SiGe BiCMOS Technologies with RF and Photonic Modules

Transcription

1 INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS SiGe BiCMOS Technologies with RF and Photonic Modules Mul Project and Low Volume Wafer Produc on

2 About Us IHP-GmbH is a German R & D institution, focused on wireless and broadband communication. Core competencies are: Mixed signal process technology RF & digital circuit design Communication System Design IHP is running an 8 pilot line housed in a 1,000 square meter class-1 cleanroom. Several 0.25 µm and 0.13 µm SiGe:C BiCMOS technologies are available. IHP Solutions GmbH is a 100% subsidiary of IHP. IHP Solutions was founded to focus on and grow the transfer of research results (technology transfer) of IHP research activities as well as the commercial partner for value added services along the value chain of IC manufacturing. In the context of IHP s service offerings IHP Solution is responsible for commercial IC production.

3 About Us

4 Low-Volume & MPW Service IHP offers research partners and customers access to its powerful SiGe:C BiCMOS technologies and special integrated RF modules. These technologies are especially suited for applications in the higher GHz bands (e.g. for wireless, broadband, radar). They provide integrated HBTs with cut-off frequencies of up to 500 GHz including complementary devices. For products in fiber optics, payload in space, wireless communication, radar, data centers, measurement equipment, THz imaging SiGe BiCMOS with world record 500 GHz HBTs 8 inch wafer fab for research and production in Germany Reliable service since 2001

5 Low-Volume & MPW Service

6 SiGe:C BiCMOS Technologies for MPW & Prototyping SG25H3 SG25H4 SGB25V SG13S SG13G2 A 0.25 µm technology with a set of npn-hbts ranging from a higher RF performance (f T /f max = 110/180 GHz) to higher breakdown voltages up to 7 V. A high performance BiCMOS technology. Process is identical to former SG25H1 technology, only Process Design Kit is new. The bipolar module is based on H1 SiGe:C npn HBTs with up to 200 GHz transit frequency and up to 220 GHz maximum oscillation frequency. A cost-effective technology with a set of npn-hbts up to a breakdown voltage of 7 V. A high-performance 0.13 µm BiCMOS with npn-hbts up to f T /f max = 250/340 GHz, with 3.3 V I/O CMOS and 1.2 V logic CMOS. A 0.13 µm BiCMOS technology with higher bipolar performance of f T /f max = 300/500 GHz

7 SG25H4_EPIC A joint technology for IHP s 0.25 µm node, encapsulati ng the complete features and devices of the SG25_PIC and SG25H4 technologies. It off ers pn-phase shift ers, germanium photodetectors (f 3dB > 67 GHz), low loss passive opti cs as well as high performance bipolar transistors with f T = 200 GHz. The backend offers 3 (SG13: 5) thin and 2 thick metal layers (TM1: 2 µm, TM2: 3 µm). The schedule for MPW & Prototyping runs is located at Cadence-based mixed signal Design Kit is available. For high frequency designs an analog Design Kit in ADS can be used. IHP s reusable blocks and IPs for wireless and broadband are offered to support your designs. SiGe:C BiCMOS Technologies

8 The Following Modules are Available RFMEMS PIC LBE TSV Module is an additional option in SG13S and SG13G2 technologies which offers integrated capacitive RFMEMS switch devices for frequencies between 40 GHz to 150 GHz. Additional photonic design layers together with BiCMOS BEOL layers on SOI wafers (available in SG25H3) The Localized Backside Etching module is offered to remove silicon locally to improve passive performance (available in all technologies). Module is an additional option in SG25H4 technology which offers RF grounding by vias through silicon to improve RF performance.

9 Available Modules

10 Key Specification Feature SG13S SG13G2 SG25H3 SG25H4 SGB25V Technology node (nm) f max NPN (GHz) CMOS core supply (V) 1.2, , C MIM (ff/µm²) Poly Res (Ω/ ) High Poly Res (Ω/ ) 1300 tbd BEOL 7 Al 7 Al 5 Al 5 Al 5 Al Varactor (C max /C min ) tbd. tbd Q inductor 37* 37* 37* 37* 37* *1 nh (with LBE)

11 Bipolar Transistors Feature SG13S SG13G2 SG25H3 SG25H4 SGB25V NPN1 ft / f max (GHz) 250 / / / / / 95 NPN2 ft / f max (GHz) 45 / / / / / 90 NPN3 ft / f max (GHz) 25 / / 70 NPN1 BV CE0 (V) NPN2 BV CE0 (V) NPN3 BV CE0 (V) 7 7 NPN1 BV CB0 (V) NPN2 BV CB0 (V) NPN3 BV CB0 (V) *1 nh (with LBE) Bipolar Sec on

12 CMOS Section Feature SG25H3/H4* SG13S*** Core Supply Voltage (V) nmos V TH (V) I OUT ** (µa/µm) I OFF (pa/µm) pmos V TH (V) I OUT (µa/µm) I OFF (pa/µm) * Parameters for SGB25V are similar VG = 2.5 V *** Parameters for SG13G2 have to be defined

13 Passive Section Feature SG25H3/H4 SGB25V SG13S MIM Capacitor (ff/µm²) N+ Poly Resistor (Ω/ ) P+ Poly Resistor (Ω/ ) High Poly Resistor (Ω/ ) Varactor Cmax/Cmin 3 tbd. tbd. Inductor Q@ 5 GHz 18 (1 nh) 18 (1 nh) 18 (1 nh) Inductor Q@10 GHz 20 (1 nh) 20 (1 nh) 20 (1 nh) Inductor 5 GHz 37 (1 nh)* 37 (1 nh)* 37 (1 nh)* * with LBE CMOS Sec on, Passive Sec on

14 TSV-Module Through-Silicon Via Module for RF Grounding available in SG25 and SG13 technologies. Single TSVs can provide low GND inductance 30 ph to improve RF circuit performance. A backside metallization is provided as chip-to-package interface for die attach.

15 RF MEMS Switch Module RF MEMS Switch Module Actuation voltage (V) 60 (Pull-In 50) C on / C o ff 10 Switch time (µs) 10 Isolation* (db) 20 Insertion loss* 1 (db) 60 GHz TSV-Module, RF MEMS Switch Module

16 Photonic Integrated Circuit Module Wave guides Main features 220 nm Si on 2 µm SiO 2 3 etching depths 4 doping levels (p, n, p+, n thick AlCu backend metal layers Germanium photo diodes (f 3dB > 67 GHz) HBTs (f max = 220 GHz) Optional localized backside etching Loss 3.5 db/cm 1.2 db/cm 2.5 db/cm Core width 450 nm 700 nm 500 nm Etching depth 220 nm 70 nm 120 nm Features Grating etch p, n, p+, n+ possible

17 Photo diode Phase shifter f 3dB > 67 GHz@ 2 V R > 0.8 A/W I dark = 200 na@ 1 V Ipkiss3 building block GDSII cell Typical values 7 mm in length V π = 4.3 V, V bias = 2.2 V C = 1.8 pf Photonic Integrated Circuit Module

18 Design Kit The design kits support a Cadence mixed signal platform. Analog/Mixed-Signal Flow: Design Framework II (Cadence 6.1) Schematic Design Entry (Virtuoso Schematic Editor) Simulation Analog Design Environment ADE (Cadence) RF: SpectreRF (Cadence) Analog: Spectre/APS (Cadence) Mixed-Signal: AMS Designer/XPS (Cadence) Full Custom Layout (Cadence Virtuoso Layout Editor) Physical Verification (Cadence Assura: DRC/LVS/QRC, selected PDKs support Substrate Noise Analysis) Selected PDKs support Cadence VPS for EMIR analysis Support of Analog Office and TexEDA via partners is available Sonnet support for all design kits ADS-support via Golden Gate/RFIC dynamic link to Cadence is available Standalone ADS Kit including Momentumsubstrate layer file Digital Design Flow: Behavioral Modeling (VHDL, Verilog HDL) Verification Simulation: ModelSim (Mentor Graphics), Incisive Enterprise Simulator IES (Cadence) VHDL/Verilog Logic Synthesis & Opti mizati on (Design Compiler/Synopsys, PrimeTime/Synopsys, Genus/ Cadence) Design for Test, Test Pattern Generation (Synopsys DFT Compiler, Cadence RTL Compiler and Innovus Test) Digital CMOS libraries and IO cells for 0.25 µm CMOS and 0.13 µm CMOS

19 Models SG25H4 SG25H3 SGB25V SG13S SG13G2 PSP x x x x x MOSVAR x x HSIM x x x VBIC/HICUM x x x x x EM simulations SG25H4 SG25H3 SGB25V SG13S SG13G2 Keysight momentum x x x x x Sonnet x x x x x Design platforms SG25H4 SG25H3 SGB25V SG13S SG13G2 Keysight ADS x x x x x Cadence Assura DRC/LVS/QRC x x x x x Cadence PVS DRC/LVS/QRC x Cadence Virtuoso & Virtuoso XL x x x x x Cadence Spectre & Spectre RF x x x x x Cadence VPS & Voltus FI x x x x x Mentor Calibre DRC/LVS x Mentor Calibre XRC NI AWR Design Environment x x x x x TexEDA RFIC Studio x x x x x Design Kit

20 IHP GmbH / IHP Solutions GmbH Innovations for High Performance Microelectronics Leibniz-Institut für innovative Mikroelektronik / Gesellschaft für technologiebasierten Innovationstransfer 12/2017 Address Im Technologiepark Frankfurt (Oder) Germany MPW & Foundry Contact Dr. René Scholz Phone: Fax: scholz@ihp-microelectronics.com Website: Our Representatives Europractice Thomas Drischel virtual-asic@iis.fraunhofer.de France Fabio Coccetti coccetti@rfmicrotech.com Italy Claudio Marziali info@alfamicroonde.it Israel Ari Mizrachi ari.mizrachi@kedem-tech.com China/Asia Dr. Yaoming Sun y.sun@hk-microsystem.com Russia Radiant-EC JSC foundry@ranet.ru Americas, Japan Volker Blaschke volker.blaschke@siliconrfsynergy.com