MCM C/Mlxed Technologies and Thick Film Sensors

Transcription

1 MCM C/Mlxed Technologies and Thick Film Sensors

2 NATO ASI Series Advanced Science Institutes Series A Series presenting the results of activities sponsored by the NATO Science Committee, which aims at the dissemination of advanced scientific and technological knowledge, with a view to strengthening links between scientific communities. The Series is published by an international board of publishers in conjunction with the NATO Scientific Affairs Division A Life Sciences B Physics C Mathematical and Physical Sciences D Behavioural and Social Sciences E Applied Sciences F Computer and Systems Sciences G Ecological Sciences H Cell Biology I Global Environmental Change Plenum Publishing Corporation London and New York Dordrecht, Boston and London Springer-Verlag Berlin, Heidelberg, New York, London, Paris and Tokyo PARTNERSHIP SUB-SERIES 1. Disarmament Technologies 2. Environment 3. High Technology 4. Science and Technology Policy 5. Computer Networking Springer-Verlag / The Partnership Sub-Series incorporates activities undertaken in collaboration with NATO's Cooperation Partners, the countries of the CIS and Central and Eastern Europe, in Priority Areas of concern to those countries. NATO-PCO-DATA BASE The electronic index to the NATO ASI Series provides full bibliographical references (with keywords and/or abstracts) to more than contributions from international scientists published in all sections of the NATO ASI Series. Access to the NATO-PCO-DATA BASE is possible in two ways: - via online FILE 128 (NATO-PCO-DATA BASE) hosted by ESRIN, Via Galileo Galilei, I Frascati, Italy. - via CD-ROM "NATO-PCO-DATA BASE" with user-friendly retrieval software in English, French and German ( WTV GmbH and DATAWARE Technologies Inc. 1989). The CD-ROM can be ordered through any member of the Board of Publishers or through NATO- PCO, Overijse, Belgium. c p]rp Series 3: High Technology - Vol. 2

3 MCM C/Mixed Technologies and Thick Film Sensors edited by W. Kinzy Jones Department of Mechanical Engineering, Florida International University, Miami, Florida, U.S.A. Karel Kurzweil BULL, SA, Les Clayes-sous-Bois, France Gabor Harsänyi Department of Electronics Technology, Technical University of Budapest, Budapest, Hungary and Sylvia Mergui Department of Electrical Engineering, Florida International University, Miami, Florida, U.S.A. Springer Science+Business Media, B.V.

4 Proceedings of the NATO Advanced Research Workshop on Advances in Multi-Chip Modules (MCM) and High Performance Electronic Materials Islamorada, Florida, U.S.A. May 23-25,1994 A C.I.P. Catalogue record for this book is available from the Library of Congress ISBN DOI / ISBN (ebook) Printed on acid-free paper All Rights Reserved 1995 Springer Science+Business Media Dordrecht Originally published by in 1995 Softcover reprint of the hardcover 1st edition 1995 No part of the material protected by this copyright notice may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying, recording or by any information storage and retrieval system, without written permission from the copyright owner.

5 Table of Contents Preface ix Technology of Multichip Modules "3-D Interconnection Microsystems Applications," Christian M. Val "High Performance Packaging with Multilayer Ceramic Modules," Eckardt Bihler "High Frequency LTCC Modules," Per Johnsson, C. Vaktniis, N. Billstrom "Analysis and Optimization of Circuit Interconnect Performance," Joris Peeters, Eric Beyne "High Performance Interconnect on Cofired Ceramic," D. Lambert, Karel Kurzweil "New Aspects in the Reliability Design of High Density Interconnects in MCMs," Gabor Harsanyi "MCM-D Technology with Active and Passive Substrates," Hans Hentzell "High Performance Ceramic Modules and Packages," Paul Danner "Laser Processing in MCM-C Technologies," Zsolt Illyefalvi-Vitez "LTCC Technology: Where We Are and Where We're Going," Charles Q. Scrantom "Design and Realization of High Performance Ceramic Heat Sinks," E. Gambarte, M. Topfer, A. Paredes, Martin Reill, M. Weickhmann "AIN Cofired MCM-C/D," W. Kinzy Jones, M. A. Zampino "Very Fine Line Photoimageable Thick Film Technology Developed at Hybridas, Lithuania," Jurate Minalgiene, Steve Muckett Applications of MCM-C or Mixed MCM Technologies "High-Performance Solid State Mass Memory Modules," Augustin Coello-Vera, P. D'Andrea, G. Cysarek 121

6 vi "Mass Memory Packaging for Space Applications," Jacques de Givry "Advanced Multichip Modules for Telecom Applications," Kurt Loesch, H.M. Rappold "Telecom Applications ofmcm Technology," Jose Luis Conesa "Design and Realization of a Multichip Module as a Motion Estimator for HDTV Applications," Siamak Fazelpour, R. Brodowski, R. Diimcke, H. Reichl, B. Bolike "Multichip Module Applications in Satellite Communications," Nihal Sinnadurai Material for MCM Applications "MaterialslDesign Considerations for MCMs," Harry K. Charles, Jr. "MCMs: Material Choices for Electronics and Optoelectronics," Nick Chandler, N.E. Sellars, R.K. Barton, S.J. Foster, P.D. Sleep, G. N. Blackie, LR. Croston "Low Permittivity Porous Silica Thin Films for MCM-CID Applications," Rosario A. Gerhardt, Julie R. Kokan, and Paul A. Kohl "MCM Passivation Studies for Enhanced Producibility and Reliability," Thomas J. Sanders, C. Roy Miller, Kurt E. Gsteiger, Glenn T. Hess, and Duraiswami Nedunchellyan "Buried Thick Film Capacitors Built Up with High-K Dielectrics for MCM Applications," Walter Smetana Sensors Technology for MCM-C Technologies "Advances in Materials for Sensors," Sylvia Mergui "PTC Thick Film Thermistors," 1. Hormadaly, S.J. Horowitz, 1.R. Larry, P. O'Callaghan "Evaluation of Some Thick Film Materials for Temperature, Force, and Humidity Sensors," Marko Hrovat, D. Belavic, J. Holc "Parameters and Technology of Thick Film Electrolytic S02 Sensors," Leszek 1. Golonka "Sensors: A Great Chance for Microelectronic Technologies," Roberto Dell' Acqua

7 vii "High Sensitivity Thermometers for Millikelvin Temperature Range," Milos Samora, D. Vanicky, TU Kosice; 1. Batko, K. Flachbart "Thick Films Based on Glass and Polymeric Matrices, Mechanism of Conductivity," Iva Krivka, 1. Kubat, R. Kuzel, 1. Prokes Author Index Keyword Index

8 PREFACE Advances in electronic devices with higher speeds and complexity have placed higher demands on the electronic packaging of systems. Multi-chip modules (MCM's), with high wiring density, controlled impedance interconnects and thermal management capabilities have recently evolved to address these new requirements. Under the auspices of the NATO Science Committee, an Advanced Research Workshop (ARW) was held on MCM-ClMixed Technologies (Florida International University, host at Islamorada, FL, May 23-25, 1994). This volume presents the majority of papers presented at this workshop. The book addressed advances in multi-chip packaging, with primary emphasis on ceramic multi-chip technology (MCM-C), although other technologies were reviewed. The extent and advantages ofmcm technology are reviewed relative to many application areas, including the full range from high volume, cost sensitive, to low volume, high reliability space applications. Applications in satellite communications, telecommunications, and military applications are reviewed. MCM technologies and "known good die" availability allows the introduction of MCM's into communication products at a very attractive and competitive cost. The European Economic Community is sponsoring cooperative technical projects by European companies and academic institutions. APACHIP (Advanced Packaging for High Performance) has significantly contributed to the advancement of packaging technology in Europe, covering various aspects of high performance packaging at lower cost with improved thermal characteristics and ease of assembly. Considerable research and development has been undertaken on three dimensional (3-D) packaging. Mass memories represent a major application of 3-D, in particular for space applications. 3-D interconnections will surely allow moving into microsystems which are more autonomous, denser and smarter. This book highlights recent advances in MCM-C technology. Developments in materials and processes which have lead to the increase density of interconnection in MCM-C are reviewed. Finer resolution thick film inks, high performance low temperature dielectric tapes, precision via generation by both mechanical and laser methods, and enhanced screen printing technologies has produced feature resolution to the 50 f.1m line/space level. New material developments, from cofrre AIN to diamond has greatly expanded the thermal management capabilities of MCM-C technology. The work of the ARW, as demonstrated in the papers, addressed new materials development and characterization methods for electronic packaging. Because of the compatibility of thick film sensors to MCM-C technology and the work by researchers in the Cooperating Partner (CP) countries, ceramic thick film based sensors were reviewed over a wide range of applications. Environmental gas sensors, pressure and temperature sensors, as well as the development of novel materials to support the sensor development, are presented. ix

9 x The organizers of the ARW gratefully acknowledge the fmancial support by the NATO Scientific Committee, and ISlIM, The Microelectronic Society. Special thanks are due to Dr. Karel Kurzweil, who organized the NATO European participants, and Dr. Gabor Harsanyi, who organized participants from cooperating partner (CP) countries. Special thanks also to Richard Breck and Janet Kingston of ISlIM for their support and guidance in organizing the conference and providing support for the manuscript.