ICX205AL. Diagonal 8mm (Type 1/2) Progressive Scan CCD Image Sensor with Square Pixel for B/W Cameras

Transcription

1 ICX0AL Diagonal mm (Type /) Progressive Scan CCD Image Sensor with Square Pixel for B/W Cameras Description The ICX0AL is a diagonal mm (Type /) interline CCD solid-state image sensor with a square pixel array and.m effective pixels. Progressive scan allows all pixels' signals to be output independently within approximately /7. second. Also, the adoption of high frame rate readout mode supports 0 frames per second. This chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still image without a mechanical shutter. High sensitivity and low dark current are achieved through the adoption of HAD (Hole-Accumulation Diode) sensors. This chip is suitable for applications such as electronic still cameras, PC input cameras, etc. 0 pin DIP (Cer-DIP) Features Progressive scan allows individual readout of the image signals from all pixels. High horizontal and vertical resolution (both approx. 0T-lines) still image without a mechanical shutter. Supports high frame rate readout mode (effective 6 lines output, 0 frame/s) Square pixel Horizontal drive frequency:.mhz No voltage adjustments (reset gate and substrate bias are not adjusted.) High resolution, high sensitivity, low dark current Low smear, excellent antiblooming characteristics Continuous variable-speed shutter Pin H Pin 0 Optical black position (Top iew) Device Structure Interline CCD image sensor Image size: Diagonal mm (Type /) Total number of pixels: (H) 00 () approx..0m pixels Number of effective pixels: 9 (H) 00 () approx..m pixels Number of active pixels: 60 (H) 0 () approx..0m pixels (7.99mm diagonal) Chip size: 7.60mm (H) 6.0mm () Unit cell size:.6µm (H).6µm () Optical black: Horizontal (H) direction: Front pixels, rear 0 pixels ertical () direction: Front pixels, rear pixels Number of dummy bits: Horizontal 0 ertical Substrate material: Silicon Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. E969B9

2 DD φsub CSUB L φrg Hφ Hφ ertical register OUT φ φb φa φ ICX0AL Block Diagram and Pin Configuration (Top iew) Note) Horizontal register Note) : Photo sensor Pin Description Pin No. Symbol Description Pin No. Symbol Description φ ertical register transfer clock DD Supply voltage φa ertical register transfer clock φb ertical register transfer clock φsub Substrate clock φ ertical register transfer clock CSUB Substrate bias L Protective transistor bias φrg Reset gate clock 9 9 Hφ Horizontal register transfer clock 0 OUT Signal output 0 Hφ Horizontal register transfer clock DC bias is generated within the CCD, so that this pin should be grounded externally through a capacitance of 0.µF.

3 ICX0AL Absolute Maximum Ratings Item Ratings Unit Remarks DD, OUT, φrg φsub 0 to +0 φa, φb φsub 0 to + Against φsub φ, φ, L φsub 0 to +0. Hφ, Hφ, φsub 0 to +0. CSUB φsub to DD, OUT, φrg, CSUB 0. to + Against φ, φa, φb, φ 0 to + Hφ, Hφ 0 to + Against L φa, φb L φ, φ, Hφ, Hφ, L 0. to + 0. to + Between input clock pins oltage difference between vertical clock input pins Hφ Hφ Hφ, Hφ φ to + 6 to +6 6 to +6 Storage temperature Operating temperature + (Max.) when clock width < 0µs, clock duty factor < 0.%. +6 (Max.) is guaranteed for turning on or off power supply. 0 to +0 0 to +60 C C

4 ICX0AL Bias Conditions Supply voltage Item Symbol Min. Typ. Max. Unit Remarks DD..0. Protective transistor bias Substrate clock Reset gate clock L φsub φrg L setting is the L voltage of the vertical transfer clock waveform, or the same power supply as the L power supply for the driver should be used. Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated within the CCD. DC Characteristics Item Symbol Min. Typ. Max. Unit Remarks Supply current IDD. ma Clock oltage Conditions Item Symbol Min. Typ. Max. Unit Waveform diagram Remarks Readout clock voltage T..0. H0A H = H0A H, HA, HB, H L, LA, LB, L L = (L + L)/ ertical transfer clock voltage φ, φa, φb, φ L L HH 0.9 High-level coupling HL. High-level coupling LH.0 Low-level coupling LL 0.9 Low-level coupling Horizontal transfer clock voltage φh HL Reset gate clock voltage φrg RGLH RGLL RGL RGLm Low-level coupling Low-level coupling Substrate clock voltage φsub..0.

5 ICX0AL Clock Equivalent Circuit Constant Item Capacitance between vertical transfer clock and Capacitance between vertical transfer clocks Capacitance between horizontal transfer clock and Capacitance between horizontal transfer clocks Capacitance between reset gate clock and Capacitance between substrate clock and ertical transfer clock series resistor ertical transfer clock ground resistor Horizontal transfer clock series resistor Reset gate clock series resistor Cφ CφA CφB Cφ CφA, CφB CφA, CφB Cφ CφH, CφH CφHH CφRG CφSUB R RA, R RB R RφH Ω RφRG Symbol Min. Typ. Max. Unit Remarks 00 pf 00 pf 600 pf 00 pf 00 pf 00 pf 00 pf 7 pf 00 pf pf 60 pf 6 Ω 6 Ω Ω 0 Ω 0 Ω φ φa R CφA RA Hφ RφH RφH Hφ Cφ CφA CφHH CφB CφA CφH CφH RB R CφB Cφ CφB Cφ R φb φ ertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit RGφ RφRG CφRG Reset gate clock equivalent circuit

6 ICX0AL Drive Clock Waveform Conditions () Readout clock waveform T 00% 90% II II φm 0% T φm 0% tr twh tf 0 () ertical transfer clock waveform Note) Readout clock is used by composing vertical transfer clocks φa and φb. φ H HH H HL LH L0 L L LL φa, φb H0A, H0B HH HA, HB H HL LH LA, LB LL L φ H HH H HL L0 LH L LL H = H0A L = (L0 + L0)/ L = L0 φ = H L0 φa = H0A LA φb = H0B LB φ = H L0 6

7 ICX0AL () Horizontal transfer clock waveform tr Hφ 90 % twh tf CR 0 % Hφ φh two φh twl HL Cross-point voltage for the Hφ rising side of the horizontal transfer clocks Hφ and Hφ waveforms is CR. The overlap period for twh and twl of horizontal transfer clocks Hφ and Hφ is two. () Reset gate clock waveform tr twh tf RG waveform RGH twl φrg Point A RGLH RGLL RGLm RGL RGLH is the maximum value and RGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, RGL is the average value of RGLH and RGLL. RGL = (RGLH + RGLL)/ Assuming RGH is the minimum value during the interval twh, then: φrg = RGH RGL. Negative overshoot level during the falling edge of RG is RGLm. () Substrate clock waveform 00% 90% φm SUB 0% 0% (A bias generated within the CCD) tr twh tf 7 φsub φm

8 ICX0AL Relative Response Clock Switching Characteristics Item Symbol twh twl tr tf Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit Remarks Readout clock T µs During readout ertical transfer clock φ, φa, φb, φ 0 ns Horizontal transfer clock During imaging During parallel-serial conversion Hφ Hφ Hφ Hφ ns µs Reset gate clock φrg ns Substrate clock φsub µs During drain charge When vertical transfer clock driver CXD67AN is used. tf tr ns, and the cross-point voltage (CR) for the Hφ rising side of the Hφ and Hφ waveforms must be at least φh/ []. two Item Symbol Unit Min. Typ. Max. Horizontal transfer clock Hφ, Hφ 6 0 ns Remarks Spectral Sensitivity Characteristics (excludes lens characteristics and light source characteristics) Wave Length [nm]

9 ICX0AL Image Sensor Characteristics (Ta = C) Item Symbol Min. Typ. Max. Unit Measurement method Remarks Sensitivity S 60 0 m /0s accumulation Saturation signal sat 0 m Ta = 60 C Smear Sm % No electronic shutter ideo signal shading SH 0 % % Zone 0 and I Zone 0 to II' Dark signal dt 6 m Ta = 60 C Dark signal shading Δdt m 6 Ta = 60 C Lag Lag 0. % 7 Zone Definition of ideo Signal Shading 6 9 (H) 6 H 0 H 00 () Zone 0, I Zone II, II' 0 Ignored region Effective pixel region Measurement System CCD signal output [ A] CCD C.D.S AMP S/H Signal output [ B] Note) Adjust the amplifier gain so that the gain between [ A] and [ B] equals. 9

10 ICX0AL Image Sensor Characteristics Measurement Method Readout modes The diagram below shows the output methods for the following two readout modes. Progressive scan mode High frame rate readout mode OUT OUT Note) Blacked out portions in the diagram indicate pixels which are not read out. Output starts from the line in high frame rate readout mode.. Progressive scan mode In this mode, all pixel signals are output in non-interlace format in /7.s. The vertical resolution is approximately 0T-lines and all pixel signals within the same exposure period are read out simultaneously, making this mode suitable for high resolution image capturing.. High frame rate readout mode All effective areas are scanned in approximately /0s by reading out two out of eight lines (st and th lines, 9th and th lines). The vertical resolution is approximately 6T-lines. This readout mode emphasizes processing speed over vertical resolution. 0

11 ICX0AL Measurement conditions ) In the following measurements, the device drive conditions are at the typical values of the progressive scan mode, bias and clock voltage conditions. ) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value measured at point [ B] of the measurement system. Definition of standard imaging conditions ) Standard imaging condition I: Use a pattern box (luminance : 706cd/m, color temperature of 00K halogen source) as a subject. (pattern for evaluation is not applicable.) Use a testing standard lens with CM00S (t =.0mm) as an IR cut filter and image at F. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. ) Standard imaging condition II: Image a light source (color temperature of 00K) with a uniformity of brightness within % at all angles. Use a testing standard lens with CM00S (t =.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm.. Sensitivity Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of /0s, measure the signal output (S) at the center of the screen, and substitute the value into the following formula. S = S 0 0 [m]. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 0 times the intensity with the average value of the signal output, 0m, measure the minimum value of the signal output.. Smear Set to standard imaging condition II. With the lens diaphragm at F.6 to F, first adjust the luminous intensity to 00 times the intensity with the average value of the signal output, 0m. Then after the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value (sm [m]) of the signal output and substitute the value into the following formula. sm Sm = 00 [%] (/0 method conversion value) ideo signal shading Set to standard imaging condition II. With the lens diaphragm at F.6 to F, adjust the luminous intensity so that the average value of the signal output is 0m. Then measure the maximum (max [m]) and minimum (min [m]) values of the signal output and substitute the values into the following formula. SH = (max min)/0 00 [%]. Dark signal Measure the average value of the signal output (dt [m]) with the device ambient temperature 60 C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference.

12 ICX0AL 6. Dark signal shading After measuring, measure the maximum (dmax [m]) and minimum (dmin [m]) values of the dark signal output and substitute the values into the following formula. Δdt = dmax dmin [m] 7. Lag Adjust the signal output value generated by strobe light to 0m. After setting the strobe light so that it strobes with the following timing, measure the residual signal (lag). Substitute the value into the following formula. Lag = (lag/0) 00 [%] D A Strobe light timing Light Output Signal output 0m lag (Lag)

13 ICX0AL Drive Circuit X XA XSG XSUB H H RG CXD67AN /0 / 00k Hφ Hφ φrg L DD φ φa φb φ OUT ICX0 (Bottom iew) 0. /6 M 0. 00P / k CCD OUT SK 00 φsub CSUB.0 X XB XSG CXD67AN 0.

14 ICX0AL Sensor Readout Clock Timing Chart Progressive Scan Mode X XA/XB X XSG/XSG HD.µs (00 bits) A/B 9ns ( bits) Sensor readout clocks XSG and XSG are used by composing XA and XB..9µs (0 bits)

15 ICX0AL Sensor Readout Clock Timing Chart High Frame Rate Readout Mode X XA/XB X XSG XSG Sensor readout clock XSG is used by composing XA. HD 9ns ( bits).9µs (0 bits).µs (00 bits) A B.0µs (7 bits) bits bits.7µs ( bits)

16 ICX0AL Drive Timing Chart (ertical Sync) Progressive Scan Mode D HD A B CCD OUT

17 ICX0AL Drive Timing Chart (ertical Sync) High Frame Rate Readout Mode /0s /0s D HD A B CCD OUT

18 ICX0AL Drive Timing Chart (Horizontal Sync) Progressive Scan Mode HD 96 CLK Hφ Hφ φ 96 φa 96 φb 96 φ 6 96 SUB 96 6 RGφ

19 ICX0AL Drive Timing Chart (Horizontal Sync) High Frame Rate Readout Mode 96 HD 6 CLK Hφ Hφ φ φa φb φ SUB 9 6 RGφ

20 ICX0AL Notes on Handling ) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. ) Soldering a) Make sure the package temperature does not exceed 0 C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 0W soldering iron and solder each pin in less than seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. ) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. ) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the package.) Upper ceramic 9N 9N 9N 0.9Nm Lower ceramic Low melting point glass Compressive strength Shearing strength Tensile strength Torsional strength 0

21 ICX0AL b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portions. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to other locations as a precaution. d) The upper and lower ceramic are joined by low melting point glass. Therefore, care should be taken not to perform the following actions as this may cause cracks. Applying repeated bending stress to the outer leads. Heating the outer leads for an extended period with a soldering iron. Rapidly cooling or heating the package. Applying any load or impact to a limited portion of the low melting point glass using tweezers or other sharp tools. Prying at the upper or lower ceramic using the low melting point glass as a fulcrum. Note that the same cautions also apply when removing soldered products from boards. e) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) ) Others a) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition exceeding the normal using condition, consult our company. b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions.

22 ~ 7... ~ ~ ICX0AL Package Outline Unit: mm 0 pin DIP (600mil) (.0) (.7) 0 0 to A 0 C (R0.7) φ. B. (.0). ± 0. H ± B'. A is the center of the effective image area..6. The two points B of the package are the horizontal reference. The point B' of the package is the vertical reference.. The bottom C of the package is the height reference.. The center of the effective image area, relative to B and B' is (H, ) = (9.0, 7.) ± 0.mm The rotation angle of the effective image area relative to H and is ± The height from the bottom C to the effective image area is. ± 0.mm..0 ± 0.. ± 0. M The tilt of the effective image area relative to the bottom C is less than 60µm.. The thickness of the cover glass is 0.7mm, and the refractive index is.. PACKAGE STRUCTURE 9. The notch and the hole on the bottom must not be used for reference of fixing. Cer-DIP PACKAGE MATERIAL TIN PLATING LEAD TREATMENT LEAD MATERIAL ALLOY PACKAGE MASS.60g DRAWING NUMBER AS-B-0(E) Sony Corporation