ITRS Update (and the European situation) Mart Graef Delft University of Technology

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1 ITRS Update (and the European situation) Mart Graef Delft University of Technology

2 Overview Roadmapping: Moore s Law & More than Moore Europe and the Roadmap Beyond CMOS: Nano-Tec Infrastructures: ENI2 New directions 2

3 Overview Roadmapping: Moore s Law & More than Moore Europe and the Roadmap Beyond CMOS: Nano-Tec Infrastructures: ENI2 New directions 3

4 International Technology Roadmap for Semiconductors (ITRS) now 2013 ITRS 2012 ITRS Update 2011 ITRS 2010 ITRS Update 2009 ITRS 2008 ITRS Update 2007 ITRS NTRS 1994 NTRS 1992 NTRS 1991 MicroTech 2000 Report USA Japan Korea Taiwan USA 2006 ITRS Update 2005 ITRS 2004 ITRS Update 2003 ITRS 2002 ITRS Update 2001 ITRS 2000 ITRS Update 1999 ITRS Europe 1998 ITRS Update 4

5 ITRS Objective Provide guidance to the semiconductor industry by predicting technology trends in the industry, spanning 15 years (near-term 1-6 yrs; long-term 7-15 yrs) 5

6 ITRS Organization and Implementation Organization International Roadmap Committee (IRC) 16 international technology working groups (ITWGs) ITRS release every 2 years 16 chapters, ~1000 pages, >200 tables >300 contributors, representing >50 companies ww Update of tables every other year 3 Workshops/year Europe (spring / Semicon Europa) USA (summer / Semicon West) Asia (winter / Semicon Japan) 2 Public symposia/year (incl. press conference) ~130 participants 6

7 ITRS Technology Working Groups 1. System Drivers 2. Design 3. Test & Test Equipment 4. Process Integration, Devices & Structures 5. RF and Analog/Mixed Signal 6. Emerging Research Devices 7. Emerging Research Materials 8. Front End Processes 9. Lithography 10.Interconnect 11.Factory Integration 12.Assembly & Packaging 13.Environment, Safety & Health 14.Yield Enhancement 15.Metrology 16.Modeling & Simulation 7

8 Impact of the ITRS Provides a benchmark for the semiconductor industry Identifies technology challenges Generates industrial and academic research agenda Is used by policy-makers 8

9 EC: New European strategy for electronics 9

10 Roadmapping: Requirements for technology scaling 10

11 The Red Brick Wall 11

12 Cumulative Interdependent Challenges More Moore: Increasing complexity Area Speed Power Yield Software and co-design become vital! Late CMOS Gate leakage Variability FINFET FDSOI Multi-MG High k Low k Strained SiGe Manual Design Happy Scaling V S/D leakage V Dynamic power Low cost, low power Critical dimension [nm] Year

13 Reaching dimension/complexity limits M 1G 1T Complexity in # of devices 10 mm µm 1 µm 10 nm Quantum computing Spintronics Molecular electronics Nanotubes Graphene 2013 Validated concept 1 Å 2020 Beyond CMOS? Source: STMicroelectronics 13

14 Parameterization of emerging technologies Source: ITRS/Intel 14

15 More Moore & More than Moore Source: ITRS (2011) 15

16 Smart microsystems: Beyond CMOS = More Moore + More than Moore Data Processing & Storage Radio Power Sensor & Actuator More Moore More than Moore Heterogeneous Integration 16

17 Why a Moore than More Roadmap? ITRS has demonstrated value of roadmapping for CMOS Identify pre-competitive research domains, enabling cooperation between industries, institutes and universities. Sharing of R&D efforts Increase resource efficiency through focus Reduction of development costs and time Synchronization of the equipment & materials community with the semiconductor manufacturing community More than Moore roadmapping offers a similar but more challenging opportunity Need to propose a roadmapping methodology White paper 17

18 More than Moore White Paper Roadmapping Methodology Published by the ITRS in More-than-Moore workshops Co-organized by ITRS and inemi Potsdam (D), April 2011 Noordwijk (NL), April 2012 Lyon (F), April

19 MtM Technology Assessment in ITRS FOM LEP SHR WAT ECO In ITRS today? Figure of merit Law of expected progress Willing-ness to share Wide applicability Existing community RF /++ + Yes Power + +? =? No Imaging + +? =? No Sensors / actuators (MEMS) --?? Yes Biochips --? --? -- No 19

20 MtM Roadmapping Process 20

21 Moore s Law Extended 21

22 22

23 Convergence of Semiconductors with Synthetic Biology I D. Herr, SRC SemiSynBio Workshop, February SemiSynBio Inspired Cell-Like Functionality Energy Generation Conversion Storage Utilization Architectures Research Narrow Options Prototype Continuous Improvement Sensing Physical Chemical Multimode Multiscale Subsurface Research Narrow Options Prototype Continuous Improvement Actuation Analog Digital Hybrid Approaches Hard and Soft/Adaptive Systems Autonomous Emergent Behavior Research Narrow Options Prototype Continuous Improvement Communication Transmission Filtering Novel A/D Interconversions Low Energy Approaches Reception Research Narrow Options Prototype Continuous Improvement Bioelectronics Personalized Medical Diagnostics Prosthetics and Implantable Devices Biotic/Abiotic Interfaces Multiproperty Imaging Noninvasive [Tricorder-like] Research Narrow Options Prototype Continuous Improvement Adaptive Coatings Dynamic Local Mapping Camouflage Obscuration Smart Physical Changes Remotely Directed Adaptations Research Narrow Options Prototype Continuous Improvement 23

24 ITRS: Towards a permanent process Cooperation with inemi started Introduction More-than- Moore concept MEMS Working Group started Test case for roadmap codesign 24

25 Overview Roadmapping: Moore s Law & More than Moore Europe and the Roadmap Beyond CMOS: Nano-Tec Infrastructures: ENI2 New directions 25

26 NANO-TEC Ecosystems Technology & Design for Nanoelectronics FP7 Support Action Objective To identify the next generation of emerging device concepts and technologies for ICT, through a foresight exercise on medium and long-term requirements in nanolectronics research To build a joint technology-design community to coordinate research efforts in nanoelectronics, by harmonising the efforts of existing and new initiatives and projects 26

27 NANO-TEC recommendations: Technology transfer challenges (1) Integratability Possibility of integration of a switching device with other components towards a computing system or a more complex functional system Systemability The ability to economically design and manufacture reliable systems from the interaction of devices fabricated in a given technology. The simplest system in logic should be a full functional computing system. Manufacturability Possibility of manufacturing in a reliable and reproducible way, in compliance with industrial practice 27

28 NANO-TEC recommendations: Technology transfer challenges (2) Type Device/concept Integratability Systemability Manufacturability Charge-based state variable Non charge-based state variable New computing paradigms Graphene Nanowire Molecular electr. NEMS Spintronics Molecular electr. Neuromorphic Quantum Feasibility demonstrated Proof of concept in progress Major research challenge 28

29 ENI2 An open European Nanoelectronics Infrastructure for Innovation Objective: Create and sustain a durable multi-disciplinary distributed research infrastructure with year horizons To work towards the definition of a strong set of common long term R&D strategic nanoelectronics programs To establish strategic groupings of research communities with common interests and expertise, and focus resources on target issues 29

30 ENI2 30

31 Overview Roadmapping: Moore s Law & More than Moore Europe and the Roadmap Beyond CMOS: Nano-Tec Infrastructures: ENI2 New directions 31

32 New Directions: Crossroads and bridges Academic Pilot Industrial facilities lines facilities 32

33 Nanoelectronics Ecosystem 33

34 Innovation Supply Chain TRL Institute/ University Basic Res. Pilot line OEM Foundry Technology transfer Time 34

35 Conclusion The Roadmap continues, but the rules are changing More than Moore is (still) a great opportunity for the European nanoelectronics community Application/Technology roadmapping is essential for guiding the European strategic research agenda An effective academic/industrial ecosystem is the backbone of the European nanoelectronics innovation chain 35

36 Acknowledgments My colleagues in The ITRS International Roadmap Committee The NANO-TEC consortium The ENI2 consortium 36

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