ITRS Update (and the European situation) Mart Graef Delft University of Technology
|
|
- Brook Weaver
- 5 years ago
- Views:
Transcription
1 ITRS Update (and the European situation) Mart Graef Delft University of Technology
2 Overview Roadmapping: Moore s Law & More than Moore Europe and the Roadmap Beyond CMOS: Nano-Tec Infrastructures: ENI2 New directions 2
3 Overview Roadmapping: Moore s Law & More than Moore Europe and the Roadmap Beyond CMOS: Nano-Tec Infrastructures: ENI2 New directions 3
4 International Technology Roadmap for Semiconductors (ITRS) now 2013 ITRS 2012 ITRS Update 2011 ITRS 2010 ITRS Update 2009 ITRS 2008 ITRS Update 2007 ITRS NTRS 1994 NTRS 1992 NTRS 1991 MicroTech 2000 Report USA Japan Korea Taiwan USA 2006 ITRS Update 2005 ITRS 2004 ITRS Update 2003 ITRS 2002 ITRS Update 2001 ITRS 2000 ITRS Update 1999 ITRS Europe 1998 ITRS Update 4
5 ITRS Objective Provide guidance to the semiconductor industry by predicting technology trends in the industry, spanning 15 years (near-term 1-6 yrs; long-term 7-15 yrs) 5
6 ITRS Organization and Implementation Organization International Roadmap Committee (IRC) 16 international technology working groups (ITWGs) ITRS release every 2 years 16 chapters, ~1000 pages, >200 tables >300 contributors, representing >50 companies ww Update of tables every other year 3 Workshops/year Europe (spring / Semicon Europa) USA (summer / Semicon West) Asia (winter / Semicon Japan) 2 Public symposia/year (incl. press conference) ~130 participants 6
7 ITRS Technology Working Groups 1. System Drivers 2. Design 3. Test & Test Equipment 4. Process Integration, Devices & Structures 5. RF and Analog/Mixed Signal 6. Emerging Research Devices 7. Emerging Research Materials 8. Front End Processes 9. Lithography 10.Interconnect 11.Factory Integration 12.Assembly & Packaging 13.Environment, Safety & Health 14.Yield Enhancement 15.Metrology 16.Modeling & Simulation 7
8 Impact of the ITRS Provides a benchmark for the semiconductor industry Identifies technology challenges Generates industrial and academic research agenda Is used by policy-makers 8
9 EC: New European strategy for electronics 9
10 Roadmapping: Requirements for technology scaling 10
11 The Red Brick Wall 11
12 Cumulative Interdependent Challenges More Moore: Increasing complexity Area Speed Power Yield Software and co-design become vital! Late CMOS Gate leakage Variability FINFET FDSOI Multi-MG High k Low k Strained SiGe Manual Design Happy Scaling V S/D leakage V Dynamic power Low cost, low power Critical dimension [nm] Year
13 Reaching dimension/complexity limits M 1G 1T Complexity in # of devices 10 mm µm 1 µm 10 nm Quantum computing Spintronics Molecular electronics Nanotubes Graphene 2013 Validated concept 1 Å 2020 Beyond CMOS? Source: STMicroelectronics 13
14 Parameterization of emerging technologies Source: ITRS/Intel 14
15 More Moore & More than Moore Source: ITRS (2011) 15
16 Smart microsystems: Beyond CMOS = More Moore + More than Moore Data Processing & Storage Radio Power Sensor & Actuator More Moore More than Moore Heterogeneous Integration 16
17 Why a Moore than More Roadmap? ITRS has demonstrated value of roadmapping for CMOS Identify pre-competitive research domains, enabling cooperation between industries, institutes and universities. Sharing of R&D efforts Increase resource efficiency through focus Reduction of development costs and time Synchronization of the equipment & materials community with the semiconductor manufacturing community More than Moore roadmapping offers a similar but more challenging opportunity Need to propose a roadmapping methodology White paper 17
18 More than Moore White Paper Roadmapping Methodology Published by the ITRS in More-than-Moore workshops Co-organized by ITRS and inemi Potsdam (D), April 2011 Noordwijk (NL), April 2012 Lyon (F), April
19 MtM Technology Assessment in ITRS FOM LEP SHR WAT ECO In ITRS today? Figure of merit Law of expected progress Willing-ness to share Wide applicability Existing community RF /++ + Yes Power + +? =? No Imaging + +? =? No Sensors / actuators (MEMS) --?? Yes Biochips --? --? -- No 19
20 MtM Roadmapping Process 20
21 Moore s Law Extended 21
22 22
23 Convergence of Semiconductors with Synthetic Biology I D. Herr, SRC SemiSynBio Workshop, February SemiSynBio Inspired Cell-Like Functionality Energy Generation Conversion Storage Utilization Architectures Research Narrow Options Prototype Continuous Improvement Sensing Physical Chemical Multimode Multiscale Subsurface Research Narrow Options Prototype Continuous Improvement Actuation Analog Digital Hybrid Approaches Hard and Soft/Adaptive Systems Autonomous Emergent Behavior Research Narrow Options Prototype Continuous Improvement Communication Transmission Filtering Novel A/D Interconversions Low Energy Approaches Reception Research Narrow Options Prototype Continuous Improvement Bioelectronics Personalized Medical Diagnostics Prosthetics and Implantable Devices Biotic/Abiotic Interfaces Multiproperty Imaging Noninvasive [Tricorder-like] Research Narrow Options Prototype Continuous Improvement Adaptive Coatings Dynamic Local Mapping Camouflage Obscuration Smart Physical Changes Remotely Directed Adaptations Research Narrow Options Prototype Continuous Improvement 23
24 ITRS: Towards a permanent process Cooperation with inemi started Introduction More-than- Moore concept MEMS Working Group started Test case for roadmap codesign 24
25 Overview Roadmapping: Moore s Law & More than Moore Europe and the Roadmap Beyond CMOS: Nano-Tec Infrastructures: ENI2 New directions 25
26 NANO-TEC Ecosystems Technology & Design for Nanoelectronics FP7 Support Action Objective To identify the next generation of emerging device concepts and technologies for ICT, through a foresight exercise on medium and long-term requirements in nanolectronics research To build a joint technology-design community to coordinate research efforts in nanoelectronics, by harmonising the efforts of existing and new initiatives and projects 26
27 NANO-TEC recommendations: Technology transfer challenges (1) Integratability Possibility of integration of a switching device with other components towards a computing system or a more complex functional system Systemability The ability to economically design and manufacture reliable systems from the interaction of devices fabricated in a given technology. The simplest system in logic should be a full functional computing system. Manufacturability Possibility of manufacturing in a reliable and reproducible way, in compliance with industrial practice 27
28 NANO-TEC recommendations: Technology transfer challenges (2) Type Device/concept Integratability Systemability Manufacturability Charge-based state variable Non charge-based state variable New computing paradigms Graphene Nanowire Molecular electr. NEMS Spintronics Molecular electr. Neuromorphic Quantum Feasibility demonstrated Proof of concept in progress Major research challenge 28
29 ENI2 An open European Nanoelectronics Infrastructure for Innovation Objective: Create and sustain a durable multi-disciplinary distributed research infrastructure with year horizons To work towards the definition of a strong set of common long term R&D strategic nanoelectronics programs To establish strategic groupings of research communities with common interests and expertise, and focus resources on target issues 29
30 ENI2 30
31 Overview Roadmapping: Moore s Law & More than Moore Europe and the Roadmap Beyond CMOS: Nano-Tec Infrastructures: ENI2 New directions 31
32 New Directions: Crossroads and bridges Academic Pilot Industrial facilities lines facilities 32
33 Nanoelectronics Ecosystem 33
34 Innovation Supply Chain TRL Institute/ University Basic Res. Pilot line OEM Foundry Technology transfer Time 34
35 Conclusion The Roadmap continues, but the rules are changing More than Moore is (still) a great opportunity for the European nanoelectronics community Application/Technology roadmapping is essential for guiding the European strategic research agenda An effective academic/industrial ecosystem is the backbone of the European nanoelectronics innovation chain 35
36 Acknowledgments My colleagues in The ITRS International Roadmap Committee The NANO-TEC consortium The ENI2 consortium 36
ICT Micro- and nanoelectronics technologies
EPoSS Proposers' Day, 2 Feb 2017, Brussels ICT 31-2017 Micro- and nanoelectronics technologies Eric Fribourg-Blanc, Henri Rajbenbach, Andreas Lymberis European Commission DG CONNECT (Communications Networks,
More informationMEMS Technology Roadmapping
MEMS Technology Roadmapping Michael Gaitan, NIST Chair, inemi and ITRS MEMS Technology Working Groups Nano-Tec Workshop 3 31 May 2012 MEMS Technology Working Group More than Moore White Paper, http://www.itrs.net
More information2015 ITRS/RC Summer Meeting
2015 ITRS/RC Summer Meeting July 11 and 12, Stanford University, CISX 101 July 11 Time Duration Presentation Title Speaker Affiliation 7:30 am Breakfast 8:00 am 60 min Introduction Paolo Gargini ITRS 9:00am
More informationEU-Russia Meeting on R&D Collaboration Moscow, 25 September 2007
EU-Russia Meeting on R&D Collaboration Moscow, 25 September 2007 The FP7 ICT Theme Components & Systems Dr Erastos Filos European Commission Information Society and Media Directorate-General EF_Comp+Syst_FP7ICT_25Sep07-1
More informationNEREID. H2020-ICT-CSA: Micro- and Nano-Electronics Technologies Grant Agreement n Enrico Sangiorgi,
NEREID H2020-ICT-CSA: Micro- and Nano-Electronics Technologies Grant Agreement n 685559 Enrico Sangiorgi, enrico.sangiorgi@unibo.it University of Bologna/IUNET, Scientific Coordinator of Nereid 11 th MOS
More informationHOW TO CONTINUE COST SCALING. Hans Lebon
HOW TO CONTINUE COST SCALING Hans Lebon OUTLINE Scaling & Scaling Challenges Imec Technology Roadmap Wafer size scaling : 450 mm 2 COST SCALING IMPROVED PERFORMANCE 3 GLOBAL TRAFFIC FORECAST Cloud Traffic
More informationG450C. Global 450mm Consortium at CNSE. Michael Liehr, General Manager G450C, Vice President for Research
Global 450mm Consortium at CNSE Michael Liehr, General Manager G450C, Vice President for Research - CNSE Overview - G450C Vision - G450C Mission - Org Structure - Scope - Timeline The Road Ahead for Nano-Fabrication
More informationA Presentation to the National Academies July 29, Larry W. Sumney President/CEO Semiconductor Research Corporation1
A Presentation to the National Academies July 29, 2009 Larry W. Sumney President/CEO Semiconductor Research Corporation1 What is SRC? World s leading consortium funding collaborative university research
More informationThe SEMATECH Model: Potential Applications to PV
Continually cited as the model for a successful industry/government consortium Accelerating the next technology revolution The SEMATECH Model: Potential Applications to PV Dr. Michael R. Polcari President
More informationYou may well remember that we had already a joint call between the IST and the NMP thematic priorities
FP6 in 2004: The second joint call IST-NMP Andrea Gentili Directorate Industrial Technologies Research Directorate-general - European Commission andrea.gentili@cec.eu.int These pages do not represent any
More informationSemiconductor Industry Perspective
Semiconductor Industry Perspective National Academy of Engineering Workshop on the Offshoring of Engineering Washington, D.C. October 25, 2006 Dr. Robert Doering Texas Instruments, Inc. A Few Introductory
More informationSmart Integrated Systems (and more)
Smart Integrated Systems (and more) - Integrating the European Digital Industrial Strategy - Nikolaos Kyrloglou, Henri RAJBENBACH European Commission DG CONNECT 39 th OE-A Working Group Meeting 11-Oct-2016
More informationSmart Components and Smart Systems Integration
Smart Components and Smart Systems Integration in the ICT Work Programme 2011-2012 Francisco Javier Bonal Georg Kelm Francisco Ibáñez Information Event Brussels, 11 October 2010 1 Smart Systems and Smart
More informationIdentification-Benchmarking-SWOT Analysis-Recommendations of Beyond CMOS Technologies. Coordination Action in FP7 Contract no.
Identification-Benchmarking-SWOT Analysis-Recommendations of Beyond CMOS Technologies Coordination Action in FP7 Contract no. 257694 J. Ahopelto VTT Technical Research Centre of Finland 1 PROJECT PARTNERS
More informationFirst "Digitising European Industry" Stakeholder Forum, 01 February 2017, Essen
First "Digitising European Industry" Stakeholder Forum, 01 February 2017, Essen Michael Berz DG for Internal Market, Industry, Entrepreneurship and SMEs Unit GROW.F.3 KETs, Digital Manufacturing and Interoperability
More informationEU's contribution to research and innovation in Electronics
EU's contribution to research and innovation in Electronics Henri.RAJBENBACH@ec.europa.eu Nikolaos.KYRLOGLOU@ec.europa.eu European Commission DG CONNECT (not legally binding presentation) SEMICON Europa-Flex
More informationRecent Developments in Multifunctional Integration. Stephan Guttowski, Head of Technology Park»Heterointegration«, Fraunhofer FMD
Recent Developments in Multifunctional Integration Stephan Guttowski, Head of Technology Park»Heterointegration«, Fraunhofer FMD Founding Participants 2 One-Stop-Shop for developments from wafer technologies
More informationStatus and Perspectives of the European Semiconductor Industry. Andreas Wild
Status and Perspectives of the European Semiconductor Industry Andreas Wild Content 1. 2011 for the European Semiconductors Industry 2. Public-Private Partnership 3. Key Enabling Technologies: Pilot Lines
More informationNanotechnology and its effect on Electronics Manufacturing
Nanotechnology and its effect on Electronics Manufacturing Dr. Alan Rae Vice President, Market & Business Development, NanoDynamics, Inc. Dr. Robert C. Pfahl, Jr. VP of Operations, inemi Topics Covered
More informationARTEMIS Industry Association
The innovation strategy is to strengthen the application contexts, based upon offers your R&I members Go to to apply for More members make the is an excellent members enjoy Members are able to join the
More informationTowards EU-US Collaboration on the Internet of Things (IoT) & Cyber-physical Systems (CPS)
Towards EU-US Collaboration on the Internet of Things (IoT) & Cyber-physical Systems (CPS) Christian Sonntag Senior Researcher & Project Manager, TU Dortmund, Germany ICT Policy, Research and Innovation
More informationMEDEA+ and Embedded Systems
MEDEA+ and Embedded Systems ARTEMIS Annual Conference 2005 Paris Σ! 2365 Jürgen Deutrich Vice Chaiman of the Board MEDEA+ Applications ARTEMIS ANNUAL CONFERENCE 2005 1. About MEDEA+ 2. MEDEA+ Projects
More informationHigh Value Manufacturing Landscape Update. Andrew Gill IfM Education and Consultancy Services
IfMWork Briefing in Day progress High Value Manufacturing Landscape Update Andrew Gill IfM Education and Consultancy Services Agenda HVM study Background and Objectives Definitions HVM Challenges International
More informationProgress due to: Feature size reduction - 0.7X/3 years (Moore s Law). Increasing chip size - 16% per year. Creativity in implementing functions.
Introduction - Chapter 1 Evolution of IC Fabrication 1960 and 1990 integrated t circuits. it Progress due to: Feature size reduction - 0.7X/3 years (Moore s Law). Increasing chip size - 16% per year. Creativity
More informationAccelerating Growth and Cost Reduction in the PV Industry
Accelerating Growth and Cost Reduction in the PV Industry PV Technology Roadmaps and Industry Standards An Association s Approach Bettina Weiss / SEMI PV Group July 29, 2009 SEMI : The Global Association
More informationFET in H2020. European Commission DG CONNECT Future and Emerging Technologies (FET) Unit Ales Fiala, Head of Unit
FET in H2020 51214 European Commission DG CONNECT Future and Emerging Technologies (FET) Unit Ales Fiala, Head of Unit H2020, three pillars Societal challenges Excellent Science FET Industrial leadership
More informationSTM RH-ASIC capability
STM RH-ASIC capability JAXA 24 th MicroElectronic Workshop 13 th 14 th October 2011 Prepared by STM Crolles and AeroSpace Unit Deep Sub Micron (DSM) is strategic for Europe Strategic importance of European
More informationHorizon 2020 Funding opportunities
Horizon 2020 Funding opportunities Workprogramme 2018-20 DG CONNECT 22 nd November 2018 Lisbon, EFECS HORIZON 2020 Facts & Figures Around 54% of the Horizon 2020 participants are newcomers Almost half
More informationOne-Stop-Shop for. Research Fab Microelectronics Germany
Fraunhofer Group for Microelectronics One-Stop-Shop for Technologies and Systems Research Fab Microelectronics Germany The entire added-value chain for microelectronics and nanoelectronics from a single
More informationWP Topic LEIT ICT 3 Advanced TOLAE technologies
Brussels, 14 February 2014 Information and Networking Day WP 2014-15 Topic LEIT ICT 3 Advanced TOLAE technologies Philippe Reynaert and Andreas Lymberis Project Officer, Unit A1 and A4, DG CONNECT European
More informationISMI Industry Productivity Driver
SEMATECH Symposium Japan September 15, 2010 Accelerating Manufacturing Productivity ISMI Industry Productivity Driver Scott Kramer VP Manufacturing Technology SEMATECH Copyright 2010 SEMATECH, Inc. SEMATECH,
More informationInternational Center on Design for Nanotechnology Workshop August, 2006 Hangzhou, Zhejiang, P. R. China
Challenges and opportunities for Designs in Nanotechnologies International Center on Design for Nanotechnology Workshop August, 2006 Hangzhou, Zhejiang, P. R. China Sankar Basu Program Director Computing
More informationIntroduction to CMC 3D Test Chip Project
Introduction to CMC 3D Test Chip Project Robert Mallard CMC Microsystems Apr 20, 2011 1 Overview of today s presentation Introduction to the project objectives CMC Why 3D chip stacking? The key to More
More informationExtending The Life Of 200mm Fabs And The Re-use of Second Hand Tools
Extending The Life Of 200mm Fabs And The Re-use of Second Hand Tools Gareth Bignell, FE Equipment Procurement Director SEMICON Europa 2012 Presentation Summary 2 An introduction to STMicroelectronics The
More informationProcess Variability and the SUPERAID7 Approach
Process Variability and the SUPERAID7 Approach Jürgen Lorenz Fraunhofer Institut für Integrierte Systeme und Bauelementetechnologie IISB, Erlangen, Germany ESSDERC/ ESSCIRC Workshop Process Variations
More informationICT 29 : Development of novel materials and systems for OLED lighting
ICT 29 : Development of novel materials and systems for OLED lighting Martyn Chamberlain Photonics Unit DG CONNECT - European Commission 14 February 2014 Photonics PPP: Overview of Calls 2014-15 (28 M
More informationHorizon Work Programme Leadership in enabling and industrial technologies - Introduction
EN Horizon 2020 Work Programme 2018-2020 5. Leadership in enabling and industrial technologies - Introduction Important notice on the Horizon 2020 Work Programme This Work Programme covers 2018, 2019 and
More informationR&D Requirements from the 2004 inemi Roadmap. April 7, 2005 Dr. Robert C. Pfahl, Jr. VP of Operations, inemi
R&D Requirements from the 2004 inemi Roadmap April 7, 2005 Dr. Robert C. Pfahl, Jr. VP of Operations, inemi Topics Covered Overview of inemi and the 2004 Roadmap Situation Analysis Highlights from the
More informationBeyond Moore the challenge for Europe
Beyond Moore the challenge for Europe Dr. Alfred J. van Roosmalen Vice-President Business Development, NXP Semiconductors Company member of MEDEA+/CATRENE/AENEAS/Point-One FIT-IT 08 Spring Research Wien,
More informationSelected Topics in Nanoelectronics. Danny Porath 2002
Selected Topics in Nanoelectronics Danny Porath 2002 Links to NST http://www.foresight.org/ http://itri.loyola.edu/nanobase/ http://www.zyvex.com/nano/ http://www.nano.gov/ http://www.aeiveos.com/nanotech/
More informationDr Günter Clar
Frontiers of Research in Global Innovation Dr Günter Clar clar@c3-solutions.eu Growing pressures on HEIs from two fronts Role of donors, e.g. Munk School of Global Affairs Effect change, improve our collective
More information» Facing the Smart Future «
Industrie 4.0 Internet of Things» Facing the Smart Future «Smart Products, Production and Services Internet of Services Industrial Internet Digital Manufacturing Call for Partners: Consortium Study Our
More informationFRAUNHOFER GROUP FOR MICROELECTRONICS ONE-STOP-SHOP FOR TECHNOLOGIES AND SYSTEMS
FRAUNHOFER GROUP FOR MICROELECTRONICS ONE-STOP-SHOP FOR TECHNOLOGIES AND SYSTEMS The entire added-value chain for microelectronics and nanoelectronics from a single provider The Research Fab Microelectronics
More informationAre innovative sensor concepts included in the funding programmes of the EU and Germany? Dr. Bernhard Ruf, VDI/VDE-IT
Are innovative sensor concepts included in the funding programmes of the EU and Germany? Dr. Bernhard Ruf, VDI/VDE-IT VDI/VDE IT: Who we are? Company Employees: ca. 270 Turnover (2012): 24,8 Mio. Share
More informationINDUSTRIAL LEADERSHIP AND KEY ENABLING TECHNOLOGIES IN HORIZON 2020
INDUSTRIAL LEADERSHIP AND KEY ENABLING TECHNOLOGIES IN HORIZON 2020 Horizon 2020 Space Information Day Jyrki Suominen Deputy Head of Unit DG Research and Directorate Industrial Technologies Unit G.4 Nanosciences
More informationCommon Development Topics for Semiconductor Manufacturers and their Suppliers in Germany
Common Development Topics for Semiconductor Manufacturers and their Suppliers in Germany SEMICON Europa 2013 TechARENA 1: Secondary Equipment Session Contact: Dr.-Ing. Martin Schellenberger, Fraunhofer
More informationThermal Management in the 3D-SiP World of the Future
Thermal Management in the 3D-SiP World of the Future Presented by W. R. Bottoms March 181 th, 2013 Smaller, More Powerful Portable Devices Are Driving Up Power Density Power (both power delivery and power
More informationHorizon 2020 and Photonics
Brussels, 13 December 2013 Horizon 2020 and Photonics Thomas Skordas Head of the Photonics Unit, DG CONNECT European Commission Thomas.Skordas@ec.europa.eu Horizon 2020 Horizon 2020 Budget: 78.6 B (in
More information2017 inemi Roadmap - Highlights. Steve Payne, inemi
2017 inemi Roadmap - Highlights Steve Payne, inemi Highlights of the inemi Roadmap inemi inemi 2017 Roadmap okey Trends oiot omedical oa&d inemi Collaborative Projects Summary 2 inemi International Electronics
More informationCAPACITIES. 7FRDP Specific Programme ECTRI INPUT. 14 June REPORT ECTRI number
CAPACITIES 7FRDP Specific Programme ECTRI INPUT 14 June 2005 REPORT ECTRI number 2005-04 1 Table of contents I- Research infrastructures... 4 Support to existing research infrastructure... 5 Support to
More informationConvergence of Knowledge, Technology, and Society: Beyond Convergence of Nano-Bio-Info-Cognitive Technologies
WTEC 2013; Preliminary Edition 05/15/2013 1 EXECUTIVE SUMMARY 1 Convergence of Knowledge, Technology, and Society: Beyond Convergence of Nano-Bio-Info-Cognitive Technologies A general process to improve
More informationProject presentation Lampros Stegioulas. NEM General Assembly, Brussels 1 April 2014
To help protect your privacy, PowerPoint has blocked automatic download of this picture. Project presentation Lampros Stegioulas Cre-AM @ NEM General Assembly, Brussels 1 April 2014 This publication reflects
More informationResearch Infrastructure Programme
Research Infrastructure Programme Humanities Information Day 18 February 2015 Katie Lambert UK National Contact Point Overview What are Research Infrastructures? What did the 2014-2015 WP fund? What has
More informationEU programs in Large Area Electronics
EU programs in Large Area Electronics Form research to innovation funding Henri Rajbenbach European Commission DG CONNECT (Communications Networks, Content and Technology) Not legally binding presentation
More informationPPP InfoDay Brussels, July 2012
PPP InfoDay Brussels, 09-10 July 2012 The Factories of the Future Calls in ICT WP2013. Objectives 7.1 and 7.2 DG CONNECT Scientific Officers: Rolf Riemenschneider, Mariusz Baldyga, Christoph Helmrath,
More informationFET Flagships in Horizon 2020
HORIZON 2020 - Future & Emerging Technologies (FET) Paris, 21 st December 2017 FET Flagships in Horizon 2020 Aymard de Touzalin Deputy Head of Unit, Flagships DG Connect, European Commission 1 Horizon
More informationOASIS concept. Evangelos Bekiaris CERTH/HIT OASIS ISWC2011, 24 October, Bonn
OASIS concept Evangelos Bekiaris CERTH/HIT The ageing of the population is changing also the workforce scenario in Europe: currently the ratio between working people and retired ones is equal to 4:1; drastic
More informationNew Process Technologies Will silicon CMOS carry us to the end of the Roadmap?
HPEC Workshop 2006 New Process Technologies Will silicon CMOS carry us to the end of the Roadmap? Craig L. Keast, Chenson Chen, Mike Fritze, Jakub Kedzierski, Dave Shaver HPEC 2006-1 Outline A brief history
More information450mm and Moore s Law Advanced Packaging Challenges and the Impact of 3D
450mm and Moore s Law Advanced Packaging Challenges and the Impact of 3D Doug Anberg VP, Technical Marketing Ultratech SOKUDO Lithography Breakfast Forum July 10, 2013 Agenda Next Generation Technology
More informationMEDIA RELEASE FOR IMMEDIATE RELEASE 26 JULY 2016
MEDIA RELEASE FOR IMMEDIATE RELEASE 26 JULY 2016 A*STAR S IME KICKS OFF CONSORTIA TO DEVELOP ADVANCED PACKAGING SOLUTIONS FOR NEXT-GENERATION INTERNET OF THINGS APPLICATIONS AND HIGH-PERFORMANCE WIRELESS
More informationRobotics: from FP7 to Horizon Libor Král, Head of Unit Unit A2 - Robotics DG Communication Networks, Content and Technology European Commission
Robotics: from FP7 to Horizon 2020 Libor Král, Head of Unit Unit A2 - Robotics DG Communication Networks, Content and Technology European Commission Robotics in Regions 30 October 2013 Key issues research
More informationTorsti Loikkanen, Principal Scientist, Research Coordinator VTT Innovation Studies
Forward Looking Activities Governing Grand Challenges Vienna, 27-28 September 2012 Support of roadmap approach in innovation policy design case examples on various levels Torsti Loikkanen, Principal Scientist,
More informationSILICON EUROPE THE LEADERS FOR INNOVATIVE ELECTRONICS & SOFTWARE TECHNOLOGIES
011 1111 1 0000 0000 01 1011 1111 111 1010 1101 001 0111 1111 100 1101 0010 00 SILICON EUROPE THE LEADERS FOR INNOVATIVE ELECTRONICS & SOFTWARE TECHNOLOGIES WHAT CAN DO FOR YOU? A one-stop shop for creative
More informationAnalog front-end electronics in beam instrumentation
Analog front-end electronics in beam instrumentation Basic instrumentation structure Silicon state of art Sampling state of art Instrumentation trend Comments and example on BPM Future Beam Position Instrumentation
More informationAI in Europe How could the EC help European society and economy to make the best of this revolution?
AI in Europe How could the EC help European society and economy to make the best of this revolution? => H2020 - ICT-26-2018-2020 Artificial Intelligence Cécile Huet, PhD Deputy Head of Unit A1 Robotics
More informationAssessment of Smart Machines and Manufacturing Competence Centre (SMACC) Scientific Advisory Board Site Visit April 2018.
Assessment of Smart Machines and Manufacturing Competence Centre (SMACC) Scientific Advisory Board Site Visit 25-27 April 2018 Assessment Report 1. Scientific ambition, quality and impact Rating: 3.5 The
More informationCompetitive in Mainstream Products
Competitive in Mainstream Products Bert Koek VP, Business Unit manager 300mm Fabs Analyst Day 20 September 2005 ASML Competitive in mainstream products Introduction Market share Device layers critical
More informationNanoelectronics and the Future of Microelectronics
Nanoelectronics and the Future of Microelectronics Mark Lundstrom Electrical and Computer Engineering University, West Lafayette, IN August 22, 2002 1. Introduction 2. Challenges in Silicon Technology
More informationSuccess Stories within Factories of the Future
Success Stories within Factories of the Future Patrick Kennedy Communications Advisor European Factories of the Future Research Association EFFRA Representing private side in Factories of the Future PPP
More informationThe Development of the Semiconductor CVD and ALD Requirement
The Development of the Semiconductor CVD and ALD Requirement 1 Linx Consulting 1. We create knowledge and develop unique insights at the intersection of electronic thin film processes and the chemicals
More informationFP7 ICT Work Programme
FP7 ICT Work Programme 2011-12 Focus on ICT Call 8 and PPP Calls Alessandro Barbagli European Commission Head of Sector - ICT Operations Roma 9 September 2011 Disclaimer: The aim of this presentation is
More informationMAPPER: High throughput Maskless Lithography
MAPPER: High throughput Maskless Lithography Marco Wieland CEA- Leti Alterative Lithography workshop 1 Today s agenda Introduction Applications Qualification of on-tool metrology by in-resist metrology
More informationPractical Information
EE241 - Spring 2010 Advanced Digital Integrated Circuits TuTh 3:30-5pm 293 Cory Practical Information Instructor: Borivoje Nikolić 550B Cory Hall, 3-9297, bora@eecs Office hours: M 10:30am-12pm Reader:
More informationCatching the Nanotechnology Wave: Needs, Risks, and Opportunities
Catching the Nanotechnology Wave: Needs, Risks, and Opportunities November 1, 2013 The webinar will begin at 1pm Eastern Time Perform an audio check by going to Tools > Audio > Audio Setup Wizard Chat
More informationLecture Introduction
Lecture 1 6.012 Introduction 1. Overview of 6.012 Outline 2. Key conclusions of 6.012 Reading Assignment: Howe and Sodini, Chapter 1 6.012 Electronic Devices and Circuits-Fall 200 Lecture 1 1 Overview
More informationRoadmap Pitch: Road2CPS - Roadmapping Project Platforms4CPS Roadmap Workshop
Roadmap Pitch: Road2CPS - Roadmapping Project Platforms4CPS Roadmap Workshop Meike Reimann 23/10/2017 Paris Road2CPS in a nutshell Road2CPS: Strategic action for future CPS through roadmaps, impact multiplication
More informationWorkshop on Enabling Technologies in CSF for EU Research and Innovation Funding
Workshop on Enabling Technologies in CSF for EU Research and Innovation Funding Rapporteur Professor Costas Kiparissides, Department of Chemical Engineering, Aristotle University of Thessaloniki Brussels,
More informationHorizon Scanning. Why & how to launch it in Lithuania? Prof. Dr. Rafael Popper
VTT TECHNICAL RESEARCH CENTRE OF FINLAND LTD Horizon Scanning Why & how to launch it in Lithuania? Prof. Dr. Rafael Popper Principal Scientist in Business, Innovation and Foresight VTT Technical Research
More informationChristina Miller Director, UK Research Office
Christina Miller Director, UK Research Office www.ukro.ac.uk UKRO s Mission: To promote effective UK engagement in EU research, innovation and higher education activities The Office: Is based in Brussels,
More informationFuture and Emerging Technologies. Ales Fiala, Head of Unit C2 European Commission - DG CONNECT Directorate C - Excellence in Science
Future and Emerging Technologies Ales Fiala, Head of Unit C2 European Commission - DG CONNECT Directorate C - Excellence in Science FET in Horizon 2020 Excellent Science pillar in H2020 European Research
More informationTransforming Consumer and Health-Oriented Society through Science and Innovation. SBRA meeting 20 June 2018
OPEN INNOVATION TEST BEDS - Nanotech and Advanced Materials Transforming Consumer and Health-Oriented Society through Science and Innovation Søren BØWADT-Deputy Head of Unit Advanced Materials and Nanotechnologies
More informationARTEMIS The Embedded Systems European Technology Platform
ARTEMIS The Embedded Systems European Technology Platform Technology Platforms : the concept Conditions A recipe for success Industry in the Lead Flexibility Transparency and clear rules of participation
More informationSuccess Factors for downstreaming research results into CEN/CENELEC committees. Andreea Gulacsi CEN-CENELEC Management Centre
Success Factors for downstreaming research results into CEN/CENELEC committees Andreea Gulacsi CEN-CENELEC Management Centre Policy Context The Innovation Union, 2010: Standards play an important role
More informationInitiatives to accelerate the deployment of Industry 4.0
Initiatives to accelerate the deployment of Industry 4.0 Dr. Pierre Padilla, IDEA Consult ERRIN ADMA Working Group Tuesday, 20 June 2017 Brussels With the Support of Agenda 1. The Vanguard Initiative 2.
More informationIndustry trends are boosting Jet Printing. Nico Coenen Global Sales Director Jet Printing
Industry trends are boosting Jet Printing Nico Coenen Global Sales Director Jet Printing Agenda What is Jet Printing Market Overview Industry Trends Typical Applications 2 What is Jet Printing What is
More informationICT in HORIZON The New EU Framework Programme for Research and Innovation
ICT in HORIZON 2020 The New EU Framework Programme for Research and Innovation 2014-2020 Vassilis Kopanas European Commission DG CONNECT International Relations What is Horizon 2020 EU research and innovation
More informationIndustrial Innovation Information Days Brussels 3-4 October 2017
Industrial Innovation Information Days Brussels 3-4 October 2017 NMBP Programme Parallel Sessions OPEN INNOVATION TEST BEDS Calls 2018/2019 Helene CHRAYE, HoU Unit D3 DG Research & Innovation A joint presentation
More informationPracticing Uncertainty in R&D Networks
Practicing Uncertainty in R&D Networks Don t Change Something Unless It s Broken Explorative Evidence from a Stretching as an Interorganizational Semiconductor Industry Practice Network in a Semiconductor
More informationIntroduction to IEEE CAS Publications
Introduction to IEEE CAS Publications Gianluca Setti 12 1 Dep. of Engineering (ENDIF) University of Ferrara 2 Advanced Research Center on Electronic Systems for Information Engineering and Telecommunications
More informationGrand Challenges in Silicon Technology
Grand Challenges in Silicon Technology Contents: Outcome of Consultation Exercise Page 2 Grand Challenges for Silicon Technology Roadmap Page 5 1 Outcome of Consultation Exercise Executive summary The
More informationAdvanced PDK and Technologies accessible through ASCENT
Advanced PDK and Technologies accessible through ASCENT MOS-AK Dresden, Sept. 3, 2018 L. Perniola*, O. Rozeau*, O. Faynot*, T. Poiroux*, P. Roseingrave^ olivier.faynot@cea.fr *Cea-Leti, Grenoble France;
More informationEurope as a Global Actor. International Dimension of Horizon 2020 and Research Opportunities with Third Countries
Europe as a Global Actor International Dimension of Horizon 2020 and Research Opportunities with Third Countries The way to Horizon 2020 7 PQ CIP EIT Europa 2020 Innovation Union Horizon 2020 2007-2013
More informationPanel Discussion. Dr. Dr. Norbert A. Streitz. The infinity Initiative Sophia Antipolis, 29. November Darmstadt, Germany
The infinity Initiative Sophia Antipolis, 29. November 2007 Panel Discussion Dr. Dr. Norbert A. Streitz Darmstadt, Germany www.ipsi.fraunhofer.de/~streitz streitz@ipsi.fraunhofer.de Panel Discussion Topics
More informationFRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS. Application Area. Quality of Life
FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS Application Area Quality of Life Overlay image of visible spectral range (VIS) and thermal infrared range (LWIR). Quality of Life With extensive experience
More informationAdvancing MEMS R&D in materials, processes and devices to face major needs arising from the booming MEMS market
Advancing MEMS R&D in materials, processes and devices to face major needs arising from the booming MEMS market Dr Julien Arcamone MEMS Business development Manager, CEA-LETI julien.arcamone@cea.fr MEMS
More information2010 IRI Annual Meeting R&D in Transition
2010 IRI Annual Meeting R&D in Transition U.S. Semiconductor R&D in Transition Dr. Peter J. Zdebel Senior VP and CTO ON Semiconductor May 4, 2010 Some Semiconductor Industry Facts Founded in the U.S. approximately
More informationPackaging Roadmap: The impact of miniaturization. Bob Pfahl, inemi Celestica-iNEMI Technology Forum May 15, 2007
Packaging Roadmap: The impact of miniaturization Bob Pfahl, inemi Celestica-iNEMI Technology Forum May 15, 2007 The Challenges for the Next Decade Addressing the consumer experience using the converged
More informationStrategic Policy Intelligence setting priorities and evaluating impacts Ireland
Strategic Policy Intelligence setting priorities and evaluating impacts Ireland Helena Acheson Head of Division Enterprise Policy OECD 15/16 September 2008 Working to gain economic advantage from investments
More informationFaurecia : Smart Life on board An innovative company
Faurecia : Smart Life on board An innovative company Anna Rossi December 6,th, 2017 Les interactions confort et santé dans l habitacle automobile Faurecia is a leading equipment manufacturer 35 countries
More informationDigitising European Industry. Strengthening competitiveness in digital technologies value chains and platforms
Digitising European Industry Strengthening competitiveness in digital technologies value chains and platforms #DigitiseEU Peter Droell and Khalil Rouhana European Commission DG RTD and DG CONNECT Pan-European
More information