1/3-inch CCD Image Sensor for CCIR Black-and-White Video Camera. Optical black: Horizontal (H) direction: Front 3 pixels, rear 40 pixels

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1 /-inch CCD Image Sensor for CCIR Black-and-White ideo Camera Description The ICX09CL is an interline CCD solid-state image sensor suitable for CCIR black-and-white video cameras. Compared with the current product ICX09AL, sensitivity is improved drastcally through the adoption of Super HAD CCD technology. This chip features a field period readout system and an electronic shutter with variable charge-storage time. 6 pin DIP (Plastic) Features High sensitivity (+db at F8, +db at F. compared with ICX09AL) High resolution, low smear and low dark current Excellent antiblooming characteristics Continuous variable-speed shutter Horizontal register: Reset gate: Device Structure Interline CCD image sensor Optical size: Number of effective pixels: Number of total pixels: Chip size: Unit cell size: drive drive /-inch format 7 (H) 8 () approx. 0K pixels 79 (H) 96 () approx. 70K pixels 6.00mm (H).96mm () 6.0µm (H) 6.µm () Optical black: Horizontal (H) direction: Front pixels, rear 0 pixels ertical () direction: Number of dummy bits: Horizontal Substrate material: ertical (even field only) Silicon Front pixels, rear pixels Pin Pin 9 H 0 Optical black position (Top iew) Super HAD CCD is a trademark of Sony Corporation. Super HAD CCD is a CCD that drastically improves sensitivity by introducing newly developed semiconductor technology by Sony Corporation into Sony's high-performance HAD (Hole-Accumulation Diode) sensor. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. E97X-PS

2 DD GND SUB RG Hφ Hφ ertical register OUT SS GG GND φ φ φ ICX09CL Block Diagram and Pin Configuration (Top iew) φ Note) Horizontal register Note) : Photo sensor Pin Description L LHφ Pin No. Symbol Description Pin No. Symbol Description φ φ φ φ GND GG SS OUT ertical register transfer clock ertical register transfer clock ertical register transfer clock ertical register transfer clock GND Output amplifier gate bias Output amplifier source Signal output DD GND SUB L RG LHφ Hφ Hφ Output amplifier drain supply GND Substrate (Overflow drain) Protective transistor bias Reset gate clock Horizontal register final stage transfer clock Horizontal register transfer clock Horizontal register transfer clock Absolute Maximum Ratings Item Ratings Unit Remarks Substrate voltage SUB GND 0. to + Supply voltage DD, OUT, SS GND DD, OUT, SS SUB 0. to +8 to +0 ertical clock input voltage φ, φ, φ, φ GND φ, φ, φ, φ SUB to +0 to +0 oltage difference between vertical clock input pins to + oltage difference between horizontal clock input pins to +7 Hφ, Hφ φ 7 to +7 Hφ, Hφ, LHφ, RG, GG GND 0 to + Hφ, Hφ, LHφ, RG, GG SUB to +0 L SUB 6 to +0. φ, φ, φ, φ, DD, OUT L 0. to +0 RG L 0. to + GG, SS, Hφ, Hφ, LHφ L 0. to +0 Storage temperature 0 to +80 C Operating temperature 0 to +60 C +7 (Max.) when clock width < 0µs, clock duty factor < 0.%.

3 Bias Conditions Item Output amplifier drain voltage Output amplifier gate voltage Output amplifier source Substrate voltage adjustment range Fluctuation range after substrate voltage adjustment Reset gate clock voltage adjustment range Fluctuation range after reset gate clock voltage adjustment Protective transistor bias Symbol Min. Typ. Max. Unit Remarks DD GG SS SUB ΔSUB RGL ΔRGL L Grounded with 80Ω resistor % % ±%, 6 DC Characteristics Item Output amplifier drain current Input current Input current Symbol Min. Typ. Max. Unit Remarks IDD IIN IIN ma µa 0 µa Indications of substrate voltage (SUB) reset gate clock voltage (RGL) setting value. The setting values of substrate voltage and reset gate clock voltage are indicated on the back of the image sensor by a special code. Adjust substrate voltage (SUB) and reset gate clock voltage (RGL) to the indicated voltage. Fluctuation range after adjustment is ±%. RGL code SUB code one character indication RGL code one character indication RGL code SUB code Code and optimal setting correspond to each other as follows. 6 7 Optimal setting SUB code E f G h J K L m N P Q R S T U W X Y Z Optimal setting <Example> L RGL =.0 SUB =.0 L setting is the L voltage of the vertical transfer clock waveform. ) Current to each pin when 8 is applied to DD, OUT, ss and SUB pins, while pins that are not tested are grounded. ) Current to each pin when 0 is applied sequentially to φ, φ, φ and φ pins, while pins that are not tested are grounded. However, 0 is applied to SUB pin. ) Current to each pin when is applied sequentially to RG, LHφ, Hφ, Hφ and GG pins, while pins that are not tested are grounded. However, is applied to SUB pin. ) Current to L pin when 0 is applied to φ, φ, φ, φ, DD and OUT pins or when, is applied to RG pin or when, 0 is applied to GG, ss, Hφ, Hφ and LHφ pins, while L pin is grounded. However, GND and SUB pins are left open. Current to SUB pin when is applied to SUB pin, while pins that are not tested are grounded.

4 Clock oltage Conditions Item Symbol Min. Typ. Max. Unit Waveform diagram Remarks Readout clock voltage T..0. H, H H = (H + H)/ H, H L, L, L, L L = (L + L)/ φ φ = Hn Ln (n = to ) ertical transfer clock voltage H H H H H H 0. HH High-level coupling HL High-level coupling LH Low-level coupling LL Low-level coupling Horizontal transfer clock voltage φh, φlh HL, LHL Reset gate clock voltage φrg RGLH RGLL Low-level coupling Substrate clock voltage φsub... 6 The horizontal final stage transfer clock input pin LHφ is connected to the horizontal transfer clock input pin Hφ. The reset gate clock voltage need not be adjusted when reset gate clock is driven when the specifications are as given below. In this case, the reset gate clock voltage setting indicated on the back of the image sensor has not significance. Item Symbol Min. Typ. Max. Unit Waveform diagram Remarks Reset gate clock voltage RGL φrg

5 Clock Equivalent Circuit Constant Item Capacitance between vertical transfer clock and GND Capacitance between vertical transfer clocks Capacitance between horizontal transfer clock and GND Capacitance between horizontal transfer clocks Capacitance between horizontal final stage transfer clock and GND Capacitance between reset gate clock and GND Capacitance between substrate clock and GND ertical transfer clock series resistor ertical transfer clock ground resistor Horizontal transfer clock series resistor Cφ, Cφ Cφ, Cφ Cφ, Cφ Cφ, Cφ Cφ Cφ CφH, CφH CφHH CφLH CφRG CφSUB R, R, R, R 80 Ω RGND Symbol Min. Typ. Max. Unit Remarks Ω RφH Ω φ φ R Cφ R Cφ Cφ Hφ RφH CφHH RφH Hφ Cφ Cφ CφH CφH Cφ R Cφ RGND Cφ Cφ Cφ R φ φ ertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit

6 Drive Clock Waveform Conditions () Readout clock waveform 00% 90% II II φm 0% 0% T tr twh tf φm 0 () ertical transfer clock waveform φ φ H HH H HH HH HH H HL HL HL H HL L LH L LH L LL L LL φ φ HH HH H H HH HH H HL HL HL H HL LH L LH L LL L LL L H = (H + H)/ L = (L + L)/ φ = Hn Ln (n = to ) 6

7 () Horizontal transfer clock waveform tr twh tf 90% φh twl 0% HL () Reset gate clock waveform tr twh tf RGH twl RG waveform RGLH RGLL Point A φrg RGL + RGL LHφ waveform. RGLH is the maximum value and RGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, RGL is the average value of RGLH and RGLL. RGL = (RGLH + RGLL)/ Assuming RGH is the minimum value during the interval twh, then: φrg = RGH RGL 7

8 () Substrate clock waveform 00% 90% φm SUB 0% 0% φsub tr twh tf φm Clock Switching Characteristics Note) Because the horizontal final stage transfer clock LHφ is connected to the horizontal transfer clock Hφ, specifications will be the same as Hφ. Item Symbol twh twl tr tf Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit Remarks Readout clock T.. µs During readout ertical transfer clock φ, φ, φ, φ 0 ns Horizontal transfer clock During imaging During parallel-serial conversion Hφ, LHφ Hφ Hφ, LHφ Hφ ns µs Reset gate clock φrg ns Substrate clock φsub..8 µs During drain charge When vertical transfer clock driver CXD67AN is used. tf tr ns, and the cross-point voltage (CR) for the Hφ LHφ rising side of the Hφ LHφ and Hφ waveforms must be at least.. Item Symbol two Min. Typ. Max. Unit Remarks Horizontal transfer clock Hφ LHφ, Hφ 6 0 ns The overlap period for twh and twl of horizontal transfer clocks Hφ LHφ and Hφ is two. 8

9 Image Sensor Characteristics (Ta = C) Item Sensitivity Saturation signal Smear ideo signal shading Dark signal Dark signal shading Flicker Lag Symbol Min. Typ. Max. Unit Measurement method Remarks S sat m m Sm % SH 0 % % dt Δdt F Lag m m % % Ta = 60 C Zone 0 and I Zone 0 to II Ta = 60 C 6 Ta = 60 C 7 8 Zone Definition of ideo Signal Shading 7 (H) H 8 0 H () Zone 0, I Zone II, II' 6 0 Ignored region Effective pixel region 9

10 Image Sensor Characteristics Measurement Method Measurement conditions ) In the following measurements, the substrate voltage and the reset gate clock voltage are set to the values indicated on the device, and the device drive conditions are at the typical values of the bias and clock voltage conditions. ) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black (OB) level is used as the reference for the signal output, and the value measured at point [ A] in the drive circuit example is used. Definition of standard imaging conditions ) Standard imaging condition I: Use a pattern box (luminance 706cd/m, color temperature of 00K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM00S (t =.0mm) as an IR cut filter and image at F8. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. ) Standard imaging condition II: Image a light source (color temperature of 00K) with a uniformity of brightness within % at all angles. Use a testing standard lens with CM00S (t =.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm.. Sensitivity Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of /0s, measure the signal output (s) at the center of the screen and substitute the value into the following formula. S = s 0 0 [m]. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 0 times the intensity with average value of the signal output, 00m, measure the minimum value of the signal output.. Smear Set to standard imaging condition II. With the lens diaphragm at F.6 to F8, adjust the luminous intensity to 00 times the intensity with average value of the signal output, 00m. When the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value Sm [m] of the signal output and substitute the value into the following formula. Sm = Sm [%] (/0 method conversion value). ideo signal shading Set to standard imaging condition II. With the lens diaphragm at F.6 to F8, adjust the luminous intensity so that the average value of the signal output is 00m. Then measure the maximum (max [m]) and minimum (min [m]) values of the signal output and substitute the values into the following formula. SH = (max min)/00 00 [%]. Dark signal Measure the average value of the signal output (dt [m]) with the device ambient temperature 60 C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 0

11 6. Dark signal shading After measuring, measure the maximum (dmax [m]) and minimum (dmin [m]) values of the dark signal output and substitute the values into the following formula. Δdt = dmax dmin [m] 7. Flicker Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the signal output is 00m, and then measure the difference in the signal level between fields (Δf [m]). Then substitute the value into the following formula. F = (Δf/00) 00 [%] 8. Lag Adjust the signal output value generated by strobe light to 00m. After setting the strobe light so that it strobes with the following timing, measure the residual signal (lag). Substitute the value into the following formula. Lag = (lag/00) 00 [%] FLD SG Strobe light timing Light Signal output 00m lag (lag) Output

12 Hφ Hφ LHφ RG L SUB GND DD φ φ φ φ GND /6. ICX09CL SUB XSUB X X XSG X XSG X Hφ Hφ RG CXD67AN / /6 0 /0 SA7 0k 00k 7k 0. 0/6 00k 0.0 9k 00k /6 80 7/6. 00 SK.9k p./0 M 8. [ A] CCD OUT GG SS OUT Drive Circuit ICX09 (BOTTOM IEW)

13 Relative Response ICX09CL Spectral Sensitivity Characteristics (Includes lens characteristics, excludes light source characteristics) Wave Length [nm] Sensor Readout Clock Timing Chart HD. Odd Field Even Field Unit : µs

14 ICX09CL Drive Timing Chart (ertical Sync) FLD D BLK HD SG SG CCD OUT CLP

15 ICX09CL Drive Timing Chart (Horizontal Sync) HD BLK H/LH H RG SHP SHD CLP SUB

16 Notes on Handling ) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. ) Soldering a) Make sure the package temperature does not exceed 80 C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 0W soldering iron and solder each pin in less than seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. ) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. ) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the package.) Cover glass Plastic package N N Compressive strength Nm Torsional strength b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. 6

17 c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution. d) The notch of the package is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch of the package. e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) ) Others a) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition exceeding the normal using condition, consult our company. b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD characteristics. 7

18 .7. ± ± 0. ~ ± to 9. ~ ICX09CL Package Outline Unit: mm 6. B H. 0.. ± ~ 0.69 (For the first pin only).7 0. M PACKAGE STRUCTURE PACKAGE MATERIAL Plastic LEAD TREATMENT GOLD PLATING LEAD MATERIAL ALLOY PACKAGE WEIGHT 0.9g A 6pin DIP (0mil) D B' C A is the center of the effective image area. -R. The two points B of the package are the horizontal reference. The point B' of the package is the vertical reference.. The bottom C of the package, and the top of the cover glass D are the height reference The center of the effective image area relative to B and B' is (H, ) = (6.,.7) ± 0.mm.. The rotation angle of the effective image area relative to H and is ±. 6. The height from the bottom C to the effective image area is. ± 0.0mm. The height from the top of the cover glass D to the effective image area is.9 ± 0.mm. 7. The tilt of the effective image area relative to the bottom C is less than 0µm. The tilt of the effective image area relative to the top D of the cover glass is less than 0µm. 8. The thickness of the cover glass is 0.7mm, and the refractive index is.. 9. The notches on the bottom of the package are used only for directional index, they must not be used for reference of fixing. 8