Diagonal 11 mm (Type 2/3) Progressive Scan CCD Image Sensor with Square Pixel for B/W Cameras

Transcription

1 ICXAL Diagonal mm (Type /) Progressive Scan CCD Image Sensor with Square Pixel for B/W Cameras Description The ICXAL is a diagonal mm (Type /) interline CCD solid-state image sensor with a square pixel array. High sensitivity and low smear are achieved through the adoption of EXview HAD CCD technology. Progressive scan allows all pixel s signals to be output independently within approximately / second. Also, the adoption of high frame rate readout mode supports 0 frames per second. This chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still images without a mechanical shutter. This chip is suitable for image input applications such as still cameras which require high resolution, etc. 0 pin DIP (Ceramic) Features Progressive scan allows individual readout of the image signals from all pixels. High horizontal and vertical resolution (both approximately 0 T-lines) still images without a mechanical shutter Supports high frame rate readout mode (effective lines output, 0 frame/s) Square pixel Aspect ratio: : Horizontal drive frequency:. MHz Pin High sensitivity, low smear Low dark current, excellent anti-blooming characteristics Continuous variable-speed shutter Horizontal register:.0 drive Device Structure Interline CCD image sensor Image size: Diagonal mm (Type /) Total number of pixels: (H) 00 () approx..0m pixels Number of effective pixels: (H) 00 () approx..m pixels Number of active pixels: 0 (H) 0 () approx..0m pixels Chip size: 0. mm (H). mm () Unit cell size: Optical black: Number of dummy bits: Horizontal 0 ertical Substrate material: Silicon. µm (H). µm () Horizontal (H) direction: Front pixels, rear 0 pixels ertical () direction: Front pixels, rear pixels Pin H 0 Optical black position (Top iew) * EXview HAD CCD is a trademark of Sony Corporation. EXview HAD CCD is a CCD that drastically improves light efficiency by including near infrared light region as a basic structure of HAD (Hole-Accumulation-Diode) sensor. Sony reserves the right to change products and specifications without prior notice. This information does not convery any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. E00Y-TE

2 ICXAL Block Diagram and Pin Configuration (Top iew) 0 0 OUT DD φrg Hφ Hφ φsub CSUB L Hφ Hφ ertical register GND GND φ φ NC NC φb NC φa φ Horizontal register Note) Note) : Photo sensor Pin Description Pin No. Symbol Description Pin No. Symbol Description φ ertical register transfer clock OUT Signal output φa ertical register transfer clock DD Supply voltage NC φrg Reset gate clock φb ertical register transfer clock Hφ Horizontal register transfer clock NC Hφ Horizontal register transfer clock NC φsub Substrate clock φ ertical register transfer clock CSUB Substrate bias * φ ertical register transfer clock L Protective transistor bias GND GND Hφ Horizontal register transfer clock 0 GND GND 0 Hφ Horizontal register transfer clock * DC bias is generated within the CCD, so that this pin should be grounded externally through a capacitance of 0.µF.

3 ICXAL Absolute Maximum Ratings Item Ratings Unit Remarks DD, OUT, φrg φsub 0 to + φa, φb φsub 0 to + Against φsub φ, φ, φ, L φsub 0 to +0. Hφ, Hφ, GND φsub 0 to +0. CSUB φsub to DD, OUT, φrg, CSUB GND 0. to + Against GND φ, φa, φb, φ, φ GND 0 to + Hφ, Hφ GND 0 to +. Against L φa, φb L φ, φ, φ, Hφ, Hφ, GND L 0. to + 0. to + Between input clock pins oltage difference between vertical clock input pins Hφ Hφ Hφ, Hφ φ to +. to +. 0 to + * Storage temperature to +0 C Performance guarantee temperature 0 to +0 C Operating temperature 0 to + C * + (Max.) when clock width < 0 µs, clock duty factor < 0.%. + (Max.) is guaranteed for power-on and power-off. Bias Conditions Item Symbol Min. Typ. Max. Unit Remarks Supply voltage DD..0. Protective transistor bias L * Substrate clock φsub * Reset gate clock φrg * DC characteristics Item Symbol Min. Typ. Max. Unit Remarks Supply current IDD ma * L setting is the L voltage of the vertical clock waveform, or the same voltage as the L power supply for the driver should be used. * Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated within the CCD.

4 ICXAL Clock oltage Conditions Item Symbol Min. Typ. Max. Unit Waveform diagram Remarks Readout clock voltage T..0. H, H H = (H + H)/ H, H L, L, L, L..0. L = (L + L)/ ertical transfer clock voltage φ H H H H φ = Hn Ln (n = to ) HH. High-level coupling HL. High-level coupling LH. Low-level coupling LL 0. Low-level coupling Horizontal transfer clock voltage φh HL CR. 0.0 φh/ Cross-point voltage Reset gate clock voltage φrg RGLH RGLL RGL RGLm Low-level coupling Low-level coupling Substrate clock voltage φsub..0.

5 ICXAL Clock Equivalent Circuit Constants Item Symbol Min. Typ. Max. Unit Remarks Cφ 00 CφA 00 Capacitance between vertical transfer clock and GND CφB 000 Cφ 00 Cφ 000 CφA 0 CφB 0 CφA 0 Capacitance between vertical transfer clocks CφB Cφ 0 00 Cφ CφA 0 CφB 0 Capacitance between horizontal transfer clock and GND CφH CφH Capacitance between horizontal transfer clocks CφHH Capacitance between reset gate clock and GND CφRG Capacitance between substrate clock and GND CφSUB 0 R, R Ω ertical transfer clock series resistor RA, RB Ω R 0 Ω ertical transfer clock ground resistor RGND 0 Ω Horizontal transfer clock series resistor RφH. Ω Reset gate clock ground resistor RφRG Ω φ Hφ RφH RφH Hφ CφB Cφ R Cφ Hφ RφH CφHH RφH Hφ φ R Cφ CφB CφB RB φb CφH CφH Cφ Horizontal transfer clock equivalent circuit CφA CφA RA RGND CφA CφB Cφ R RGφ RφRG CφRG φa CφA φ ertical transfer clock equivalent circuit Reset gate clock equivalent circuit

6 ICXAL Drive Clock Waveform Conditions () Readout clock waveform 00% 0% φm 0% T φm 0% tr twh tf 0 () ertical transfer clock waveform φ φ H HH HH HH HH H HL HL H HL H HL LH LH L L LL L L LL φa, φb φ H HH H HH HH HH H HL HL HL H HL L LH L LH LL LL L L H = (H + H)/ L = (L + L)/ φ = Hn Ln (n = to )

7 ICXAL () Horizontal transfer clock waveform tr twh tf Hφ 0% CR 0% φh φh twl Hφ HL two Cross-point voltage for the Hφ rising side of the horizontal transfer clocks Hφ and Hφ waveforms is CR. The overlap period for twh and twl of horizontal transfer clocks Hφ and Hφ is two. () Reset gate clock waveform tr twh tf RG waveform RGH twl φrg Point A RGLH RGLL RGLm RGL RGLH is the maximum value and RGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, RGL is the average value of RGLH and RGLL. RGL = (RGLH + RGLL)/ Assuming RGH is the minimum value during the interval twh, then: φrg = RGH RGL Negative overshoot level during the falling edge of RG is RGLm. () Substrate clock waveform 00% 0% φm 0% φsub φm SUB 0% tr twh tf (A bias generated within the CCD)

8 ICXAL Clock Switching Characteristics (Horizontal drive frequency:. MHz) twh twl tr tf Item Symbol Unit Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Readout clock T µs φ, φ, ertical transfer clock 0 ns φ, φ Hφ During imaging ns Hφ During parallelserial conversion Hφ Hφ µs Reset gate clock φrg ns Horizontal transfer clock Substrate clock φsub µs Remarks During readout When using CXD0N rf rf ns During drain charge Item Symbol two Unit Min. Typ. Max. Remarks Horizontal transfer clock Hφ, Hφ 0 ns Spectral Sensitivity Characteristics (excludes lens characteristics and light source characteristics) Relative Response Wave Length [nm]

9 ICXAL Image Sensor Characteristics (Ta = C) Item Symbol Min. Typ. Max. Unit Measurement method Remarks Sensitivity S 00 0 m / s accumulation Sensitivity S 000 m / s accumulation Saturation signal sat 0 m Ta = 0 C Smear Sm 0 00 db Progressive scan mode High frame rate readout mode ideo signal shading SH 0 % Zone 0 and I Zone 0 to II' Dark signal dt m Ta = 0 C, frame/s Dark signal shading dt m Ta = 0 C, frame/s, * Lag Lag 0. % * Excludes vertical dark signal shading caused by vertical register high-speed transfer. Zone Definition of ideo Signal Shading (H) H 0 H 00 () Zone 0, I Zone II, II' 0 Ignored region Effective pixel region Measurement System CCD signal output [*A] CCD C.D.S AMP S/H Signal output [*B] Note) Adjust the amplifier gain so that the gain between [*A] and [*B] equals.

10 ICXAL Image Sensor Characteristics Measurement Method Readout modes The diagram below shows the output methods for the following two readout modes. Progressive scan mode High frame rate readout mode 0 0 OUT OUT Note) Blacked out portions in the diagram indicate pixels which are not read out. Output starts from line in high frame rate readout mode.. Progressive scan mode In this mode, all pixel signals are output in non-interlace format in / s. All pixel signals within the same exposure period are read out simultaneously, making this mode suitable for high resolution image capturing.. High frame rate readout mode All effective areas are scanned in approximately /0 s by reading out two out of eight lines (st and th lines, th and th lines, and so on). The vertical resolution is approximately T-lines. This readout mode emphasizes processing speed over vertical resolution. 0

11 ICXAL Measurement conditions () In the following measurements, the substrate voltage is set to the value indicated on the device, and the device drive conditions are at the typical values of the progressive scan mode, bias and clock voltage conditions. () In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value measured at point [*B] of the measurement system. Definition of standard imaging conditions () Standard imaging condition I: Use a pattern box (luminance: 0 cd/m, color temperature of 0K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM00S (t =.0 mm) as an IR cut filter and image at F. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. () Standard imaging condition II: This indicates the standard imaging condition I with the IR cut filter removed. () Standard imaging condition III: Image a light source (color temperature of 0K) with a uniformity of brightness within % at all angles. Use a testing standard lens with CM00S (t =.0 mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm.. Sensitivity Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of /00 s, measure the signal output (S) at the center of the screen, and substitute the value into the following formula. 00 S = S [m]. Sensitivity Set to standard imaging condition II. After selecting the electronic shutter mode with a shutter speed of /00 s, measure the signal output (S) at the center of the screen, and substitute the value into the following formula. 00 S = S [m]. Saturation signal Set to standard imaging condition III. After adjusting the luminous intensity to 0 times the intensity with the average value of the signal output, 00 m, measure the minimum value of the signal output.. Smear Set to standard imaging condition III. With the lens diaphragm at F. to F, first adjust the luminous intensity to 00 times the intensity with the average value of signal output, 00 m. Then after the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value (sm [m]) of the signal output and substitute the value into the following formula. Sm = 0 log sm [db] (/0 method conversion value)

12 ICXAL. ideo signal shading Set to standard imaging condition III. With the lens diaphragm at F. to F, adjust the luminous intensity so that the average value of the signal output is 00 m. Then measure the maximum (max [m]) and minimum (min [m]) values of the signal output and substitute the values into the following formula. SH = (max min)/00 00 [%]. Dark signal Measure the average value of the signal output (dt [m]) with the device ambient temperature 0 C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference.. Dark signal shading After measuring, measure the maximum (dmax [m]) and minimum (dmin [m]) values of the dark signal output and substitute the values into the following formula. dt = dmax dmin [m]. Lag Adjust the signal output generated by strobe light to 00 m. After setting the strobe light so that it strobes with the following timing, measure the residual signal (lag). Substitute the value into the following formula. Lag = (lag/00) 00 [%] D Strobe light timing Light Signal output 00 m lag (lag) Output

13 ICXAL 0 φ φa NC φb NC NC φ φ GND GND ICX (BOTTOM IEW) Hφ Hφ L CSUB φsub Hφ Hφ φrg DD OUT 0 0. CXD0N (TOP IEW).0 XSUB X X XSGB / 0 00k /0./ 0. MΩ 0.0 SC0.k Drive Circuit /0 CCD OUT XSGA X X XSUB Hφ Hφ φrg

14 ICXAL Drive Timing Chart (ertical Sync) Progressive Scan Mode D HD "a" A B 0 00 CCD OUT

15 ICXAL Drive Timing Chart (ertical Sync "a" Enlarged) Progressive Scan Mode H 0 0 HD. µ sec (00 bits) 0 A 0 nsec ( bits). µ sec (00 bits) B 0

16 ICXAL Drive Timing Chart (Horizontal Sync) Progressive Scan Mode SHD φ CLK Hφ Hφ RGφ SHP φa φb φ φ 0 SUB

17 ICXAL D HD Drive Timing Chart (ertical Sync) High Frame Rate Readout Mode "a" "a" A B CCD OUT

18 ICXAL Drive Timing Chart (ertical Sync "a" Enlarged) High Frame Rate Readout Mode H nsec ( bits) HD. µ sec (00 bits). µ sec (00 bits) A B

19 ICXAL 0 Drive Timing Chart (Horizontal Sync) High Frame Rate Readout Mode CLK Hφ Hφ RGφ SHP 0 SHD φ φa φb 0 0 φ φ SUB 0

20 ICXAL Notes on Handling ) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. ) Soldering a) Make sure the package temperature does not exceed 0 C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground W soldering iron and solder each pin in less than seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. ) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. ) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition exceeding the normal using condition, consult our company. ) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. ) CCD image sensors are precise optical equipment that should not be subject to too much mechanical shocks. 0

21 ICXAL 0. Package Outline Unit: mm.0 ~ -.0 R.0 -. ± ± ± (AT STAND OFF) ~ C.0 ± 0..0 ± 0. -φ A B φ (Reference Hole) ± 0. Pin Index M PACKAGE STRUCTURE PACKAGE MATERIAL Ceramic LEAD TREATMENT GOLD PLATING LEAD MATERIAL ALLOY PACKAGE MASS.0g DRAWING NUMBER AS-A-0(E) 0 pin DIP (00mil) 0 to D (Elongated Hole). "A" is the center of the effective image area.. The straight line B which passes through the center of the reference hole and the elongated hole is the reference axis of vertical direction ().. The straight line C which passes through the center of the reference hole at a right angle to vertical reference line B is the reference axis of horizontal direction (H).. The two points D on the package bottom are the height reference.. The center of the effective image area relative to the reference hole is (H, ) = (.,.0) ± 0. mm.. The rotation angle of the effective image area relative to line B is ±.. The height from the bottom D to the effective image area is. ± 0. mm.. The tilt of the effective image area relative to the bottom D is 0 µm or less.. The thickness of the seal glass is 0. mm (actual dimension), and the refractive index is.. Sony Corporation