Electronic Costing & Technology Experts
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1 Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer Nantes France Phone : +33 (0) info@systemplus.fr March Version 1 - written by Romain Fraux DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners by SYSTEM PLUS CONSULTING, all rights reserved. 1
2 Glossary 1. Overview / Introduction 4 Executive Summary Reverse Costing Methodology 2. Company Profile 7 Broadcom 2. Physical Analysis 11 Package Package View & Dimensions Package Opening Package Cross-Section Die Die View & Dimensions Die Marking Die Delayering Main Blocks Identification Die Process (CMOS Transistors, SRAM, ROM) Die Cross-Section Process Characteristics 3. Cost Analysis 35 Synthesis of the Cost Analysis Main Steps of Economical Analysis Yields Explanation Die Summary Front-End Summary Wafer Fabrication Unit Back-End: Probe Test, Backgrinding & Dicing Back-End: Package Assembly Back-End: Final Test Economic Analysis Hypotheses Yields Synthesis Wafer Cost Die Cost Packaging Cost Final Test Cost Component Cost 4. Selling Price Estimation 52 Definitions of Prices Broadcom Financial Results & Correction Factors Selling Price Contact 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 2
3 This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the. The BCM89501 uses Broadcom s high-performance BroadR-Reach Ethernet technology, the world s first Ethernet automotive solution, to deliver 100Mbps over unshielded single-twisted pair cable. This technology for automotive central gateway, Advanced Driver Assistance (ADAS), and infotainment is on the road today in a wide range of vehicles, and according to Broadcom it reduces connectivity cost by up to 80% and cabling weight by as much as 30%. The BCM89501 is a highly-integrated 7-port switch with five embedded PHYs. The component is provided in a thermally-enhanced elqfp 176-pin package and delivers the most comprehensive automotive technology solution required by OEM and Tier 1 suppliers, with automotive grade-2 temperature, AEC-Q100, and TS16949 certifications. Built with a 65nm technology, the circuit integrates an ARM Cortex R4 processor and a large amount of on-chip SRAM. This report, based on a complete physical analysis of the chip, provides an estimated manufacturing cost and selling price along with forecasts for the coming years by SYSTEM PLUS CONSULTING, all rights reserved. 3
4 The reverse costing analysis is conducted in 3 phases: Teardown analysis Package is analyzed and measured. The die is extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking. Removal of metal layers in order to identify the nature of the transistors and to measure the minimum dimensions. A cross section is realized in order to get the BEOL structure Set up of the manufacturing process. Costing analysis Setup of the manufacturing environment. Cost simulation of the process steps with different year and quantity scenarios. Selling price analysis Supply chain analysis. Analysis of the selling price by SYSTEM PLUS CONSULTING, all rights reserved. 4
5 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 5
6 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 6
7 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 7
8 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 8
9 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 9
10 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 10
11 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 11
12 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 12
13 Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated). These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 13
Electronic Costing & Technology Experts
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Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
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