The Collaboration Engine: Enabling Innovation in Microelectronics
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1 The Collaboration Engine: Enabling Innovation in Microelectronics Karen Savala President, SEMI Americas
2 Outline About SEMI Semiconductors: A History of Collaboration Collaboration in other Microelectronics Industries 3D IC Crossroads
3 SEMI: The Global Association Global Association ~1800 member companies Events SEMICON, SOLARCON Standards Advocacy Market Research EHS Semiconductor, LED, FPD, MEMS, PV, plastic electronics, emerging markets
4 Discovery Invention Innovation
5 Semiconductors: A History of Collaboration
6 Moore s Law: A Collaborative Effort
7 R&D Collaboration: A New Era in Industry Collaboration
8 Manufacturing Standards: Reducing Cost, Enabling Innovation
9 SEMI International Standards
10 Collaboration: Critical to Scale in Emerging Industries
11 Solar PV: Standards to Support a Global Trillion Dollar Industry Calisolar/ESP Calisolar/ESP
12 International PV Technology Roadmap (ITRPV) ITRPV has become a major contributor to identifying and focusing the industry on key cost reduction opportunities in c-si PV Now in its 3rd Edition Participation from leading suppliers and manufacturers in US, Asia and Europe Cost reduction targets identified in 18 areas 12
13 LED: Powering the Solid State Lighting Revolution Critical technology for reduction of energy consumption Standards: leading the way to reducing costs, accelerating technology development and adoption
14 LED Standards: Reducing Costs to Enable Solid State Lighting North America HB-LED Committee Iain Black (Philips Lumileds) Chris Moore (Semilab) David Reid (Silian) Bill Quinn (WEQ Consulting) Taiwan EHS Committee Shuh-Woei Yu (SAHTECH) Fang-Ming Hsu (TSMC) HB-LED Wafer TF Julie Chao (Silian) David Joyce (GT Advanced Technologies) HB-LED Assembly TF Paul Reid (Kulicke & Soffa) Impurities & Defects in HB-LED Sapphire Wafers TF Luke Glinski (GT Advanced Technologies) David Joyce (GT Advanced Technologies) Julie Chao (Silian) HB-LED Factory Automation Interface TF Daniel Babbs (Brooks Automation) Jeff Felipe (Entegris) HB-LED Equipment Communication Interfaces TF Brian Rubow (Cimetrix) Patterned Sapphire Substrate (PSS) TF Matt Novak (Bruker-Nano) Nigel Mason (LayTec) LED Safety TF Eric Lin (Epistar) Korea HB-LED Working Group Hyungsu Park (SEMES) Jonghyup Baek (KOPTI) SEMI HB-LED Liaison Report
15 New Industries Based on New Materials
16 Manufacturing Standards: Enabling Innovation
17 450mm Standards: Essential for Innovation SEMI: advocating open process, facilitating readiness through standards Transition costs: high US$8-$30 billion Collaboration essential
18 Stacked ICs Have Been Around Awhile 1979: Mostek--MK2716 EPROM riding piggyback on top of the MK38P70 microcontroller. 1985: Texas Instruments:--Two, 64Kbit, plastic-packaged DRAMs in DIPs have been stacked and soldered to produce a 128Kbit device. Source: EDA360 Insider, Nov. 9, 2011
19 SEMI 3DS-IC Standard Organization Chart NA 3DS-IC Committee Chairs: Urmi Ray (Qualcomm) Sesh Ramaswami (Applied Materials) Chris Moore (Semilab) Rich Allen (NIST) Wafer Bonded Stacks Task Force Leader: Rich Allen (NIST) Inspection & Metrology Task Force Thin Wafer Handling Task Force Leader: Urmi Ray (Qualcomm) Raghunandan Chaware (Xilinx) Richard Allen (NIST) Leader: Yi-Shao Lai (ASE) David Read (NIST) Victor Vartanian (SEMATECH) SEMI 3DS-IC Standards Activities - July 2013
20 3DS-IC: Technical Challenges Samsung Ships First Vertical 3D Memory August 2013, Engadget Xilinx Wins D InCites Award for World's First Heterogeneous All Programmable 3D IC (July 2013, PR Newswire)
21 3D IC Potential 2017 Unit Shipments WLP TSV In Million Units Gartner 2013 Excludes CMOS Sensors and MEMS
22 Competing Business Models TSMC path Front Side NiPdAu Pad Wafer Support Thin Backside Bump Debond Ship Foundry IDM Vias and Metal Layers Decision point Send to OSAT Wafer Support Thin Backside Bump Debond Assembly UMC and GLOBALFOUNDRIES path Ref: R. Huemoeller, Amkor Technology
23 The Next Step Meaningful collaboration needed across value chain Standards work helps, but new model needed to make 3D IC affordable
24 Semiconductor PV Emerging Markets Driving the Electronics Revolution
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