COBP PHOTO REFLECTOR with RED & IR LED

Transcription

1 NJLR COBP PHOTO REFLECTOR with RED & GENERAL DISCRIPTION The NJLR is the compact surface mount type photo reflector, which is built in a, Infrared LED and a high sensitive detector. This product is suit for the application for Bio monitor as pulse rate, SpO 2. FEATURES Peak wavelength : λ P 66±3nm (RED), 94±nm (Infrared) High output current : to 43 typ (RED), 4 to 8 typ (Infrared) Miniature, thin package:.9x2.6x.8mm APPLICATION Bio monitor as pulse rate, SpO 2 ABSOLUTE MAXIMUM RATINGS (Ta=2 C) PARAMETER SYMBOL RATINGS UNIT Emitter Forward Current (Continuous) Reverse oltage (Continuous) Power Dissipation * Detector Collector-Emitter oltage Emitter-Collector oltage Collector Current Collector Power Dissipation Coupled Total Power Dissipation Operating Temperature Storage Temperature Reflow Soldering Temperature IF RED IF IR R RED R IR PD CEO ECO IC PC Ptot Topr Tstg Tsol * Prohibits that "" and "" turn on at the same time to +8-3 to peak ELECTRO-OPTICAL CHARACTERISTICS (Ta=2 C) PARAMETER SYMBOL TEST CONDITION MIN TYP MAX UNIT Emitter Forward oltage Reverse Current Peak Wavelength * Detector Dark Current Collector-Emitter oltage Coupled Output Current * 2 Operating Dark Current * 3 Response Time(Rise/Fall) F RED F IR IR RED IR IR λ P RED λ P IR ICEO CEO IO RED IO IR ICEOD RED ICEOD IR Tr,Tf R= R= I F =2mA I F =2mA CE= IC=,CE=2,d=.7mm,CE=2,d=.7mm,CE=2,CE=2 IO=, CE=2,d=.7mm,RL=kΩ * This is represented as Emission wavelength range of LED. The emission wavelength verification test has not confirmed in the manufacturing process. *2 Please refer to Output Current Test Condition. *3 ICEOD may increase according to the periphery situation of the surface mounted condition. ma ma mw ma mw mw C C C nm nm µs 2.Nov

2 NJLR OUTLINE unit:mm. Cathode for 2. Collector 3. Anode for Infrared LED 4. Cathode for Infrared LED. Emitter 6. Anode for Unspecified tolerance : ±.mm Dimensions in parenthesis are shown for reference. Example of solder pads dimensions BLOCK DIAGRAM () (). Cathode for 6. Anode for 2. Collector. Emitter 3. Anode for Infrared LED 4. Cathode for Infrared LED OUTPUT CURRENT TEST CONDITION The signal from LED is reflected at the aluminum surface. DARK CURRENT TEST CONDITION Light Sealed Dark Box Aluminum Evapolation Surface (.8mm).mm IF ICEOD IF IF Io IF CE CE 2.Nov

3 NJLR RESPONSE TIME TEST CONDITION Al evaporation surface cc RD INPUT % INPUT OUTPUT 9% OUTPUT % RL td ts tr tf EDGE RESPONSE TEST CONDITION Direction X Direction X2 l=mm l=mm Aluminum Evaporation Surface.7mm Aluminum Evaporation Surface.7mm Direction Y Direction Y2 l=mm l=mm Aluminum.7mm Aluminum.7mm Evaporation Evaporation Surface Surface 2.Nov

4 NJLR Power Dissipation vs. Temperature Forward Current vs. Temperature & Power Dissipation P(mW) Total Power Dissipation / 2 Collector Power Dissipation TYPICAL CHARACTERISTICS Forward oltage vs. Forward Current & 2.6 Forward oltage vs. Temperature & ,IF=3mA Pulse Operation IF=3 to 3mA Pulse w idth:µs Duty:. DC Operation IF= to 3mA Forward oltage F() ,,IF=3mA, Forward oltage F() Dark Current vs. Temperature Operating Dark Current vs. Temperature & Dark Current Iceo(nA)... CE= Operating Dark Current Iceod().,CE=2,CE= Nov

5 NJLR Output Current vs. Forward Current (Ta=2 C) Output Current vs. Forward Current (Ta=2 C) Output Current Io() Output Current Io() 4 CE=2, d=.7mm 2 CE=2, d=.7mm Output Current vs. Temperature Output Current vs. Temperature 2 2 Relative Output Current Io/Io(2 C)(%) Relative Output Current Io/Io(2 C)(%) Output Characteristics (Ta=2 C) Output Characteristics (Ta=2 C) IF=mA 8 7 IF=mA Output Current Io(mA) IF=8mA IF=6mA Output Current Io() IF=8mA IF=6mA 2 IF=2mA 2 IF=2mA Collector-Emitter oltage ce() Collector-Emitter oltage ce() 2.Nov

6 NJLR ce Saturation (Ta=2 C) ce Saturation (Ta=2 C). Collector-Emitter oltage ce() Io=4mA Io=3mA Collector-Emitter oltage ce() Io= Io=4 Io=3 Io=2 Io= Io=2mA Io=mA.. 2 Output Current vs. Edge Distance (Ta=2 C) 2 Output Current vs. Edge Distance (Ta=2 C),CE=2, d=.7mm,ce=2, d=.7mm Direction X Direction X Direction X Direction X Edge Distance l(mm) Edge Distance l(mm) 2 Output Current vs. Edge Distance (Ta=2 C) 2 Output Current vs. Edge Distance (Ta=2 C),CE=2, d=.7mm,ce=2, d=.7mm Direction Y2 Direction Y Direction Y2 Direction Y Edge Distance l(mm) Edge Distance l(mm) 2.Nov

7 NJLR Output Current vs. Distance (Ta=2 C) Output Current vs. Distance (Ta=2 C) , CE= , CE= Reflector Distance d(mm) Reflector Distance d(mm) Directivity at Package direction X Directivity at Package direction Y NJLR Directivity Direction X NJLR Directivity Direction Y % 9% 8% 7% 6% % 4% 3% 2% PTx % 9% 8% 7% 6% % 4% 3% 2% PTx Spectral Response (Ta=2 C) Emitter Spectral Response (Ta=2 C) Emitter 2 2 Relative Response (%) Relative Response (%) Wavelength λ(nm) Wavelength λ(nm) 2.Nov

8 NJLR Switching Time vs. Load Resistance (Ta=2 C) Switching Time t(µs) tf tr td ts. Load Resistance RL(kΩ) Remark: Please be aware that all data in the graph are only reference and are not any guarantee. 2.Nov

9 NJLR MOUNTING METHOD NOTE Mounting was evaluated with the following profiles in our company, so there was no problem. However, confirm mounting by the condition of your company beforehand. Mounting: Twice soldering is allowed. INFRARED REFLOW SOLDERING METHOD Recommended reflow soldering procedure 26 C 23 C 22 C 8 C C f e d a : Temperature ramping rate : to 4 C/s b : Pre-heating temperature time : to 8 C : 6 to 2s c : Temperature ramping rate : to 4 C /s d : 22 C or higher time : Shorter than 6s e : 23 C or higher time : Shorter than 4s f : Peak temperature : Lower than 26 C g : Temperature ramping rate : to 6 C /s The temperature of the surface of mold package Room Temp. a b c g (NOTE) Using reflow furnace with short wave infrared radiation heater such as halogen lamp Regarding temperature profile, please refer to those fo reflow furnace. In this case the resin surface temperature may become higher than lead terminals due to endothermic ally of black colored mold resin. Therefore, please avoid from direct exposure to mold resin. (NOTE2) Other method Such other methods of soldering as dipping the device into melted solder and vapor phase method (PS) are not appropriate because the body of device will be heated rapidly. Therefore, these are not recommended to apply. (NOTE3) The resin gets softened right after soldering, so, the following care has to be taken Not to contact the lens surface to anything. Not to dip the device into water or any solvents. FLOW SOLDERING METHOD Flow soldering is not possible. IRON SOLDERING METHOD Iron soldering is not possible. 2.Nov

10 NJLR CLEANING Avid washing the device after soldering by reflow method. IC STORAGE CONDITIONS AND ITS DURATION () Temperature and humidity ranges Pack Sealing Temperature: to 4 [ C] Humidity: 4 to 8 [%] Pack Opening Temperature: to 3 [ C] Humidity: 4 to 7 [%] After opening the bag, solder products within 48h. Avoid a dry environment below 4% because the products are is easily damageable by the electrical discharge. Store the products in the place where it does not create dew with the products due to a sudden change in temperature. (2) When baking, place the reel vertically to avoid load to the side. (3) Do not store the devices in corrosive-gas atmosphere. (4) Do not store the devices in a dusty place. () Do not expose the devices to direct rays of the sun. (6) Do not allow external forces or loads to be applied to IC s. (7) BE careful because affixed label on the reel might be peeled off when baking. BAKING In case of keeping expect above condition be sure to apply baking. (Heat-resistant tape) Baking method: Ta=6 C, 48 to 72h, Three times baking is allowed STORAGE DURATION Within a year after delivering this device. For the products stored longer than a year, confirm their terminals and solderability before they are used. APPLICATION NOTES () Attention in handling Treat not to touch the light receiving and light emitting part. Avoid to adhering the dust and any other foreign materials on the light receiving and light emitting part when using. Never apply reverse voltage (EC) of over 6 to the photo transistor when measuring the characteristics or adjusting the system. If applied, it causes to lower the sensitivity. When LED has operated by voltage, it should be connected the resistor of current adjustment. Avoid to applying direct voltage to LED, because there is possibility that LED is destroyed. When mounting, special care has to be taken on the mounting position and tilting of the device because it is very important to place the device to the optimum position to the object. (2) Attention in designing Avoid the entering ambient light into light receiving part for avoid the malfunction by ambient light. Furthermore, there is possibility of malfunction when there are the other mounted parts by near this product peripheral. There will be changing characteristics by detection object. Refer to this datasheet and evaluate by actual detection object. When LED has been applied continuous power on long period of time, the output current is dropped. If it uses by always applying power to LED, have to consider the circuit designing of including output current decrease. 2.Nov

11 NJLR PACKING SPECIFICATION PACKING DIMENTIONS UNIT : mm SYMBOL DIMENSION REMARKS Insert direction PIN (TE) W B P2 P Drawing direction P A D D F E W T T A 2. ±. BOTTOM DIMENSION B 2.8 ±. BOTTOM DIMENSION D. D E.7 ±. F 3. ±. P 4. ±. P 4. ±. P2 2. ±. T.2 ±. T. ±. W 8. ±. W.4 ±. THICKNESS.MAX * Carrier tape material : Polycarbonate(antistatic) Cover tape material : Polyester(antistatic) Taping Strength Pull up the cover tape from the carrier tape, and when the opening angle comes around to, and the peeling-off strength is to be within the power of 2 to 7g. Packaging ) The taped products are to be rolled up on the taping reel as on the drawing. 2) Rolling up specification 2-) Start rolling : Carrier tape open space more than 2 Pieces. 2-2) End of rolling : Carrier tape open space more than 2 Pieces, and 2 round of reel space at the cover tape only. 3) Taping quantity : 2, Pieces 4) Seal off after putting each reels in a damp proof bag with silica gel. B A D E C SYMBOL DIMENSION A φ8 ±. B φ6 ±. C φ3 ±.2 D φ2 ±.8 E 2. ±. W 9. ±. W 3. ±. W W *Material : PPE(antistatic) [CAUTION] The specifications on this databook are only given for information, without any guarantee as regards either mistakes or omissions. The application circuits in this databook are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial rights. 2.Nov