC APPLICATIONS Typical circuit for use when hot line switching is required. In this circuit the "hot" side of the line is switched and the load connected to the cold or neutral side. The load may be connected to either the neutral or hot line. R in is calculated so that I F is equal to the rated I FT of the part, 5 ma for the MOC30-M, 0 ma for the MOC302-M, or 5 ma for the MOC303-M. The 39 ohm resistor and 0.0 µf capacitor are for snubbing of the triac and is often, but not always, necessary depending upon the particular triac and load used. Suggested method of firing two, back-to-back SCR s with a Fairchild triac driver. Diodes can be N400; resistors, R and R2, are optional 330 ohm. Note: This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only. V CC V CC R in Rin 2 3 MOC30-M MOC302-M MOC303-M 2 3 MOC30-M MOC302-M MOC303-M 5 30 Ω VAC 30 FKPF2N0 39Ω Figure 0. Hot-Line Switching Application Circuit 5 4 R D 30 Ω SCR R2 D2 0.0µF SCR LOAD LOAD 5 VAC HOT NEUTRAL Figure. Inverse-Parallel SCR Driver Circuit Page of 0
7 Package Dimensions (Through Hole) Package Dimensions (Surface Mount) (8.89) (8.3) (8.89) (8.3) 0.20 (.0) (.0) 0.20 (.0) (.0) (9.90) (8.43) (.77) (.02) 0.04 (0.3) 0.00 (0.25) (8.3) (.77) (.02) 0.04 (0.3) 0.00 (0.25) (8.3) (5.08) 0.5 (2.93) (5.08) 0.5 (2.93) 0.02 (0.30) (0.20) 0.00 (2.54) 0.05 (0.38) (0.50) 0.0 (0.4) 0.00 (2.54) (0.30) (0.3) (0.5) (0.50) 0.0 (0.4) 0.00 [2.54] (0.88) 0.00 (0.) Package Dimensions (0.4 Lead Spacing) (8.89) (8.3) Recommended Pad Layout for Surface Mount Leadform 0.20 (.0) (.0) (.78) 0.00 (.52) (.77) (.02) 0.04 (0.3) 0.00 (0.25) (0.79) 0.00 (2.54) (5.08) 0.5 (2.93) (7.75) (0.7) 0.00 (2.54) 0.05 (0.38) (0.50) 0.0 (0.4) 0.00 [2.54] 0.02 (0.30) (0.2) (0.80) (0.) NOTE All dimensions are in inches (millimeters) Page 7 of 0
8 ORDERING INFORMATION Option Order Entry Identifier Description S S Surface Mount Lead Bend SR2 SR2 Surface Mount; Tape and reel T T 0.4" Lead Spacing V V VDE 0884 TV TV VDE 0884, 0.4" Lead Spacing SV SV VDE 0884, Surface Mount SR2V SR2V VDE 0884, Surface Mount, Tape & Reel MARKING INFORMATION V MOC30 X YY Q Definitions Fairchild logo 2 Device number VDE mark (Note: Only appears on parts ordered with VDE 3 option See order entry table) 4 One digit year code, e.g., 3 5 Two digit work week ranging from 0 to 53 Assembly package code *Note Parts that do not have the V option (see definition 3 above) that are marked with date code 325 or earlier are marked in portrait format. Page 8 of 0
9 Carrier Tape Specifications 4.5 ± ± ± ± ± 0.05 Ø.5 MIN.75 ± ± 0..5 ± ± ± MAX 0. ± 0.20 Ø.5 ± 0./-0 NOTE All dimensions are in inches (millimeters) User Direction of Feed Reflow Profile (White Package, -M Suffix) Temperature ( C) C peak 230 C, 0 30 s Time above 83 C, sec Ramp up = 2 0 C/sec Peak reflow temperature: 245 C (package surface temperature) Time of temperature higher than 83 C for seconds One time soldering reflow is recommended Time (Minute) Page 9 of 0
10 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Page 0 of 0
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