ICX204AL. Diagonal 6mm (Type 1/3) Progressive Scan CCD Image Sensor with Square Pixel for B/W Cameras

Transcription

1 ICX0AL Diagonal 6mm (Type /) Progressive Scan CCD Image Sensor with Square Pixel for B/W Cameras Description The ICX0AL is a diagonal 6mm (Type /) interline CCD solid-state image sensor with a square pixel array and 800K effective pixels. Progressive scan allows all pixels' signals to be output independently. Also, the adoption of high frame rate readout mode supports 60 frames per second. This chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still image without a mechanical shutter. Further, high sensitivity and low dark current are achieved through the adoption of HAD (Hole- Accumulation Diode) sensors. This chip is suitable for applications such as FA cameras, two-dimensional bar-code reader, etc. Features Progressive scan allows individual readout of the image signals from all pixels. High horizontal and vertical resolution (both approx. 768T-lines) still image without a mechanical shutter. Supports high frame rate readout mode (effective 56 lines output, 5MHz drive: 5 frame/s, 0MHz drive: 60 frame/s) Square pixel Horizontal drive frequency: Typ.: 5MHz, Max.: 0MHz No voltage adjustments (reset gate and substrate bias are not adjusted.) High resolution, high sensitivity, low dark current Low smear, excellent antiblooming characteristics Continuous variable-speed shutter Recommended range of exit pupil distance: 0 to 00mm 6 pin DIP (Plastic) Pin Pin 9 H 0 Optical black position (Top iew) 7 Device Structure Interline CCD image sensor Image size: Diagonal 6mm (Type /) Total number of pixels: 077 (H) 788 () approx. 850K pixels Number of effective pixels: 0 (H) 779 () approx. 800K pixels Number of active pixels: 0 (H) 768 () approx. 790K pixels (diagonal 5.95mm) Chip size: 5.80mm (H).9mm () Unit cell size:.65µm (H).65µm () Optical black: Horizontal (H) direction: Front pixels, rear 0 pixels ertical () direction: Front 7 pixels, rear pixels Number of dummy bits: Horizontal 9 ertical Substrate material: Silicon Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. E98809A99

2 DD GND φsub CSUB L φrg Hφ Hφ ertical register OUT NC NC GND φa φ φb φ ICX0AL Block Diagram and Pin Configuration (Top iew) Note) Horizontal register Note) : Photo sensor Pin Description Pin No. Symbol Description Pin No. Symbol Description φ ertical register transfer clock 9 DD Supply voltage φb ertical register transfer clock 0 GND GND φ ertical register transfer clock φsub Substrate clock φa ertical register transfer clock CSUB Substrate bias 5 GND GND L Protective transistor bias 6 NC φrg Reset gate clock 7 NC 5 Hφ Horizontal register transfer clock 8 OUT Signal output 6 Hφ Horizontal register transfer clock DC bias is generated within the CCD, so that this pin should be grounded externally through a capacitance of 0.µF.

3 ICX0AL Absolute Maximum Ratings Item Ratings Unit Remarks DD, OUT, φrg φsub 0 to +0 φa, φb φsub 50 to +5 Against φsub φ, φ, L φsub 50 to +0. Hφ, Hφ, GND φsub 0 to +0. CSUB φsub 5 to DD, OUT, φrg, CSUB GND 0. to +8 Against GND φ, φa, φb, φ GND 0 to +8 Hφ, Hφ GND 0 to +5 Against L φa, φb L φ, φ, Hφ, Hφ, GND L 0. to to +5 Between input clock pins oltage difference between vertical clock input pins Hφ Hφ Hφ, Hφ φ to +5 5 to +5 to + Storage temperature Operating temperature + (Max.) when clock width < 0µs, clock duty factor < 0.%. +6 (Max.) is guaranteed for turning on or off power supply. 0 to to +60 C C

4 ICX0AL Bias Conditions Item Supply voltage Protective transistor bias Substrate clock Reset gate clock Symbol Min. Typ. Max. Unit Remarks DD L φsub φrg L setting is the L voltage of the vertical transfer clock waveform, or the same power supply as the L power supply for the driver should be used. Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated within the CCD. DC Characteristics Item Symbol Min. Typ. Max. Unit Remarks Supply current IDD 5.5 ma Clock oltage Conditions Item Symbol Min. Typ. Max. Unit Waveform diagram Remarks Readout clock voltage T H0A H = H0A H, HA, HB, H L, LA, LB, L L = (L + L)/ ertical transfer clock voltage φ, φa, φb, φ L L HH 0.9 High-level coupling HL. High-level coupling LH.0 Low-level coupling LL 0.9 Low-level coupling Horizontal transfer clock voltage φh HL Reset gate clock voltage φrg RGLH RGLL RGL RGLm Low-level coupling Low-level coupling Substrate clock voltage φsub

5 ICX0AL Clock Equivalent Circuit Constant Item Capacitance between vertical transfer clock and GND Capacitance between vertical transfer clocks Capacitance between horizontal transfer clock and GND Capacitance between horizontal transfer clocks Capacitance between reset gate clock and GND Capacitance between substrate clock and GND ertical transfer clock series resistor ertical transfer clock ground resistor Horizontal transfer clock series resistor Symbol Min. Typ. Max. Unit Remarks Cφ CφA CφB Cφ CφA CφB CφA CφB Cφ CφAB CφH, CφH CφHH CφRG CφSUB R RA RB R RGND Ω 68 Ω 6 Ω 0 Ω Ω RφH 0 Ω φ φa R CφA RA Hφ RφH RφH Hφ Cφ CφA CφHH CφB CφA CφH CφH CφAB RB RGND CφB Cφ CφB Cφ R φb φ ertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit 5

6 ICX0AL Drive Clock Waveform Conditions () Readout clock waveform T 00% 90% II II φm 0% T φm 0% tr twh tf 0 () ertical transfer clock waveform Note) Readout clock is used by composing vertical transfer clocks φa and φb. φ H HH H HL LH L0 L L LL φa, φb H0A, H0B HH HA, HB H HL LH LA, LB LL L φ H HH H HL L0 LH L LL H = H0A L = (L0 + L0) / L = L0 6 φ = H L0 φa = H0A LA φb = H0B LB φ = H L0

7 ICX0AL () Horizontal transfer clock waveform Hφ tr twh tf 90% CR 0% φh φh twl Hφ two HL Cross-point voltage for the Hφ rising side of the horizontal transfer clocks Hφ and Hφ waveforms is CR. The overlap period for twh and twl of horizontal transfer clocks Hφ and Hφ is two. () Reset gate clock waveform tr twh tf RG waveform RGH twl φrg Point A RGLH RGLL RGLm RGL RGLH is the maximum value and RGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, RGL is the average value of RGLH and RGLL. RGL = (RGLH + RGLL)/ Assuming RGH is the minimum value during the interval twh, then: φrg = RGH RGL. Negative overshoot level during the falling edge of RG is RGLm. (5) Substrate clock waveform 00% 90% φm φsub 0% SUB 0% (A bias generated within the CCD) tr twh tf φm 7

8 Relative Response ICX0AL Clock Switching Characteristics Item Symbol twh twl tr tf Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit Remarks Readout clock T µs During readout ertical transfer clock φ, φa, φb, φ 5 50 ns Horizontal transfer clock During imaging During parallel-serial conversion Hφ Hφ Hφ Hφ ns µs Reset gate clock φrg 7 0 ns Substrate clock φsub µs During drain charge When vertical transfer clock driver CXD67AN is used. tf tr ns, and the cross-point voltage (CR) for the Hφ rising side of the Hφ and Hφ waveforms must be at least φh/ []. Item Symbol two Min. Typ. Max. Unit Horizontal transfer clock Hφ, Hφ ns Remarks Spectral Sensitivity Characteristics (excludes lens characteristics and light source characteristics) Wave Length [nm] 8

9 ICX0AL Image Sensor Characteristics (Ta = 5 C) Item Symbol Min. Typ. Max. Unit Measurement method Remarks Sensitivity S m /0s accumulation Saturation signal sat 50 m Ta = 60 C Smear Sm % No electronic shutter ideo signal shading SH 0 5 % % Zone 0 and I Zone 0 to II' Dark signal dt 6 m 5 Ta = 60 C, 0 frame/s Dark signal shading dt m 6 Ta = 60 C, 0 frame/s Lag Lag 0.5 % 7 Zone Definition of ideo Signal Shading 0 (H) H 8 0 H () Zone 0, I Zone II, II' 5 0 Ignored region Effective pixel region Measurement System CCD signal output [ A] CCD C.D.S AMP S/H Signal output [ B] Note) Adjust the amplifier gain so that the gain between [ A] and [ B] equals. 9

10 ICX0AL Image Sensor Characteristics Measurement Method Readout modes The diagram below shows the output methods for the following two readout modes. Progressive scan mode High frame rate readout mode OUT OUT Note) Blacked out portions in the diagram indicate pixels which are not read out. Output starts from the line 7 in high frame rate readout mode.. Progressive scan mode In this mode, all pixel signals are output in non-interlace format in /0s. The vertical resolution is approximately 768T-lines and all pixel signals within the same exposure period are read out simultaneously, making this mode suitable for high resolution image capturing.. High frame rate readout mode All effective areas are scanned in approximately /60s by reading out one line for every three lines. The vertical resolution is approximately 56T-lines. This readout mode emphasizes processing speed over vertical resolution. 0

11 ICX0AL Measurement conditions ) In the following measurements, the device drive conditions are at the typical values of the progressive scan mode, bias and clock voltage conditions. ) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value measured at point [ B] of the measurement system. Definition of standard imaging conditions ) Standard imaging condition I: Use a pattern box (luminance: 706cd/m, color temperature of 00K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t =.0mm) as an IR cut filter and image at F8. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. ) Standard imaging condition II: Image a light source (color temperature of 00K) with a uniformity of brightness within % at all angles. Use a testing standard lens with CM500S (t =.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. ) Standard imaging condition III: Image a light source (color temperature of 00K) with a uniformity of brightness within % at all angles. Use a testing standard lens (exit pupil distance mm) with CM500S (t =.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm.. Sensitivity Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of /50s, measure the signal outputs (S) at the center of screen, and substitute the values into the following formulas. S = S 50 0 [m]. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 0 times the intensity with the average value of the signal output, 50m, measure the minimum values of the signal output.. Smear Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, first adjust the luminous intensity to 500 times the intensity with the average value of the signal output, 50m. Then after the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value (Sm [m]) of the signal output, and substitute the values into the following formula. Sm = sm 00 [%] (/0 method conversion value)

12 ICX0AL. ideo signal shading Set to standard imaging condition III. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so that the average value of the signal output is 50m. Then measure the maximum (max [m]) and minimum (min [m]) values of the signal output and substitute the values into the following formula. SH = (max min)/50 00 [%] 5. Dark signal Measure the average value of the signal output (dt [m]) with the device ambient temperature 60 C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 6. Dark signal shading After measuring 5, measure the maximum (dmax [m]) and minimum (dmin [m]) values of the dark signal output and substitute the values into the following formula. dt = dmax dmin [m] 7. Lag Adjust the signal output value generated by strobe light to 50m. After setting the strobe light so that it strobes with the following timing, measure the residual signal (lag). Substitute the value into the following formula. Lag = (lag/50) 00 [%] D A Strobe light timing Light Signal output 50m lag (lag) Output

13 Hφ Hφ φrg φ φb φ φa GND NC NC OUT ICX0AL 5 XSUB X XA XSG XB XSG X /0 /5 /6 00k p./6 M 7 SK875.8k./ CCD OUT L CSUB φsub GND DD Hφ Hφ φrg CXD67AN ICX0 (BOTTOM IEW) Drive Circuit

14 ICX0AL Sensor Readout Clock Timing Chart Progressive Scan Mode X XA/XB X XSG/XSG HD.µs (88 bits) A/B 0.µs ( bits) Sensor readout clocks XSG and XSG are used by composing XA and XB..55µs (5 bits)

15 ICX0AL Sensor Readout Clock Timing Chart High Frame Rate Readout Mode X XA/XB X XSG XSG Sensor readout clock XSG is used by composing XA. HD 0.µs ( bits).55µs (5 bits).µs (88 bits) A B 5.0µs (00 bits) 0 bits 8 bits.7µs (5 bits) 5

16 ICX0AL Drive Timing Chart (ertical Sync) Progressive Scan Mode D HD A B CCD OUT

17 ICX0AL Drive Timing Chart (ertical Sync) High Frame Rate Readout Mode FLD D BLK HD A B CCD OUT Note) ertical OB and aperture lines,, 775 and 778 are not output. 7

18 ICX0AL Drive Timing Chart (Horizontal Sync) Progressive Scan Mode HD BLK CLK RG SHP SHD A B H H 8 SUB µs Note) unit: 50ns 8

19 ICX0AL Drive Timing Chart (Horizontal Sync) High Frame Rate Readout Mode HD BLK CLK RG SHP SHD A B H H SUB Note) unit: 50ns 9

20 ICX0AL Notes on Handling ) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. ) Soldering a) Make sure the package temperature does not exceed 80 C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 0W soldering iron and solder each pin in less than seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. ) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. ) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the package.) Cover glass Plastic package 50N 50N Compressive strength.nm Torsional strength b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. 0

21 ICX0AL c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution. d) The notch of the package is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch of the package. e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) Others a) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition exceeding the normal using condition, consult our company. b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD characteristics.

22 .7.5 ± ± 0.5 ~ ± to 9.5 ~ ICX0AL 6pin DIP (50mil) 9 6. C R0.5. A is the center of the effective image area.. The two points B of the package are the horizontal reference. The point B' of the package is the vertical reference.. The bottom C of the package, and the top of the cover glass D are the height reference The center of the effective image area relative to B and B' is (H, ) = (6., 5.7) ± 0.5mm. 5. The rotation angle of the effective image area relative to H and is ±. 6. The height from the bottom C to the effective image area is. ± 0.0mm. The height from the top of the cover glass D to the effective image area is.9 ± 0.5mm. 7. The tilt of the effective image area relative to the bottom C is less than 50µm. The tilt of the effective image area relative to the top D of the cover glass is less than 50µm. B A D B' Package Outline Unit: mm H 0.. ± The thickness of the cover glass is 0.75mm, and the refractive index is The notches on the bottom of the package are used only for directional index, they must not be used for reference of fixing. ~ (For the first pin only) M 0. PACKAGE STRUCTURE Plastic PACKAGE MATERIAL GOLD PLATING LEAD TREATMENT ALLOY LEAD MATERIAL 0.9g PACKAGE WEIGHT