Glass Substrates for Semiconductor Manufacturing

Transcription

1 Glass Substrates for Semiconductor Manufacturing The first REPORT analyzing in detail the glass wafer for wafer level packaging and micro structuring technologies applications 2013

2 Content of the report (1/2) Table of contents...2 Glossary...3 Report Scope...4 Companies Cited in the Report.. 5 Executive Summary..6 Glass Wafer Market Forecast (in $M, wspy) Breakdown by Functionality 9 Breakdown by End-Application.12 Breakdown by Wafer Size 14 Glass Substrate Players Market Share and Revenue..16 Introduction, Definitions & Report Scope Glass Wafer Market Status & Evaluation Breakdown by End- Application.34 Glass Substrate Market Forecast (in wspy) Shipment Forecast Shipment Forecast..42 Glass Substrate Market Forecast (in $M) Revenue Forecast Revenue Forecast Detailed Glass Market Forecast by End-Application..57 MEMS Application Opportunities 59 CIS Application Opportunities. 71 RF/Analog IC Opportunities. 77 LED Application Opportunities. 83 Memory Opportunities 88 Logic IC Opportunities 93 Power Opportunities 98 Optoelectronic Component Opportunities 106 µbattery Opportunities Glass Wafer Market Status & Evaluation: Breakdown by Functionnalities Glass Substrate Market Forecasts (in wspy) Shipment Forecast Shipment Forecast..118 Glass Substrate Market Forecasts (in $M) Revenue Forecast Revenue Forecast

3 Content of the report (2/2) Detailed Glass Market Forecast by Function/Platform 123 Focus on Support Substrate..125 Focus on WLCapping 141 Focus on WLOptics 171 Focus on 3D TGV/2.5D Interposer. 194 Focus on Carrier 209 Focus on Microstructuring 227 Glass Substrate Wafer: Supply Chain & Value Chain Main Players involved in Glass Substrate Processing 233 Glass Substrate Players Market Share and Revenue Main Players involved in Glass Substrate Processing Glass Substrate Players Market Share and Revenue..245 Structuration of Glass Substrate Wafer-Level Packaging Applications: Supply Chain for Logic IC..255 Supply Chain for MEMS Devices 257 Supply Chain for CMOS Image Sensors Supply Chain for Microfluidic Devices. 273 Glass Substrate Micromachining Technologies Conclusions & Perspectives

4 Key Objectives of the Report We have prepared a report on the glass substrate topic related to Wafer- Level Packaging and microstructuring technologies applications in order to understand the applications, the technology trends and be able to provide market forecast per functions and end applications in this area The objectives of the report are: Describe the applications of glass substrate Give the following detailed information a definition of the applicative segmentation for finished glass substrates an overview of the overall glass wafer market and market share of the main glass materials suppliers Evaluation of market developments in terms of market size (volume, value), substrate sizes/formats, by applications Technology process, specification and value chain The report does not cover ROE/DOE µoptics applications Photonics applications Flat panel display applications PV applications

5 Scope of this report coverage Platforms / Functionnalities of Glass substrates covered Wafer-Level Packaging Using Glass Microstructuring technologies Using Glass Substrate WLCapping WLOptics 3D TGV/3D glass capping interposers Glass carriers µstructures Support Substrate End Applications MEMS LED CIS Power Memory Logic RF ICs IPD/Analog µfluidic c-pv ICs Opto comp. Fuel-cells/ µbatteries

6 Glass Substrate Value Chain Structuration of GLASS Substrates: Simple GLASS: Wafer 4 / 6 / 8 / 12 Sheet or Panel Finished / Structured Wafers with: Advanced thinning & polishing treatment Cavities Fluidic channel Fluidic hole Electric «Through the Glass» Vias Electric redistribution & Bumping Printed polymer structures Specific coating / functionalization Functionnality of GLASS Substrates: Wafer Level Packaging technologies using GLASS: Support substrate WLC WLO 3D TGV/3D glass capping interposers Glass carriers Microstructuring technologies using GLASS: µstructures End Applications for GLASS Substrates: MEMS & Sensors CMOS image sensors LED Modules Memories Logic ICs Analog & RF ICs Microfluidic / Microreaction Micro-batteries / Fuel-cells Power components Concentrated - Solar PV Example of glass value chain in a camera module

7 Functionnalities of Glass substrate wafer versus End applications MEMS CIS LED memory Logic ICs RF/Analog ICs µfluidic Opto comp. Fuel-cells/ µbatteries Power Support Substrate WLC X X X X X X X WLO 3D TGV/ interposer Carriers X X X X X X X X Micro structures X

8 Glass substrate market: 2012 shipments per Application MEMS CIS LED memory Logic ICs RF/Analog ICs µfluidic Opto comp. Fuel-cells/ µbatteries Power Support Substrate 111Kwpy 58Kwpy 2,5Kwpy 0Kwpy WLC 493Kwpy 4,5Kwpy 2,9Mwpy WLO 191Kwpy 3D TGV/ interposer 25Kwpy 0Kwpy 0Kwpy 63Kwpy Carriers 22Kwpy 15Kwpy 53Kwpy Micro structures 210Kwpy

9 Shipments ( in 8 inch eq wspy) Glass substrate overall market size in wspy Breakdown per Functionnalities Glass substrate overall market size (in 8 inch Million wspy) Breakdown per End Application 16 Yole Developpement April Opto components µfluidic RF devices Logic Memory Power LED CIS MEMS

10 2012 Overall market share for glass substrate Glass substrate production for WLP 2012 Market Share Breakdown by glass supplier (in M$) Others HOYA Schott AG AGC Corning $158M Yole Developpement April 2013 PlanOptik Tecnisco Bullen Total market related to the Glass market is assessed at $158M in Schott (G), Tecnisco (JP), PlanOptik (G), Bullen (US) and Corning (US) will share almost 70% of the $158M glass substrate market this year, driven mainly by demand for WLCapping

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12 Who should be interested in this report? Equipment & Material suppliers Identify new business opportunities and prospects Understand the differentiated value of your products and technologies in this market Identify technology trends, challenges and precise requirements related to glass substrate Glass substrate manufacturers Evaluate market potential of your technologies and products Position your company in the value chain and market Monitor and benchmark your competitors R&D organizations & Investors Monitor the global activity and consolidation currently happing in the semiconductor equipment & material business in order to identify new partners, targets and take the right decision before committing to one particular supplier IDMs, CMOS foundries & OSAT players Understand technology trends related to glass substrate used in the Wafer-Level-Packaging and Micro structuring technologies

13 About the Authors of this report Amandine Pizzagalli Amandine recently joined Yole Development Advanced Packaging and MEMS manufacturing teams after graduating as an engineer in Electronics, with a specialization in Semiconductors and Nano Electronics Technologies. She worked in the past for Air Liquide with an emphasis on CVD and ALD processes for semiconductor applications Contact: pizzagalli@yole.fr

14 Companies Cited in this Report AGC, Amkor, Anteryon, ASE, Audi, Berliner Glass, Bosch, Bullen, Colorship, Corning, Dolomite, Heptagon, Hoya, Hoya, Honeywell, Hynix, Qualcomm, Ibiden, IMT AG, IPDiA, Infineon, Lemoptix, Microfluidic ChipShop, Micronit, Micron, MikroGlass, Murata, Nemotek, Omnivision, Osram, OptoPac, PlanOptik, Saint-Gobain,Sensonor/Infineon, Samsung, SK Hynix,Statchippac, STMicro, Schott, Sony, SPIL,Tecnisco, Texas Instruments, Toshiba, TSMC, Ulcoat, VisEra, and more

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16 2010 Copyrights Yole Développement SA. All rights reserved. Our latest market reports Flip-chip 2013 Report 3D Glass & Silicon interposers Report MEMS Packaging Market & Technology Trends N o k i a 6 & 6 mm mm ~25 sq mm ~125 sq mm MEMS Front End Manufacturing Deep RIE Thin Wafer Handling Ferro-Electric Thin Films Flexible & Printed Electronics

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