Application-Based Opportunities for Reused Fab Lines

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1 Application-Based Opportunities for Reused Fab Lines Semicon China, March 17 th 2010 Keith Best Simax Lithography S I M A X A L L I A N C E P A R T N E R S

2 Outline Market: Exciting More than Moore applications are well suited for mature manufacturing technology Equipment: used production equipment can do the job with minimal adaptations Examples of equipment adaptations and process integration Page 2

3 COMPANY CONFIDENTIAL More than Moore is well suited for mature manufacturing technology Integration Density (design rule) 0.1 µm 0.2 µm 0.4 µm 0.8 µm 1.6 µm Moore s Law 300mm TFH Compound Semiconductors MEMS 3D IC 200mm Photonics Opto- MEMS More than Moore Lab-ona-chip Biochips Electronics RF Mechanics Optics Chemistry Biology Integration of functionality Page 3

4 MEMS is diverse and growing rapidly Si microphone Revenues 2007 ~ 7 B$ CAGR (units) 32% CAGR (rev): 17% Key MEMS Application Areas Telecommunications Accelerometer ( IC Mechanics) Automotive Medical Gyroscope ( UC Irvine) Consumer IT Peripherals Pressure sensor ( ST) Page 4 Source: Yole development 2008

5 Compound semiconductor (III-V) devices can be found everywhere Source: Yole Development 2008 Page 5

6 Applications Requirements and Trends MEMS Non-CMOS devices with a large diversity of non-standard processes on Si or glass Double side alignment Non-standard material & wafer stack handling Thick resist, large DoF, high topography & trenches, noncritical CD, but relatively tight CDU (<< 10%) Compound Semiconductor Materials are typically only available in smaller wafer sizes i-line or DUV T-Gate process to allow for high current densities 2" wafers, thinner wafers, backside alignment for backside Vias High RF needs push litho requirements towards 0.15 µm (e.g. SAW filters)

7 Outline Market Opportunities Overview Equipment: Used Lithography and Track systems Material handling and Process integration Page 7

8 Lithography and Track Requirements Lithography Front to Back-side Alignment: double side processing, passive above IC concepts Sensor apps require excellent CD control Pressure, filters, etc 5x reduction litho Superior stitching for large die manufacturing requires accurate stages High topography requires focus depth and flexibility on z-axis Ability to align on different focal planes Wafer Track Double sided processing & through hole Vias Wafer reverser Edge handling hotplates Edge grip chuck Bonded wafer applications and mixed wafer size runs require multiple wafer size handling Support for short shelf life resists and low volume applications require syringe dispensers Thick film applications require high viscosity pumps

9 Simax Lithography and Rite Track specialize in pre-owned equipment ASML PAS5500 ASML PAS 2500/5000 TEL Mark 7/8 TEL Mark Vz, VA SVG 90-S/SE SVG 8x, RT88e Page 9

10 Applications ASML and Rite Track 200mm systems Silicon Scan -ner PAS 5500/4x0 PAS 5500/11x0 PAS 5500/5x0, /7x0, /8x0 Stepper PAS 5500/3x0 PAS 5500/1x0, /2x0 PAS 5500/22 PAS 5500/80, /60 PAS 2500/5000 ( 6 wafers) ArF system (193nm) KrF system (248nm) i-line system (365nm) Track TEL Mk 7, Mk 8 (5-8 ) TEL Mk V (3-6 ) SVG 9x (4-8 ) SVG/RT 8x (2-8 ) TEL Mk Series SVG/Rite Track 1.6µm 0.8µm 0.4µm 0.2µm 0.1µm

11 Outline Market Opportunities Overview Equipment: Used Lithography systems Material handling and Process Integration Page 11

12 Material Handling: Lithography III V 2, 3 wafers & Pieces Holders and positioning rings Flexible materials Lamination to Holder wafers MEMS: Thin/Thick Wafers Allows the usage of wafer thickness between 140um 2000µm Page 12

13 Improved wafer table for ASML systems Flatter, harder (SiC) chucks with lower contact area 20 local data position (μm) A verage M ax M in Thickness and ring customization A verage M ax M in Page 13

14 RITE TRACK MEMS & LED ENHANCEMENTS Need Double Sided Processing Through-Hole Via Wafer Processing Quick Wafer Size Change Special Resist Considerations Description Inline Front & Backside Wafer Processing Vacuumless Chuck Bonded Wafer Applications Mixed Size Wafer Runs Short Shelf-Life Resists Low Volume Applications High Viscosity Resists WAFER REVERSER EDGE GRIP CHUCK AUTO SIZE CHANGE SYRINGE DISPENSE RITE TRACK Solution April INLINE DOUBLE SIDED WAFER PROCESSING EXCLUSION ZONE CONTACT EDGE HANDLING HOTPLATE BACKSIDE CONTACT IN OUTER 3-4 MM ONLY 150MM & 200MM EDGE GRIP DESIGN WITH FLAT/NOTCH ORIENTATION 150MM & 200MM WAFER ENHANCING TODAY S TECHNOLOGY INNOVATION FOR TOMORROW Rite Track Confidential Presentation 2009 RUN TWO WAFER SIZES WITH NO CHANGEOVER INCREASE PRODUCTIVITY A WINNING COMBINATION Production-Proven Track Systems + Rite Track Customized Solutions SYRINGE DISPENSE CONTROLLED AS ONE OF THE COAT DISPENSES QUICK EASY CHANGE-OUT HI VISCOSITY PUMPS RETROFIT ON EXISTING TOOL OR WITH SUPPLIED SYSTEMS SYSTEM INTEGRATION OR WITH SIDE CABINET ADDITIONS

15 Thick Resist for MEMS plating Recent improvements in chemically amplified i-line materials have provided solutions for higher NA systems Thick, DUV (248nm)resist has similar properties 2um (1:1) Dense Lines in 10um KMPR Isolated 0.3um trench in 4um resist AZ DTF8 Page 15

16 Conclusion Applications markets are growing fast Revenues 2007 ~ 7 B$ CAGR (units) 32% CAGR (rev): 17% Key MEMS Application Areas Telecommunications Automotive Medical Consumer IT Peripherals Mature technology equipment can very well handle these applications Solid process integration will optimize the production process Simax focuses on applications for mature technology equipment and is eager to support you Page 16

17 Thank You www. services.com S I M A X A L L I A N C E P A R T N E R S Page 17

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