SURFACE MOUNT LED LAMP 0805 Chip Type - Water Clear

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1 85 Chip Type - Water Clear PACKAGE DIMENSIONS.87 (2.2).71 (1.8) R.8 (.2).57 (1.45).41 (5) TOP CATHODE MARK FEATURES Ultra-miniature and extremely low profile.55 (1.4).12 (.3) 2X Industrial standard footprint AlInGaP technology.47 (1.2).41 (5).24 (.6) Wide viewing angle of 14 Water clear optics.16 (.4) 2X SIDE.47 (1.2) Available in.42 (12mm) width tape on 7 (178mm) diameter. Moisture-proof packaging BOTTOM NOTE: Dimensions are in inches (mm). DESCRIPTION These surface mount lamps are designed to fit industry standard profile and footprint for ultra-miniature chip type 85. The low profile and 14 viewing angle, moisture-proof packaging makes this chip type LED ideal for panel illumination, push-button backlighting and membrane switch applications. ABSOLUTE MAXIMUM RATINGS (T A = 25 C unless otherwise specified) Parameter Red Orange Yellow QTLP63C-R QTLP63C-E QTLP63C-Y Continuous Forward Current - I F ma Peak Forward Current - I F ma (f = KHz, Duty Factor = 1/1) Reverse Voltage - V R (I R = 1 µa) V Power Dissipation - P D mw Operating Temperature - T OPR -4 to +1 C Storage Temperature - T STG -4 to +1 C Lead Soldering Time - T SOL Wave 26 for 5 sec C Reflow 26 for 1 sec Units 1 of 5 3/1/ 343A

2 ELECTRICAL / OPTICAL CHARACTERISTICS (TA =25 C) Part Number Red Orange Yellow QTLP63C-R QTLP63C-E QTLP63C-Y Condition Luminous Intensity (mcd) I F = 2mA Minimum Typical Forward Voltage (V) I F = 2mA Maximum Typical Peak Wavelength (nm) I F = 2mA Spectral Line Half Width (nm) I F = 2mA Viewing Angle ( ) I F = 2mA TYPICAL PERFORMANCE CURVES IF - FORWARD CURRENT (ma) RELATIVE LUMNOUS INTENSITY (NORMALIZED AT 2 ma) V F - FORWARD VOLTAGE (V) Fig. 1 Forward Current vs. Forward Voltage I F - DC FORWARD CURRENT (ma) Fig. 2 Relative Luminous Intensity vs. DC Forward Current 2 of 5 3/1/ 343A

3 RELATIVE INTENSITY Fig. 1 Forward Current vs. Forward Voltage TYPICAL PERFORMANCE CURVES YELLOW ORANGE RED Fig. 2 Relative Luminous Intensity vs. DC Forward Current WAVELENGTH - nm Fig. 3 Relative Intensity vs Peak Wavelength REL. LUMINOUS INTENSITY (%) Fig. 4 Radiation Diagram 5 IF - FORWARD CURRENT (ma) RED, ORANGE YELLOW AMBIENT TEMPERATURE T A ( C) Fig.5 Forward Current vs. Ambient Temperature 3 of 5 3/1/ 343A

4 RECOMMENDED PRINTED CIRCUIT BOARD PATTERN.43 (1.1).49 (1.25).49 (1.25).43 (1.1) RECOMMENDED IR REFLOW SOLDERING PROFILE 5 sec MAX soldering time 24 C MAX +5 C/s MAX -5 C/s MAX 6-12 sec Preheating C MAX 4 of 5 3/1/ 343A

5 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 2 Fairchild Semiconductor Corporation 5 of 5 3/1/ 343A