Features. Application. Camera 0.15

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1 ASMT-FJ6-AFJ Surface Mount AFA LED Data Sheet Description Avago Technologies ASMT-FJ6-AFJ is a SMT dome lamp that uses an untinted, non diffused lens to provide a high luminous intensity within a narrow radiation pattern. The device is made by encapsulating an LED chip on an axial lead frame to form a molded epoxy lamp package with six bent leads for surfacing mounting. Package Dimensions 45 x Features Smooth, consistent narrow radiation pattern 1degree viewing angle 4.8L x4.8w x4.35h mm package dimension Available in 16mm tape on 15" (38mm) diameter reel Clear, non-diffused epoxy. RoHS compliant Application Camera Pin 1,2,4 - Anode Pin 3,5,6 - Cathode All dimensions in millimeters. 2. Tolerance is ±.1mm unless otherwise specified..15 CAUTION: ASMT-FJ6-AFJ LED is Class 1A ESD sensitive per JESD22-A114C.1 standard. Please observe appropriate precautions during handling and processing.

2 Device Selection Guide Color Parts Number Typ. Iv (cd) Test Current (ma) Dice Technology Orange ASMT-FJ6-AFJ 29 2 AlInGaP 1. The luminous intensity I V is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. I V Tolerance = ±15%. Absolute Maximum Ratings at T A = 25 C Parameter ASMT-FJ6-AFJ Units DC Forward Current 7 ma Power Dissipation 18 mw LED Junction Temperature 11 C Operating Temperature Range -4 to 85 C Storage Temperature Range -4 to 85 C Optical Characteristics at T A = 25 C Peak Wavelength λ peak (nm) Dominant Wavelength λ d [1] (nm) Viewing Angle 2 θ 1/2 [2] (Degrees) Part Number Color Typ. Typ. Typ. ASMT-FJ6-AFJ Orange The dominant wavelength, λ d, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 2. θ 1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity. Electrical Characteristics at T A = 25 C Forward Voltage V F (Volts) [1] Color Test Current Min. Typ. Max. Min. Orange 2mA Vf tolerance : ±.1V Reverse Breakdown, V R (Volts)@ I R = 1μA 2

3 RELATIVE INTENSITY WAVELENGTH - nm Figure 1. Relative Intensity vs. Wavelength FORWARD CURRENT - ma FORWARD VOLTAGE - V Figure 2. Forward Current vs Forward Voltage RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 2 ma) NORMALIZED INTENSITY DC FORWARD CURRENT - ma Figure 3. Relative Intensity vs. Forward Current ANGULAR DISPLACEMENT - DEGREES Figure 4. Radiation Pattern MAXIMUM DC FORWARD CURRENT - ma AMBIENT TEMPERATURE - DEGREE C Figure 5. Maximum forward current vs ambient temperature. 3

4 1-3 SEC. 1.2 TEMPERATURE 217 C 2 C 15 C C 3 C/SEC. MAX. 3 C/SEC. MAX. 6 C/SEC. MAX SEC. 1 SEC. MAX. TIME Figure 6. Recommended reflow soldering profile (Acc. to J-STD-2C) 2.88 Figure 7. Recommended soldering land pattern USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 8. Reel Orientation ±.5 Figure 9. Reel Dimensions 4

5 Y.35 ±.5 Do 1.55±.5 2. ±.1 (I) 4. ±.1 (II) 1.75 ±.1 D1 1.5min. Bo F (III) H H W Ko REF. 3 REF. 1 Typ. R.3 Y P1 Ao SECTION Y-Y Ao 4.95 ±.1 Bo 5.4 ±.1 Ko 4.4 ±.1 F P1 W 7.5 ± ± ±.3 SECTION H-H REF. 3 REF. 1 Figure 1. Tape Dimensions END START THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 23 mm (9.5 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 11. Tape Leader and Trailer Dimensions 1. All dimensions in millimeters. 2. Tolerance is ±.1 mm unless otherwise specified 5

6 Iv Bin Category (cd) Bin ID Min Max F G H I J Iv Tolerance = ±15% Color Bin Category Orange Orange Min (nm) Max (nm) A 6 64 B C Tolerance = ±1nm Handling Precaution This products is classified as moisture sensitive level 3 When the bag is opened, parts required to mount within 168 hours of factory conditions 3 C/6%, and stored at <1% RH. Devices required bake, before mounting if: a) The humidity indicator card is > 1% when read at 23±5 C b) The pack has been opened for more than 168 hours. Baking recommended condition: 6 +/ 5 C for 2 hours. Note: 1. Do not stack the units after reflow. DISCLAIMER: Avago s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright Avago Technologies. All rights reserved. AV2-2348EN - December 8, 21