KMOC3012 Series 4PIN ZERO-CROSS TRIAC DRIVER PHOTOCOUPLER

Transcription

1 Description Schematic The KMOC312 series consist of a GaAs infrared emitting diode optically coupled to a 1 4 monolithic silicon detector performing the function of a zero voltage crossing bilateral TRIAC driver. They are designed for use with a TRIAC in the 2 Z.C 3 interface of logic systems to equipment powered from 115/24 VAC lines, such as solid-state relays, 1. Anode industrial controls, motors, solenoids and 2. Cathode consumer appliances, etc. 3. Main terminal 4. Main terminal Features 1. Pb free and RoHS compliant. 2. 6V peak blocking voltage. 3. Simplifies logic control of 115/24 VAC power. 4. Zero voltage crossing. 5. Isolation voltage between input and output (Viso:53Vms). 6. MSL class 1 7. Agency Approvals: UL Approved (No. E169586): UL1577 C-UL Approved (No. E169586) VDE Approved (No ): DIN EN CQC Approved: GB , GB Applications Solenoid/Valve controls Lighting controls Static power switches AC motor drives Temperature controls E.M contactors AC motor contactors Solid state relay Programmable controllers Document No. 69P

2 Outside Dimension Unit:mm 1. Dual-in-line type. 2. Surface mount type. KMOC312 KMOC312S ±.4 ~1.1± Long creepage distance type. 4. Long creepage distance for surface mount type. KMOC312H KMOC312L ±.25.9± ~ Device Marking TOLERANCE:±.2mm 312 YWW Notes: 312 YWW Y:Year code / W:Week code Document No. 69P

3 Absolute Maximum Ratings (Ta=25 ) Parameter Symbol Rating Unit Forward current I F 5 ma Input Peak forward current I FM 1 A Reverse voltage V R 6 V Power dissipation P D 7 mw Off-state output terminal voltage V DRM 6 V PEAK Output On-state R.M.S. current I T(RMS) 1 ma Peak repetitive surge current (PW=1ms.DC 1%) I TSM 1 A Power dissipation P D 3 mw Total power dissipation P tot 33 mw Isolation voltage 1 minute V iso 53 Vrms Operating temperature T opr -4 to +115 Storage temperature T stg -5 to +125 Soldering temperature 1 seconds T sol 26 Electro-optical Characteristics (Ta=25 ) Parameter Symbol Conditions Min. Typ. Max. Unit Input Forward voltage V F I F =1mA V Reverse current I R V R =4V μa Output Peak blocking current I DRM V DRM Rated na On-state voltage V TM I TM =1mA V Holding current I H ma Transfer characteristics Critical rate of rise of Off-state voltage Inhibit voltage (MT1-MT2 voltage above which device will not trigger.) Leakage in inhibited state dv/dt V DRM =(1/ 2 )*Rated V/μs V INH I F = Rated I FT V I DRM2 I F =Rated I FT, Rated V DRM, Off State μa Isolation resistance R iso DC5V 5x Ω Minimum trigger current I FT Main Terminal Voltage=3V ma Static dv/dt Test Circuit Vdc RTEST PULSE INPUT MERCURY WETTED RELAY CTEST D.U.T R=1KΩ X1 SCOPE PROBE APPLIED VOLTAGE WAVEFORM VOLTS.63 Vmax Vmax dv/dt =.63 Vmax τrc τrc Document No. 69P

4 Fig.1 Forward Current 6 Fig.2 Diode Power Dissipation 12 Forward Current IF ( ma ) Diode Power Dissipation PD (mw) Ambient Temperature Ta ( ) Ambient Temperature Ta ( ) Fig.3 On-state R.M.S. Current Fig.4 Total Power Dissipation On-state Current ITM ( ma ) Total Power Dissipation PD (mw) Ambient Temperature Ta ( ) Ambient Temperature Ta ( ) Fig.5 Peak Forward Current Fig.6 Forward Current Peak Forward Current IFT ( ma ) vs. Duty Ratio Duty Ratio Pulse width <= 1us Ta=25 C 1 Forward Current IF ( ma ) vs. Forward Voltage Ta=75 C 5 C 25 C C -25 C Forward Voltage (V) Document No. 69P

5 Fig.7 On-state Characteristics Fig.8 Inhibit Voltage +4 Output pulse width 8us On-state Current ITM ( ma ) IF=3mA, f=6hz, Ta=25 C -3 VINH, Normalized On-state Voltage (V) Ambient Temperature Ta ( ) Fig.9 Leakage with LED off Fig.1 I DRM2,Leakage in Inhibited State Peak Blocking Current ( na ) IDRM2, Normalized IFT=Rated IFT Ambient Temperature Ta ( ) Ambient Temperature Ta ( ) Fig.11 Trigger Current IFT, Normalized Normalized to Ta=25 C Ambient Temperature Ta ( ) Document No. 69P

6 Recommended Soldering Conditions (a) Infrared reflow soldering: Peak reflow soldering: 26 or below (package surface temperature) Time of peak reflow temperature: 1 sec Time of temperature higher than 23 : 3-6 sec Time to preheat temperature from 18~19 : 6-12 sec Time(s) of reflow: Two Flux: Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of.2 Wt% is recommended.) Recommended Temperature Profile of Infrared Reflow 26 1 sec Max. temperature sec sec t (s) (b) Wave soldering: Temperature: Time: Preheating conditions: Time(s) of reflow: Flux: 26 or below (molten solder temperature) 1 seconds or less 12 or below (package surface temperature) One Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of.2 Wt% is recommended.) (c) Cautions: Fluxes: Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. Avoid shorting between portion of frame and leads. Document No. 69P

7 Numbering System KMOC312 X (Y) Notes: KMOC312 = Part No. X = Lead form option ( blank S H L ) Y = Tape and reel option ( TLD TRU ) Option Description Packing quantity S (TLD) surface mount type package + TLD tape & reel option 2 units per reel S (TRU) surface mount type package + TRU tape & reel option 2 units per reel L (TLD) L (TRU) long creepage distance for surface mount type package + TLD tape & reel option long creepage distance for surface mount type package + TRU tape & reel option 2 units per reel 2 units per reel Recommended Pad Layout for Surface Mount Lead Form 1. Surface mount type. 2. Long creepage distance for surface mount type. 4-pin SMD 4-pin L Unit:mm Document No. 69P

8 4-pin SMD Carrier Tape & Reel Unit:mm TLD TOLERANCE:±.2mm.33 TRU 4.2 Direction of feed from reel Direction of feed from reel 1.5± ±.2 Document No. 69P

9 4-pin L Carrier Tape & Reel Unit:mm TLD TOLERANCE:±.2mm.33 TRU 4.2 Direction of feed from reel Direction of feed from reel 1.5±.5 1±.5 13.±.2 33 Max Max. Document No. 69P

10 Application Notice The statements regarding the suitability of products for certain types of applications are based on 's knowledge of general applications of products. Such statements are not binding statements about the suitability of products for a particular application. It is the customer's responsibility to verify the specifications are suitable for use in a particular application. Customers are solely responsible for all aspects of their own product design or applications. The parameters provided in the datasheet may vary in different applications and performance may vary over time. All operating parameters (including typical parameters) must be validated by customer's technical experts for different applications. assumes no liability for customer product design or applications. Product specifications do not expand or otherwise change 's terms and conditions of purchase, including but not limited to the warranty expressed therein. When using products, please comply with safety standards and instructions. has no liability and responsibility to the damage caused by improper use of the instructions specified in the specifications. products are designed for use in general electronic equipment such as telecommunications, office automation equipments, personal computers, test and measurement equipments, consumer electronics, industrial control, instrumentation, audio, video. devices shall not be used in equipment that requires higher level of reliability and safety, such as nuclear power control equipment, telecommunication equipment(trunk lines), space application, medical and other life supporting equipments, and equipment for aircraft, military, automotive or any other application that can cause human injury or death. reserves the right to change the specifications, data, characteristics, structure, materials and other contents at any time without notice. Please contact to obtain the latest specification. disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Document No. 69P