Diagonal 4.5mm (Type 1/4) CCD Image Sensor for PAL Color Video Cameras

Transcription

1 ICX09AK Diagonal.mm (Type /) CCD Image Sensor for PAL Color ideo Cameras Description The ICX09AK is an interline CCD solid-state image sensor suitable for PAL color video cameras. Compared with the current product ICX069AK, sensitivity and saturation signal are improved drastically through the adoption of Super HAD CCD technology. High resolution is achieved through the use of,,, and complementary color mosaic filters. This chip features a field period readout system and an electronic shutter with variable charge-storage time. The package is a mm-square -pin DIP (Plastic). Features High sensitivity (+db compared with ICX069AK) High saturation signal (+.db compared with ICX069AK) Horizontal register:. to.0 drive Reset gate:. to.0 drive No voltage adjustment (Reset gate and substrate bias are not adjusted.) High resolution, low smear and low dark current Excellent antiblooming characteristics Continuous variable-speed shutter Recommended range of exit pupil distance: 0 to 0mm,,, and complementary color mosaic filters on chip pin DIP (Plastic) Pin Pin 8 H 0 Optical black position (Top iew) Device Structure Interline CCD image sensor Image size: Diagonal.mm (Type /) Number of effective pixels: 7 (H) 8 () approx. 0K pixels Total number of pixels: 79 (H) 96 () approx. 70K pixels Chip size:.7mm (H).80mm () Unit cell size:.8µm (H).6µm () Optical black: Horizontal (H) direction: Front pixels, rear 0 pixels ertical () direction: Front pixels, rear pixels Number of dummy bits: Horizontal ertical (even fields only) Substrate material: Silicon Super HAD CCD is a registered trademark of Sony Corporation. Super HAD CCD is a CCD that drastically improves sensitivity by introducing newly developed semiconductor technology by Sony Corporation into Sony's high-performance HAD (Hole-Accumulation Diode) sensor. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. E979C99

2 DD ND φsub L R OUT ND φ φ φ φ ICX09AK Block Diagram and Pin Configuration (Top iew) 7 6 Note) Note) : Photo sensor 9 Hφ Hφ ertical Register NC Horizontal Register 8 Pin Description Pin No. Symbol Description Pin No. Symbol Description φ ertical register transfer clock 8 DD Supply voltage φ ertical register transfer clock 9 ND ND φ ertical register transfer clock φsub Substrate clock φ ertical register transfer clock L Protective transistor bias NC R Reset gate clock 6 ND ND Hφ Horizontal register transfer clock 7 OUT Signal output Hφ Horizontal register transfer clock Absolute Maximum Ratings Item Ratings Unit Remarks DD, OUT, R φsub 0 to +8 Against φsub φ, φ φsub φ, φ, L φsub 0 to + 0 to +0. Hφ, Hφ, ND φsub 0 to +0. DD, OUT, R ND 0. to +8 Against ND φ, φ, φ, φ ND to +8 Hφ, Hφ ND to +6 Against L φ, φ L φ, φ, Hφ, Hφ, ND L 0. to to + Between input clock pins oltage difference between vertical clock input pins Hφ Hφ Hφ, Hφ φ to + to + to + Storage temperature 0 to +80 C Operating temperature to +60 C + (Max.) when clock width < µs, clock duty factor < 0..

3 ICX09AK Bias Conditions Item Supply voltage Symbol Min. Typ. Max. Unit Remarks DD..0. Protective transistor bias Substrate clock Reset gate clock L φsub φr L setting is the L voltage of the vertical transfer clock waveform, or the same power supply as the L power supply for the driver should be used. Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated within the CCD. DC Characteristics Item Symbol Min. Typ. Max. Unit Remarks Supply current IDD. 6. ma Clock oltage Conditions Item Symbol Min. Typ. Max. Unit Waveform diagram Remarks Readout clock voltage T..0. H, H H = (H + H)/ H, H L, L, L, L L = (L + L)/ φ φ = Hn Ln (n = to ) ertical transfer clock voltage H H H H HH 0. High-level coupling HL 0. High-level coupling LH 0. Low-level coupling LL 0. Low-level coupling Horizontal transfer clock voltage φh HL Reset gate clock voltage φr RLH RLL Input through 0.µF capacitance Low-level coupling RL RLm 0. Low-level coupling Substrate clock voltage φsub.0.0.

4 ICX09AK Clock Equivalent Circuit Constant φ Item Capacitance between vertical transfer clock and ND Capacitance between vertical transfer clocks Capacitance between horizontal transfer clock and ND Capacitance between horizontal transfer clocks Capacitance between reset gate clock and ND Capacitance between substrate clock and ND ertical transfer clock series resistor ertical transfer clock ground resistor Horizontal transfer clock series resistor Reset gate clock series resistor Symbol Min. Typ. Max. Unit Remarks Cφ, Cφ 680 Cφ, Cφ 70 Cφ, Cφ 0 Cφ, Cφ 70 Cφ 8 Cφ 7 CφH, CφH 7 CφHH CφR CφSUB 80 R, R, R, R 8 Ω RND Ω RφH Ω RφR 9 Ω φ R Cφ R Hφ RφH RφH Hφ Cφ Cφ CφHH Cφ Cφ CφH CφH Cφ R Cφ RND Cφ Cφ Cφ R φ φ ertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit Rφ RφR CφR Reset gate clock equivalent circuit

5 ICX09AK Drive Clock Waveform Conditions () Readout clock waveform 0 90 II II φm T φm 0 tr twh tf 0 () ertical transfer clock waveform φ φ H HH H HH HH HH H HL HL HL H HL L LH L LH L LL L LL φ φ HH HH H H HH HH H HL HL HL H HL LH L LH L LL L LL L H = (H + H)/ L = (L + L)/ φ = Hn Ln (n = to )

6 ICX09AK () Horizontal transfer clock waveform tr twh tf 90 φh twl HL () Reset gate clock waveform tr twh tf RH twl R waveform Point A φr RLH RLL RL RLm Hφ waveform φh/ [] RLH is the maximum value and RLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of R. In addition, RL is the average value of RLH and RLL. RL = (RLH + RLL)/ Assuming RH is the minimum value during the interval twh, then: φr = RH RL Negative overshoot level during the falling edge of R is RLm. () Substrate clock waveform 0 90 φm SUB 0 (A bias generated within the CCD) φsub tr twh tf φm 6

7 ICX09AK Clock Switching Characteristics Item Symbol twh twl tr tf Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit Remarks Readout clock T µs During readout ertical transfer clock φ, φ, φ, φ 0 ns Horizontal transfer clock During imaging During parallel-serial conversion Hφ Hφ Hφ Hφ ns µs Reset gate clock φr ns Substrate clock φsub µs During drain charge When vertical transfer clock driver CXD67AN is used. When φh =.0. tf tr ns, and the cross-point voltage (CR) for the Hφ rising side of the Hφ and Hφ waveforms must be at least φh/ []. Item Symbol two Min. Typ. Max. Unit Remarks Horizontal transfer clock Hφ, Hφ 6 ns The overlap period for twh and twl of horizontal transfer clocks Hφ and Hφ is two. 7

8 ICX09AK Image Sensor Characteristics (Ta = C) Sensitivity Item Sensitivity ratio Saturation signal Smear ideo signal shading Uniformity between video signal channels Dark signal Dark signal shading Flicker Y Flicker R-Y Flicker B-Y Line crawl R Line crawl Line crawl B Line crawl W Lag Symbol Min. Typ. Max. Unit Measurement method Remarks S 0 0 m R R Ysat 70 m Ta = 60 C Sm SHy 0 Zone 0 and I Zone 0 to II' Sr Sb Ydt Ydt Fy Fcr Fcb Lcr Lcg Lcb Lcw Lag 0. m m Ta = 60 C Ta = 60 C Zone Definition of ideo Signal Shading 7 (H) H 8 H () Measurement System CCD C.D.S Zone 0, I Zone II, II' 6 Ignored region Effective pixel region [ A] [ Y] CCD signal output LPF AMP (db down 6.MHz) Y signal output S H S H [ C] LPF Chroma signal output (db down MHz) Note) Adjust the amplifier gain so that the gain between [ A] and [ Y], and between [ A] and [ C] equals. 8

9 ICX09AK Image Sensor Characteristics Measurement Method Measurement conditions ) In the following measurements, the device drive conditions are at the typical values of the bias and clock voltage conditions. ) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value of Y signal output or chroma signal output of the measurement system. Color coding of this image sensor & Composition of luminance (Y) and chroma (color difference) signals B A A As shown in the left figure, fields are read out. The charge is mixed by pairs such as A and A in the A field. (pairs such as B in the B field) As a result, the sequence of charges output as signals from the horizontal shift register (Hreg) is, for line A, ( + ), ( + ), ( + ), and ( + ). Hreg Color Coding Diagram These signals are processed to form the Y signal and chroma (color difference) signal. The Y signal is formed by adding adjacent signals, and the chroma signal is formed by subtracting adjacent signals. In other words, the approximation: Y = {( + ) + ( + )} / = / {B + + R} is used for the Y signal, and the approximation: R Y = {( + ) ( + )} = {R } is used for the chroma (color difference) signal. For line A, the signals output from Hreg in sequence are ( + ), ( + ), ( + ), ( + ). The Y signal is formed from these signals as follows: Y = {( + ) + ( + )} / = / {B + + R} This is balanced since it is formed in the same way as for line A. In a like manner, the chroma (color difference) signal is approximated as follows: (B Y) = {( + ) ( + )} = {B } In other words, the chroma signal can be retrieved according to the sequence of lines from R Y and (B Y) in alternation. This is also true for the B field. 9

10 ICX09AK Definition of standard imaging conditions ) Standard imaging condition I: Use a pattern box (luminance 706cd/m, color temperature of 00K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM00S (t =.0mm) as an IR cut filter and image at F.6. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. ) Standard imaging condition II: Image a light source (color temperature of 00K) with a uniformity of brightness within at all angles. Use a testing standard lens with CM00S (t =.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. ) Standard imaging condition III: Image a light source (color temperature of 00K) with a uniformity of brightness within at all angles. Use a testing standard lens (exit pupil distance mm) with CM00S (t =.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm.. Sensitivity Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of /0s, measure the Y signal (Ys) at the center of the screen and substitute the value into the following formula. 0 S = Ys [m] 0. Sensitivity ratio Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 00m, and then measure the signal output (S [m]) and signal output (S [m]), and signal output (S [m]) and signal output (S [m]) at the center of the screen with frame readout method. Substitute the values into the following formula. R = S/S R = S/S. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to times the intensity with average value of the Y signal output, 00m, measure the minimum value of the Y signal.. Smear Set to standard imaging condition II. With the lens diaphragm at F.6 to F8, adjust the luminous intensity to 00 times the intensity with average value of the Y signal output, 00m. When the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value YSm [m] of the Y signal output and substitute the value into the following formula. Sm = YSm ideo signal shading Set to standard imaging condition III. With the lens diaphragm at F.6 to F8, adjust the luminous intensity so that the average value of the Y signal output is 00m. Then measure the maximum (Ymax [m]) and minimum (Ymin [m]) values of the Y signal and substitute the values into the following formula. SHy = (Ymax Ymin)/00 0 [] 0 [] (/ method conversion value) 6. Uniformity between video signal channels Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 00m, and then measure the maximum (Crmax, Cbmax [m]) and minimum (Crmin, Cbmin [m]) values of the R Y and B Y channels of the chroma signal and substitute the values into the following formula. Sr = (Crmax Crmin)/00 0 [] Sb = (Cbmax Cbmin)/00 0 []

11 ICX09AK 7. Dark signal Measure the average value of the Y signal output (Ydt [m]) with the device ambient temperature 60 C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 8. Dark signal shading After measuring 7, measure the maximum (Ydmax [m]) and minimum (Ydmin [m]) values of the Y signal output and substitute the values into the following formula. Ydt = Ydmax Ydmin [m] 9. Flicker ) Fy Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 00m, and then measure the difference in the signal level between fields ( Yf [m]). Then substitute the value into the following formula. Fy = ( Yf/00) 0 [] ) Fcr, Fcb Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 00m, insert an R or B filter, and then measure both the difference in the signal level between fields of the chroma signal ( Cr, Cb) as well as the average value of the chroma signal output (CAr, CAb). Substitute the values into the following formula. Fci = ( Ci/CAi) 0 [] (i = r, b). Line crawls Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 00m, and then insert a white subject and R,, and B filters and measure the difference between Y signal lines for the same field ( Ylw, Ylr, Ylg, Ylb [m]). Substitute the values into the following formula. Lci = ( Yli/00) 0 [] (i = w, r, g, b). Lag Adjust the Y signal output value generated by strobe light to 00m. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Ylag). Substitute the value into the following formula. Lag = (Ylag/00) 0 [] FLD Strobe light timing Light Y signal output 00m Ylag (lag) Output

12 Hφ Hφ R L φsub ND ICX09AK CXD67AN /6 / ICX09 (BOTTOM IEW) /0./6 0 SK.9k 0.0 M 7.0 DD φ φ φ φ NC ND OUT Drive Circuit XSUB X X XS X XS X Hφ Hφ R /0 0k 00p CCD OUT

13 Relative Response ICX09AK Spectral Sensitivity Characteristics (excludes both lens characteristics and light source characteristics) Wave Length [nm] Sensor Readout Clock Timing Chart Odd Field Even Field Unit: µs

14 ICX09AK Drive Timing Chart (ertical Sync) FLD D BLK HD CCD OUT

15 ICX09AK 0 0 Drive Timing Chart (Horizontal Sync) HD BLK H H R SUB

16 ICX09AK Notes on Handling ) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. ) Soldering a) Make sure the package temperature does not exceed 80 C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 0W soldering iron and solder each pin in less than seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. ) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 00 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. ) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the package.) Cover glass Plastic package 0N 0N.Nm Compressive strength Torsional strength b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. 6

17 ICX09AK c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution. d) The notch of the package is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch of the package. e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) ) Others a) Do not expose to strong light (sun rays) for long periods, color filters will be discolored. When high luminance objects are imaged with the exposure level control by electronic-iris, the luminance of the image-plane may become excessive and discolor of the color filter will possibly be accelerated. In such a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-off mode should be properly arranged. For continuous using under cruel condition exceeding the normal using condition, consult our company. b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD characteristics. d) This package has kinds of internal structure. However, their package outline, optical size, and strength are the same. Structure A Structure B Package Chip Metal plate (lead frame) Cross section of lead frame The cross section of lead frame can be seen on the side of the package for structure A. 7

18 . ± ± ~ ± ~. 0 to 9 ICX09AK Package Outline Unit: mm.0 8 B H ± ~.7 0. M PACKAE STRUCTURE PACKAE MATERIAL Plastic LEAD TREATMENT OLD PLATIN LEAD MATERIAL ALLOY PACKAE WEIHT 0.6g pin DIP (00mil) A 8 D C.7 B'. A is the center of the effective image area. 7. The two points B of the package are the horizontal reference. The point B' of the package is the vertical reference.. The bottom C of the package, and the top of the cover glass D are the height reference.. The center of the effective image area relative to B and B' is (H, ) = (.0,.0) ± 0.mm.. The rotation angle of the effective image area relative to H and is ± The height from the bottom C to the effective image area is. ± 0.mm. The height from the top of the cover glass D to the effective image area is.9 ± 0.mm. 7. The tilt of the effective image area relative to the bottom C is less than µm. The tilt of the effective image area relative to the top D of the cover glass is less than µm. 8. The thickness of the cover glass is 0.7mm, and the refractive index is.. 9. The notch of the package is used only for directional index, that must not be used for reference of fixing. 8