From Technologies to Market. Advanced RF SiP for Cell Phones

Transcription

1 From Technologies to Market Advanced RF SiP for Cell Phones

2 REPORT METHODOLOGY Market forecast methodology Market segmentation methodology Advanced RF SiP for Cell Phones 2017 Sample 2

3 REPORT METHODOLOGY Technology analysis methodology Information collection Advanced RF SiP for Cell Phones 2017 Sample 3

4 METHODOLOGIES AND DEFINITIONS Yole s market forecast model is based on the following elementary structured blocks: Yole s analysis framework Advanced RF SiP for Cell Phones 2017 Sample 4

5 TABLE OF CONTENTS o Introduction 3 Methodology Report Synergies Objectives, Scope, Glossary Advanced Packaging platforms o Executive Summary 15 o Market drivers and dynamics 35 Advanced Packaging drivers RF packaging environment o Disruptions and opportunities o Technology 56 o Challenges and requirements for 5G packaging o Analysis on RF SiP packaging platforms in development o RF SiP Packaging roadmaps o Players and Supply Chain 87 Player landscape and positioning Company strategies Business model shifts Market forecasts 102 RF SiP Forecasts Unit count Wafer count Revenue o Conclusions 117 o YOLE presentation Advanced RF SiP for Cell Phones 2017 Sample 5

6 THIS REPORT IS ACCOMPANIED BY A PHYSICAL TEARDOWN AND REVERSE COSTING REPORT! Advanced RF SiP for Cellphones Reverse Costing Review: Physical Analyses & Cost Estimations RF report by Stéphane ELISABETH October rue la Noue Bras de Fer NANTES - FRANCE info@systemplus.fr

7 COMPANIES CITED IN THE REPORT (non-exhaustive list) Amkor (J-Devices, Nanium), Apple, ASE Group, Broadcom Ltd. (Avago Technologies, Javelin Semiconductor), Cavendish Kinetics, Cisco, Deca Technologies, Ericsson, Fujitsu, GLOBALFOUNDRIES, Google, Huawei (Hisilicon), Infineon, Intel, JCET/STATS ChipPAC, Kyocera, Lenovo, LG, Marvell, Mediatek, Nepes, NXP Semiconductors (Freescale), Microsoft, Murata Manufacturing Company, NTT Docomo, ON Semiconductor, OPPO, Panasonic, Peregrine Semiconductor/Murata, Powertech Technology, Qorvo (RFMD, Triquint), Qualcomm (RF360), Samsung, Skyworks Solutions, Soitec, Spreadtrum, SPIL, STMicroelectronics, TDK- EPC (EPCOS), Texas Instruments, TSMC, UMC, Vivo, Xiaomi, ZTE and more Advanced RF SiP for Cell Phones 2017 Sample 7

8 WHAT S NEW IN THE ADVANCED PACKAGING TEAM? Advanced Substrates and RF packaging activities From 2017, the Advanced Packaging team at Yole Développement is establishing Advanced Substrates and RF Packaging as standalone and separate activities, to allow deeper focus on these segments The Advanced Substrate activity is dedicated to exploring the market and technologies of PCBs, IC substrates and thin film RDLs The RF Packaging activity will deal with low power RF packaging as requirements for high frequency packages rise (5G) Start of the standalone Advanced Substrates and RF packaging activities The objectives of these activities will be to: Propose a common terminology framework Identify and analyze competitive and overlapping technologies Analyze the supply chain and business model shifts Provide related market forecasts Provide related technology roadmaps Provide an outlook on market dynamics and disruptions Identify market shares of involved players Provide analysis on substrate and RF package - architectures, equipment and materials Advanced RF SiP for Cell Phones 2017 Sample 8

9 KEY FEATURES OF THIS REPORT The Advanced RF SiP for Cell Phones 2017 is the first report of the RF advanced packaging series. The objectives of the report are as follows: Market overview o Drivers and dynamics for 5G flavors: 5G mmwave and 5G sub 6 GHz o Disruptions and opportunities thereof o Focus on FEM and PAM architectures in RF Front-End of cellphones o RF Front End SiP forecast (Revenue,Wafers, Units) Supply chain analysis Supply chain changes in the new 5G era Strategies and outlook of current RF SiP manufacturers New entries and supply chain disruptions for mmwave packaging Technology trends and forecasts o RF Front-End multi-die System-in-Package challenges and technology requirements for 5G sub 6 GHz and 5G mmwave (>24 GHz) bands o 5G SiP packaging roadmaps for smartphone Front-End o RF SiP Revenue,Wafer and Unit forecasts Advanced RF SiP for Cell Phones 2017 Sample 9

10 SCOPE OF THE REPORT Focus of the report Mobile phones Mobile Infrastructure RF Front- End SiP packaging for 5G in cell phones RF front-end components (PA, LNA, filters, switches, antenna tuners) 2G, 3G, 4G, 5G technologies Modems, transceivers, baseband processors, Wi-fi & Bluetooth modules Antennas, IPDs, Topics NOT included in the report Advanced RF SiP for Cell Phones 2017 Sample 10

11 RF COMPONENT AND MODULE SUPPLY CHAIN (KEY PLAYERS) RF switch RF component stage OSAT services Focus of this report! FEM stage PA/LNA Handset device stage Discrete components Integrated modules RF filter Antenna device (tuner & switch) Pure players Integrated players CMOS-based 5G mmwave FEM (Module maker + test + assembly) Advanced RF SiP for Cell Phones 2017 Sample 11

12 ADVANCED PACKAGING PLATFORMS Focus packaging platform Integration:2D 3D Increased functionality, performance Leadframes w/o IC substrates IC substrates-based Overview of advanced packaging platforms QFN Fan-in Fan-out W/B BGA X Flip Chip BGA 3DIC Interposer based (Si, Glass, Org) SiP Package Substrate (organic) Embedded die PCB (in substrate or PCB) (organic board) Interconnect: Bumping, Pillars, Studs, Through-silicon-via, Bump-less, Embedded Technologies Advanced RF SiP for Cell Phones 2017 Sample 12

13 HOW DOES A 4G SiP (PAMID) LOOK LIKE TODAY? in a 43mm 2! Passives spxt switch Passives BAW filters BAW filters BAW filters Example with the Broadcom AFEM 8050 module in the iphone 7 Plus phone Mid Band PAMiD BAW filters BAW filters BAW filters BAW filters BAW filters BAW filters spxt switch Passives BAW filters BAW filters PA BAW filters RF IC PA Advanced RF SiP for Cell Phones 2017 Sample 13

14 DEVELOPMENT OF TECHNOLOGY FOR 5G Advancem ents in 4G in sub 6 GHz range (labeled 4G+) will go in parallel with 5G mmwave developme nts Different flavors of 5G are developing in parallel! All tracks include higher integration and further RF SiP development 2G 3G 4G 5G mm Wave 5G sub 6 GHz 5G IoT mmwave 5G technology - disruptive innovation Introduction of mmwave frequencies >24 GHz Adoption off new packaging architectures and platforms Heavy design changes and new materials required Upgrade of 4G technology - incremental innovation Will stay at frequencies < 6 GHz Modification of current RF packaging architectures Minimal change in BOM Used frequencies <1GHz To address transfer of data generated by many IoT end devices (mainly sensors) Still undefined standards/protocols Little to no innovation regarding semiconductor packaging Advanced RF SiP for Cell Phones 2017 Sample 14

15 SMARTPHONE RF PACKAGING ARCHITECTURES Today (4G in 2017) Tomorrow, 5G sub 6 GHz and mmwave 5G (>2019) FC substrate SiP Disruptive packaging ahead! dies in Flip Chip SiP Mix of Si and III/V Front End (i.e. PA) Flip Chip balls or Cu pillars Power amplifiers still wirebonded Enhanced FC substrate SiP Which package architecture will win? Glass substrate Fan-Out WLP Sub 2.7 GHz Improvements in sub 6 GHz and mmwave bands (28, 39, 60 GHz) Advanced RF SiP for Cell Phones 2017 Sample 15

16 SUPPLY CHAIN CHANGES EXPECTED IN 5G! Key OEM mobile drivers More OEM involvement + others Potential new semiconductor entries Supply chain to get more complex with Qualcomm 5G push and potential new entries Key RF FEM/PAM SiP suppliers in 4G Working on incremental advancements 5G sub 6GHz Directly to disruptive mmwave 5G mmwave 5G? OSAT services OSAT services Technology strategy and competition ongoing Advanced RF SiP for Cell Phones 2017 Sample 16

17 RELATED REPORTS Discover more related reports within our bundle here Advanced RF SiP for Cell Phones 2017 Sample 17

18 ADVANCED RF SYSTEM-IN-PACKAGE FOR CELL PHONES 2017 Market & Technology report - October 2017 The transition from 4G to 5G requires disruptive packaging innovation. 5G mmwave, 5G sub 6 GHz - which packaging architectures can rise to the occasion? KEY FEATURES OF THE REPORT Get the sample of the report on Market overview Drivers and dynamics for 5G flavors: 5G mmwave and 5G sub 6 GHz Disruptions and opportunities thereof Focus on FEM and PAM architectures in RF front-end of cellphones RF front end SiP forecast (revenue, wafers, units) Technology trends and forecasts RF front-end multi-die System-in- Package challenges and technology requirements for 5G sub 6 GHz and 5G mmwave (>24 GHz) bands 5G SiP packaging roadmaps for smartphone front-end RF SiP revenue, wafer and unit forecasts Supply chain analysis Supply chain changes in the new 5G era Strategies and outlook of current RF SiP manufacturers New entries and supply chain disruptions for mmwave packaging 5G THE DISRUPTION IS AROUND THE CORNER! The 5 th generation of cellular networks is anticipated to arrive in the timeframe of the next 2-5 years, enabling Gbps datarates and a plethora of new applications and services. One of the key drivers for developing such speed is high resolution video demand (4K, 8K etc.) over mobile devices. Furthermore, future applications such as mobile driven augmented and virtual reality would benefit greatly from such technical capabilities. In addition, certain amounts of data generated by the Internet of Things end devices will need to be transmitted over the cellular network as well. Global mobile data traffic is growing at an astonishing rate, with >40% CAGR predicted from While some parts of 5G might be available as soon as 2019, in reality, there are many uncertainties which keep the global community in discussion: Accuracy of future projected data demands and market growth Growth of applications and services which would require 5G networks Justification of financial investment in infrastructure required Allocation of appropriate frequency bands Technology readiness Competition from advanced WiFi (i.e. WiGiG) Capabilities of ongoing 4G innovation The fundamental motivation for developing 5G networks is the assumption that much higher datarates will be needed, than current 4G allows. The speed of 5G adoption will highly depend on market demand and status of RF semiconductor technology quality. While the step from 3G to 4G was more incremental, 5G is considered a disruptive step, both from financial and technology viewpoint. 5G has 3 aspects: mmwave, sub 6GHz and sub 1 GHz (5G Internet-of-Thing - IoT). Highest frequency 5G targets mmwave frequency bands, in the range from 28 GHz to 60 GHz and even in some cases up to 80 GHz. This requires significant technology overhaul and installation of a large number of smaller local cells to assure signal quality. Meanwhile, significant efforts are being allocated to improve current 4G technology in the sub 6 GHz bands, towards 100 Mbit/s and beyond. The semiconductor industry, from front end to assembly and test is under heavy pressure to innovate at a very fast pace while maintaining desired quality and reliability. RF front end modules today are utilizing complex System-in-Package (SiP) architectures with dies (switches, filters, power amplifiers) included and several types of interconnects (wire bond, flip chip, Cu pillars) in a single package. Future smartphone connectivity relies on SiP innovation with SiP packaging revenue expected to grow >10% CAGR 2017 to 2022, more than the overall fast growing advanced packaging sector with CAGR of 7%. Overall RF front end component market for smartphones is expected to grow from 12.3 $B in 2017 to 22.8 $B in 2022, with a CAGR of 13%. Advanced multi die SiP packaging holds a large set of key technologies to address all flavors of 5G requirements with the ability to enable or slow down the 5G market! All flavors of 5G are developing in parallel! All tracks include higher integration and further RF SiP development 5G mm Wave mmwave 5G technology - disruptive innovation Introduction of mmwave frequencies >24 GHz Adoption of new packaging architectures and platforms Major design changes and new materials required 2G 3G 4G 5G sub 6 GHz Upgrade of 4G technology - incremental innovation Will stay at frequencies < 6 GHz Modification of current RF packaging architectures Minimal change in BOM 5G IoT Used frequencies <1GHz To address transfer of data generated by many IoT end devices (mainly sensors) Still undefined standards/protocols Little to no innovation regarding semiconductor packaging (Yole Développement, October 2017)

19 ADVANCED RF SYSTEM-IN-PACKAGE FOR CELL PHONES 2017 NEW DESIGNS FOR CHALLENGING 5G REQUIREMENTS More and disruptive SiP architectures expected in 5G mmwave Today (4G in 2017) FC substrate SiP dies in Flip Chip SiP Mix of Si and III/V Front End (i.e. PA) Flip Chip balls or Cu pillars Power amplifiers still wirebonded Sub 2.7 GHz Tomorrow, 5G sub 6 GHz and mmwave 5G (>2019) Enhanced Flip Chip substrate SiP (Yole Développement, October 2017) Which package architecture will win? Fan-Out WLP Glass substrate Improvements in sub 6 GHz and mmwave bands (28, 39, 60 GHz) Accomplishing Gbps wireless datarates on the cellular network requires operation of devices at GHz frequencies. While allocation of frequency bands is still in discussion, mmwave bands around 28 GHz, 39 GHz and 60 GHz come most into discussion. Meanwhile 5G below 6GHz is targeting expansion to 3.5 GHz and 4.5 GHz. Although 5G below 6 GHz also requires semiconductor packaging innovation, it can be considered mostly incremental. However, the 5G mmwave domain is opening completely new sets of requirements that requires considerable technology disruptions. At mmwave frequencies signal path length becomes particularly critical and any design imperfection is transformed into considerable signal losses and deteriorated device performance. Today, RF SiPs, namely FEMiD and PAMiD are rather complex and contain heterogeneous dies (Si based, III/V, MEMS etc.) with mixed wirebonding, flip chip ball or Cu pillar interconnects attaching to organic package substrates with up to 7 metal layers. Future 5G sub 6 GHz and especially 5G mmwave will require even denser integration of dies in order to minimize signal paths and keep losses under control. Finding new innovative substrate/rdl solutions will directly impact the performance and success of a product. On top of that, integration of the antenna within the SiP is more a need than an option, bringing a set of additional challenges from placement options, processing, shielding etc. Future RF packaging innovation in cellphones is being performed on several levels and in parallel for 5G sub 6GHz and 5G mmwave, however the real packaging disruption is expected on mmwave frequencies >24 GHz. Some of the future RF packaging quests are search for low loss materials, antenna integration, possible integration of dies in front end, overhaul in packaging architectures and exploration of shielding options all in order to develop new generations of 5G RF SiPs. Investigated packaging platforms for 5G so far include advanced Flip Chip substrate solutions, Fan-Out WLP and glass interposers. What are the requirements and challenges in 5G packaging? How does that reflect on RF packaging architectures and materials? What are the advantages and limitations of developing RF packaging architectures? How will the dies and interconnects change at higher frequencies? Is there a better fit for lower and higher mmwave 5G bands? Which RF packaging architectures will win? Take a look into the full report for an in depth analysis providing answers to these questions. 5G BRINGS BOTH COMPLEXITY AND NEW BUSINESS OPPORTUNITIES Supply chain to get more complex with Qualcomm 5G push and potential new entries Key RF FEM/PAM SiP suppliers in 4G OSAT services Key OEM mobile drivers Working on incremental advancements (Yole Développement, October 2017) More OEM involvement + others 5G sub 6GHz Directly to disruptive mmwave 5G Potential new semiconductor entries mmwave 5G OSAT services Technology strategy and competition ongoing? The SiP supply chain in the smartphone RF front end (FEM/PAM) in today s 4G technology is clearly led by 5 IDMs: Qorvo, Broadcom (Avago), Skyworks, Murata and TDK Epcos. Part of their production is outsourced to top OSATs: ASE, Amkor, JCET Group and SPIL. The future brings diversified strategies on which markets to target first. Today s IDMs are more focusing on 5G sub 6 GHz solutions while Qualcomm is attempting to skip a step directly focusing on promoting and developing mmwave 5G technologies while working on establishing a 5G mmwave supply chain in order to ensure early leadership. Various packaging technology options and market uncertainties leave OSATs to make difficult choices on targeted customers, markets and packaging architectures to qualify and offer, in order to motivate IDMs for further outsourcing. With 5G mmwave, 5G sub 6 GHz and 5G IoT developing in parallel, what are the strategies of each RF SiP manufacturer and their long term

20 MARKET & TECHNOLOGY REPORT outlook? Can Qualcomm outpace the competitors by being first to develop 5G mmwave technologies or are the timelines premature? How are OSATs responding and is outsourcing expected to increase or decrease at mmwave frequencies? With specific technology changes at 5G mmwave, doors are open for other fabless and IDM to enter the competition at RF front end. Why are they considered as potential new entries and how can the supply chain? This report aims to provide answers to these diverse and challenging questions. COMPANIES CITED IN THE REPORT (non exhaustive list) Amkor (J-Devices, Nanium), Apple, ASE Group, Broadcom Ltd. (Avago Technologies, Javelin Semiconductor), Cavendish Kinetics, Cisco, Deca Technologies, Ericsson, Fujitsu, GLOBALFOUNDRIES, Google, Huawei (Hisilicon), Infineon, Intel, JCET/STATS ChipPAC, Kyocera, Lenovo, LG, Marvell, Mediatek, Nepes, NXP Semiconductors (Freescale), Microsoft, Murata Manufacturing Company, NTT Docomo, ON Semiconductor, OPPO, Panasonic, Peregrine Semiconductor/Murata, Powertech Technology, Qorvo (RFMD, Triquint), Qualcomm (RF360), Samsung, Skyworks Solutions, Soitec, Spreadtrum, SPIL, STMicroelectronics, TDK-EPC (EPCOS), Texas Instruments, TSMC, UMC, Vivo, Xiaomi, ZTE and more TABLE OF CONTENTS (complete content on i-micronews.com) Introduction 3 > Methodology > Report synergies > Objectives, scope, glossary > Advanced packaging platforms Executive summary 15 Market drivers and dynamics 35 > Advanced packaging drivers > RF packaging environment > Disruptions and opportunities Technology 56 > Challenges and requirements for 5G packaging > Analysis on RF SiP packaging platforms in development > RF SiP packaging roadmaps Players and supply chain 87 > Player landscape and positioning > Company strategies > Business model shifts Market forecasts 102 > RF SiP forecasts > Unit count > Wafer count > Revenue Conclusions 117 Yole Développement presentation 121 AUTHORS Andrej Ivankovic is a Technology & Market Analyst, in the Advanced Packaging and Semiconductor Manufacturing team, at Yole Développement the «More than Moore» market research and strategy consulting company. He holds a master s degree in Electrical Engineering, with specialization in Industrial Electronics from the University of Zagreb, Croatia and a PhD in Mechanical Engineering from KU Leuven, Belgium. He started as an intern at ON Semiconductor performing reliability tests, failure analysis and characterization of power electronics and packages. The following 4 years he worked as a R&D engineer at IMEC Belgium on the development of 3D IC technology, focusing on electrical and thermo-mechanical issues of 3D stacking and packaging. Part of this time he also worked at GLO- BALFOUNDRIES as an external researcher. He has regularly presented at international conferences authoring and co-authoring 18 papers and 1 patent. OBJECTIVES OF THE REPORT Translate 5G market drivers to semiconductor packaging dynamics Summarize multi die packaging (SiP) technology challenges and requirements for RF Front-End in smartphones Analyze various developing RF SiP architectures for sub 6 GHz and mmwave frequencies, advantages and suitability thereof Analyze supply chain changes and opportunities for 5G in smartphones RELATED REPORTS Benefit from our Bundle & Annual Subscription offers and access our analyses at the best available price and with great advantages Smartphone RF Front-End Module Review Status of the Advanced Packaging Industry 2017 Glass Substrate Manufacturing in the semiconductor field 2017 Find all our reports on 5G s Impact on the RF Front-End Industry Find more details about this report here: Claire Troadec is leading the RF activity at Yole Développement. She has been a member of the MEMS manufacturing team from She graduated from INSA Rennes in France with an engineering degree in microelectronics and material sciences. She then joined NXP Semiconductors, and worked for 7 years as a CMOS process integration engineer at the IMEC R&D facility. During this time, she oversaw the isolation and performance boost of CMOS technology node devices from 90 nm down to 45 nm. She has authored or co-authored seven US patents and nine international publications in the semiconductor field and before joining Yole Développement managed her own distribution company.

21 ORDER FORM Advanced RF System-in-Package for Cell Phones 2017 BILL TO Name (Mr/Ms/Dr/Pr): Job Title: Company: Address: City: State: Postcode/Zip: Country*: *VAT ID Number for EU members: Tel: Date: PRODUCT ORDER - REF. YDAP17041 Please enter my order for above named report: One user license*: Euro 5,490 Multi user license: Euro 6,490 - The report will be ready for delivery from November 6, For price in dollars, please use the day s exchange rate. All reports are delivered electronically at payment reception. For French customers, add 20% for VAT I hereby accept Yole Développement s Terms and Conditions of Sale (1) Signature: *One user license means only one person at the company can use the report. SHIPPING CONTACT First Name: PAYMENT Last Name: Phone: BY CREDIT CARD Visa Mastercard Amex Name of the Card Holder: Credit Card Number: Card Verification Value (3 digits except AMEX: 4 digits): Expiration date: BY BANK TRANSFER BANK INFO: HSBC, 1 place de la Bourse, F Lyon, France, Bank code: 30056, Branch code: Account No: , SWIFT or BIC code: CCFRFRPP, IBAN: FR RETURN ORDER BY FAX: +33 (0) MAIL: YOLE DÉVELOPPEMENT, Le Quartz, 75 Cours Emile Zola, Villeurbanne/Lyon - France SALES CONTACTS North America - Steve Laferriere: laferriere@yole.fr Europe & RoW - Lizzie Levenez: levenez@yole.fr Japan & Rest of Asia - Takashi Onozawa: onozawa@yole.fr Greater China - Mavis Wang: wang@yole.fr Specific inquiries: info@yole.fr (1) Our Terms and Conditions of Sale are available at The present document is valid 24 months after its publishing date: October 11, 2017 / ABOUT YOLE DEVELOPPEMENT Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management. The More than Moore market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business. CONSULTING AND ANALYSIS Market data & research, marketing analysis Technology analysis Strategy consulting Reverse engineering & costing Patent analysis Design and characterization of innovative optical systems Financial services (due diligence, M&A with our partner) More information on MEDIA & EVENTS i-micronews.com website and e-newsletter Communication & webcast services Events: TechDays, forums, More information on REPORTS Market & technology reports Patent investigation and patent infringement risk analysis Teardowns & reverse costing analysis Cost simulation tool More information on CONTACTS For more information about : Consulting & Financial Services: Jean-Christophe Eloy (eloy@yole.fr) Reports: David Jourdan (jourdan@yole.fr) Yole Group of Companies Press Relations & Corporate Communication: Sandrine Leroy (leroy@yole.fr)

22 Source: Wikimedia Commons Yole Développement From Technologies to Market 2017

23 FIELDS OF EXPERTISE COVERED BY OUR 35+ ANALYSTS Software Photonics Imaging MEMS & Sensors RF Devices & Techno. Displays MedTech Solid State Lighting (LED, OLED, ) Manufacturing Compound Semi. Advanced Packaging Power Electronics Advanced Substrates Batteries / Energy Management About Yole Développement 2

24 3 BUSINESS MODELS o Consulting and Analysis Market data & research, marketing analysis Technology analysis Strategy consulting Reverse engineering & costing Patent analysis Design and characterization of innovative optical systems Financial services (due diligence, M&A with our partner) o Reports Market & technology reports Patent investigation and patent infringement risk analysis Teardowns & reverse costing analysis Cost simulation tool o Media i-micronews.com e-newsletter Communication & webcast services Events: TechDays, forums, About Yole Développement 3

25 A GROUP OF COMPANIES Due diligence Innovation and business maker Market, technology and strategy consulting Manufacturing costs analysis Teardown and reverse engineering Cost simulation tools IP analysis Patent assessment Design and characterization of innovative optical systems About Yole Développement 4

26 OUR GLOBAL ACTIVITY Europe office Frankfurt Paris Nantes Vénissieux Nice HQ in Lyon Yole Korea Yole Japan Greater China office 40% 30% of our business Seoul Tokyo Hsinchu Yole Inc. Phoenix Palo Alto 30% of our business of our business About Yole Développement 5

27 ANALYSIS SERVICES - CONTENT COMPARISON Breadth of the analysis High Technology and Market Report Leadership Meeting Multi- Customers Action Q&A Service Meet the Analyst Custom Analysis Low Depth of the analysis High About Yole Développement 6

28 SERVING THE ENTIRE SUPPLY CHAIN Integrators and end-users Our analysts provide market analysis, technology evaluation, and business plans along the entire supply chain Device manufacturers Suppliers: material, equipment, OSAT, foundries Financial investors, R&D centers About Yole Développement 7

29 SERVING MULTIPLE INDUSTRIAL FIELDS We work across multiples industries to understand the impact of More-than- Moore technologies from device to system Industrial and defense Energy management Transportation makers Medical systems Mobile phone and consumer electronics Automotive From A to Z About Yole Développement 8

30 REPORTS COLLECTION o o o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in: MEMS & Sensors RF devices & technologies Imaging Medical technologies (MedTech) Photonics Advanced packaging Manufacturing Advanced substrates Power electronics Batteries and energy management Compound semiconductors Solid state lighting Displays You are looking for: An analysis of your product market A review of your competitors evolution An understanding of your manufacturing and production costs An understanding of your industry technology roadmap and related IPs A clear view on the evolution of the supply chain The combined team of 60+ experts (PhDs, MBAs, industry veterans ) from Yole Développement, System Plus Consulting and KnowMade, collect information, identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape. In the past 19 years, we worked on more than projects, interacting with technology professionals and high level opinion makers from the main players of the industry. Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. Gain full benefit from our Bundle and Annual Subscription offers About Yole Développement 9

31 OUR 2017 REPORTS PLANNING (1/2) MARKET AND TECHNOLOGY REPORTS by Yole Développement o MEMS & SENSORS Acoustic MEMS and Audio Solutions 2017 Integrated Passive Devices Market Status D Imaging & Sensing 2017 Status of the MEMS Industry 2017 Silicon Photonics 2017* MEMS & Sensors for Automotive 2017 High End Inertial Sensors for Defense and Industrial Applications 2017* Magnetic Sensors Market and Technologies 2017 Sensors and Sensing Modules for Smart Homes and Buildings 2017 Sensing and Display for AR/VR/MR 2017** MEMS Packaging 2017 Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017 o RF DEVICES AND TECHNOLOGIES RF Front End Modules and Components for Cellphones 2017 Advanced RF SiP for Cellphones G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals 2017 RF Technologies for Automotive Applications 2017 GaN and Si LDMOS Market and Technology Trends for RF Power 2017 o MANUFACTURING Glass Substrate Manufacturing 2017 Equipment & Materials for Fan Out Technology 2017 Equipment and Materials for 3D TSV Applications 2017 Emerging Non Volatile Memories 2017* *2016 version still available / **To be confirmed o MEDTECH Status of the Microfluidics Industry 2017 Solid State Medical Imaging 2017 Connected Medical Devices: the Internet of Medical Things 2017 Sensors for Medical Robotics 2017 Artificial Organs: Market & Technology Analysis 2017 Organs-on-a Chip 2017 o ADVANCED PACKAGING Advanced Substrates Overview 2017 Integrated Passive Devices Market Status 2017 Status of the Advanced Packaging Industry 2017 Fan Out Packaging: Market & Technology Trends 2017* 3D TSV and 2.5D Business Update - Market and Technology Trends 2017 Advanced QFN: Market & Technology Trends 2017** MEMS Packaging 2017 Advanced Packaging for Memories 2017 Advanced RF SiP for Cellphones 2017 Power Packaging Market and Technology Trends 2017 Embedded Die Packaging: Technologies and Markets Trends 2017 o IMAGING & OPTOELECTRONICS 3D Imaging & Sensing 2017 Status of the CMOS Image Sensor Industry 2017* Camera Module for Consumer and Automotive Applications 2017* Uncooled Infrared Imaging Technology & Market Trends 2017* Solid State Medical Imaging 2017 Embedded Software for Machine Vision Systems 2017** o BATTERY AND ENERGY MANAGEMENT Status of the Rechargeable Li-ion Battery Industry About Yole Développement 10

32 OUR 2017 REPORTS PLANNING (2/2) o POWER ELECTRONICS Status of Power Electronics Industry 2017 Power MOSFET 2017: Market and Technology Trends IGBT Market and Technology Trends 2017 Power Module Packaging: Material Market and Technology Trends 2017 Power SiC 2017: Materials, Devices, and Applications Power GaN 2017: Materials, Devices, and Applications* Materials Market Opportunities for Cellphone Thermal Management (Battery Cooling, Fast Charging, Data Processing, etc.) 2017 Gate Driver Market and Technology Trends 2017 Power Management ICs Market Quarterly Update 2017 Integrated Passive Devices Market Status 2017 Thermal Management for LED and Power 2017 o COMPOUND SEMICONDUCTORS Power SiC 2017: Materials, Devices, and Applications Power GaN 2017: Materials, Devices, and Applications* GaN and Si LDMOS Market and Technology Trends for RF Power G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals 2017 Bulk GaN Substrate Market 2017 o DISPLAYS MicroLED Displays 2017 MicroLED IP 2017 Quantum Dots for Display Applications 2017 Phosphors & Quantum Dots LED Downconverters for Lighting & Displays Horticultural Lighting Technology, Industry and Market Trends Automotive Lighting Technology, Industry and Market Trends* Active Imaging and Lidar IR Lighting** LED Lighting Module Technology, Industry and Market Trends IR LEDs and VCSELs - Technology Applications and Industry Trends 2017 Phosphors & Quantum Dots LED Downconverters for Lighting & Displays MicroLED Displays 2017 CSP LED Lighting Module 2017 LED Packaging 2017 Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017 PATENT ANALYSIS by Knowmade Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017 Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets 2017 MEMS Microphone: Patent Landscape Analysis 2017 Knowles MEMS Microphones in Apple iphone 7 Plus Patent-to-Product Mapping Microbolometer: Patents Used in Products 2017 Microfluidic Technologies for Diagnostic Applications Patent Landscape 2017 Pumps for Microfluidic Devices Patent Landscape III-N Patent Watch MicroLEDs: Patent Landscape Analysis 2017 Uncooled Infrared Imaging: Patent Landscape Analysis D Monolithic Memory: Patent Landscape Analysis 2017 NMC Lithium-Ion Batteries Patent Landscape Analysis FLUIDIGM Patent Portfolio Analysis o SOLID STATE LIGHTING UV LEDs Technology, Manufacturing and Application Trends* *2016 version still available / **To be confirmed TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be published in About Yole Développement 11

33 OUR 2016 PUBLISHED REPORTS LIST (1/2) MARKET AND TECHNOLOGY REPORTS by Yole Développement o MEMS & SENSORS Gas Sensors Technology and Market 2016 Status of the MEMs Industry 2016 Sensors for Cellphones and Tablets 2016 Market and Technology Trends of Inkjet Printheads 2016 Sensors for Biometry and Recognition 2016 Silicon Photonics 2016 o IMAGING & OPTOELECTRONICS Status of the CMOS Image Sensor Industry 2016 Uncooled Infrared Imaging Technology & Market Trends 2016 Imaging Technologies for Automotive 2016 Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016 o MEDTECH BioMEMS 2016 Point of Care Testing 2016: Application of Microfluidic Technologies o ADVANCED PACKAGING Embedded Die Packaging: Technology and Market Trends D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016 Fan-Out: Technologies and Market Trends 2016 Fan-In Packaging: Business update 2016 Status and Prospects for the Advanced Packaging Industry in China 2016 o MANUFACTURING Thin Wafer Processing and Dicing Equipment Market 2016 Emerging Non Volatile Memories 2016 o COMPOUND SEMICONDUCTORS Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends GaN RF Devices Market: Applications, Players, Technology and substrates 2016 Sapphire Applications & Market 2016: from LED to Consumer Electronics Power SiC 2016: Materials, Devices, Modules, and Applications o LED UV LED Technology, Manufacturing and Applications Trends 2016 OLED for Lighting 2016 Technology, Industry and Market Trends Automotive Lighting: Technology, Industry and Market Trends 2016 Organic Thin Film Transistor 2016: Flexible Displays and Other Applications Sapphire Applications & Market 2016: from LED to Consumer Electronics o POWER ELECTRONICS Power Electronics for EV/HEV 2016: Market, Innovations and Trends Status of Power Electronics Industry 2016 Passive Components Technologies and Market Trends for Power Electronics 2016 Power SiC 2016: Materials, Devices, Modules, and Applications Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends Inverter Technologies Trends & Market Expectations 2016 Opportunities for Power Electronics in Renewable Electricity Generation 2016 Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017 GaN RF Devices Market: Applications, Players, Technology and substrates 2016 o BATTERY AND ENERGY MANAGEMENT Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016 Stationary Storage and Automotive Li-ion Battery Packs 2016 Opportunities for Power Electronics in Renewable Electricity Generation About Yole Développement 12

34 OUR 2016 PUBLISHED REPORTS LIST (2/2) PATENT ANALYSIS by Knowmade Microbattery Patent Landscape Analysis Miniaturized Gas Sensors Patent Landscape Analysis 3D Cell Culture Technologies Patent Landscape Phosphors and QDs for LED Applications Patent Landscape TSV Stacked Memory Patent Landscape Fan-Out Wafer Level Packaging Patent Landscape Analysis TEARDOWN & REVERSE COSTING by System Plus Consulting More than 45 teardowns and reverse costing analysis and cost simulation tools published in MORE INFORMATION o o All the published reports from the Yole Group of Companies are available on our website Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports automatically (multi-user format). Contact your sales team according to your location (see the last slide) About Yole Développement 13

35 MICRONEWS MEDIA o About Micronews Media To meet the growing demand for market, technological and business information, Micronews Media integrates several tools able to reach each individual contact within its network.we will ensure you benefit from this. ONL I N E ONS I TE INP E e-newsletter i-micronews.com i-micronewsjp.com FreeFullPDF.com Unique, cost-effective ways to reach global audiences. Online display advertising campaigns are great strategies for improving your product/brand visibility. They are also an efficient way to adapt with the demands of the times and to evolve an effective marketing plan and strategy. Benefit from the i-micronews.com traffic generated by the 8,500+ monthly visitors, the 11,500+ weekly readers e-newsletter Events Brand visibility, networking opportunities Today's technology makes it easy for us to communicate regularly, quickly, and inexpensively but when understanding each other is critical, there is no substitute for meeting in-person. Events are the best way to exchange ideas with your customers, partners, prospects while increasing your brand/product visibility. Seven main events planned for 2017 on different topics to attract 100 attendees on average Webcasts Targeted audience involvement equals clear, concise perception of your company s message. Webcasts are a smart, innovative way of communicating to a wider targeted audience. Webcasts create very useful, dynamic reference material for attendees and also for absentees, thanks to the recording technology. Gain new leads for your business from an average of 300 registrants per webcast Contact: Camille Veyrier (veyrier@yole.fr), Marketing & Communication Project Manager About Yole Développement 14

36 CONTACT INFORMATION o o CONSULTING AND SPECIFIC ANALYSIS North America: Steve LaFerriere, Director of Northern America Business Development laferriere@yole.fr Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development onozawa@yole.fr Greater China: Mavis Wang, Director of Greater China Business Development wang@yole.fr RoW: Jean-Christophe Eloy, CEO & President, Yole Développement eloy@yole.fr REPORT BUSINESS North America: Steve LaFerriere, Director of Northern America Business Development laferriere@yole.fr Europe: Lizzie Levenez, EMEA Business Development Manager levenez@yole.fr Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development onozawa@yole.fr Japan & Asia: Miho Othake, Account Manager ohtake@yole.fr Greater China: Mavis Wang, Director of Greater China Business Development wang@yole.fr Follow us on o FINANCIAL SERVICES (in partnership with Woodside Capital Partners) Jean-Christophe Eloy, CEO & President eloy@yole.fr o GENERAL Public Relations: leroy@yole.fr info@yole.fr About Yole Développement 15