Day One 13 March Day Two 14 March 2019

Transcription

1 GSEF 2019 Advisory Board Ralph Lauxmann, Senior Vice President Systems & Technology, Continental Automotive Hans Adlkofer, Vice President Systems Group, The Automotive Division, Infineon Technologies Hai Wang, Senior Vice President, Global Technology Innovation, NXP Semiconductors Wei-Chung Wang, Executive Vice President, Manufacturing and Operations, Cypress Semiconductor Michael Campbell, Senior Vice President Engineering, Qualcomm Incorporated Qi Bi, Senior Vice President, China Telecom Technology Innovation Centre Dr Guanshan Tong, Senior Vice President and Former Chief Technology Officer, BOE Technology Group Co Eiji Fujii, Executive Officer, Panasonic Corporation and Vice President Chief Technology Officer, Automotive & Industrial Systems Company Ross Jatou, Vice President & General Manager, Automotive Solutions Division, ON Semiconductor Day One 13 March :00-18:00 Event Registration 18:00-21:00 Drinks Reception and Welcome Dinner Day Two 14 March :00-08:50 Event Registration and Collection of Meeting schedules 08:50-09:00 Chair s opening remarks 09:00-09:30 Opening Address: Hans Storks, Chief Technology Officer, On Semiconductor The race for disruptive technology market dominance Understanding what is needed to achieve leadership in the market Assessing the relationship between artificial intelligence, big data and IoT 09:30-10:00 How is artificial intelligence disrupting the semiconductor and consumer electronics industry Embracing the opportunities of artificial intelligence in new technology and chip development Future trends: Exploring how artificial intelligence is driving UAV intelligence, autonomy in consumer drones

2 10:00-10:30 Application of Big Data and Machine Learning in Global Manufacturing Chains to Control IC Quality, Yield, and Manufacturing Excellence Implementation of end-to-end IC-level traceability for automotive quality control Automated cross-supply-chain data analytics for smart manufacturing Smart data sharing in collaborative manufacturing ecosystems Going from big data to instant manufacturing insights and action Dr. Paul Simon - Executive VP and co-founder, Qualtera 10:35-11:05 Business Meeting 1 11:10-11:40 Business Meeting 2 GSF Chairperson tbc GEF Chairperson tbc 11:45-12:15 12:15-12:45 Business Meeting 3 Semiconductors for Safe and Secure Mobility Automotive is driving the next wave of semiconductor growth as global megatrends result in tripling the IC content per car With this growth, comes a new set of disruptive challenges in automotive IC manufacturing To ensure quality, safety and security, a new more holistic approach is needed This session will address the manufacturing considerations and requirements for future car electronics Automotive: Enabling the Next Era of In-Vehicle Experiences Exploring the advancement of new features, connectivity, and intelligence in modern vehicle Optimising IVI systems to enhance user experience How to successful integrate of smart technology to meet customer needs The role of artificial intelligence and machine learning in personalising the driving experience Business Meeting 4

3 12:45-13:15 13:15-14:15 Hai Wang, Senior Vice President, Global Technology Innovations, NXP Semiconductors Business Meeting 5 E-mobility and Electric Vehicles: GM s Zero emission strategy Overcoming challenges to battery technology and charging infrastructure How existing supply chain support EV battery production Maximising car lifetime value through IOT and data analytics Lunch and Networking 14:15-14:45 Chairperson: Chris Foster: Vice President Fellow, FAB25 Product Engineering and Integration, Cypress Advanced Materials: Role of materials in addressing new challenges in developing devices with advanced performance Business Meeting 6 PANEL DISCUSSION: The future of semiconductor test systems Options for testing complex semiconductor devices 14:45-15:15 Traditional design and test cycles High Volume MEMS Production Test Speakers: Astronics Test Systems 15:15-15:45 Business Meeting 7 15:50-16:20 Panel discussion: The Future of displays LCD, OLED, or MicroLED Flexible displays for future technology: Unlocking innovative Which will dominate the industry LCD, OLED or MicroLED product designs Acknowledging how OLED will influence the smartphone, smart TVs and flexible electronics industry How will flexible displays and sensors promote innovative products What will emerge after MicroLED How will they facilitate greater user experience and compatibility with the user s lifestyle

4 16:20-16:50 16:50-17:20 17:20-18:00 Best Practice: Samsung Advanced Package Solution What is "Advanced Package"? Mobile package trend and solution path for future premium mobile products AI/Network package solution using interposer and future application Samsung Package solution you may not know! Dae-Woo Kim, Vice President of advanced package solution, package development team, Samsung Semiconductor R&D Center The end of Moore s law: Assessing the Path forward for IC manufacturing New Technology innovation and brand protection Understanding the next level of consumer technology Brand protection and the development of unique products Business Meeting 8 PR (Chidi) Chidambaram, Vice President, QCT Process Technology & Foundry Engineering, Qualcomm, Incorporated PANEL DISCUSSION: 5G world- Growth in high bandwidth communication: the move from 4G to 5G Research shows that 5G connections will provide a number of enhanced capabilities over 4G which include increased data rates, reduced latency and enhanced reliability. This panel aims to assess the progress of 5G connection. Establishing infrastructure to withstand 5G capabilities Overcoming challenges surrounding power and the security risk brought on by connections Exploring how 5G will push forward innovation in autonomous vehicles, smartphones and VR/AR industries Examining the future of 5G: Will there be 6G in the near future Qi Bi, Senior Vice Present, China Telecom Technology Innovation Centre 18:00 Chair s Closing Remarks 18:00-20:00 Drinks Reception and Networking 08:00-09:00 Event Registration and Collection of Meeting Schedules 09:00-09:10 Chair s Opening Remarks: Day Three 15 March 2019

5 09:10-09:40 Opening address: Maximising Industry 4.0 to achieve efficiency and save cost How to successfully deploy machine learning and robotics for labour intensive tasks Combining lean manufacturing and industry 4.0 principles to achieve operational excellence Prevention maintenance: Implementing advanced analytics to assess machine function in real-time and predict failure Leveraging incoming data to improve day-to-day operations 09:40-10:10 Sponsored presentation by Linde 10:10-10:40 Business Meeting 9 10:40-11:10 Business Meeting 10 11:10-11:40 IoT Security be part of the solution How to successfully mitigate the increased security risks of connecting several devices to the internet Latest policies and planning of IoT security such as internet security law of the People's Republic of China Designing chips that protect themselves: Protecting data, embedded systems and software Recognising the long-term cost benefits of this approach Understanding the rapidly evolving cyber-threat landscape 11:45-12:15 12:15-12:45 GSF Chairman: tbc Business Meeting 11 Lithography: Movement from 7nm to 5nm Lithography at 5nm - Will EUVL have a prominent role at 5nm? Identifying new innovative methods for heat management Analysing the power density and physical limits of 5nm chips Overcoming the manufacturing cost barriers: Alternative to EUV How quantum effects will impact designs below 5nm GEF Chairman: tbc Virtual reality and augmented reality deployment: maximising the impact How to best utilise VR tech and mainstream VR adoption to further your business goals and increase revenue Integrating augmented reality to personalise user experience Leveraging VR and AR in other industries Convergence in the cloud for IoT and Big Data Examining the exponential growth of artificial intelligence adoption in the cloud and at the edge The value of pre-processing at the edge to optimising the cloud environment

6 12:45-13:45 Lunch and Networking 13:45-14:15 14:15-14:45 14:45-15:15 15:15-15:55 Business Meeting 12 Memory/NAND application in the Internet of Things world Addressing new applications Exploring the 3D NAND Flash memory demand for smartphones, laptops and tablets John Scaramuzzo, SVP, Advanced Storage Technology Office, Western Digital Automotive and telecom industry partnerships in driving forward innovation in mobility and 5G The benefits of collaborations in the development of future mobility and 5G services Security considerations and future forecasts Business Meeting 13 Business Meeting 14 PANEL DISCUSSION: The growth of autonomous driving: Achieving level four - highly autonomous vehicles by Autonomous vehicles can be viewed as a blend of semiconductor driven technology, the list includes: 3-D mapping applications, augmented reality, enhanced LIDAR sensors and improved camera based sensors. These developments have changed the way vehicle manufacturers interact with their suppliers and increased the demands from the semiconductor industry. What will it take to achieve success and encourage the journey towards full-autonomous vehicles? How will the industry address the fundamental concerns around safety How to bridge the impeding gap between expectations and demands between the automotive industry and their suppliers Understanding the regulation and policies that underpin the movement to build driverless cars Evaluation to the practicality of the time frame 15:55-16:00 Chair s Closing Remarks 16:00-17:00 Farewell Drinks and Close of GSEF 2019